CN1034841A - The manufacture method of printed substrate - Google Patents
The manufacture method of printed substrate Download PDFInfo
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- CN1034841A CN1034841A CN 89100432 CN89100432A CN1034841A CN 1034841 A CN1034841 A CN 1034841A CN 89100432 CN89100432 CN 89100432 CN 89100432 A CN89100432 A CN 89100432A CN 1034841 A CN1034841 A CN 1034841A
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Abstract
The invention provides first chemical deposition conducting metal on general insulating sheet material, re-plating conductive metal deposition, the technology of producing printed substrate.With the printed substrate of this explained hereafter, cost is low, and base plate is not yielding in the course of processing, saves metal material, can make the printed substrate that the bus surface is an any kind of metal, and the discharging waste liquid amount is few, reduces environmental impact.Metal on the product printed substrate combines firmly with base plate, can not break away from when welding, and solderability is good, and easy weldering metal is arranged on the inwall of the hole of inserting element leg, can reduce the dry joint rate.
Description
The present invention relates to produce the process of printed substrate.More particularly, the present invention relates to earlier on the insulating base surface, according to designed wiring board pattern, in the position that needs conducting metal, with conductive metal film on the no electrochemistry plated deposition, and then with electric plating method depositing metal layers on said conductive film, to produce the method for printed substrate.
So far, the most of printed substrate in the electronics industry all is the insulation board of hot pressing complex metal layer, through figure transfer, again through corrosion treatment, removes the method for part metals by pattern and manufactures.The inventor thinks that the major defect of this method has, and the utilance of metal is low; Base plate is yielding after eroding the part metals layer; Need macro-corrosion solution, so environmental impact is comparatively serious; Metallic conductor on the printed substrate can only be a kind of metal generally, is difficult to compound another kind of metal again; Metal during intensification on the wiring board is being answered undercapacity, and heat disengaging easily during welding particularly through welding several times, is very easy to come off; In addition, to the double sided board of plated-through hole, production technology is very complicated, and cost is very high, and because the hole metal is in vertical position with multiple Copper Foil, therefore connects difficulty, causes the big quality problems of through hole resistance easily.
In some nonmetallic materials, promptly on the insulating material, for example can plate on the plastics, directly adopt the method depositing metal layers of no electrochemistry plating, be public technology, and extensive use already.
But, up to now, industrially do not adopt direct plated metal method to produce printed substrate.The inventor thinks that this mainly is owing to also have following problems not to be resolved for a long time always.At first, the technology cost of electroless deposition metal is higher, and is if adopt the method for chemical plating to produce printed substrate fully, also uneconomical economically.Secondly, with regard to chemical plating itself, wanting only just to deposit the metal level that thicker, that the border is neat, as to conduct electricity very well, be suitable as wiring board conduction slice uses with chemical plating, is inconvenient.This is because of the various insulating material of making wiring board in traditional being used to, does not have to select with chemical plating the prior art of plated metal figure, therefore also needs to solve this technical problem.At last, also has a very important problem, the pattern of the circuit of industrial actual needs is very complicated, often just need tens on the bar printing wiring board, even the disjunct each other conductive metal layer bar of hundreds of bar, with the method for no electrochemistry plating how could be in the position that needs deposition by design plated metal exactly, also be the technical issues that need to address; Can be reduced volume, need very thin metal level bar sometimes on the wiring board, the distance between the conductiving metal strip be very near sometimes, satisfy the requirement of electric property aspect with the method for chemical plating deposition, and also being needs the problem that solves; After above-mentioned these problems all solve, also need to solve and how could continue the problem of plated metal with on the printed substrate that electric plating method is very complicated at figure, the conductive metal layer bar is not connected again each other.
