CN103476894B

CN103476894B - Adhesive, adhesive material using same, and method for using said adhesive and material

Info

Publication number: CN103476894B
Application number: CN201280018169.9A
Authority: CN
Inventors: 福山雄大; 增田克之; 品田咏逸; 大越将司; 山本和德; 山口正利; 大山泰; 柳田裕贵; 片寄光雄
Original assignee: Hitachi Chemical Co Ltd
Current assignee: Showa Denko Materials Co Ltd
Priority date: 2011-04-12
Filing date: 2012-04-12
Publication date: 2017-02-15
Anticipated expiration: 2032-04-12
Also published as: WO2012140740A1; WO2012141267A1; TW201245372A; TWI535811B; CN103459544A; CN103476894A; KR101564156B1; TW201245373A; CN103459544B; TW201247824A; KR20130143664A; WO2012141271A1; CN103476895A; KR20130143665A; CN103476895B; KR20130143663A; KR101592662B1; KR101642174B1; WO2012141266A1

Abstract

An adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including the following: a monomer (A) that has at least two carboxyl groups; and a monomer (B) that has at least two amino groups. One condition (1) is that at least one of the following is a liquid at 25 DEG C: the first (A) of the aforementioned monomers, an anhydride thereof, and the other (B) of the aforementioned monomers. The other condition (2) is that the condensation resin contains a polyoxyalkane diyl group.

Description

Sticker and the sticky material using it and their using method

Technical field

The present invention relates to be also able to maintain that under hot environment adhesive sticker and using its sticky material and it Using method.

Background technology

All the time, as sticker, be used mostly is acrylic acid seriess sticker.Additionally, the adhesion as thermostability Silicone-based sticker has been recorded in agent, such as patent documentation 1.

Prior art literature

Patent documentation

Patent documentation 1：Japanese Unexamined Patent Publication 2009-256542 publication

Content of the invention

Invention problem to be solved

However, acrylic acid seriess sticker there are the following problems：Under hot environment（Such as more than 200 DEG C）Adhesion can not be maintained Property, produce bubbling, strip off.

Additionally, silicone-based sticker there are the following problems：Limited by the object that price is high, pasted（For example, to polyester film, The cohesiveness of the plastic materials such as polyimide film is low）.

Therefore, it is an object of the invention to provide be also able to maintain that under hot environment adhesive new sticker and its Using method.It is further an object that providing sticky material and its using method employing this sticker.

Method for solving problem

One aspect of the present invention is related to a kind of sticker, and it contains the condensation resin with following construction unit, institute State the monomer that construction unit passes through to make to comprise to have at least 2 carboxyls（A）And there is the monomer of at least 2 amino（B）Polymerization Property monomer polycondensation and obtain.

And, above-mentioned sticker meets following（1）And（2）At least one of.

（1）By above-mentioned monomer（A）, above-mentioned monomer（A）Anhydride and above-mentioned monomer（B）At least one selecting in the group of composition Planting at 25 DEG C is liquid.

（2）Above-mentioned condensation resin has polyoxy alkane diyl.

According to above-mentioned sticker, under hot environment（Such as more than 200 DEG C）Also maintenance high adhesion, fully suppression bubbling, The generation stripped off.Additionally, above-mentioned sticker shows high adhesion for adherends such as plastic materials.And then, above-mentioned sticker exists Also maintain high adhesion after adherend is peeled off, therefore, it is possible to stickup and stripping with adherend is repeated.

Above-mentioned sticker preferably meets above-mentioned simultaneously（1）And（2）.According to such sticker, cohesiveness improves further. Additionally, such sticker easily can be pasted onto on adherend by pressing at such as 0～50 DEG C.

In above-mentioned sticker, above-mentioned condensation resin preferably comprise by polyamide-imide resin, polyimide resin and At least one selected in the group of polyamide composition.

In above-mentioned sticker, above-mentioned condensation resin is preferably polyamide.

In above-mentioned sticker, the said structure unit in preferably above-mentioned condensation resin has above-mentioned polyoxy alkane diyl.That is, Above-mentioned（2）In polyoxy alkane diyl preferably be contained in said structure unit.

In above-mentioned sticker, in said structure unit from above-mentioned monomer（B）Structure preferably there is above-mentioned polyoxy alkane Diyl.That is, above-mentioned（2）In polyoxy alkane diyl preferably be contained in said structure unit from above-mentioned monomer（B）Structure In.

In above-mentioned sticker, above-mentioned polymerizable monomer is preferably with respect to above-mentioned monomer（A）And above-mentioned monomer（B）Total amount Ratio for 2.5～10mol% comprises the monomer with polyoxy alkane diyl and at least 2 amino（b-1）.

The other side of the present invention is related to a kind of sticker, its contain more than 50 mass % selected from polyamide, Condensation resin in the group of polyamide-imide resin and polyimide resin composition, above-mentioned condensation resin has polyoxy alkane Diyl.

In above-mentioned sticker, above-mentioned condensation resin can comprise the diamine unit with polyoxy alkane diyl.

In above-mentioned sticker, above-mentioned condensation resin can have the fragrant ring group of bivalence further it is also possible to comprise tool There are the dicarboxylic acid units of the fragrant ring group of bivalence.

In above-mentioned sticker, above-mentioned condensation resin can have Isosorbide-5-Nitrae-piperazine diyl further it is also possible to comprise to have The diamine unit of 1,4- piperazine diyl.

In above-mentioned sticker, the content of above-mentioned condensation resin is preferably more than 50 mass %.Additionally, above-mentioned sticker Can be made up of above-mentioned condensation resin.Such sticker is more excellent due to thermostability, heat-resisting therefore, it is possible to be more suitable for Property sticker use.

Above-mentioned sticker is peeled off from this adherend after for example can serve as being pasted onto on adherend and be heated to more than 200 DEG C Thermostability sticker.That is, the technique that above-mentioned sticker can be suitable for having the operation of the high temperature being exposed to more than 200 DEG C In.

The other side of the present invention is related to a kind of condensation resin as the application of sticker, and described condensation resin has Following construction unit, meets following（1）And（2）At least one of, described construction unit passes through to make to comprise there is at least 2 carboxylics The monomer of base（A）And there is the monomer of at least 2 amino（B）Polymerizable monomer polycondensation and obtain.

（2）Above-mentioned condensation resin has polyoxy alkane diyl.

The other side of the present invention is related to a kind of application in the manufacture of sticker for condensation resin, described condensation system tree Fat has following construction unit, meets following（1）And（2）At least one of, described construction unit pass through to make to comprise to have to The monomer of few 2 carboxyls（A）And there is the monomer of at least 2 amino（B）Polymerizable monomer polycondensation and obtain.

（2）Above-mentioned condensation resin has polyoxy alkane diyl.

The other side of the present invention is related to the application as sticker for the condensation resin with polyoxy alkane diyl, described contracting Syzygy resin is selected from the group of polyamide, polyamide-imide resin and polyimide resin composition.

The other side of the present invention is related to there is application in the manufacture of sticker for the condensation resin of polyoxy alkane diyl, Described condensation resin is selected from the group of polyamide, polyamide-imide resin and polyimide resin composition.

The present invention also provides a kind of sticky material, it possess supporter and be arranged on this supporter containing above-mentioned adhesion The adhesion coating of agent.

The present invention also provides a kind of using method of sticker, and it possesses：Adhering processes, via containing above-mentioned sticker Adhesion coating, the second adherend is pasted on the first adherend；Heating process, becomes more than 200 DEG C in the temperature of above-mentioned adhesion coating Under conditions of, heat above-mentioned first adherend and above-mentioned second adherend；And stripping process, from experienced above-mentioned heating process Above-mentioned first adherend peel off above-mentioned adhesion coating and above-mentioned second adherend.

In the using method of above-mentioned sticker, in above-mentioned adhering processes, preferably paste above-mentioned first adherend at 0～50 DEG C With above-mentioned second adherend.

In the using method of above-mentioned sticker, in above-mentioned stripping process, preferably at 0～50 DEG C from above-mentioned first adherend stripping From above-mentioned adhesion coating and above-mentioned second adherend.

In the using method of above-mentioned sticker, the above-mentioned adhesion coating being stripped can be recycled in above-mentioned stripping process In above-mentioned adhering processes.

The present invention also provides a kind of using method of sticky material, and it possesses：Adhering processes, are joined according to above-mentioned adhesion coating Put in the mode near above-mentioned adherend side, above-mentioned sticky material is pasted on adherend；Heating process, in above-mentioned sticky material Temperature become more than 200 DEG C under conditions of, heat above-mentioned adherend；And stripping process, from experienced above-mentioned heating process Above-mentioned adherend peels off above-mentioned sticky material.

In the using method of above-mentioned sticky material, in above-mentioned adhering processes, preferably at 0～50 DEG C, above-mentioned sticky material is glued It is affixed on above-mentioned adherend.

In the using method of above-mentioned sticky material, in above-mentioned stripping process, preferably peel off from above-mentioned adherend at 0～50 DEG C Above-mentioned sticky material.

In the using method of above-mentioned sticky material, can by the above-mentioned sticky material being stripped in above-mentioned stripping process again It is used in above-mentioned adhering processes.

The effect of invention

According to the present invention it is possible to also be able to maintain that adhesive new sticker and its user under offer hot environment Method.Additionally, according to the present invention it is possible to providing sticky material and its using method employing this sticker.

Brief description

Fig. 1 is the constructed profile of a preferred embodiment of the sticker representing the present invention.

Fig. 2 be represent measured using differential scanning calorimeter, the polyamide of embodiment 1-50～200 DEG C it Between thermally equilibrated figure.

Fig. 3 be represent measured using differential scanning calorimeter, the polyamide of embodiment 2-50～200 DEG C it Between thermally equilibrated figure.

Fig. 4 be represent measured using differential scanning calorimeter, the polyamide of comparative example 1 is at -50～200 DEG C Between thermally equilibrated figure.

Specific embodiment

Hereinafter, preferred embodiment the illustrating of the sticker to the present invention and sticky material.

（Sticker）

The sticker of present embodiment contains the condensation resin with following construction unit, and described construction unit passes through to make Comprise the monomer with least 2 carboxyls（A）And there is the monomer of at least 2 amino（B）Polymerizable monomer polycondensation and obtain.

And, the sticker of present embodiment meets following（1）And（2）At least one of.

