CN103486120B - The fixed structure of plate and rivet and method - Google Patents
The fixed structure of plate and rivet and method Download PDFInfo
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- CN103486120B CN103486120B CN201310337274.5A CN201310337274A CN103486120B CN 103486120 B CN103486120 B CN 103486120B CN 201310337274 A CN201310337274 A CN 201310337274A CN 103486120 B CN103486120 B CN 103486120B
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- plate
- rivet
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- plastic parts
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Abstract
The invention provides the fixed structure of a kind of plate and rivet, this structure is used in electronic equipment, and this structure comprises plate, rivet and plastic parts.This plate is provided with countersink; This rivet has joint and main part, and this joint is fixedly installed in this countersink, and this main part protrudes from this plate; This plastic parts is injected and molded in the intersection of this plate and this main part.Compared with prior art, in an electronic, by injection molding, the intersection between plate and rivet sets up plastic parts in the present invention.Thus when not increasing panel thickness, effectively improve the join strength between plate and rivet, and save the manufacture cost of electronic equipment.
Description
Technical field
The present invention relates to a kind of electronic equipment, particularly relate to fixed structure and the method for plate in a kind of electronic equipment and rivet.
Background technique
At present, the rivet value on plate can along with the lower thickness of plate, and the intensity of its rivet also can reduce.Namely when rivet riveting is on thin plate, because plate is thinner, thus rivet is easy to bending fracture, thus rivet and plate are departed from, and causes the problem being fixedly connected with inefficacy.
It is particularly serious that this problem shows in frivolous electronic equipment.As shown in Figure 1, be the partial schematic diagram of plate in electronic equipment and riveted joint structure 100, such as this electronic equipment is mobile phone, and the lower floor's plate 101 in this electronic equipment is connected by rivet 103 with upper strata plate 102.After this electronic equipment is dropped, because lower floor's plate 101 is thinner, the join strength between this lower floor's plate 101 and rivet 103 is more weak, thus makes this rivet 103 occur phenomenon of rupture with the junction 104 of this lower floor's plate 101.Thus this electronic equipment is easy to the situation that " open-top steamed bread " occurs.Generally, as long as increase the thickness of iron plate, the intensity of rivet can be increased, with make iron plate and rivet constant intensity larger.But in an electronic, so not only add thickness and the weight of electronic equipment, but also add the cost of electronic equipment.
Summary of the invention
In order to overcome above-mentioned technical problem, the invention provides the fixed structure of a kind of plate and rivet, when ensureing that electronic equipment is frivolous, effectively can increase the join strength between plate and rivet.
To achieve these goals, the invention provides the fixed structure of a kind of plate and rivet, this structure is used in electronic equipment, and this structure comprises plate, rivet and plastic parts.This plate is provided with countersink; This rivet has joint and main part, and this joint is fixedly installed in this countersink, and this main part protrudes from this plate; This plastic parts is injected and molded in the intersection of this plate and this main part.
Preferably, in the fixed structure of described plate and rivet, the surrounding of this main part is provided with groove.
Preferably, in the fixed structure of described plate and rivet, the side that this plastic parts contacts with this main part has projection, and this projection is embedded in this groove.
Preferably, in the fixed structure of described plate and rivet, the edge of this plate is embedded in frame.
Preferably, in the fixed structure of described plate and rivet, this plastic parts and this frame are formed in one structure.
Preferably, in the fixed structure of described plate and rivet, the top of this main part protrudes from this plastic parts.
Preferably, in the fixed structure of described plate and rivet, this rivet has internal thread, and this rivet is for connecting a screw.
Present invention also offers the fixation method of a kind of plate and rivet, wherein, this plate is provided with countersink, this rivet has joint and main part, this joint is fixedly installed in this countersink, this main part protrudes from this plate, and the method comprises: step one, by this plate and rivet burying forming mould; Step 2, injects in shaping die after being pressurizeed by plastic cement, forms plastic parts with the intersection at this plate and main part.
Preferably, in the fixation method of described plate and rivet, the edge of this plate is embedded in frame, and described step 2 also comprises, and this frame is formed together with this plastic parts.
Preferably, in the fixation method of described plate and rivet, the top of this main part protrudes from this plastic parts.
Compared with prior art, in an electronic, by injection molding, the intersection between plate and rivet sets up plastic parts in the present invention.Thus when not increasing panel thickness, effectively improve the join strength between plate and rivet, and save the manufacture cost of electronic equipment.