Through studying for a long period of time, the inventor finds, adopts specific processing step just can solve above-mentioned all problems fully.Thereby can be used in the method for direct conductive metal deposition on the insulating base, manufacture printed substrate.With the printed substrate of this explained hereafter, cost is low; Save metal material; Wiring board can not be out of shape in the course of processing; The metal conductive strips border is neat; Metal conducting layer combines with base plate firmly, can not break away from when welding; The metallic copper of electroplating deposition, or silver, surperficial solderability is good, and can improve the soldering reliability between element and the printed wire at an easy rate at the hole of plug connector elements inwall plated metal; Particularly, shortened technological process greatly and reduced cost producing the two-sided circuit of plated-through hole that extensively adopts now; Since adopted the galvanoplastic plated metal, therefore can be at any metal of conducting metal outside deposition, and this is for HF link and itself with regard to having the printed substrate that patches a little very big benefit is arranged; In addition, the discharging waste liquid amount of this method is little, has reduced the influence to environment.
Therefore, first purpose of the present invention provides and adopts conventional chemical to plate used solution, first chemical deposition on insulating base, and then electroplating deposition conducting metal, the process of producing printed substrate.This process can be divided into two parts, and its step separately is as follows.First selects suitable insulating base for use; Accomplishing fluently need be at the open-work of inwall plated metal by design; With the conventional sensitizing solution that is suitable in the chemical plating, just reducing solution soaks; After the clean dry, carry out figure transfer, coated protective finish on the position that does not need plated metal on the base plate; Activated solution with conventional in the chemical plating has just contained the catalytic action metal ion solution, soaks; At last it is placed chemical plating solution, up to the metal that has deposited desired thickness, the step of coated protective finish also can be after activation step, carries out before the chemical plating.
A base plate and a conducting surface that second portion is crossed first one step process are superimposed, though be not communicated with mutually between the bonding jumper of chemical deposition on each face of base plate, but metal level by open-work inwall deposition, arbitrary metal level bar on each face is communicated with the metal that the aperture of another side deposits on every side, therefore after one side was superimposed with conducting surface, any plated metal on the another side also just all had been communicated with conducting surface; Again superimposed conducting surface and base plate are placed electroplating bath, as negative electrode, plated metal just can be continued in the energising back on the metal of the side that does not contact with conducting surface.
Second purpose of the present invention provides by the detail of design coated of wiring board or deposited on the insulating base of conductive materials, continues plated metal on conductive materials with electric plating method, to produce the method for printed substrate.
The 3rd purpose of the present invention provides the printed substrate of through hole conduction, the method for electroplating deposition metal.
In this specification and the appended claims, the meaning of used term is as mentioned below.
" printed substrate " is meant that insulating material is a base plate, a lot of bars are gone up on its surface compound conductive devices of disconnected conductiving metal strip each other.It is widely used for computer, electronic instrument, and television set, solid integrated circuit, and in the various electronic circuit product.
The meaning of " coated " speech is meant any method of using, certain material that can be attached to base plate is applied on the base plate, for example certain coating is printed on the base plate by detail of design with silk screen printing or offset printing, spray printing coating on base plate perhaps is coated with full photoactive coating earlier at backplate surface and is photo-etched into methods such as required pattern again.
" alligatoring " instigates insulating material surface roughening, just removes the processing of surface-brightening film." mechanical alligatoring " refers to make surface coarsening with the friction or the method for impacting, as abrasive lapping, with shaggy object pressure rolling etc." chemical roughen " refers to use the chemical reagent coarse surface.
" open-work " refers to that inserting element leg on the base plate penetrates the hole or the conductive hole of printed substrate.
" sensitization processing " refers to that any backplate surface that makes has the reproducibility processing, as soaking with reducing solution." the active processing " refers to the mass treatment backplate surface that catalytic action is arranged, for example with the surface after the argentiferous ion solution processing sensitization.
" conducting surface " refers to the conducting surface of any material, as the wire side that fine wire is woven into, and film conducting surface etc.
" protective layer " refers to the general position that can cover institute's coated commonly used, and it is not contacted with liquid.For example, the coating of using in the etch, printing ink, photoresists, photosensitive dry film etc.
Hereinafter be described in detail the present invention.