（1）By monomer（A）, monomer（A）Anhydride and monomer（B）At least one selected in the group of composition is liquid at 25 DEG C Shape.

（2）Condensation resin has polyoxy alkane diyl.

According to such sticker, even if under being maintained at such as more than 200 DEG C of hot environment, also maintaining high adhesion, Fully suppression bubbling, the generation stripped off.

Here, above-mentioned condensation resin not necessarily makes above-mentioned polymerizable monomer polycondensation manufacture, as long as having energy Enough construction units being formed by the polycondensation of above-mentioned polymerizable monomer.

That is, above-mentioned in order to meet（1）It is not necessary to make above-mentioned condensation resin be the monomer for liquid using 25 DEG C（Or Anhydride is the monomer of liquid at 25 DEG C）To manufacture, if above-mentioned condensation resin have can by comprise 25 DEG C be liquid lists Body（Or anhydride is the monomer of liquid at 25 DEG C）The polycondensation of polymerizable monomer and the construction unit that formed.

Said structure unit in above-mentioned condensation resin can be to make a kind of monomer（A）And monomer（B）Obtained by polycondensation Construction unit or make various of monomer（A）And monomer（B）Construction unit obtained by polycondensation.In the case of the latter, in order to Meet above-mentioned（1）As long as being selected from various of monomer（A）, their anhydride and various of monomer（B）In the group of composition at least one Planting at 25 DEG C is liquid.

The monomer of said structure unit can be formed（A）And monomer（B）Can be confirmed by following methods.I.e., it is possible to will Compound generating during hydrolysis said structure unit, having at least compound of 2 carboxyls and have at least 2 amino is respectively It is set to monomer（A）And monomer（B）.

For example, following formula（1-1）Shown construction unit can be referred to as to make following formula（A-1）Shown monomer and following Formula（B-1）Shown construction unit obtained by monomer polycondensation.Here, in formula, R1 and R2 represents the organic group of bivalence.

[changing 1]

[changing 2]

[changing 3]

Here, in order that formula（1-1）Shown construction unit meets above-mentioned（1）, a solemnity（A-1）Shown monomer and formula （B-1）At least one in shown monomer is liquid at 25 DEG C.

In addition, for example, following formula（1-2）Shown construction unit can be referred to as to make following formula（A-2）Shown monomer And above-mentioned formula（B-1）Shown construction unit obtained by monomer polycondensation.Here, in formula, R³Represent the organic group of trivalent.

[changing 4]

[changing 5]

Here, in order that formula（1-2）Shown construction unit meets above-mentioned（1）If, by formula（A-2）Shown monomer, Formula（B-1）Shown monomer and following formula（A-2’）At least one selected in the shown group of anhydride composition is liquid at 25 DEG C ?.

[changing 6]

And then, for example, following formula（1-3）Shown construction unit can be referred to as to make following formula（A-3）Shown monomer And above-mentioned formula（B-1）Shown construction unit obtained by monomer polycondensation.Here, in formula, R⁴Represent the organic group of tetravalence.

[changing 7]

[changing 8]

Here, in order that formula（1-3）Shown construction unit meets above-mentioned（1）If, by formula（A-3）Shown monomer, Formula（B-1）Shown monomer and following formula（A-3’）At least one selected in the shown group of anhydride composition is liquid at 25 DEG C ?.

[changing 9]

As monomer（A）, the monomer with 2 carboxyls can be enumerated（Formula（A-1）Shown monomer）, there are 3 carboxyls Monomer（Formula（A-2）Shown monomer）, there is the monomer of 4 carboxyls（Formula（A-3）Shown monomer）Deng.

As the monomer with 2 carboxyls, such as oxalic acid, malonic acid, succinic acid, 1,3-propanedicarboxylic acid, adipic acid, heptan can be enumerated Diacid, suberic acid, Azelaic Acid, decanedioic acid, 1,9- nonane diacid, dodecanedioic acid, tetracosandioic acid, pentacosandioic acid, 18 The alkylene dicarboxylic acids such as docosandioic acid, phthalic acid, p-phthalic acid, M-phthalic acid, Isosorbide-5-Nitrae-naphthalene dicarboxylic acids, 1,5- naphthalene two Carboxylic acid, 2,6 naphthalene dicarboxylic acid, acenaphthene -5,6- dicarboxylic acids, pyridine -2,3- dicarboxylic acids, pyridine -2,6- dicarboxylic acids, 1H- imidazoles -4,5- Dicarboxylic acids, 1H- pyrroles -2,4- dicarboxylic acids, furan -2, the aromatic dicarboxylic acid such as 5- dicarboxylic acids, 2,5-ThiophenedicarboxyliAcid Acid, 1,3- Cyclohexane dicarboxylic acid, 1,4- cyclohexane dicarboxylic acid, 4- methylhexahydrophthaacid acid, 3- methylhexahydrophthaacid acid, 3- second Base hexahydrophthalic acid, 4- ethyl hexahydrophthalic acid, methyl norcamphane -2,3- dicarboxylic acids etc. have hexamethylene skeleton Dicarboxylic acids, 3- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid, 4- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid, methyl -3,6- Methylene -1,2,3,6- tetrahydrophthalic acid etc. has dicarboxylic acids of cyclohexene skeleton etc..

That is, as formula（1-1）In R¹, fragrant ring group of alkane diyl, the alcyl of bivalence, bivalence etc. can be enumerated.

As alkane diyl, preferably carbon number is 1～30 alkane diyl, and more preferably carbon number is 1～20 alkane diyl. Alkane diyl can also be able to be branched, preferably straight-chain for straight-chain.

As the concrete example of alkane diyl, can enumerate methylene, ethylidene, glyceryl, fourth diyl, penta diyl, dihexyl, Heptan diyl, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl, hexadecane diyl etc..

The alcyl of bivalence is the group with the no saturation of aromatic series or undersaturated carbocyclic ring structure.The alicyclic ring of bivalence The carbon number of base is preferably 3～20, more preferably 4～12.Additionally, the alcyl of bivalence preferably has cyclohexane ring.

As the alcyl of bivalence, can enumerate 1,3- hexamethylene diyl, Isosorbide-5-Nitrae-hexamethylene diyl, 4- alkyl cyclohexane- 1,2- diyl, 3- alkyl cyclohexane -1,2- diyl, 4,5- dialkycyclohexane -1,2- diyl, 3,4- dialkycyclohexane -1, 2- diyl, norcamphane diyl, 5- alkyl norcamphane -2,3- diyl, 3- alkyl -4- cyclohexene -1,2- diyl, 4- alkyl -4- ring Hexene -1,2- diyl, 4- methyl -3,6- methylene -4- cyclohexene -1,2- diyl etc..

Here, the alkyl being incorporated into the carbocyclic ring structure of the alcyl of bivalence is preferably the alkyl of carbon number 1～10, more excellent Elect the alkyl of carbon number 1～5 as.

The fragrant ring group of bivalence is to have the group of the ring structure having aromatic series.As the fragrant ring group of bivalence, preferably The fragrant ring group of the fragrant ring group of the bivalence of carbon number 6～20, the more preferably bivalence of carbon number 6～10.

As the fragrant ring group of bivalence, such as benzene diyl, naphthalene-diyl, biphenyl diyl, acenaphthene -5,6- diyl, pyrrole can be enumerated Pyridine -2,3- diyl, pyridine -2,6- diyl, 1H- imidazoles -4,5- diyl, 1H- pyrroles's -2,4- diyl, furan -2,5- diyl, thiophene Fen -2,5- diyl.Additionally, as benzene diyl, 1,2- benzene diyl, 1,3- benzene diyl, Isosorbide-5-Nitrae-benzene diyl can be enumerated.Additionally, making For naphthalene-diyl, 1,2- naphthalene-diyl 1,3- naphthalene-diyl, Isosorbide-5-Nitrae-naphthalene-diyl, 1,5- naphthalene-diyl, 1,6- naphthalene-diyl, 1,7- naphthalene can be enumerated Diyl, 1,8- naphthalene-diyl, 2,3- naphthalene-diyl, 2,6- naphthalene-diyl, 2,7- naphthalene-diyl etc..Additionally, as biphenyl diyl, can enumerate Biphenyl -4,4 '-diyl.

As the monomer with 3 carboxyls, the aromatic tricarboxylic acids such as such as trimellitic acid, hexamethylene -1 can be enumerated, 2, Ester ring type tricarboxylic acids such as 4- tricarboxylic acids etc..

That is, as formula（1-2）In R³, the alcyl of trivalent, fragrant ring group of trivalent etc. can be enumerated.

As the alcyl of trivalent, preferably hexamethylene three base, more preferably hexamethylene -1,2,4- tri- bases.

As the fragrant ring group of trivalent, such as benzene three base, naphthalene three base, preferably benzene -1,2,4- tri- bases can be enumerated.

