CN1034792C - Fluxes for metal recombination - Google Patents
Fluxes for metal recombination Download PDFInfo
- Publication number
- CN1034792C CN1034792C CN 94108027 CN94108027A CN1034792C CN 1034792 C CN1034792 C CN 1034792C CN 94108027 CN94108027 CN 94108027 CN 94108027 A CN94108027 A CN 94108027A CN 1034792 C CN1034792 C CN 1034792C
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- composite
- solder
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- Powder Metallurgy (AREA)
Abstract
The present invention relates to a welding flux for metal composition, which belongs to the field of welding materials. The welding flux has the following chemical components by weight percentage: 42 to 65% of Cu, 13 to 25% of Ni, 15 to 33% of Zn, 3 to 10% of Sn, 1 to 5% of Pb, 2 to 4.5% of P, 0.4 to 0.5% of Si, 0.0001 to 0.001% of Au and 0.1 to 1.0% of Ag. The welding flux is mainly suitable for the composition process of composite metal plates or composite coils. The welding flux has the main functions of lowering the melting point of an interface between a base layer plate and a composite layer plate, increasing a wetting property between the base layer plate and the composite layer plate, activating the interface and accelerating the atomic diffusion of the interface, so that atomic combination between the base layer plate and the composite layer plate is achieved. Thus, the binding strength of a composite body is greatly increased.
Description
The invention belongs to brazing material field.Mainly be applicable to the recombination process of composite metal plate or coiled composite.
Metallic composite as the composite plate that normal carbon steel plate and corrosion resistant plate, copper coin or titanium plate are composited, has obtained using comparatively widely.The application of metallic composite is mainly based on economical and economize on resources.For example, require to possess the pressure vessel of resistance to corrosion, suitable to adopt stainless steel to make, but the cost height; Composite plate that get is made this class pressure vessel if employing common straightcarbon steel and stainless steel are compound, and the thickness of corrosion resistant plate only is 2～10% of integral thickness, like this, has not only kept the corrosion resistance of container, and has reduced cost widely.In addition, it is more rare resembling the expensive material heat-resisting, corrosion-resistant and that can conduct electricity of copper, nickel and chromium and so on, if use bilayer and 3-layer composite material, then can help to save resource.
The manufacture method of existing metallic composite mainly contains two kinds: the one, and it is compound to explode; The one, hot rolling is compound.
Exploding compound is that basal plate is placed on the smooth firm work anvil, normally on the cement plate, complex laminate is placed on the top of basal plate with certain angle, explosive is placed on the complex laminate top, in order to prevent that thin complex laminate from damaging, usually between explosive and complex laminate, fill up the buffer board of last layer metal or other material.Pass through explosive charge, produce one extremely strong impulsive force, make complex laminate produce extremely strong angular impact to basal plate, the energy of this collision is enough to make the interface of two plates to produce metallurgical the connection, promptly the interface of two plates reaches interatomic combination, reaches the composite with certain shear strength.The compound advantage of exploding is to prepare difform composite, as compound slab, compound end socket, multiple tube or the like.
Suitable plane is processed into the composite surface of basal plate and complex laminate with machine-tooled method in the compound normally elder generation of hot rolling, keeps clean; And the relative stack of the face that will process together, and welded perimeter vacuumizes then, seals the interface of two plates again, prevents to treat the surface oxidation of composite surface; After the sealing, the two superimposed plate that is superimposed sent in the heating furnace heat, after waiting to be incubated certain hour, carry out hot rolling, rolling roll-force (depressing power) and drafts can be determined according to the thickness of basal plate, complex laminate and final composite; After the hot rolling, superimposed plates promptly becomes required composite plate composite.
In above-mentioned two kinds of combination process, all be basal plate and complex laminate under required separately condition, both directly are composited, any solder is not added in the centre, therefore, the bond strength of composite is all not ideal enough.
The object of the present invention is to provide and a kind ofly can quicken recombination process, improve the metal composite solder of composite bond strength.
At above-mentioned purpose, metal composite of the present invention with the chemical composition (weight %) of solder is: Cu 42～65%, and Ni 13～25%, and Zn 15～33%, Sn 3～10%, and Pb 1～5%, and P 2～4.5%, Si0.4～0.5%, Au 0.0001～0.001%, and Ag 0.1～1.0%.