Industrial, require printed substrate fire-retardant, the solderability of conductive layer is good, especially at the hole inwall of need insertion element welding, wishes also to deposit easy weldering metal, can reduce the dry joint rate greatly like this.Require conducting metal to combine with base plate firmly in addition, can heat not break away from during welding.Use method of the present invention, can produce the printed substrate that satisfies above-mentioned requirements fully.In concrete enforcement, should preferentially select for use fire-retardant, the base plate of good insulation preformance, as epoxy resin board, the phenolic resins plate, polyimide plates etc. should be pointed out that method of the present invention almost can implement on any known insulating sheet material, never be limited to above-mentioned different materials.
Behind the selected base plate, at first punching, every hole inwall needs the hole of plated metal all will accomplish fluently in advance.And every strip metal conductive layer that will deposit will surround one at least and penetrate base plate, and inwall is wanted the hole of plated metal.The position in hole should be very accurate, therefore preferably uses mould or numerical control to bore punching.
Some insulating base needs surface coarsening to remove the shiny film layer on surface.Alligatoring is all wanted on the double-sided wiring board two sides, and the single face wiring board also is that the two sides alligatoring is better.Certainly also alligatoring one side only all, but around the aperture of another side, carry out roughening treatment.In addition, also can punch after the first alligatoring.In general, the hole inwall does not need alligatoring.Certainly, some insulating material is arranged also, do not need alligatoring.
The method of alligatoring is a lot, should at first select solvent alligatoring and chemical roughen method for use.For the material that is difficult to these two kinds of method alligatoring, can only use mechanical roughening method.After wishing alligatoring, concave-convex surface change to be wanted greatly, and the distance between concavo-convex is little, and alligatoring is just wanted carefully, and is close.Therefore, when grinding rotten alligatoring, should select finer abrasive for use.After the alligatoring, backplate surface be cleaned up.
Chemical roughen is very desirable method of roughening, and the kind of coarsening solution is a lot, can select suitable coarsening solution for use according to the material of insulating base.The specific resin of coated on base plate, and then alligatoring earlier also is the method for roughening that is in daily use.
As long as can make backplate surface that reproducibility is arranged, any known sensitization processing method all can be used in the method for the invention.From considering economically, better with the Bivalent Tin sensitization.For making all fully sensitizations of concave-convex surface place, can in Bivalent Tin solution, add the sensitization auxiliary agent, the composition that wherein mainly works is a surfactant.Should select the easiest surfactant that is adsorbed for use according to baseboard material.
After base plate after the sensitization dried up, can the coated protective layer.The method of coated is a lot, as can printing, but spray printing, also all coated photosensitive composition photoetching again.As long as the design of pressing printed substrate will not need the guarded by location of plated metal firmly to get final product on the base plate.Material on the coated should be to later activation processing and the not influence of chemical plating solutions employed.Material commonly used is a printing ink, and photoresist and dry film can print to printing ink on the base plate with screen printing technique simply.The definition of printing has determined the definition of wiring board, the just spacing of conducting metal on base plate and the width of conductiving metal strip.When making single side printed wiring board, should be noted that at the base plate another side and want the aperture of plated metal to stay next little garden on every side that the coated protective layer will not deposit metal, the conductive junction point during as plating at these places, little gardens later at each inwall.But certain contact Any shape is as long as be communicated with metal on the inwall of hole.With photoetching process protection, can make copper lines and copper cash spacing and be 0.2 millimeter or printed substrate more clearly.
Identical in the plating of activation processing and traditional chemical.But during owing to chemical plating, need not deposit too thick metal, in other words, the purpose of chemical plating only is to provide necessary conductive metal film when electroplating.Therefore, as long as chemistry is plated to the continuous metal film.For economy, just there is no need to make too dense precious metal ion activating solution.Silver ion is more satisfactory activation active ingredient.Sometimes also can save the activation processing step, perhaps activation processing and chemical plating are finished simultaneously.
After the activation processing, carry out figure transfer again,, also can reach purpose of the present invention not needing the position of plated metal to protect.
After the activation processing, can soak chemical plating.Do not have electrochemical deposition at non-metal material surface, extensive use need not to be described in detail herein.The chemical plating fluid of any routine is all in the method for the invention available, but for economy, first-selected is chemical bronze plating liquid.Slightly have any different with the chemical plating of routine, this step of the present invention does not need to deposit too thick metal level, but wishes that the metal of deposition is careful evenly, forms the continuous conduction film, therefore, can select the lower chemical plating fluid of concentration for use.