Accompanying drawing explanation
Fig. 1 is the partial schematic diagram of the fixed structure of iron plate and rivet in prior art;
Fig. 2 is the structural representation of a preferred embodiment of the present invention;
Fig. 3 is the generalized section of a preferred embodiment of the present invention;
Fig. 4 is the structural representation of another preferred embodiment of the present invention;
Fig. 5 is the partial schematic diagram of another preferred embodiment of the present invention;
Fig. 6 is the schematic diagram of rivet in another preferred embodiment of the present invention;
Fig. 7 is the flow chart of a preferred embodiment of the present invention method.
Embodiment
For making there is further understanding to object of the present invention, structure, feature and function thereof, embodiment is hereby coordinated to be described in detail as follows.
As shown in Figure 2, be fixed structure 200 schematic diagram of a preferred embodiment of the present invention plate and rivet.This structure 200 is in electronic equipment, and it is very frivolous that this electronic equipment often manufactures, and thus needs inner structure more frivolous.Such as, this electronic equipment is mobile phone, panel computer or e-book etc.This structure 200 comprises plate 201, rivet 203 and plastic parts 204.
Shown in composition graphs 3, Fig. 3 is the generalized section of this structure 200.This plate 201 is provided with countersink 206; This rivet 203 has joint 208 and main part 207, and this joint 208 is fixedly installed in this countersink 206, by engaging between this countersink 206 with this joint 208, can make together with this rivet 203 is fixedly connected with this plate 201.And this joint 208 is contained in this countersink 206 just, makes this joint 208 can not protrude from the bottom of this countersink 206, thus the thickness of this plate 201 can not be increased.
This rivet 203 has internal thread (not marking in figure), thus this rivet 203 can connect a screw 205.The main part 207 of this rivet 203 protrudes from above this plate 201, thus on plate 201, reserve the space holding other electronic components.By this rivet 203 and this screw 205 this plate 201 and a upper strata plate 202 can be fixedly connected in together with.
This plastic parts 204 is injected and molded in the intersection of this plate 201 and this main part 207.This plastic parts 204 adheres to the surface of this plate 201, and it is more fastening that this plastic parts 204 can make this plate 201 be connected with this rivet 203; This plastic parts 204 is coated on this main part 207 around simultaneously, adds the intensity of this rivet 203 simultaneously.In addition, when this electronic device falling, this plastic parts 204 effectively can reduce this rivet 203 and rock, and then can effectively avoid the joint 208 of this rivet 203 rupture and make the problem that this plate 201 is separated with upper strata plate 202, thus this plastic parts 204 can strengthen the intensity be connected between this plate 201 with this rivet greatly.In addition, this plastic parts 204 is by being injected and molded in the intersection of this plate 201 and this main part 207, thus the thickness increasing this plate 201 is not needed, reduce the manufacture cost of this plate 201 and this rivet 207, and this plastic parts 204 is by inserting mould, utilize the plastic cement of injection to be coated on rivet 203, thus the manufacturing process of this plastic parts 204 is also simple and convenient, is very easy to manufacture.Thus also can not increase too large manufacture cost.Namely, under the thickness not increasing plate and cost, utilize the plastic cement of injection to carry out coated rivet, thus add the intensity of rivet.
Shown in composition graphs 1, main part 207 top of this rivet 203 protrudes from this plastic parts 204, by this gap h reserved between this main part 207 top and this plastic parts 204, thus this plastic parts 204 can be avoided when molding and forming, plastic cement covers the top of this main part 207, and causes this rivet 203 to lock bad with screw 205.
As shown in Figure 4, be the schematic diagram of plate in another preferred embodiment electronic equipment of the present invention.The surrounding of this plate 301 is provided with frame 302.Wherein, in the present embodiment, this rivet 303 is fixedly installed on this plate 301 near frame 302, and this plastic parts 304 and this frame 302 are formed in one structure.This plastic parts 304 and this frame 302 can together be formed on this plate 301 by injection molding, thus reduce the manufacturing process of electronic equipment.