As the monomer with 4 carboxyls, such as PMA, benzene -1 can be enumerated, 2,3,4- tetrabasic carboxylic acids, 1,2,5,6- Naphthalene tetracarboxylic acid, 2,3,6,7- naphthalene tetracarboxylic acid, 1,2,4,5- naphthalene tetracarboxylic acid, 1,4,5,8- naphthalene tetracarboxylic acid, 2,3,6,7- anthracene tetrabasic carboxylic acid, Phenanthrene -1,8,9,10- tetrabasic carboxylic acid, 3,4,9,10- tetrabasic carboxylic acid, 3,3 ', 4,4 '-biphenyltetracarboxyacid acid, 2,2 ', 3,3 '-biphenyl tetracarboxylic acid Acid, 2,3,3 ', 4 '-biphenyltetracarboxyacid acid, 3,3 ', 4,4 '-benzophenone tetrabasic carboxylic acid, 2,3,2 ', 3 '-benzophenone tetrabasic carboxylic acid, 2, 3,3 ', 4 '-benzophenone tetrabasic carboxylic acid, 3,3 ', 4,4 '-xenyl ether tetrabasic carboxylic acid, double（3,4- dicarboxyphenyi）Ether, double（3,4- Dicarboxyphenyi）Sulfone, 1- trifluoromethyl -2,3,5,6- benzene tertacarbonic acid, double（2,3- dicarboxyphenyi）Methane, double（3,4- dicarboxyl Base phenyl）Methane, 1,1- are double（2,3- dicarboxyphenyi）Ethane, 1,1- are double（3,4- dicarboxyphenyi）Ethane, 2,2- are double（3,4- Dicarboxyphenyi）Propane, 2,2- are double（2,3- dicarboxyphenyi）Propane, 4,4 '-（4,4 '-isopropylidene two phenoxy group）- bis-（Adjacent benzene Dioctyl phthalate）, double to penylene（Trimellitate）, double（3,4- dicarboxyphenyi）Dimethylsilane, double（3,4- dicarboxyphenyi） Aminomethyl phenyl silane, double（3,4- dicarboxyphenyi）Diphenyl silane, 1,3- are double（3,4- dicarboxyphenyi）- 1,1,3,3- tetramethyl Base disiloxane, 1,4- are double（3,4- dicarboxyphenyi dimetylsilyl）Benzene, 2,2- are double（3,4- dicarboxyphenyi）Hexafluoro Propane, 2,2- are double（4-（3,4- di carboxyl phenyloxy）Phenyl）HFC-236fa, 4,4 '-bis-（3,4- di carboxyl phenyloxy）Diphenyl Thioether, 2,3,5,6- pyridine tetrabasic carboxylic acid, pyrrolidine -2,3,4,5- tetrabasic carboxylic acid, pyrazine -2,3,5,6- tetrabasic carboxylic acid, thiophene -2,3,4, 5- tetrabasic carboxylic acid, oxolane -2,3,4,5- tetrabasic carboxylic acid, ethylidene tetrabasic carboxylic acid, 1,2,3,4- BTCA, 1,1,2,2- ethane Tetrabasic carboxylic acid, 1,1,2,3- propane tetracarboxylic acid, 1,1,6,6- hexane tetrabasic carboxylic acid, 1,2,4,5- cyclopentanetetracarboxylic, 1,2,3,4- ring Pentane tetrabasic carboxylic acid, 1,2,3,4- Tetramethylene. tetrabasic carboxylic acid, decahydronaphthalene naphthalene-1,4,5,8-tetracarboxylic acid, 4,8- dimethyl -1,2,3,5,6, 7- hexahydro naphthalene -1,2,5,6- tetrabasic carboxylic acid, Pentamethylene. -1,2,3,4- tetrabasic carboxylic acid, 1,2,3,4- Tetramethylene. tetrabasic carboxylic acid, bicyclic - 2.2.2 ］ octyl- 7- alkene -2,3,5,6- tetrabasic carboxylic acid, double（Heptane -2,3- dicarboxylic acids outward-bicyclic ［ 2.2.1 ］）Sulfone, 1,2,4,5- tetra- Carboxy cyclohex alkane, bicyclic ［ 2.2.2 ］ octane -2,3,5,6- tetrabasic carboxylic acid, 5,5 ' -（1,1,3,3,5,5- hexam ethylcyclotrisiloxane -1, 5- diyl）Double（Bicyclic ［ 2.2.1 ］ heptane -2,3- dicarboxylic acids）Deng.

That is, as formula（1-3）In R4, can enumerate alkane four base, the alcyl of tetravalence, the fragrant ring group of tetravalence or The heterocyclic radical of tetravalence.In other words, as R⁴, can enumerate by alkane, ester ring type compound, aromatic compound or hetero ring type Compound removes group obtained by 4 hydrogen atoms.

The carbon number of alkane four base is preferably 2～10, more preferably 2～6.As alkane four base, such as second can be enumerated Alkane -1,1,2,2- four base, propane -1,1,2,3- four base, butane -1,2,3,4- four base, hexane -1,1,6,6- four base, ethylidene Four bases.

As the alcyl of tetravalence, preferably carbon number is 4～50 group, and more preferably carbon number is 6～30 base Group.Additionally, the alcyl of tetravalence preferably has cyclohexane ring.

As the alcyl of tetravalence, can enumerate for example from hexamethylene, Pentamethylene., Tetramethylene., bis cyclohexane, decahydronaphthalene Naphthalene, bicyclic ［ 2,2,2 ］ octane, bicyclic ［ 2,2,1 ］ heptane, dimethyl hexahydro naphthalene, bicyclic ［ 2,2,2 ］ octyl- 7- alkene, 5,5 '-（1,1, 3,3,5,5- hexam ethylcyclotrisiloxane -1,5- diyl）Double（Bicyclic ［ 2.2.1 ］ heptane）Or it is double（Bicyclic ［ 2,2,1 ］ heptane）Sulfone goes Except group obtained by 4 hydrogen atoms.

As the fragrant ring group of tetravalence, can enumerate for example from benzene, naphthalene, anthracene, phenanthrene, biphenyl, benzophenone, xenyl Ether, sulfobenzide., trifluoromethylbenzene, diphenyl methane, 1,1- diphenylethane, 2,2- diphenyl propane, 2,2- are double（4- benzene oxygen Base phenyl）Propane, double phenol benzoate, diphenyldimethyl silane, trityl group silane, tetraphenyl silane, 1,3- hexichol Base -1,1,3,3- tetramethyl disiloxane, double（Diphenyldimethyl silicyl）Benzene, 2,2- diphenyl HFC-236fa, 2,2- Double（4- Phenoxyphenyl）HFC-236fa or diphenylsulfide remove group obtained by 4 hydrogen atoms.

As the heterocyclic radical of tetravalence, can enumerate and for example remove 4 from pyridine, pyrazine, thiophene, pyrrolidine or oxolane Group obtained by hydrogen atom.

These monomers（A）And its in anhydride as being the compounds of liquid at 25 DEG C, 3- methyl hexahydro can be enumerated adjacent Phthalic acid anhydride, 4- methylhexahydrophthaacid acid anhydride, 3- ethyl hexahydrophthalic acid anhydride, 4- ethyl hexahydro neighbour's benzene Dioctyl phthalate anhydride, 3- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid anhydride, 4- methyl isophthalic acid, the acid of 2,3,6- tetrahydrophthalic acid Acid anhydride, methyl -3,6- methylene -1,2,3,6- tetrahydrophthalic acid anhydride, 5,5 '-outer -（1,1,3,3,5,5- hexamethyl three Siloxanes -1,5- diyl）Double（Bicyclic ［ 2.2.1 ］ heptane-outer -2,3- dicarboxylic acids）Dicarboxylic anhydride etc..

Here, working as above-mentioned formula（1-1）In R1 be such as 4- alkyl cyclohexane -1,2- diyl, 3- alkyl cyclohexane -1,2- Diyl, 3- alkyl -4- cyclohexene -1,2- diyl, 4- alkyl -4- cyclohexene -1,2- diyl, 4- methyl -3,6- methylene -4- During cyclohexene -1,2- diyl（It is preferably 4- hexahydrotoluene -1,2- diyl, 3- hexahydrotoluene -1,2- diyl, 3- methyl -4- Cyclohexene -1,2- diyl, 4- methyl -4- cyclohexene -1,2- diyl, 4- methyl -3,6- methylene -4- cyclohexene -1,2- two During base）, the sticker of present embodiment meets above-mentioned（1）.

Additionally, working as above-mentioned formula（1-3）In R4 be such as 5,5 '-outer-（1,1,3,3,5,5- hexam ethylcyclotrisiloxane -1, 5- diyl）Double（Bicyclic ［ 2.2.1 ］ heptane-outer -2,3- diyl）When, the sticker of present embodiment meets above-mentioned（1）.

Additionally, as monomer（B）, preferably there is the monomer of 2 amino, as such monomer, such as 2 can be enumerated, Double ［ the 4- of 2-（4- amino-benzene oxygen）Phenyl ］ propane, double ［ 4-（3- amino-benzene oxygen）Phenyl ］ sulfone, double ［ 4-（4- amino-benzene oxygen） Phenyl ］ sulfone, the double ［ 4- of 2,2-（4- amino-benzene oxygen）Phenyl ］ HFC-236fa, double ［ 4-（4- amino-benzene oxygen）Phenyl ］ methane, 4, 4 '-bis-（4- amino-benzene oxygen）Biphenyl, double ［ 4-（4- amino-benzene oxygen）Phenyl ］ ether, double ［ 4-（4- amino-benzene oxygen）Phenyl ］ Ketone, 1,3- are double（4- amino-benzene oxygen）Benzene, 1,4- are double（4- amino-benzene oxygen）Benzene, 2,2 '-dimethyl diphenyl base -4,4 '-diamidogen, 2,2 '-bis-（Trifluoromethyl）Xenyl -4,4 '-diamidogen, 2,6,2 ', 6 '-tetramethyl biphenyl base -4,4 '-diamidogen, 5,5 '-diformazan Base -2,2 '-sulfonyl-xenyl -4,4 '-diamidogen,（4,4 '-diaminourea）Diphenyl ether,（4,4 '-diaminourea）Sulfobenzide., （4,4 '-diaminourea）Benzophenone,（3,3 '-diaminourea）Benzophenone,（4,4 '-diaminourea）Diphenyl methane,（4,4 '-two Amino）Diphenyl ether,（3,3 '-diaminourea）The aromatic diamines such as diphenyl ether；The Alkylenediamines such as ethylenediamine, propane diamine；Poly- The polyoxy alkylene diamine such as oxygen ethylene diamine, polypropyleneoxide diamine, 1,3- cyclohexane diamine, 1,4- cyclohexane diamine,（4,4’- Diaminourea）The double aminopropylpiperazine of dicyclohexyl methyl hydride, isophorone diamine, 1,4-, ［ 3,4- is double（1- Aminoheptyl）- 6- is own Base -5-（1- octenyl）The silica such as aliphatic diamine, PDMS such as cyclohexene, double amino methyl norcamphane Alkane diamidogen etc..

That is, as formula（1-1）、（1-2）And（1-3）In R², alkane diyl, polyoxy alkane diyl, the fat of bivalence can be enumerated Ring group, the fragrant ring group of bivalence, the heterocyclic radical of bivalence, polysiloxanes diyl etc..

As the alkane diyl in R2, preferably the alkane diyl of carbon number 1～30, the more preferably alkane two of carbon number 1～20 Base.Alkane diyl can also be able to be branched, preferably straight-chain for straight-chain.

As R²In alkane diyl, methylene, ethylidene, glyceryl, fourth diyl, penta diyl, dihexyl, heptan can be enumerated Diyl, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl, hexadecane diyl etc..

As the alcyl of the bivalence in R2, the preferably alcyl of carbon number 3～10, more preferably 4～8 alcyl. In addition, the alcyl of bivalence preferably has cyclohexane ring.