In addition, before activation processing, base plate according to the detail of design coated protective layer, therefore, activation processing and chemical plating all only work in the position that does not have coated.So the base plate after the chemical plating has been the wiring board that has the conducting metal of required pattern just.Just the thickness low LCL of conductive metal layer is not suitable for actual needs.Also be appreciated that at this moment, inwall has also deposited metal in previously described hole, and the metal on the inwall of hole is connected one by one with the metal on base plate two sides.
On the section of border, printing coated protective layer is difficulty relatively around the base plate.In coated step also coated on section not.On printed substrate, also need the open-work of no metal on the inwall sometimes.Therefore, can or immerse before electroplating before the chemical plating fluid, adopt the die-cut method of mould to cut away the limit of base plate and go out the open-work that inwall does not need plated metal.Certainly this step also can in the end be carried out, but can slightly increase cost like this.
One plane electric conductor is flattened on the base plate that chemical plating has been crossed, the metal that has deposited on the base plate directly contacts with planar conductor, like this, by the metal on the hole inwall of accomplishing fluently in advance, just the metal with any chemical deposition on the base plate another side is communicated with planar conductor.Put into electroplating bath when the base plate that will make up like this and planar conductor, during as negative electrode, on any chemical deposition metal film of base plate another side, all can continue electrodeposit metals, up to required thickness.Obtain at last, the hole inwall also electro-deposition the wiring board of metal.Planar conductor is attached to another side, electroplates once more, just can obtain double-sided wiring board.
When carrying out an invention, plane electric conductor and base plate are superimposed, and it is a lot of to make metal and conducting surface on the chemical plating tie the method for touching mutually, and for example available conductive film is a conducting surface, and it is attached to the one side of base plate, electroplates another side.Reasonable method is to adopt frock clamp.There are two class frock clamps very suitable.A kind of is the pinching frock clamp, and another kind is the tensioning-type frock clamp.
For thicker base plate, more than 1 millimeter, base plate has certain rigid, and is better with clamping device as the thickness of insulating base.Clamping tool anchor clamps basic structure is rectangular frame, is similar to the picture frame in the family, and material can be selected stainless steel for use, the material of any ability electroplate liquid corrosion such as engineering plastics.Size by base plate is made rectangular frame, make framework just push down base plate around, expose the part that will electroplate thickening on the base plate.The base plate another side contacts with conducting surface, wire netting or other soft electric conducting materials that conducting surface is soft, conducting surface backing elastomeric material, elastomeric material backing one rigid plane.After fastening between rigid plane and the framework, elastomeric material and conductive metal mesh are sandwiched between said rigid plane and the base plate, utilize the elasticity of elastomeric material, the any a slice metallic film that has deposited on the base plate is contacted with conductive metal mesh, and said any a slice metallic film is all by the metallic communication of the chemical deposition on open-work that inwall has deposited metal and the one side that will electroplate thickening.So just caused the metal film that mutual disjunct each bar will be electroplated thickening on the base plate all by open-work and conductive metal mesh UNICOM, can thicken with electric plating method.
Folded elastomeric material can also can be the air bag of thin flexible wall with elasticity rubber slab preferably between said rigid plane and the base plate.The pressure of gas in the control airbag can make the metallic conduction net well contact with metal film on the base plate; And with gas pressure as power fastening between framework and the rigid face, can also simplify the structure of whole frock clamp.Also can be with another piece base plate as said rigid face, at this moment the basic structure of frock clamp is two rectangular frames that can be secured together.The concrete practice is, the base plate that electroplate thickening is as the mirror picture frame framework of packing into of packing into, the one side that electroplate outwardly, another side is respectively put the layer of metal conductive mesh, the centre is elastomeric material or airbag, these two frameworks are fastened to becomes an assembly more together.Assembly can be electroplated two base plates of thickening simultaneously.
