CN114000028A - NiCoFeCuSiB high-entropy alloy brazing filler metal and preparation method thereof - Google Patents
NiCoFeCuSiB high-entropy alloy brazing filler metal and preparation method thereof Download PDFInfo
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- CN114000028A CN114000028A CN202111195133.5A CN202111195133A CN114000028A CN 114000028 A CN114000028 A CN 114000028A CN 202111195133 A CN202111195133 A CN 202111195133A CN 114000028 A CN114000028 A CN 114000028A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 110
- 239000000956 alloy Substances 0.000 title claims abstract description 110
- 238000005219 brazing Methods 0.000 title claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 43
- 239000002184 metal Substances 0.000 title claims abstract description 43
- 239000000945 filler Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000006263 metalation reaction Methods 0.000 title description 2
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000003723 Smelting Methods 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 229910052796 boron Inorganic materials 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 4
- 238000009689 gas atomisation Methods 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- 238000010791 quenching Methods 0.000 claims abstract description 4
- 230000000171 quenching effect Effects 0.000 claims abstract description 4
- 238000007712 rapid solidification Methods 0.000 claims abstract description 4
- 238000005303 weighing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims description 2
- 229910010038 TiAl Inorganic materials 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 13
- 239000010953 base metal Substances 0.000 abstract description 10
- 239000006104 solid solution Substances 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 238000002844 melting Methods 0.000 description 17
- 230000008018 melting Effects 0.000 description 17
- 239000010949 copper Substances 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 11
- 238000005476 soldering Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 229910004337 Ti-Ni Inorganic materials 0.000 description 2
- 229910011209 Ti—Ni Inorganic materials 0.000 description 2
- OMOVVBIIQSXZSZ-UHFFFAOYSA-N [6-(4-acetyloxy-5,9a-dimethyl-2,7-dioxo-4,5a,6,9-tetrahydro-3h-pyrano[3,4-b]oxepin-5-yl)-5-formyloxy-3-(furan-3-yl)-3a-methyl-7-methylidene-1a,2,3,4,5,6-hexahydroindeno[1,7a-b]oxiren-4-yl] 2-hydroxy-3-methylpentanoate Chemical compound CC12C(OC(=O)C(O)C(C)CC)C(OC=O)C(C3(C)C(CC(=O)OC4(C)COC(=O)CC43)OC(C)=O)C(=C)C32OC3CC1C=1C=COC=1 OMOVVBIIQSXZSZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- -1 Ti-Ni Chemical class 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention relates to a NiCoFeCuSiB high-entropy alloy solder and a preparation method thereof, wherein the high-entropy alloy solder comprises the following chemical components in atomic percentage: ni: 20% -30%, Co: 15% -25%, Fe: 15% -25%, Cu: 10-20%, Si: 4% -12%, B: 5 to 15 percent. The preparation method comprises the following steps: weighing raw materials required by smelting according to the components of the brazing filler metal; smelting the raw materials to obtain a high-entropy alloy brazing filler metal ingot; the amorphous high-entropy alloy foil strip is prepared by utilizing a vacuum quenching rapid solidification technology, or the high-entropy alloy solder powder is prepared by adopting a vacuum gas atomization technology. The high-entropy alloy solder has high mixed entropy, the structure of the high-entropy alloy solder is mainly solid solution structure, the high-entropy alloy solder can be used for braze welding connection between two extremely different materials of TiAl alloy and high-temperature alloy, and can simultaneously keep good compatibility with the two welded base metals to obtain high connection strength.
Description
Technical Field
The invention relates to a NiCoFeCuSiB high-entropy alloy solder and a preparation method thereof, belonging to the technical field of welding.
Background
The TiAl alloy has low density, high specific strength and good high-temperature oxidation resistance and creep resistance, is a light high-temperature-resistant structural material with development prospect, can be used at a high temperature of 750-860 ℃, is known as a substitute material of titanium alloy and high-temperature alloy, and has good application prospect in the fields of aviation, aerospace, nuclear industry, weapons, automobiles and the like.
For the TiAl alloy, in order to expand the engineering application range, the welding technology will be very important, especially for the connection of the TiAl alloy and other metals. For example, in the field of aviation, the metallic thermal protection structure of a hypersonic aircraft needs to meet the use requirement of 700-800 ℃, and the structural weight can be greatly reduced by adopting the scheme of a double-alloy honeycomb thermal structure consisting of TiAl alloy and high-temperature alloy. The brazing is one of the methods suitable for welding the double-alloy complex precise structure, in the brazing process, a welded base metal and the brazing filler metal are integrally heated, the brazing temperature is higher than the melting range of the brazing filler metal and lower than the melting point of the base metal, so that the brazing filler metal is melted, and the base metal is not melted. However, the TiAl alloy and the superalloy have a great difference in physical and chemical properties, and the joint thereof is a very different material combination. The components of the two materials are greatly different, the elements Ti, Al and Ni are extremely different to react to form brittle compounds such as Ti-Ni, Al-Ti-Ni and the like, and the thermal expansion coefficients of the TiAl alloy and the high-temperature alloy are different, so that cracks are easily induced in a connecting area. In addition, the existing titanium-based or nickel-based brazing filler metal is difficult to have good compatibility with the two extremely different materials, and is very difficult to realize good connection.