Simultaneously shown in composition graphs 5, Fig. 5 is the schematic diagram of this plate 301 and this rivet 303 linkage structure.Wherein, the difference of this embodiment and above-described embodiment is, in the above-described embodiments, refers to Fig. 2 and Fig. 3, and this plastic parts 204 is formed at the intersection of plate 201 and rivet 203 by the mode of follow-up injection injection moulding.And in the present embodiment, this plastic parts 304 and frame 302 are formed in one structure, and can be formed by injection molding together.This plate 301 has edge 305, and this edge 305 is embedded in this frame 302.Thus the steadiness of this frame 302 and this plate 301 can be increased.This frame 302 is structure as a whole with this plastic parts 304, this frame 302 can play the effect of location to plastic parts 304, further enhance the stability of plastic parts 304 simultaneously, thus also indirectly enhance the stability of rivet 303, make rivet 303 more firm with fixing of plate 301.Countersink (not marking out in figure) simultaneously on this plate 301, near the edge 305 of this plate 301, thus can be convenient to this plastic parts 304 and be formed by injection molding with this frame 302 simultaneously.Thus effectively can reduce manufacturing process, reduce the manufacture cost of electronic equipment.
As shown in Figure 6, be the structural representation of rivet in another preferred embodiment of the present invention.Groove 306 is provided with around the main part 307 of this rivet 303.When this plastic parts 304 is by being injected and molded in this main part 307 surrounding, the side that this plastic part 304 contacts with this main part 307 has projection (not shown in FIG.), and this projection is embedded in this groove 306.Namely this plastic parts 304 can form projection in this groove 306, thus is engaged with the adhesion of this groove 306 by this projection, can increase the steadiness that this plastic parts 304 is combined with this main part 307 further.
As shown in Figure 7, be the flow chart of a preferred embodiment of the present invention method.This embodiment offers the fixation method of a kind of plate and rivet, composition graphs 2,3, shown in 4 and 5, wherein, this plate is provided with countersink, this rivet has joint and main part, and this joint is fixedly installed in this countersink, and this main part protrudes from this plate, the method comprises: step S110, by this plate and rivet burying forming mould.S120, injects in shaping die after being pressurizeed by plastic cement, forms plastic parts with the intersection at this plate and main part.Namely inject plastic cement by shaping die at the intersection of plate and rivet, to form plastic parts, this plastic parts is coated on around this rivet, adheres on this plate simultaneously.Thus effectively can increase the intensity of rivet, strengthen the steadiness of plate and rivet.The main part top of this rivet protrudes from this plastic parts, thus can avoid when molding and forming, and plastic cement flash, to the top of rivet, causes rivet and screw to lock bad problem.In addition, in another embodiment of the invention, the edge of this plate is embedded in frame, and wherein, this frame is formed by injection molding together with this plastic parts.Thus can manufacturing process be simplified, reduce manufacture cost.Meanwhile, this frame is formed by injection molding together with this plastic parts, and this frame can play the effect of location to plastic parts, and strengthens the stability of plastic parts, thus also indirectly enhances the stability of rivet, makes the fixing more firm of rivet and plate.To sum up, in an electronic, by injection molding, the intersection between plate and rivet sets up plastic parts in the present invention.Thus when not increasing panel thickness, effectively improve the join strength between plate and rivet, and save the manufacture cost of electronic equipment.
The present invention is described by above-mentioned related embodiment, but above-described embodiment is only enforcement example of the present invention.Must it is noted that the embodiment disclosed limit the scope of the invention.On the contrary, change done without departing from the spirit and scope of the present invention and retouching, all belong to scope of patent protection of the present invention.
Claims (10)
1. a fixed structure for plate and rivet, this structure is used in electronic equipment, and it is characterized in that, this structure comprises:
Plate, this plate is provided with countersink;
Rivet, has joint and main part, and this joint engages to be fixedly installed in this countersink with this countersink, and this main part protrudes from this plate;
Plastic parts, is injected and molded in the intersection of this plate and this main part, and this plastic parts is coated on around this main part.
2. the fixed structure of plate as claimed in claim 1 and rivet, it is characterized in that, the surrounding of this main part is provided with groove.
3. the fixed structure of plate as claimed in claim 2 and rivet, it is characterized in that, the side that this plastic parts contacts with this main part has projection, and this projection is embedded in this groove.
4. the fixed structure of plate as claimed in claim 1 and rivet, it is characterized in that, the edge of this plate is embedded in frame.
5. the fixed structure of plate as claimed in claim 4 and rivet, is characterized in that, this plastic parts and this frame are formed in one structure.