When rigidity big when base areas or base plate is not enough, only pushes down around the base plate, rely on elasticity to be difficult to guarantee that each piece metallic film can both reliably contact with conductive metal mesh.At this moment can use ladder-shaped frame.The principle of ladder-shaped frame frock clamp is identical with above-mentioned rectangular frame.Just add one or many muscle in the middle of rectangular frame, if original framework was " square shape ", ladder-shaped frame just becomes " day font " or " order font ".Owing to added muscle, as many asly reduce the base areas that monolithic will compress, so just increased the elastic force of the elastomeric material between base plate and the rigid face, can guarantee that arbitrary block of metallic film reliably contacts with conductive metal mesh on the base plate.Doing the problem of bringing like this is can't once electroplate the one side that will thicken all to electroplate thickening, because added " muscle " covered the part base plate, during plating, the part that is covered can not deposit metal.The available thickening method once of electroplating is once more remedied, and the framework of electroplating jig just exposes the part that covers when electroplating thickening for the first time once more, and will cover the part of having electroplated thickening for the first time.At the intersection of twice electroplating deposition metal, the fin of plated metal may appear, and this can grind off with mechanical means when reprocessing.
Say in principle, as long as on jig frame, fill up the muscle of enough amounts, can electroplate the thickening base plate of size arbitrarily, and will not have the problem of loose contact between metallic conduction net and the base plate with the method for above-mentioned second time electroplating thickening.
Base plate is thinner, and the rigidity of base plate is relatively poor, when perhaps the length of base plate is very big, adopts the tensioning-type frock clamp favourable.The backing rigid face of tensioning-type anchor clamps is the bigger curved surface of radius of curvature, garden arc surface preferably, the arc length of garden arc surface with to electroplate the length that adds base plate and match.On the convex surface of curved surface, put one deck elastomeric material earlier, put conductive metal mesh again, the base plate of electroplating thickening places conducting metal online, apply pulling force simultaneously at the base plate two ends, direction of pull is identical with the curved surface tangential direction basically, and the one side of base plate is pressed onto conductive metal mesh and elastomeric material on the arc surface of garden, and base plate, conductive metal mesh and elastomeric material all are deformed into the garden arc surface at this moment, and because the effect of base plate tension force, conductive metal mesh and elastomeric material all are clipped between base plate and the curved rigid surfaces.As long as it is enough big to be applied to the pulling force at base plate two ends, just elastomeric material can be compressed, the elastic force of elastomeric material makes wire netting contact with arbitrary block of metallic film on the base plate concave surface, this effect with the pinching anchor clamps is the same, the purpose that is able to make on the base plate convex surface metal that disjunct each bar mutually will electroplate thickening all to connect with conductive metal mesh.
If make elastomeric material with airbag, the base plate two ends are fixed to earlier on the curved rigid surfaces, then to airbag inflation, increase airbag pressure, just increased base plate tension force, tension force is enough big, just can guarantee that conductive metal mesh reliably contacts with every metal film on the base plate concave surface.Because when using the tensioning-type anchor clamps, base plate will change shape, thus the big curved rigid surfaces of garden arc radius of curvature should be used as far as possible, to reduce the bending deformation quantity of base plate.
Certainly, can any metal of lining with plating step.For example, can first copper facing, the surface is silver-plated more then, can be fit to the wiring board that high frequency uses.In the situation that wiring board need be plugged on the complete machine, also can design plugging position in the circuit board, at electroplating work procedure, wear-resisting grafting metal on plugging position is electroplated.
Because the metal of chemical deposition and insulating material surface are that machinery is compound, therefore as long as the concavo-convex degree on insulating material surface is suitable, and, plated metal and bottom plate combined intensity are enough to satisfy the requirement of using as wiring board, can both be as the base plate of producing printed substrate by method of the present invention.Compare with the lamination copperclad plate, significantly benefit is that the internal stress between depositing metal layers and base plate is little, still keeps higher binding strength in welding temperature.
In the processing step of the present invention, the step of figure transfer protective layer must be carried out after sensitization is handled.This be because, if before sensitization is handled, carry out, then on the protective layer that does not need plated metal, also may deposit metal, the result, clear at the bonding jumper obscure boundary that the position that needs plated metal deposits, even cause short circuit.Certainly, figure transfer protective layer step also can be carried out after activation processing.