The high-entropy alloy is a novel material, generally can be defined as comprising five or more main elements, each element is alloyed according to equal atomic ratio or approximate equal atomic ratio, the high-entropy alloy is a novel multi-principal-element alloy, the mixed entropy of the high-entropy alloy is higher than the melting entropy of the alloy, and the high-entropy alloy has good comprehensive mechanical properties. According to the maximum entropy generation principle, a large entropy value can stabilize a high-entropy phase, and high mixed entropy generated by multiple elements is beneficial to forming a solid solution phase or a two-phase eutectic structure instead of an intermetallic compound by reducing Gibbs free energy.
Aiming at the technical current situation of braze welding connection of TiAl alloy and high-temperature alloy, a high-entropy alloy brazing filler metal with high-entropy characteristics is designed and prepared by referring to a high-entropy alloy design theory, so that the brazing filler metal is guaranteed to have a microstructure mainly based on solid solution, the reaction of the high-entropy alloy brazing filler metal and a base metal is controlled, the formation of brittle compounds in the welding process is reduced, and a welding seam structure mainly based on solid solution is obtained. The main constituent elements of the high-temperature alloy are Ni, Cr, Co, Fe and the like, and the high-entropy alloy solder mainly containing the elements is designed, so that the solder and the high-temperature alloy have good compatibility, but the high melting point of the elements can cause the high melting point of the high-entropy alloy solder, and further the brazing temperature is increased. And high welding temperature can damage the performance of the base material or lead the base material to be excessively corroded in the welding process, so that the welding method is not suitable for welding thin-wall parts. Therefore, the brazing filler metal is ensured to have a proper melting interval, and the design difficulty and the key of the high-entropy alloy brazing filler metal are also the difficulties and the keys.
Disclosure of Invention
The invention provides NiCoFeCuSiB high-entropy alloy solder and a preparation method thereof aiming at solving the problems, and aims to provide a technical solution for connection of two extremely dissimilar materials of a TiAl alloy and a high-temperature alloy, so that a connection joint has heat resistance matched with a base material, and the engineering application field of the TiAl alloy is widened.
The purpose of the invention is realized by the following technical scheme:
the technical scheme of the invention provides a NiCoFeCuSiB high-entropy alloy solder, which comprises the following chemical components in atomic percentage: ni: 20% -30%, Co: 15% -25%, Fe: 15% -25%, Cu: 10-20%, Si: 4% -12%, B: 5 to 15 percent.
In one implementation, Ni: 25% -30%, Co: 15% -20%, Fe: 15% -20%, Cu: 15% -20%, Si: 5% -10%, B: 10 to 15 percent.
In one implementation, Ni: 20% -25%, Fe: 20% -25%, Cu: 10% -15%, Si: 7% -12%, B: 10 to 15 percent.
In one implementation, Ni: 20% -25%, Co: 15% -20%, Fe: 15% -20%, Cu: 15% -20%, Si: 4% -9%, B: 5 to 10 percent.
The liquidus temperature of the high-entropy alloy solder is 1040-1150 ℃.
The high-entropy alloy solder has high mixed entropy, and the structure and the appearance of the high-entropy alloy solder are mainly solid solution structures.
The technical scheme of the invention also provides a method for preparing the high-entropy alloy solder, which comprises the following steps:
converting the atomic percentage composition of the high-entropy alloy brazing filler metal into mass percentage, and weighing raw materials required by smelting according to the mass percentage;
secondly, putting the prepared raw materials into a crucible, and smelting for 4-5 times to obtain a high-entropy alloy brazing filler metal ingot;
preparing the high-entropy alloy brazing filler metal ingot into an amorphous high-entropy alloy foil strip by using a vacuum quenching rapid solidification method; or preparing the high-entropy alloy brazing filler metal ingot into high-entropy alloy brazing filler metal powder by adopting a vacuum gas atomization method.
In one implementation, element B is added in the form of a Ni-B master alloy.
In one implementation, the melting process may be vacuum arc melting, arc melting under an argon protective atmosphere, vacuum induction melting, or electromagnetic levitation melting.