As R²In bivalence alcyl, hexamethylene diyl, alkyl cyclohexane-Isosorbide-5-Nitrae-diyl, dialkyl group can be enumerated Hexamethylene -1,4- diyl, norcamphane diyl, alkyl norcamphane -2,3- diyl, dicyclohexyl methyl hydride diyl, dicyclohexyl the third two Base, isophorone base, dimethylene cyclohexyl, dimethylene norcamphane base etc..

Here, in conjunction with R²In the carbocyclic ring structure of the alcyl of bivalence alkyl be preferably carbon number 1～10 alkane Base, the more preferably alkyl of carbon number 1～5.

As R²In bivalence fragrant ring group, such as benzene diyl can be enumerated（1,2- benzene diyl, 1,3- benzene diyl, 1, 4- benzene diyl）, naphthalene-diyl（1,2- naphthalene-diyl 1,3- naphthalene-diyl, 1,4- naphthalene-diyl, 1,5- naphthalene-diyl, 1,6- naphthalene-diyl, 1,7- naphthalene Diyl, 1,8- naphthalene-diyl, 2,3- naphthalene-diyl, 2,6- naphthalene-diyl, 2,7- naphthalene-diyl etc.）, 4,4 '-biphenyl diyl, 3,3 '-biphenyl two Base, 4,4 '-（2,2 '-diphenyl propane）Diyl, 3,3 '-（2,2 '-diphenyl propane）Diyl, 4,4 '-（Sulfobenzide.）Diyl, 3,3’-（Sulfobenzide.）Diyl, 4,4 '-（3,3- diphenyl HFC-236fa）Diyl, 3,3 '-（3,3- diphenyl HFC-236fa）Two Base, 4,4 '-（Diphenyl ether）Diyl, 3,3 '-（Diphenyl ether）Diyl, 4,4 '-（Diphenylketone）Diyl, 3,3 '-（Diphenyl Ketone）Diyl, 4,4 '-（2,2 '-dimethyl diphenyl）Diyl, 4,4 '-（2,2 '-bis-（Trifluoromethyl）Biphenyl）Diyl, 4,4 '-（2, 6,2 ', 6 '-tetramethyl biphenyl）Diyl.

As the heterocyclic radical of the bivalence in R2, can enumerate for example（1,4- dipropyl piperazine）Diyl.

As the polysiloxanes diyl in R2, such as polydimethylsiloxane diyl etc. can be enumerated.

These monomers（B）In as 25 DEG C be liquid monomers, ethylenediamine, propane diamine, isophorone two can be enumerated The double aminopropylpiperazine of amine, 1,4-, ［ 3,4- is double（1- Aminoheptyl）- 6- hexyl -5-（1- octenyl）Cyclohexene, oxyalkylene Diamidogen, double amino methyl norcamphane, alkyl diamine, polyoxy alkylene diamine, siloxane diamine etc..

Here, working as formula（1-1）、（1-2）And（1-3）In R²For such as alkane diyl,（1,4- dipropyl piperazine）Diyl, double When methylene norcamphane base or isophorone base, the sticker of present embodiment meets above-mentioned（1）.

Condensation resin preferably has polyoxy alkane diyl.There is the condensation resin of such group, Tg reduces, under low temperature There is good cohesiveness.

Here, as polyoxy alkane diyl, following formula can be enumerated（2）Shown group.Here, in formula, n represents more than 2 Integer, R⁵Represent alkane diyl.The multiple R existing⁵Can be same to each other or different to each other.

[changing 10]

R⁵In alkane diyl can also be able to be branched for straight-chain.As R⁵In alkane diyl, preferably carbon number 2 The alkane diyl of～4 alkane diyl, more preferably carbon number 2～3.As the alkane diyl in R5, can enumerate for example ethylidene, 1, 2- glyceryl, 1,3- glyceryl, 1,4- fourth diyl etc..

Formula（2）In n be preferably 2～70, more preferably 6～33.

As polyoxy alkane diyl, preferably by polyoxyethylene, polyoxypropylene, polybutylene, polyoxytetramethylene, polyoxy second Alkene poiyoxypropylene copolymer, Polyethylene Glycol polytetramethylene glycol copolymer, polypropylene glycol polytetramethylene glycol copolymer, poly- The groups derived from polyoxyalkylene such as ethylene glycol polypropylene glycol polytetramethylene glycol copolymer, more preferably polyoxyethylene groups, polyoxy- 1,2- glyceryl.

The method importing above-mentioned polyoxy alkane diyl to condensation resin is not particularly limited, can enumerate and for example will gather The condensation resins such as amide resin, polyimide resin, polyamide-imide resin are modified and import above-mentioned polyoxy alkane diyl Method.

Additionally, condensation resin preferably has above-mentioned polyoxy alkane diyl in said structure unit, more preferably in above-mentioned knot In structure unit from monomer（B）Structure in there is above-mentioned polyoxy alkane diyl.That is, preferred monomers（A）And monomer（B）In extremely Few one kind has above-mentioned polyoxy alkane diyl, more preferably monomer（B）In at least one there is above-mentioned polyoxy alkane diyl.

Condensation resin be more preferably said structure unit in from monomer（B）Structure there is polyoxy alkane diyl.

That is, as condensation resin, preferably there is following construction unit, described construction unit passes through to make to comprise with polyoxy The monomer of alkane diyl and at least 2 amino（b-1）Polymerizable monomer polycondensation and obtain.

Monomer in polymerizable monomer（b-1）Content with respect to monomer（A）And monomer（B）Total amount be preferably 0.5～ 20mol%, more preferably 1～10mol%, more preferably 2～8mol%.Make such polymerizable monomer contracting using having The condensation resin of construction unit obtained by poly-, it is possible to obtain the sticker more excellent with the adaptation of adherend.

As monomer（b-1）, polyoxy alkylene diamine can be enumerated, can be suitably using such as JEFFAMINE D-230 （HUNTSMAN, trade name）、JEFFAMINE D-400（HUNTSMAN, trade name）、JEFFAMINE D-2000（HUNTSMAN、 Trade name）、JEFFAMINE D-4000 （HUNTSMAN, trade name）Etc. polypropyleneoxide diamine；JEFFAMINE ED-600 （HUNTSMAN, trade name）、JEFFAMINE ED-900（HUNTSMAN, trade name）Deng polyoxypropylene and polyoxyethylated copolymerization Thing diamidogen；JEFFAMINE EDR-148（HUNTSMAN, trade name）、

JEFFAMINE EDR-176（HUNTSMAN, trade name）Etc. polyethyleneoxide diamine；JEFFAMINE T-403 （HUNTSMAN, trade name）、JEFFAMINE T-3000（HUNTSMAN, trade name）And JEFFAMINE T-5000 （HUNTSMAN, trade name）Deng triamine.These can be used alone it is also possible to and use two or more.

By 25 DEG C be liquid or 25 DEG C of anhydride are the monomer of liquid（A）It is set to monomer（a-1）, by 25 DEG C be liquid monomers （B）It is set to monomer（b-2）When, the monomer in polymerizable monomer（a-1）And monomer（b-2）Total content with respect to monomer（A） And monomer（B）Total amount be preferably 15～60mol%, more preferably 20～50mol%, more preferably 25～45mol%.

As the preferred compositions of polymerizable monomer, preferably：Monomer（A）Contained（A-1）R¹Fragrant ring group for bivalence Compound, formula（A-2）R³Compound for the fragrant ring group of trivalent and formula（A-3）R⁴Change for the fragrant ring group of tetravalence At least one in compound, monomer（B）Comprise monomer（b-1）And monomer（b-2）.

Additionally, as the preferred compositions of polymerizable monomer, further preferably：Monomer（A）Contained（A-1）R¹Virtue for bivalence Fragrant ring group compound, formula（A-2）R³Compound for the fragrant ring group of trivalent and formula（A-3）R⁴Fragrant ring group for tetravalence Compound at least one and monomer（a-1）, monomer（B）Comprise monomer（b-1）.

Condensation resin for example can be by comprising monomer（A）And monomer（B）The polycondensation of polymerizable monomer and obtain.This Outward, monomer can also be used（A）Anhydride, monomer（A）Carboxylate, monomer（A）Acyl halide etc. replace monomer（A）.Additionally, Polymerizable monomer can also comprise other monomer such as diisocyanate cpd.

Monomer in polymerizable monomer（A）And monomer（B）Content be preferably with respect to the total amount of polymerizable monomer More than 30mol%, more preferably more than 50mol%, more preferably more than 70mol%.Additionally, monomer（A）And monomer（B） Content can also be 100mol%.

The method of polycondensation is not particularly limited, for example, can adopt with the following method：Above-mentioned polymerizable monomer is dissolved in Solvent, 0～200 DEG C of reaction temperature, 1～5 hour response time about under reacted.

As solvent used in polycondensation, such as N-Methyl pyrrolidone, N- ethyl pyrrolidone, N- methyl can be enumerated Butanimide, dimethyl furan, toluene, N, N '-dimethyl acetamide, hexa-methylene phosphamide, dimethyl sulfoxide etc..From resin Dissolubility from the viewpoint of, preferred N-Methyl pyrrolidone in these.

Additionally, in polycondensation, for the purpose promoting condensation reaction, it is possible to use the accelerator such as catalyst.The adding of accelerator Dosage is set to 0.1～50mol equivalent with respect to polymerizable monomer 10mol equivalent.As accelerator, such as chlorination can be enumerated The inorganic salts such as lithium, calcium chloride, Calcium rhodanate；The tertiary amines such as triethylamine, pyridine；Tetramethyl ammonium chloride, tetraethylammonium bromide, four-just The quaternary ammonium salts such as butylammonium bromide.

Condensation resin can also be to the resin after polymer is modified further obtained by polycondensation, can enumerate example As olefin-modified polyamide, alkoxysilane-modified polyamide, silicone-modified polyimides, epoxy-modified polyamide, gather Carbonate-modified polyamide, olefin-modified polyimides, silicone-modified polyimides, epoxy-modified polyimides, poly- carbon Acid esters modified polyimide, silicone-modified polyimides, olefin-modified polyamidoimide, alkoxysilane-modified polyamide Acid imide, silicone-modified polyamidoimide, epoxy-modified polyamidoimide, epoxy-modified polyamidoimide, Polycarbonate modified polyamidoimide etc..

Condensation resin in present embodiment can be for example polyamide, the polyamide acyl with polyoxy alkane diyl Imide resin or polyimide resin.Such condensation resin at least meets above-mentioned（2）.