In view of the expense of electroplating deposition metal well below chemical plating, therefore, should be as far as possible the amount of electroless deposition metal be controlled to minimum.As long as it is the film that is enough to conduct electricity in the chemical deposition just should stop chemical plating, and thicken depositing metal layers with galvanoplastic, the most economical so.In addition, the metal boundary of electroplating deposition is neat, surface-brightening, and solderability is good, and is therefore in the metal that is deposited, big more with the ratio of electroplating deposition, and the easy more width true-to-size plated metal bar that obtains is worthwhile more economically.
From the narration of front as can be seen, in the technical process of production printed substrate of the present invention, make the metal conducting one by one that deposits on the base plate two sides by the metal that is deposited on the through-hole wall, and then with a conducting surface and the one side of base plate superimposed make on the another side all each other each plated metal bar that do not communicate all with the conducting surface conducting, electroplate, this is one of important technology feature of the present invention again.Therefore, have required conduction pattern on any one side that adopts earlier other technologies to make insulating base, and by open-work and another side conducting, the re-plating plated metal with the method for production wiring board all within the scope of the present invention.
Provide following example be intended to one the step specify method of the present invention, certainly do not have the present invention to be only limited to this meaning.
Example 1
0.2 centimetre of epoxy laminate of 30 cm x, 10 cm x, promptly general printed substrate base plate, with No. zero sandpaper intersect destroy the surface-brightening film after, with conventional junket acid anhydride and the corrosion of concentrated sulfuric acid corrosive liquid.With 1.8 millimeters drill bits, 2.5 millimeters drill bit is beaten a lot of open-works with 3 centimetres spacing onboard.Dry after plate cleaned up.
Prepare every liter and contain 2 gram sodium alkyl sulfonates, 30 milliliter 36% hydrochloric acid and 25 gram SnCl
22H
2The sensitizing solution of O.Base plate after will drying then soaked 1 minute in this room temperature sensitizing solution, used rinsed with deionized water after the taking-up.
After drying base plate is placed the activating solution of room temperature to soak 1 minute.Contain 2 gram AgNO in every liter of activating solution
2, 150 milliliter 95% ethanol and be enough to make the last fully transparent ammoniacal liquor of solution.After from activating solution, taking out base plate, can see darkening.
On the base plate after the activation, dip in the printing ink of color printing plastic film with the pen of drawing and scribble.All scribble on the plate two sides, a simulate press wiring board stays 0.5 millimeter, and 1 millimeter, 2 millimeters and the wide fillet of 5 millimeter are not coated with, and the garden ring that stays about 4 mm dias around the aperture is not coated with, as pad.Every the fillet that stays all links to each other with the garden ring that is not coated with around the hole at least.To be coated with full printing ink between the fillet.On the another side, just stay the garden ring around the aperture and be not coated with.
Contain 30 gram Na in the chemical plating fluid
2EDTA, 10 gram CuSO
47H
2O, 0.2 gram dodecyl sodium sulfate, 15 milliliter 38% the formaldehyde that just adds before 10 gram NaOH and the use.Soaked 5 minutes under the room temperature, take out the back as seen, all do not deposited one deck copper film in the position of inking, comprise that the inwall of open-work has also deposited copper film at all.Measure with avometer 10 Ohmic resistance shelves, the resistance between every copper layer fillet that links to each other by the garden ring of copper on the open-work inwall and another side encircles with little garden is zero.
Use the thinnest commercially available sift flour screen cloth as conducting surface, the screen cloth of 30 centimetres of 10 cm x is overlapping with the one side that is not coated with around the aperture just, the online soft rubber pad that covers one deck 3 millimeters thick, cover the plastic plate of one 3 millimeters thick on the rubber slab again, plastic plate and base plate are clamped, the negative level of storage battery is received in wiring from the screen cloth.The positive level of battery links to each other with a copper plate, folder after copper plate and the chemical plating is gone up the base plate of conducting surface and is put into a container together, and copper sulphate electroplate liquid and copper brightener are arranged in the container.Switch on after 15 minutes, as seen all deposited the thicker bright copper of one deck above the copper film fillet with electroless deposition earlier, and also deposit upward bright copper on the hole wall at all.