6. the fixed structure of plate as claimed in claim 1 and rivet, it is characterized in that, the top of this main part protrudes from this plastic parts.
7. the fixed structure of plate as claimed in claim 1 and rivet, it is characterized in that, this rivet has internal thread, and this rivet is for connecting a screw.
8. a fixation method for plate and rivet, wherein, this plate is provided with countersink, this rivet has joint and main part, and this joint engages to be fixedly installed in this countersink with this countersink, and this main part protrudes from this plate, it is characterized in that, the method comprises:
Step one, by this plate and rivet burying forming mould;
Step 2, injects in shaping die after being pressurizeed by plastic cement, form plastic parts, and this plastic parts is coated on around this main part with the intersection at this plate and main part.
9. the fixation method of plate as claimed in claim 8 and rivet, it is characterized in that, the edge of this plate is embedded in frame, and described step 2 also comprises, and this frame is formed together with this plastic parts.
10. the fixation method of plate as claimed in claim 8 and rivet, it is characterized in that, the top of this main part protrudes from this plastic parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310337274.5A CN103486120B (en) | 2013-08-06 | 2013-08-06 | The fixed structure of plate and rivet and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310337274.5A CN103486120B (en) | 2013-08-06 | 2013-08-06 | The fixed structure of plate and rivet and method |
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| Publication Number | Publication Date |
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| CN103486120A CN103486120A (en) | 2014-01-01 |
| CN103486120B true CN103486120B (en) | 2015-12-02 |
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| CN201310337274.5A Active CN103486120B (en) | 2013-08-06 | 2013-08-06 | The fixed structure of plate and rivet and method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2489400A1 (en) * | 1980-09-04 | 1982-03-05 | Shaw Mfg Ltd | IMPROVEMENTS TO WINDOW SUPPORT SUPPORTS |
| DE3607660A1 (en) * | 1986-03-08 | 1987-09-10 | Schade Maschf Gustav | Perforated plate fastening to a support structure, in particular in the case of screening machines |
| CN1368605A (en) * | 2001-02-04 | 2002-09-11 | 洪新兵 | Plastic rivet |
| CN2556414Y (en) * | 2002-07-24 | 2003-06-18 | 上海创开无框阳台窗有限公司 | Rivet |
| CN101823314A (en) * | 2010-05-28 | 2010-09-08 | 昆山兆震电子有限公司 | Embedding and ejecting molding method for panel with bamboo surface combined with metal structure |
| DE202012001799U1 (en) * | 2012-02-21 | 2012-06-12 | Frank Steinbach | Spring element for fixed point sleeve / n |
-
2013
- 2013-08-06 CN CN201310337274.5A patent/CN103486120B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2489400A1 (en) * | 1980-09-04 | 1982-03-05 | Shaw Mfg Ltd | IMPROVEMENTS TO WINDOW SUPPORT SUPPORTS |
| DE3607660A1 (en) * | 1986-03-08 | 1987-09-10 | Schade Maschf Gustav | Perforated plate fastening to a support structure, in particular in the case of screening machines |
| CN1368605A (en) * | 2001-02-04 | 2002-09-11 | 洪新兵 | Plastic rivet |
| CN2556414Y (en) * | 2002-07-24 | 2003-06-18 | 上海创开无框阳台窗有限公司 | Rivet |
| CN101823314A (en) * | 2010-05-28 | 2010-09-08 | 昆山兆震电子有限公司 | Embedding and ejecting molding method for panel with bamboo surface combined with metal structure |
| DE202012001799U1 (en) * | 2012-02-21 | 2012-06-12 | Frank Steinbach | Spring element for fixed point sleeve / n |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103486120A (en) | 2014-01-01 |
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Effective date of registration: 20200527 Address after: 215000 south of Lianyang road and east of Chang'an Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province (Science and technology entrepreneurship Park) Patentee after: Wujiang science and Technology Pioneer Park Management Service Co.,Ltd. Address before: 215000 room 901, room 9, No. 1699, Zuchongzhi South Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan Jinma Intellectual Property Operation Co.,Ltd. Effective date of registration: 20200527 Address after: Room 901, room 9, No. 1699, Zuchongzhi South Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Jinma Intellectual Property Operation Co.,Ltd. Address before: 215011 Zhujianglu Road high tech Zone, Jiangsu, No. 169, Co-patentee before: Qisda Corp. Patentee before: QISDA (SUZHOU) Co.,Ltd. |
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