This condensation resin preferably comprises the diamine unit with polyoxy alkane diyl.That is, preferably polyoxy alkane diyl is contained in In the diamine unit of condensation resin.

As the diamine unit with polyoxy alkane diyl, such as polyoxy alkylene diamine unit can be enumerated.As polyoxy Alkylenediamine unit, can enumerate the monomeric unit from the above-mentioned monomer illustrating as polyoxy alkylene diamine.

This condensation resin and then can have the fragrant ring group of bivalence, the fragrant ring group that can also comprise there is bivalence Dicarboxylic acid units.There is by condensation resin the fragrant ring group of bivalence, sticker can be suppressed further in high temperature environments Adhesion strength change.

As the dicarboxylic acid units of the fragrant ring group with bivalence, above-mentioned formula can be enumerated（A-1）R1 be bivalence virtue The compound of fragrant ring group.

Condensation resin can have the fragrant ring group as bivalence for the benzene diyl, can also comprise selected from phthalic acid At least one in the group of unit, isophthalic acid units and terephthalic acid units composition.Benzene is had by condensation resin Diyl, can suppress sticker adhesion strength change in high temperature environments further.

Additionally, this condensation resin can have Isosorbide-5-Nitrae-piperazine diyl further, can also comprise with Isosorbide-5-Nitrae-piperazine two The diamine unit of base.Using such diamine unit, sticker adhesion strength change in high temperature environments can be suppressed further.

As the diamine unit with Isosorbide-5-Nitrae-piperazine diyl, such as Isosorbide-5-Nitrae-bis- can be enumerated（Omega-amino alkyl）Piperazine list Unit.1,4- is double（Omega-amino alkyl）In piperazine unit, the carbon number of omega-amino alkyl is preferably 1～10, more preferably 2～ 4.

Double as 1,4-（Omega-amino alkyl）Piperazine unit, can enumerate Isosorbide-5-Nitrae-bis-（3- aminopropyl）Piperazine unit etc..

In condensation resin, there is diamine unit content C of Isosorbide-5-Nitrae-piperazine diyl₂With respect to having the two of polyoxy alkane diyl Content C of amine unit₁Ratio C₂/ C₁It is preferably 2～40, more preferably 4～20 with molar ratio computing.

In condensation resin from monomer（A）Construction unit can be referred to as monomer（A）Unit, from monomer（B） Construction unit can be referred to as monomer（B）Unit, condensation resin can be referred to as to comprise monomer（A）Unit and monomer（B） The condensation resin of unit.

The content of the diamine unit with polyoxy alkane diyl in condensation resin is with monomer（A）Unit and monomer（B）Single Unit total amount on the basis of meter be preferably 2.5～10mol%, more preferably 3.5～7.5mol%, more preferably 4～ 6mol%.Using such condensation resin, it is possible to obtain the sticker more excellent with the adaptation of adherend.

The content of the dicarboxylic acid units of fragrant ring group with bivalence in condensation resin is with monomer（A）Unit and monomer （B）On the basis of the total amount of unit meter be preferably 20～50mol%, more preferably 30～50mol%, more preferably 40～ 50mol%.

The content of the diamine unit with 1,4- piperazine diyl in condensation resin is with monomer（A）Unit and monomer（B） On the basis of the total amount of unit meter be preferably 15～60mol%, more preferably 20～50mol%, more preferably 25～ 45mol%.

The weight average molecular weight of condensation resin is preferably 20000～100000, more preferably 30000～60000.Here, In this specification, weight average molecular weight represents the weight average molecular weight with polystyrene conversion measuring by GPC method.

The content of the condensation resin in the sticker of present embodiment is counted on the basis of the total amount of sticker and is preferably 50 More than quality %, more than more preferably 70 mass %.The content of condensation resin within the above range, can fully remain high Thermostability and the higher cohesiveness of acquisition.Additionally, the content of condensation resin can be below 96 mass % or 90 matter Amount below %.Additionally, the sticker of present embodiment can be made up of condensation resin（That is, the content of condensation resin For 100 mass %）.But, the content of condensation resin suitably can also be in outside above range according to purposes.

Additionally, from the viewpoint of making the cohesiveness hot environment remain good, the heat of the sticker of present embodiment The content of thermosetting resin is preferably below 30 mass %, below more preferably 20 mass %, does not more preferably contain thermosetting Resin.

In order to improve adaptation, in the range of the purpose not damaging invention, can also add in the sticker of present embodiment Plus rosin resin, terpene resin, coumarone resin, phenolic resin, styrene resin, fatty family Petropols, fragrant family Tackifiers such as Petropols, aliphatic aromatic copolymerization through-stone oleoresin etc..

（The using method of sticker）

The sticker of present embodiment due to being also able to maintain that cohesiveness under hot environment, therefore can be used for possessing following （1）~（3）The purposes of operation.

（1）Adhering processes, via the adhesion coating containing sticker, the second adherend are pasted on the first adherend.

（2）Heating process, under conditions of the temperature of adhesion coating becomes more than 200 DEG C, heats the first adherend and second Adherend.

（3）Stripping process, peels off adhesion coating and the second adherend from the first adherend that experienced heating process.

In adhering processes, adhesion coating can be formed for example in the one side of the first adherend, in this adhesion coating and first Second adherend is configured on the face of adherend opposition side, by making the first adherend and the second adherend mutually extrudes and first Second adherend is pasted on adherend.

Further, it is also possible to form adhesion coating in the one side of the second adherend, in this adhesion coating and the second adherend phase First adherend is configured on the face tossed about, is mutually extruded and on the first adherend by making the first adherend and the second adherend Paste the second adherend.

Adhesion coating for example can be by preparing the sticker varnish comprising sticker and solvent, being coated with this sticker varnish simultaneously It is dried and formed.Used in sticker varnish, solvent is not particularly limited, two alcohol series solvents, glycol ether series solvent, two Alcohol ester series solvent etc. is preferred due to sticker display good dissolubility.

As solvent, such as ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, ethylene glycol, diethyl two can be enumerated Alcohol, triethylene glycol, propylene glycol, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, 3- methoxyl group- 3- methyl-1-butanol, ethylene glycol single methyl ether acetass, PMA（Propylene glycol monomethyl ether）, diethylene glycol monobutyl ether Acetass and TC acetass.Than that described above, N-Methyl pyrrolidone, N- N-ethyl pyrrole N-can also be used Alkanone, N methyl succinimide, N, N '-dimethyl acetylamide and dimethylformamide.These solvents can be used alone, Two or more can be used in mixed way.

Adhesion coating in adhering processes, can be by being coated on the first adherend or the second adherend by sticker varnish Upper and be dried and when being arranged on this upper it is also possible to the adhesion coating that will be formed on aftermentioned supporter pass through to be laminated and It is transferred in the first adherend or the one side of the second adherend, thus being arranged in this one side.

In adhering processes, for example, it is possible to the first adherend and the second adherend be pasted at 0～50 DEG C.

In heating process, the first adherend and the second adherend are heated.The purpose of the method to heating and heating does not have Especially limit, by this heating, adhesion coating is exposed at a temperature of more than 200 DEG C.Generally work as sticker low for thermostability（Example As acrylic acid seriess sticker）For when in such heating process it is impossible to maintain cohesiveness it may occur that bubbling, stripping off.But, Using the adhesion coating of the sticker comprising present embodiment, even if experiencing such heating process be also able to maintain that cohesiveness, because This generation that can fully suppress bubbling, strip off.

In heating process, processing can also be formed to the first heated adherend and the second adherend.Comprise this The adhesion coating of the sticker of embodiment is excellent due to tracing ability, even if the first adherend and the second adherend are due to forming And when deforming, bubbling, the generation stripped off also are adequately suppressed.

In stripping process, peel off adhesion coating and the second adherend from the first adherend.Here, adhesion coating and the second adherend Can integrally peel off it is also possible to peel off from the first adherend independently of one another from the first adherend.

In stripping process, for example, it is possible to peel off adhesion coating and the second adherend at 0～50 DEG C from the first adherend.

Even if the adhesion coating being stripped in stripping process experiences above-mentioned heating process is also able to maintain that cohesiveness, therefore can Enough it is reused in adhering processes.

As the first adherend and the second adherend, it is not particularly limited, can enumerate and comprise selected from polyester, polyamides Asia Amine, polyamide, polyether sulfone, polyphenylene sulfide, polyether-ketone, polyether-ether-ketone, tri acetyl cellulose, Polyetherimide, poly- naphthalene diformazan The adherend of at least one organic material in sour glycol ester, polypropylene, acrylic, polystyrene, Merlon etc..This Outward, can also be using comprising the supporter of inorganic material, it is possible to use comprise selected from such as aluminum, magnesium, titanium, chromium, manganese, ferrum, nickel, The supporter of at least one inorganic material in zinc, stannum, glass, copper, silicon wafer and alloy.

As the first adherend and the second adherend, it is possible to use have the material of the temperature thermostability to more than 200 DEG C, The such as polyamide such as nylon 6, nylon66 fiber, Stanyl (DSM). can be enumerated；Polyethylene terephthalate, poly- naphthalenedicarboxylic acid second Diol ester, polytrimethylene's diol ester, poly- naphthalenedicarboxylic acid trimethylene ester, polybutylene terephthalate The polyester resin such as ester, PBN；The vistanexes such as polypropylene, polyethylene；Acrylic resin, polyamides are sub- Polyimide resin, polyarylate resin or their hybrid resin, aluminum, magnesium, titanium, chromium, manganese, ferrum, nickel, zinc, stannum, glass, copper, silicon wafer and Alloy.In these materials, polyester resin, polyamide, vistanex, polyimide resin, acrylic resin, aluminum, Magnesium, titanium, chromium, manganese, ferrum, nickel, zinc, stannum, glass, copper, silicon wafer are preferred due to display high-fire resistance.

Using above-mentioned using method, for example, the first low for rigidity adherend is conscientiously fixed on the in high temperature process On two adherends, after processing, the first adherend can injury-free also nondeforming be stripped.

（Sticky material）

Fig. 1 is the constructed profile of the preferred embodiment of sticker representing the present invention.Adhesion shown in Fig. 1 Agent 1 possesses supporter 10 and the adhesion coating 14 containing sticker being arranged on this supporter 10.