Example 2
By the pattern among the standard GB 45881-45882-84, on epoxy laminate, adopt the basic step of embodiment 1, made a two-sided standard test panel, just use the photoetching process transition diagram instead.Detect through printed substrate inspection center, the result is as follows.
Insulation resistance 5 * 10 between conductive copper bar
11Ohm
Between 10 seconds coating of 265 ℃ of tin pots immersed solder and base material
There are not foaming, lamination
The surface solderability
235 ℃ of 3 seconds times of test temperature, can weld
Minimum 200 microhms of hole resistance
Peel strength 0.62N/mm
The bend test bending just can fracture for 5 times.
Claims (7)
1, on the insulating material base plate, earlier no electrochemistry plating, the re-plating conductive metal deposition, the technology of producing printed substrate is characterized in that comprising the steps:
(1) with chemical reagent and/or mechanical means alligatoring backplate surface;
(2) according to the design of wiring board, perforated wall needs the open-work of plated metal on base plate;
(3) sensitizing solution that the base plate that has openning hole is placed the conventional chemical plating use carries out sensitization and handles;
(4) according to the design of wiring board, on the backplate surface that sensitization was handled, carry out figure transfer, do not needing the position coated protective layer of plated metal;
(5) the base plate of coated protective layer places the activating solution and the chemical plating fluid of conventional chemical plating use to carry out activation processing and chemical deposition successively, is not having the position plated metal of coated protective layer;
(6) will be in the chemical deposition one side of the base plate of metal superimposed with a conducting surface, place electroplating bath as cloudy plate, energising continues the electroplating deposition metal on the metal level bar of any chemical deposition of base plate another side.
2, technology according to claim 1, but wherein used backplate surface is the material of direct chemical deposition, and save the alligatoring step.
3, technology according to claim 1, the step of wherein said coated protective layer was carried out before chemical deposition metal after the activation processing.
4, technology according to claim 1 in the electroplating deposition step (6) wherein, adopts a kind of in following two kinds of frock clamps, makes the one side of the base plate of metal in the chemical deposition superimposed with a conducting surface:
The pinching anchor clamps, it comprises rectangular frame, conductive metal mesh or paper tinsel, elastomeric material or airbag, rigid plane type liner plate and the part in addition that rectangular frame can be fastened to the rigidity liner plate;
The tensioning-type anchor clamps, it comprises garden arc surface shape rigidity liner plate, elastomeric material or airbag, conductive metal mesh and the base plate two ends is applied the device of pulling force, makes elastomeric material or airbag between base plate and the garden arc surface liner plate clamped.
5, technology according to claim 4 has installed one or more muscle additional in the framework of wherein said pinching anchor clamps.
6, technology according to claim 4, it is elastomeric material that wherein said pinching anchor clamps and tensioning-type anchor clamps are all used airbag, and is with earlier anchor clamps and base plate being fixed, inflate in airbag, making clamp or tension.
7, the open-work inwall that adopts technology that aforementioned any one claim limited to produce has deposited the printed substrate of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89100432 CN1034841A (en) | 1989-02-04 | 1989-02-04 | The manufacture method of printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89100432 CN1034841A (en) | 1989-02-04 | 1989-02-04 | The manufacture method of printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1034841A true CN1034841A (en) | 1989-08-16 |
Family
ID=4853860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89100432 Pending CN1034841A (en) | 1989-02-04 | 1989-02-04 | The manufacture method of printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1034841A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100508235C (en) * | 2004-01-09 | 2009-07-01 | 中国科学院上海微系统与信息技术研究所 | Preparation method of phase storage unit device |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
-
1989
- 1989-02-04 CN CN 89100432 patent/CN1034841A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100508235C (en) * | 2004-01-09 | 2009-07-01 | 中国科学院上海微系统与信息技术研究所 | Preparation method of phase storage unit device |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN104047041B (en) * | 2013-03-15 | 2017-04-26 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
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