The technical scheme of the invention has the following characteristics and beneficial technical effects:
(1) compatibility of the brazing filler metal and the base metal: as mentioned above, the compatibility between the existing solder and the existing high temperature alloy is poor due to the difference of the physical and chemical properties between the TiAl alloy and the high temperature alloy. The invention provides a thought for designing a novel high-entropy brazing filler metal by selecting main elements in two welded parent metals based on a high-entropy alloy theory, namely designing a NiCoFeCuSiB system high-entropy alloy brazing filler metal. Ni, Co and Fe in the brazing filler metal are main constituent elements of the high-temperature alloy, and Cu, Ni, Co and Ni are infinitely mutually soluble, so that a continuous solid solution can be formed, namely the compatibility is very good. Therefore, the composition design can keep good wettability of the brazing filler metal and the high-temperature alloy base metal to be welded. In addition, it should be noted that the brazing filler metal also has a certain tendency to react with the base material to be welded in order to obtain a good metallurgical bond. Cu and Ni in the high-entropy alloy brazing filler metal of the NiCoFeCuSiB system have stronger reaction with Ti element in the TiAl alloy, but the multi-principal element characteristic of the high-entropy alloy determines that the content of the Cu and Ni elements in the high-entropy alloy brazing filler metal can be strictly controlled, so that the high-entropy alloy brazing filler metal has a certain reaction tendency with a TiAl alloy welded base metal due to the existence of the Cu and Ni elements, and the content of the Cu and Ni elements must be limited to control the formation of joint brittle compounds.
(2) Controlling the melting point of the brazing filler metal: as described above, brazing is a solid-phase welding method, i.e., the base material is not melted during brazing. When the brazing temperature is higher than the melting interval of the brazing filler metal and lower than the melting point of the base metal along with the temperature rise during brazing, the brazing filler metal is gradually melted, and the base metal is not melted. Therefore, when developing a novel brazing filler metal, it is important to ensure that the brazing filler metal has a proper melting point. For the NiCoFeCuSiB high-entropy alloy solder, the elements Si and B are melting-reducing elements in the traditional nickel-based solder, can perform eutectic reaction with Ni, Fe, Cu and Co elements, and can effectively reduce the melting point of the solder. In addition, the melting point of the element Cu is 1083 ℃, which is beneficial to controlling the melting point of the brazing filler metal. The NiCoFeCuSiB high-entropy alloy solder can complete the brazing of TiAl alloy and high-temperature alloy at the temperature below 1150 ℃.
(3) Compared with Ag-based and Ti-based solders, the solder disclosed by the invention has the advantages that the raw material cost is obviously reduced, the production cost of the solder is effectively reduced, but the heat resistance of a connecting joint is greatly improved, and the high-entropy alloy solder provided by the invention can meet the requirement that the connecting joint of TiAl alloy and high-temperature alloy dissimilar materials works at the high temperature of 750 ℃. Specifically, the room-temperature shear strength of the corresponding TiAl alloy and high-temperature alloy soldered joint reaches 180-220 MPa, and the 750-DEG C shear strength reaches 160-200 MPa.
(4) The high-entropy alloy solder can be used for directly carrying out the soldering connection of the TiAl alloy and the high-temperature alloy dissimilar material, does not need to apply pressure in the soldering process, has simple and easily controlled process compared with some contact reaction soldering and pressure diffusion soldering, and has the advantage of soldering a plurality of welding lines simultaneously.
Detailed Description
Example one
The method for preparing the high-entropy alloy solder for soldering the TiAl alloy and the high-temperature alloy comprises the following steps:
step one, mixing the atomic percentage Ni of the high-entropy alloy solder: 27%, Co: 18%, Fe: 17%, Cu: 15%, Si: 9%, B: converting 14 percent into mass percent, weighing simple substances of nickel, cobalt, iron, copper, silicon and boron according to the mass percent, and mixing to obtain proportioned raw materials
And step two, putting the prepared raw materials into a crucible, smelting by adopting a vacuum arc smelting method, and repeatedly smelting for 4 times to obtain the high-entropy alloy brazing filler metal ingot.
And step three, preparing the brazing ingot into an amorphous high-entropy alloy foil strip by using a vacuum quenching rapid solidification technology, and brazing the TiAl alloy and the high-temperature alloy under a vacuum condition.
Example two
The difference between the present embodiment and the first embodiment is: in the first step, the high-entropy alloy solder comprises the following components in atomic percentage: 23%, Co: 23%, Fe: 19%, Cu: 18%, Si: 8%, B: 9 percent; in the second step, the used smelting method is arc smelting under the argon protective atmosphere. The rest is the same as the first embodiment.