As supporter, be not particularly limited, can enumerate comprise selected from polyester, polyimides, polyamide, polyether sulfone, Polyphenylene sulfide, polyether-ketone, polyether-ether-ketone, tri acetyl cellulose, Polyetherimide, PEN, polypropylene, The supporter of at least one organic material in acrylic, polystyrene, Merlon etc..Further, it is also possible to use comprise no The supporter of machine material, it is possible to use comprise to be selected from such as aluminum, magnesium, titanium, chromium, manganese, ferrum, nickel, zinc, stannum, glass, copper, silicon wafer And the material of at least one inorganic material in alloy.

Sticky material for example can make as follows：The sticker varnish comprising sticker and solvent is coated on supporter And be dried, it is consequently formed adhesion coating and make.Such it is readily available flat adhesion based on the manufacture method of the tape casting Layer, so preferably.As the solvent for sticker varnish, solvent similar to the above can be illustrated.

Additionally, sticky material can also make as follows：The sticker varnish comprising sticker and solvent is coated on the demoulding On film and be dried, the adhesion coating being consequently formed is laminated, is transferred to supporter and makes.

The thickness of adhesion coating is preferably 0.1～100 μm, more preferably 1～50 μm.The thickness of adhesion coating can be according to above-mentioned The concentration of the sticker in sticker varnish, the coating weight of sticker varnish and suitably adjust.

（The using method of sticky material）

The sticker of present embodiment is also able to maintain that cohesiveness due under hot environment, can be consequently used for possessing following （1）~（3）The purposes of operation.

（1）Adhering processes, according to adhesion coating configuration in the mode near adherend side, sticky material are pasted on and are glued Thing.

（2）Heating process, heats adherend under conditions of the temperature of sticky material becomes more than 200 DEG C.

（3）Stripping process, peels off sticky material from the adherend that experienced heating process.

In adhering processes, pressed by way of being contacted with adherend with the adhesion coating of sticky material, can will be glued Material and be pasted onto adherend.In adhering processes, the first adherend and the second adherend can be pasted at a temperature of any, It is desirable to for example be pasted at 0～50 DEG C from the viewpoint of showing suitable cohesiveness and working performance.

In heating process, adherend is heated, and meanwhile adhesion coating is exposed at a temperature of more than 200 DEG C.Generally, when By sticker low for thermostability（For example, acrylic acid seriess sticker）For during such heating process it is impossible to maintain cohesiveness, meeting There is bubbling, strip off.But, using the sticky material of present embodiment, even if experienced such heating process also can tie up Hold cohesiveness, therefore, it is possible to the abundant generation suppressing bubbling, stripping off.

It is also possible to processing is formed to the adherend after heating in heating process.Sticker containing present embodiment Adhesion coating due to tracing ability excellent, even if therefore adherend is deformed due to forming, bubbling, the generation stripped off also by Fully suppress.

In stripping process, peel off sticky material from adherend.In stripping process, for example, it is possible at 0～50 DEG C from adherend Peel off sticky material.

Even if the sticky material being stripped in stripping process experiences above-mentioned heating process is also able to maintain that cohesiveness, therefore can Enough it is reused in adhering processes.

As the adherend in this using method, the quilt same with above-mentioned first adherend and the second adherend can be illustrated Viscous thing.

Using above-mentioned using method, for example, adherend low for rigidity is conscientiously fixed on supporter in high temperature process On, after processing, adherend can injury-free also nondeforming be stripped.

It is explained above the present invention preferred embodiment, but the present invention is not limited by above-mentioned embodiment.

For example, a mode of the present invention is related to condensation resin as the application of sticker, described condensation resin tool There is following construction unit, meet above-mentioned（1）And（2）At least one of, described construction unit passes through to make to comprise above-mentioned monomer（A） And above-mentioned monomer（B）Polymerizable monomer polycondensation and obtain.

Additionally, the alternate manner of the present invention is related to application in the manufacture of sticker for the condensation resin, described condensation system Resin has following construction unit, meets above-mentioned（1）And（2）At least one of, described construction unit passes through to make to comprise above-mentioned Monomer（A）And above-mentioned monomer（B）Polymerizable monomer polycondensation and obtain.

Additionally, the alternate manner of the present invention is related to the application as sticker for the condensation resin with polyoxy alkane diyl, Described condensation resin is selected from the group of polyamide, polyamide-imide resin and polyimide resin composition.

Additionally, the alternate manner of the present invention is related to there is the condensation resin of polyoxy alkane diyl in the manufacture of sticker Application, described condensation resin is selected from the group of polyamide, polyamide-imide resin and polyimide resin composition.

Embodiment

Hereinafter, further illustrate the present invention using embodiment, but the present invention is not limited by embodiment.

（Embodiment 1）

In the detachable flask possessing blender, reflux condenser, thermometer, nitrogen ingress pipe, make isophthalic diformazan 50 parts of acyl chlorides（Mol ratio）, polypropyleneoxide diamine（JEFFAMINE（Registered trade mark）D-2000, HUNTSMAN company system）5 parts（Rub You compare）And 1,4- is double（3- aminopropyl）45 parts of piperazine（Mol ratio）Comprising 110 parts of the triethylamine as acid neutralizing agent（Mole Than）N-Methyl pyrrolidone in, carry out polycondensation under ice cooling.After reaction terminates, reaction mixture adds 3 times amount Water, insoluble component is separated, is dried, be derived from the polyamide that weight average molecular weight is 45000.The polyamide resin that will obtain Fat is dissolved in N, N '-dimethyl acetamide, obtains sticker varnish.

Then, using applicator, the sticker varnish of acquisition is become 20 μm of side according to the thickness of dried adhesion coating Formula be coated on thickness be 25 μm, width be 20cm polyimide film on, 130 DEG C heat 5 minutes, then 150 DEG C heat 30 points Clock, is dried, and makes sticky material.

Tg is measured by the following method to the polyamide obtaining, the sticky material obtaining is evaluated by the following method Cohesiveness, stripping residue and thermostability.Result is shown in table 1.Here, Fig. 2 be represent using differential scanning calorimeter measure, Thermally equilibrated figure between -50～200 DEG C for the polyamide of embodiment 1.

（The mensure of Tg）

In Example 1 obtain polyamide 3mg to aluminium dish, using TA Instrument differential scanning type Calorimeter DSC Q2000, by the Thermal Balance Tg between -50～200 DEG C.

（Adhesive evaluation）

The sticky material obtaining in embodiment 1 is configured at 10cm × 10cm glass plate of 70 μm of thickness, at 17～25 DEG C Under conditions of with the speed of 0.8m/ minute pass through the laminating machine as 0.3MPa for the roll-in, thus pasted.The adhesion material that will paste Material, after 200 DEG C of heating 10 minutes, the end of the polyimide film of sticky material is somewhat peeled off and is held, using flow graph RE3305R（Mountain electricity system）Cupping machine, measures and peels off polyimide film width under 90 degree, draw speed 300mm/min The power of the minimum needed for 10mm（N/cm）.

（The evaluation of stripping residue）

Measure the weight of the sticky material obtaining in embodiment 1, deduct the weight of the polyimide film of measured in advance, thus Calculate the weight of the adhesion coating of sticky material.Then, with adhesive evaluate in the same manner as by sticky material paste glass plate and Carry out the stripping of sticky material.Measure the weight of the sticky material peeled off, deduct the weight of the polyimide film of measured in advance, by This calculates the weight of the adhesion coating of the sticky material after stripping.Now, by peel off after adhesion coating weight with respect to paste before The weight of adhesion coating ratio be more than 90% situation as " A ", the situation less than 90%, as " B ", thus evaluates stripping From the presence or absence of residue.

（The evaluation of thermostability）

In the same manner as adhesive evaluation, sticky material is pasted onto glass plate.The glass plate being pasted with sticky material is existed Heat 1 hour in 200 DEG C of cleaning baking oven, visually confirm that sticky material has glass plate of having no way of to peel off.The situation of no stripping is made For " A ", using situation about peeling off as " B ", thus evaluate thermostability.

（Embodiment 2）

Make 43.75 parts of m-phthaloyl chloride（Mol ratio）, 6.25 parts of paraphthaloyl chloride, polypropylene glycol diamine （JEFFAMINE（Registered trade mark）D-2000, HUNTSMAN company system）5 parts and 1,4- double（3- aminopropyl）45 parts of piperazine is in N- Polycondensation in methyl pyrrolidone, obtains polyamide.The polyamide of acquisition is dissolved in N, N '-dimethyl acetamide In, obtain sticker varnish.

Then, make sticky material similarly to Example 1 using the sticker varnish obtaining.Additionally, gathering to acquisition Amide resin by said method measure Tg, to obtain sticky material pass through said method evaluation cohesiveness, stripping residue and Thermostability.Result is shown in table 1.Here, Fig. 3 is the polyamide resin representing using differential scanning calorimeter mensure, embodiment 2 Thermally equilibrated figure between -50～200 DEG C for the fat.

（Comparative example 1）

13 parts of m-phthaloyl chloride, 13 parts of 3,3- diamino diphenyl sulfone is made to carry out polycondensation in N-Methyl pyrrolidone, Obtain polyamide.The polyamide of acquisition is dissolved in N, N '-dimethyl acetamide, obtains sticker varnish.

Then, make sticky material similarly to Example 1 using the sticker varnish obtaining.Additionally, gathering to acquisition Amide resin by said method measure Tg, to obtain sticky material pass through said method evaluation cohesiveness, stripping residue and Thermostability.Result is shown in table 1.Here, Fig. 4 is the polyamide resin representing using differential scanning calorimeter mensure, comparative example 1 Thermally equilibrated figure between -50～200 DEG C for the fat.

[table 1]

Claims

1. a kind of sticker, it contains the condensation resin with following construction unit, meets in following (1) and (2) at least One, described construction unit passes through the monomer (B) making to comprise the monomer (A) with least 2 carboxyls and have at least 2 amino Polymerizable monomer polycondensation and obtain, wherein, described condensation resin comprises Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit,

(1) at least one selected in the group being made up of described monomer (A), the anhydride of described monomer (A) and described monomer (B) exists 25 DEG C is liquid,

(2) described condensation resin has polyoxy alkane diyl.

2. sticker according to claim 1, it meets described (1) and (2) simultaneously.

3. sticker according to claim 1 and 2, wherein, described construction unit is following formula (1-1), formula (1-2) or formula (1-3) construction unit shown in,

In formula, R¹And R²Represent the organic group of bivalence, R³Represent the organic group of trivalent, R⁴Represent the organic group of tetravalence.