Solder of the present invention is a pulverulence, requires its granularity less than 0.010mm.
In the recombination process of composite metal plate or coiled composite, the solder amount that needs to add is 0.02～0.2Kg/m
2, promptly every square metre of composite surface area need add the solder of 0.02～0.2Kg.
In order to satisfy technological requirement and to obtain high-quality composite or coiled composite, solder should satisfy following several requirements:
(1) should have good wettability, can fully fill up two slits between the interface;
(2) have appropriate melting point and flowability, quicken the atom diffusion between the interface, guarantee that both are in conjunction with firm.
(3) should have stable and composition uniformly, under the high temperature compound condition, can not emanate because of the fusing of solder, the steam that can not volatilize strongly or volatilize poisonous element.
The mechanical performance at the interface after (4) compound and the technical performance requirement that physical property should satisfy monolithic composite panel or coiled composite.
Solder of the present invention mainly is applicable to the recombination process of composite metal plate or coiled composite.
In recombination process, between basal plate and complex laminate, add solder equably, its objective is the fusing point that reduces both interfaces, the top layer is dissolved in the solder, basal plate is directly contacted with complex laminate, improve mutual wetability; At high temperature, solder solid-state or molten state can reduce the fusing point at basal plate and complex laminate interface, activated interfaces, quicken the diffusion velocity of interface atom, that is to say the atom counterdiffusion mutually on the interface that makes basal plate and complex laminate, both reach combination between atom, thereby improve the bond strength of composite greatly.
By above-mentioned chemical composition as can be known, solder of the present invention is a kind of solder that mainly contains copper and multiple element composition.
Contain copper in the solder and make solder have good wetability and flowability, and, make compound interface also have higher corrosion resistance for composite plate or coiled composite; Its shortcoming is that fusing point is high slightly.In order to overcome this shortcoming, alloying element phosphorus, zinc, tin, lead and the silicon that can significantly reduce fusing point in solder, have been added.The adding of these elements has not only reduced the fusing point of solder, has improved wetability, and quickened the diffusion of interface atom, acceleration is by compound phase counterdiffusion between the atom between the two, thereby makes the interface reach interatomic combination, significantly improves the bond strength at interface.
Add nickel in the solder and can significantly improve interface bond strength, but the fusing point of solder is risen; In order to suppress the rising of fusing point, also added a spot of silicon.Silicon can also improve its wetability except reducing the solder fusing point, improve the spreading ability of solder at the interface, also improves interface bond strength simultaneously.
Tin and phosphorus can also improve the flowability and the interface bond strength of solder except reducing the solder fusing point, reduce fragility.
The purpose that adds a small amount of gold and silver is in order to improve the resistance to corrosion of composite plate or coiled composite compound interface.Silver also further reduces the fusing point of solder, improves the plasticity and the wetability of solder, and silver also improves the bond strength at interface, reduces fragility.
Production method of the present invention is simple.At first will be according to chemical composition the alloy material that is equipped with of proportioning in induction furnace, smelt, smelt good molten steel and directly be cast in the mold, after the demoulding, with its foundry goods fragmentation, further grind, sieve, make the fine powder of granularity, promptly become powdered filler metal goods of the present invention less than 0.010mm.
Compared with prior art, the present invention has following advantage:
(1), can improve the bond strength of composite widely.
(2), production method of the present invention is simple, it is also convenient to use.
(3), the present invention adapts to widely, can be used for the compound of various metal materials.
Embodiment
According to the chemical composition scope of metal composite of the present invention, three batches of solders have been prepared with solder.At first get the raw materials ready, divide then and successively in the 50Kg vaccum sensitive stove, smelt; Be cast into bar after the smelting, bar is processed into bits on lathe, and then grinds 360 mesh sieves, promptly makes the powdered filler metal goods.The concrete chemical composition of three batches of solder goods is as shown in table 1.
Three batches of solders are respectively applied in the three reply crossed belt materials.Kind and size that basic unit's band of three reply crossed belt materials, multiple layer are with are as shown in table 2.Performance test has been carried out to composite band in compound back, and its result is as shown in table 3.