EXAMPLE III
The difference between the present embodiment and the first embodiment is: in the first step, the simple substance B is added in a form of Ni-17.6B (wt.%) intermediate alloy, that is, the amount of the required Ni-17.6B (wt.%) intermediate alloy is determined according to the amount of the required simple substance B, the amount of the simple substance Ni which needs to be added is calculated, and then the raw materials after proportioning are respectively weighed and obtained; in the second step, the smelting method is vacuum induction smelting. The rest is the same as the first embodiment.
Example four
The difference between the present embodiment and the first embodiment is: in the first step, the simple substance Si is added in the form of Al-12Si (wt.%) intermediate alloy, that is, the amount of the Al-12Si (wt.%) intermediate alloy is determined according to the amount of the simple substance Si, the amount of the simple substance Al which needs to be added is calculated, and then the raw materials after proportioning are respectively weighed and obtained; in the second step, the smelting method is electromagnetic suspension smelting; and in the third step, the brazing filler metal ingot is prepared into high-entropy alloy brazing filler metal powder by adopting a vacuum gas atomization technology. The rest is the same as the first embodiment.
Claims (8)
1. The NiCoFeCuSiB high-entropy alloy solder is characterized by comprising the following chemical components in atomic percent: 20% -30%, Co: 15% -25%, Fe: 15% -25%, Cu: 10-20%, Si: 4% -12%, B: 5 to 15 percent.
2. A NiCoFeCuSiB high entropy alloy solder according to claim 1, characterized in that the liquidus temperature of the high entropy alloy solder is between 1040 ℃ and 1150 ℃.
3. The NiCoFeCuSiB high-entropy alloy solder is characterized by comprising the following chemical components in atomic percentage: ni: 25% -30%, Co: 15% -20%, Fe: 15% -20%, Cu: 15% -20%, Si: 5% -10%, B: 10 to 15 percent.
4. The NiCoFeCuSiB high-entropy alloy solder is characterized by comprising the following chemical components in atomic percentage: ni: 20% -25%, Fe: 20% -25%, Cu: 10% -15%, Si: 7% -12%, B: 10 to 15 percent.
5. The NiCoFeCuSiB high-entropy alloy solder is characterized by comprising the following chemical components in atomic percentage: ni: 20% -25%, Co: 15% -20%, Fe: 15% -20%, Cu: 15% -20%, Si: 4% -9%, B: 5 to 10 percent.
6. A method for preparing the NiCoFeCuSiB high-entropy alloy solder as claimed in claim 1, which is characterized by comprising the following steps:
converting the atomic percentage composition of the high-entropy alloy brazing filler metal into mass percentage, and weighing raw materials required by smelting according to the mass percentage;
secondly, putting the prepared raw materials into a crucible, and smelting for 4-5 times to obtain a high-entropy alloy brazing filler metal ingot;
preparing the high-entropy alloy brazing filler metal ingot into an amorphous high-entropy alloy foil strip by using a vacuum quenching rapid solidification method; or preparing the high-entropy alloy brazing filler metal ingot into high-entropy alloy brazing filler metal powder by adopting a vacuum gas atomization method.
7. A method for preparing NiCoFeCuSiB high entropy alloy solder according to claim 6, characterized in that, the element B is added by Ni-B intermediate alloy form.
8. The method for preparing NiCoFeCuSiB high-entropy alloy solder according to claim 6, wherein the smelting method can be vacuum arc smelting, arc smelting under an argon protective atmosphere, vacuum induction smelting or electromagnetic suspension smelting.
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| CN202111195133.5A CN114000028A (en) | 2021-10-13 | 2021-10-13 | NiCoFeCuSiB high-entropy alloy brazing filler metal and preparation method thereof |
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| CN116497259A (en) * | 2023-05-11 | 2023-07-28 | 大连理工大学 | Preparation method of high-entropy bulk nanocrystalline magnetically soft alloy |
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| CN114853477A (en) * | 2022-04-28 | 2022-08-05 | 浙江师范大学 | Ablation-resistant high-entropy carbide-high-entropy boride-silicon carbide composite ceramic and preparation method thereof |
| CN114853477B (en) * | 2022-04-28 | 2022-12-27 | 浙江师范大学 | Ablation-resistant high-entropy carbide-high-entropy boride-silicon carbide composite ceramic and preparation method thereof |
| CN116497259A (en) * | 2023-05-11 | 2023-07-28 | 大连理工大学 | Preparation method of high-entropy bulk nanocrystalline magnetically soft alloy |
| CN116497259B (en) * | 2023-05-11 | 2024-04-19 | 大连理工大学 | Preparation method of high-entropy bulk nanocrystalline magnetically soft alloy |
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Application publication date: 20220201 |