4. sticker according to claim 3, wherein, described R¹For the alkane diyl of carbon number 1～30, carbon number 3～ The fragrant ring group of the bivalence of the alcyl of 20 bivalence or carbon number 6～20.

5. sticker according to claim 4, wherein, described alkane diyl be methylene, ethylidene, glyceryl, fourth diyl, Penta diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl or Hexadecane diyl.

6. sticker according to claim 3, wherein, described R¹For 4- alkyl cyclohexane -1,2- diyl, 3- alkyl In alkane -1,2- diyl, 3- alkyl -4- cyclohexene -1,2- diyl, 4- alkyl -4- cyclohexene -1,2- diyl or 4- methyl -3,6- Methylene -4- cyclohexene -1,2- diyl.

7. sticker according to claim 3, wherein, described R²For alkane diyl, (1,4- dipropyl piperazine) diyl, double Asia Methyl norcamphane base or isophorone base.

8. sticker according to claim 7, wherein, described R²Alkane diyl for carbon number 1～30.

9. the sticker according to claim 7 or 8, wherein, described R²For methylene, ethylidene, glyceryl, fourth diyl, penta Diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl or ten Six alkane diyls.

10. sticker according to claim 3, wherein, described R⁴For 5,5 '-outer-(1,1,3,3,5,5- hexamethyl three silicon Oxygen alkane -1,5- diyl) double (bicyclic [2.2.1] heptane-outer -2,3- diyl).

11. stickers according to claim 1, wherein, the described construction unit in described condensation resin has described Polyoxy alkane diyl.

12. stickers according to claim 11, wherein, described polyoxy alkane diyl is the group shown in following formula (2),

In formula, R⁵Represent alkane diyl, the multiple R existing⁵Can be the same or different each other, n represents more than 2 integer.

13. stickers according to claim 12, wherein, described R⁵Alkane diyl for carbon number 2～4.

14. stickers according to claim 13, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1,4- fourth diyl.

15. stickers according to any one of claim 12～14, wherein, described n is 2～70.

16. stickers according to claim 1, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- third Diyl.

17. stickers according to claim 1, wherein, the structure from described monomer (B) in described construction unit has There is described polyoxy alkane diyl.

18. stickers according to claim 1, wherein, described polymerizable monomer is with respect to described monomer (A) and described The ratio of the total amount 0.5～20mol% of monomer (B) comprises the monomer (b-1) with polyoxy alkane diyl and at least 2 amino.

19. stickers according to claim 18, wherein, the content of the described monomer (b-1) in described polymerizable monomer It is 1～10mol% with respect to the total amount of described monomer (A) and described monomer (B).

20. stickers according to claim 1, wherein, described monomer (A) is the anhydride of described monomer (A), described monomer (A) carboxylate or the acyl halide of described monomer (A).

21. stickers according to claim 1, wherein, described monomer (A) is to have the monomer of 2 carboxyls, have 3 The monomer of carboxyl or the monomer with 4 carboxyls.

22. stickers according to claim 1, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) At least one selected in the group of the compound shown in thing, following formula (A-2) and the composition of the compound shown in following formula (A-3), It is the monomer (b- of liquid that described monomer (B) comprises to have the monomer (b-1) of polyoxy alkane diyl and at least 2 amino and 25 DEG C 2),

HO₂C-R¹-CO₂H (A-1)

In formula, R¹Represent the fragrant ring group of bivalence, R³Represent the fragrant ring group of trivalent, R⁴Represent the fragrant ring group of tetravalence.

23. stickers according to claim 1, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) Compound shown in thing, following formula (A-2) and the compound shown in following formula (A-3) composition group in select at least one, And 25 DEG C be liquid or 25 DEG C of anhydride are the monomer (a-1) of liquid, described monomer (B) comprises with polyoxy alkane diyl and at least The monomer (b-1) of 2 amino,

HO₂C-R¹-CO₂H (A-1)

24. stickers according to claim 1, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, Comprise isophorone diamine, the double aminopropylpiperazine of 1,4-, [double (1- the Aminoheptyl) -6- hexyl -5- (1- octenyl) of 3,4-] Cyclohexene, oxyalkylene diamidogen, double amino methyl norcamphane, alkyl diamine, polyoxy alkylene diamine or siloxane diamine.

25. stickers according to claim 1, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, Comprise ethylenediamine or propane diamine.

26. stickers according to claim 1, wherein, described monomer (A), as 25 DEG C be liquid or 25 DEG C of anhydride are The monomer (a-1) of liquid, comprises 3- methylhexahydrophthaacid acid anhydride, 4- methylhexahydrophthaacid acid anhydride, 3- ethyl Hexahydrophthalic acid anhydride, 4- ethyl hexahydrophthalic acid anhydride, 3- methyl isophthalic acid, the acid of 2,3,6- tetrahydrophthalic acid Acid anhydride, 4- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid anhydride, methyl -3,6- methylene -1,2,3,6- tetrahydrophthalic acid Anhydride or double (bicyclic [2.2.1] heptane-outer -2,3- of 5,5 '-outer-(1,1,3,3,5,5- hexam ethylcyclotrisiloxane -1,5- diyl) Dicarboxylic acids) dicarboxylic anhydride.

27. stickers according to claim 1, wherein, in described polymerizable monomer, 25 DEG C in described monomer (A) are In liquid or monomer (a-1) that 25 DEG C of anhydride are liquid and described monomer (B) 25 DEG C are that the totals of the monomer (b-2) of liquid contain Amount, is 15～60mol% with respect to the total amount of described monomer (A) and described monomer (B).

28. stickers according to claim 1, wherein, the described monomer (A) in described polymerizable monomer and described monomer (B) content, is more than 30mol% with respect to the total amount of described polymerizable monomer.

29. stickers according to claim 1, wherein, described condensation resin comprises by polyamide-imide resin, gathers At least one selected in the group of imide resin and polyamide composition.

30. stickers according to claim 29, wherein, described condensation resin is polyamide.

31. stickers according to claim 1, wherein, described condensation resin comprises the diamidogen with polyoxy alkane diyl Unit.

32. stickers according to claim 31, wherein, the described diamine unit with polyoxy alkane diyl is poly (oxyalkylene) Base diamine unit.

33. stickers according to claim 31 or 32, wherein, the containing of the described diamine unit with polyoxy alkane diyl Amount, is calculated as 2.5～10mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

34. stickers according to claim 1, wherein, described condensation resin has the fragrant ring group of bivalence further.

35. stickers according to claim 34, wherein, the fragrant ring group of described bivalence is benzene diyl.

36. stickers according to claim 1, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω-ammonia The carbon number of base alkyl is 1～10.

37. stickers according to claim 1, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω-ammonia The carbon number of base alkyl is 2～4.

38. stickers according to claim 1, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit is Isosorbide-5-Nitrae-bis- (3- aminopropyl) piperazine unit.

39. stickers according to claim 1, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 15～60mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

40. stickers according to claim 1, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 20～50mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

41. stickers according to claim 1, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 25～45mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

42. stickers according to claim 1, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 2～40.

43. stickers according to claim 1, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 4～20.

44. stickers according to claim 1, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

45. stickers according to claim 1, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 50 mass % 100 mass %.

46. stickers according to claim 1, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

47. stickers according to claim 45 or 46, wherein, the content of described condensation resin is with the total amount of sticker On the basis of be calculated as below 96 mass %.

A kind of 48. stickers, its contain below more than 50 mass % 100 mass % selected from polyamide, polyamide acyl Condensation resin in the group of imide resin and polyimide resin composition, wherein, described condensation resin has polyoxy alkane two Base, wherein, described condensation resin comprises the diamine unit with Isosorbide-5-Nitrae-piperazine diyl, and described have the two of Isosorbide-5-Nitrae-piperazine diyl Amine unit is double (omega-amino alkyl) piperazine unit of 1,4-.

49. stickers according to claim 48, wherein, described condensation resin is polyamide.

50. stickers according to claim 48 or 49, wherein, described polyoxy alkane diyl is the base shown in following formula (2) Group,

51. stickers according to claim 50, wherein, described R⁵Alkane diyl for carbon number 2～4.

52. stickers according to claim 51, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1,4- fourth diyl.

53. stickers according to claim 50, wherein, described n is 2～70.

54. stickers according to claim 48, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- Glyceryl.

55. stickers according to claim 48, wherein, described condensation resin comprises the diamidogen with polyoxy alkane diyl Unit.

56. stickers according to claim 55, wherein, the described diamine unit with polyoxy alkane diyl is poly (oxyalkylene) Base diamine unit.

57. stickers according to claim 48, wherein, described condensation resin has the aromatic rings of bivalence further Base.

58. stickers according to claim 57, wherein, the fragrant ring group of described bivalence is benzene diyl.

59. stickers according to claim 57 or 58, wherein, described condensation resin comprises the aromatic rings with bivalence The dicarboxylic acid units of base.

60. stickers according to claim 48, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 1～10.

61. stickers according to claim 48, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 2～4.

62. stickers according to claim 48, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit be Isosorbide-5-Nitrae- Double (3- aminopropyl) piperazine unit.

63. stickers according to claim 48, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

64. stickers according to claim 48, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

65. stickers according to claim 48 or 64, wherein, the content of described condensation resin is with the total amount of sticker On the basis of be calculated as below 96 mass %.

66. stickers according to claim 1 or 48, after it is used as to be pasted onto on adherend and be heated to more than 200 DEG C The thermostability sticker peeled off from this adherend.

A kind of 67. condensation resins have following construction unit as the application of sticker, described condensation resin, meet following (1) and at least one of (2), described construction unit passes through to make to comprise the monomer (A) with least 2 carboxyls and has at least The polymerizable monomer polycondensation of monomer (B) of 2 amino and obtain, wherein, described condensation resin comprises Isosorbide-5-Nitrae-bis- (omega-amino alkane Base) piperazine unit,

(2) described condensation resin has polyoxy alkane diyl.

68. applications according to claim 67, it meets described (1) and (2) simultaneously.

69. applications according to claim 67 or 68, wherein, described construction unit be following formula (1-1), formula (1-2) or Construction unit shown in formula (1-3),

70. applications according to claim 69, wherein, described R¹For the alkane diyl of carbon number 1～30, carbon number 3～ The fragrant ring group of the bivalence of the alcyl of 20 bivalence or carbon number 6～20.

71. applications according to claim 70, wherein, described alkane diyl be methylene, ethylidene, glyceryl, fourth diyl, Penta diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl or Hexadecane diyl.