The chemical composition (weight %) of table 1 embodiment solder
| The element lot number | Cu | Ni | Zn | Sn | Pb | P | Si | Au | Ag |
| 1 | 42.6998 | 17 | 30 | 3 | 2 | 4 | 0.4 | 0.0002 | 0.9 |
| 2 | 51.7992 | 15 | 16 | 9 | 4 | 3.5 | 0.5 | 0.0008 | 0.2 |
| 3 | 45 | 22 | 19.799 | 5 | 5 | 2.1 | 0.4 | 0.001 | 0.7 |
Table 2 embodiment solder is used for composite band and dosage
| The composite band lot number | Basic unit's band and size mm | Multiple layer band and size mm | Solder consumption Kg/m 2 |
| 1 | No. 3 common straightcarbon steels 3 * 500 * 30000 | 1Cr18Ni9 stainless steel 0.3 * 500 * 30000 | 0.05 |
| 2 | No. 3 common straightcarbon steels 8 * 500 * 20000 | 1Cr18Ni9 stainless steel 2 * 500 * 20000 | 0.03 |
| 3 | No. 3 common straightcarbon steels 10 * 400 * 50000 | Copper strips 2 * 400 * 50000 | 0.1 |
The compound back of table 3 embodiment composite band performance
| The performance lot number | Shear strength MPa | Cold-bending property d=2b angle of bend 180 | Intercrystalline corrosion | Surface quality |
| 1 | 500 | Intact | Qualified | Smooth smooth |
| 2 | 490 | Intact | Qualified | Smooth smooth |
| 3 | 230 | Intact | / | Smooth smooth |
Claims (3)
1, a kind of metal composite solder, it is characterized in that chemical composition (weight %) is: Cu 42～65%, and Ni 13～25%, and Zn 15～33%, Sn 3～10%, and Pb 1～5%, and P 2～4.5%, Si 0.4～0.5%, and Au 0.0001～0.001%, and Ag 0.1～1.0%.
2, solder according to claim 1, the granularity that it is characterized in that this solder is less than 0.010mm.
3, solder according to claim 1 is characterized in that in the recombination process of composite metal plate or coiled composite, and the solder amount that needs to add is 0.02～0.2Kg/m
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94108027 CN1034792C (en) | 1994-08-04 | 1994-08-04 | Fluxes for metal recombination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94108027 CN1034792C (en) | 1994-08-04 | 1994-08-04 | Fluxes for metal recombination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1116148A CN1116148A (en) | 1996-02-07 |
| CN1034792C true CN1034792C (en) | 1997-05-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 94108027 Expired - Fee Related CN1034792C (en) | 1994-08-04 | 1994-08-04 | Fluxes for metal recombination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1034792C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001005585A1 (en) * | 1999-07-20 | 2001-01-25 | Qinglian Meng | Composite metal coil or sheet and manufacturing method for same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863995B2 (en) * | 2003-05-16 | 2005-03-08 | Praxair S.T. Technology, Inc. | Method for brazing components using a Ni-Au-P ternary brazing alloy, the assembly so produced and the ternary alloy |
| CN101265120B (en) * | 2008-04-07 | 2010-12-08 | 哈尔滨工业大学 | Solder for braze welding silicon nitride ceramic and method for braze welding silicon nitride ceramic |
| US9616540B2 (en) | 2011-02-08 | 2017-04-11 | The University Of Utah Research Foundation | System and method for dispensing a minimum quantity of cutting fluid |
| CN106890850A (en) * | 2017-03-03 | 2017-06-27 | 河钢股份有限公司 | A kind of vacuum hot rolling method of composite metal plate |
| CN108687461A (en) * | 2017-04-10 | 2018-10-23 | 天津大学 | A kind of titanium-based amorphous alloy cored solder and preparation method thereof |
-
1994
- 1994-08-04 CN CN 94108027 patent/CN1034792C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001005585A1 (en) * | 1999-07-20 | 2001-01-25 | Qinglian Meng | Composite metal coil or sheet and manufacturing method for same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1116148A (en) | 1996-02-07 |
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Free format text: CORRECT: PATENTEE; FROM: MENG QINGLIAN TO: MENG QINGLIAN; YAN MENGJIE |
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| CP01 | Change in the name or title of a patent holder |
Patentee after: Meng Qinglian Patentee after: Yan Mengjie Patentee before: Meng Qinglian |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 19970507 Termination date: 20120804 |