72. applications according to claim 69, wherein, described R¹For 4- alkyl cyclohexane -1,2- diyl, 3- alkyl In alkane -1,2- diyl, 3- alkyl -4- cyclohexene -1,2- diyl, 4- alkyl -4- cyclohexene -1,2- diyl or 4- methyl -3,6- Methylene -4- cyclohexene -1,2- diyl.

73. applications according to claim 69, wherein, described R²For alkane diyl, (1,4- dipropyl piperazine) diyl, double Asia Methyl norcamphane base or isophorone base.

74. applications according to claim 73, wherein, described R²Alkane diyl for carbon number 1～30.

75. applications according to claim 73 or 74, wherein, described R²For methylene, ethylidene, glyceryl, fourth diyl, Penta diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl or Hexadecane diyl.

76. applications according to claim 69, wherein, described R⁴For 5,5 '-outer-(1,1,3,3,5,5- hexamethyl three silica Alkane -1,5- diyl) double (bicyclic [2.2.1] heptane-outer -2,3- diyl).

77. applications according to claim 67, wherein, the described construction unit in described condensation resin has described poly- Oxygen alkane diyl.

78. applications according to claim 77, wherein, described polyoxy alkane diyl is the group shown in following formula (2),

79. applications according to claim 78, wherein, described R⁵Alkane diyl for carbon number 2～4.

80. applications according to claim 79, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1, 4- fourth diyl.

81. applications according to any one of claim 78～80, wherein, described n is 2～70.

82. applications according to claim 67, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- third Diyl.

83. applications according to claim 67, wherein, the structure from described monomer (B) in described construction unit has There is described polyoxy alkane diyl.

84. applications according to claim 67, wherein, described polymerizable monomer is with respect to described monomer (A) and described The ratio of the total amount 0.5～20mol% of monomer (B) comprises the monomer (b-1) with polyoxy alkane diyl and at least 2 amino.

85. applications described in 4 according to Claim 8, wherein, the content phase of the described monomer (b-1) in described polymerizable monomer Total amount for described monomer (A) and described monomer (B) is 1～10mol%.

86. applications according to claim 67, wherein, described monomer (A) is the anhydride of described monomer (A), described monomer (A) carboxylate or the acyl halide of described monomer (A).

87. applications according to claim 67, wherein, described monomer (A) is to have the monomer of 2 carboxyls, have 3 carboxylics The monomer of base or the monomer with 4 carboxyls.

88. applications according to claim 67, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) At least one selected in the group of the compound shown in thing, following formula (A-2) and the composition of the compound shown in following formula (A-3), It is the monomer (b- of liquid that described monomer (B) comprises to have the monomer (b-1) of polyoxy alkane diyl and at least 2 amino and 25 DEG C 2),

HO₂C-R¹-CO₂H (A-1)

89. applications according to claim 67, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) Compound shown in thing, following formula (A-2) and the compound shown in following formula (A-3) composition group in select at least one, And 25 DEG C be liquid or 25 DEG C of anhydride are the monomer (a-1) of liquid, described monomer (B) comprises with polyoxy alkane diyl and at least The monomer (b-1) of 2 amino,

HO₂C-R¹-CO₂H (A-1)

90. applications according to claim 67, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, bag Containing isophorone diamine, the double aminopropylpiperazine of 1,4-, [double (1- the Aminoheptyl) -6- hexyl -5- (1- octenyl) of 3,4-] ring Hexene, oxyalkylene diamidogen, double amino methyl norcamphane, alkyl diamine, polyoxy alkylene diamine or siloxane diamine.

91. applications according to claim 67, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, bag Containing ethylenediamine or propane diamine.

92. applications according to claim 67, wherein, described monomer (A), as 25 DEG C be liquid or 25 DEG C of anhydride are liquid The monomer (a-1) of shape, comprises 3- methylhexahydrophthaacid acid anhydride, 4- methylhexahydrophthaacid acid anhydride, 3- ethyl six Hydrogen phthalic acid anhydride, 4- ethyl hexahydrophthalic acid anhydride, 3- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid anhydride, 4- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid anhydride, the acid of methyl -3,6- methylene -1,2,3,6- tetrahydrophthalic acid Acid anhydride or double (bicyclic [2.2.1] heptane-outer -2,3- two of 5,5 '-outer-(1,1,3,3,5,5- hexam ethylcyclotrisiloxane -1,5- diyl) Carboxylic acid) dicarboxylic anhydride.

93. applications according to claim 67, wherein, in described polymerizable monomer, 25 DEG C in described monomer (A) is liquid In shape or monomer (a-1) that 25 DEG C of anhydride are liquid and described monomer (B) 25 DEG C are that the totals of the monomer (b-2) of liquid contain Amount, is 15～60mol% with respect to the total amount of described monomer (A) and described monomer (B).

94. applications according to claim 67, wherein, the described monomer (A) in described polymerizable monomer and described monomer (B) content, is more than 30mol% with respect to the total amount of described polymerizable monomer.

95. applications according to claim 67, wherein, described condensation resin comprises by polyamide-imide resin, gathers At least one selected in the group of imide resin and polyamide composition.

96. applications according to claim 95, wherein, described condensation resin is polyamide.

97. applications according to claim 67, wherein, described condensation resin comprises the diamidogen list with polyoxy alkane diyl Unit.

98. applications according to claim 97, wherein, the described diamine unit with polyoxy alkane diyl is polyoxy alkylidene Diamine unit.

99. applications according to claim 97 or 98, wherein, the content of the described diamine unit with polyoxy alkane diyl, It is calculated as 2.5～10mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

100. applications according to claim 67, wherein, described condensation resin has the fragrant ring group of bivalence further.

101. applications according to claim 100, wherein, the fragrant ring group of described bivalence is benzene diyl.

102. applications according to claim 67, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω-ammonia The carbon number of base alkyl is 1～10.

103. applications according to claim 67, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω-ammonia The carbon number of base alkyl is 2～4.

104. applications according to claim 67, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit is Isosorbide-5-Nitrae-bis- (3- aminopropyl) piperazine unit.

105. applications according to claim 67, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 15～60mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

106. applications according to claim 67, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 20～50mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

107. applications according to claim 67, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit with It is calculated as 25～45mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

108. applications according to claim 67, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 2～40.

109. applications according to claim 67, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 4～20.

110. applications according to claim 67, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

111. applications according to claim 67, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 50 mass % 100 mass %.

112. applications according to claim 67, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

113. applications according to claim 111 or 112, wherein, the content of described condensation resin is total with sticker It is calculated as below 96 mass % on the basis of amount.

114. applications according to claim 67, wherein, described sticker is to be pasted onto on adherend and be heated to 200 DEG C The thermostability sticker peeled off from this adherend after above.

A kind of application in the manufacture of sticker for 115. condensation resins, described condensation resin has following construction unit, Meet at least one of following (1) and (2), described construction unit pass through to make to comprise the monomer (A) with least 2 carboxyls and There is the polymerizable monomer polycondensation of monomer (B) of at least 2 amino and obtain, wherein, described condensation resin comprises Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit,

(2) described condensation resin has polyoxy alkane diyl.

116. applications according to claim 115, it meets described (1) and (2) simultaneously.

117. applications according to claim 115 or 116, wherein, described construction unit is following formula (1-1), formula (1-2) Or the construction unit shown in formula (1-3),

118. applications according to claim 117, wherein, described R¹For the alkane diyl of carbon number 1～30, carbon number 3 The fragrant ring group of the bivalence of the alcyl of～20 bivalence or carbon number 6～20.

119. applications according to claim 118, wherein, described alkane diyl is methylene, ethylidene, glyceryl, fourth two Base, penta diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl Or hexadecane diyl.

120. applications according to claim 117, wherein, described R¹For 4- alkyl cyclohexane -1,2- diyl, 3- alkyl ring Hexane -1,2- diyl, 3- alkyl -4- cyclohexene -1,2- diyl, 4- alkyl -4- cyclohexene -1,2- diyl or 4- methyl -3,6- Methylene -4- cyclohexene -1,2- diyl.

121. applications according to claim 117, wherein, described R²For alkane diyl, (1,4- dipropyl piperazine) diyl, double Methylene norcamphane base or isophorone base.

122. applications according to claim 121, wherein, described R²Alkane diyl for carbon number 1～30.

123. applications according to claim 121 or 122, wherein, described R²For methylene, ethylidene, glyceryl, fourth two Base, penta diyl, dihexyl, diyl in heptan, pungent diyl, nonyl diyl, last of the ten Heavenly stems diyl, hendecane diyl, dodecane diyl, tridecane diyl Or hexadecane diyl.

124. applications according to claim 117, wherein, described R⁴For 5,5 '-outer-(1,1,3,3,5,5- hexamethyl three silicon Oxygen alkane -1,5- diyl) double (bicyclic [2.2.1] heptane-outer -2,3- diyl).

125. applications according to claim 115, wherein, the described construction unit in described condensation resin has described Polyoxy alkane diyl.

126. applications according to claim 125, wherein, described polyoxy alkane diyl is the group shown in following formula (2),

127. applications according to claim 126, wherein, described R⁵Alkane diyl for carbon number 2～4.

128. applications according to claim 127, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1,4- fourth diyl.

129. applications according to any one of claim 126～128, wherein, described n is 2～70.

130. applications according to claim 115, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- Glyceryl.

131. applications according to claim 115, wherein, the structure from described monomer (B) in described construction unit There is described polyoxy alkane diyl.

132. applications according to claim 115, wherein, described polymerizable monomer is with respect to described monomer (A) and institute The ratio stating the total amount 0.5～20mol% of monomer (B) comprises the monomer (b-1) with polyoxy alkane diyl and at least 2 amino.

133. applications according to claim 132, wherein, the content of the described monomer (b-1) in described polymerizable monomer It is 1～10mol% with respect to the total amount of described monomer (A) and described monomer (B).

134. applications according to claim 115, wherein, described monomer (A) is the anhydride of described monomer (A), described list The carboxylate of body (A) or the acyl halide of described monomer (A).

135. applications according to claim 115, wherein, described monomer (A) is to have the monomer of 2 carboxyls, have 3 The monomer of carboxyl or the monomer with 4 carboxyls.

136. applications according to claim 115, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) At least one selected in the group of the compound shown in thing, following formula (A-2) and the composition of the compound shown in following formula (A-3), It is the monomer (b- of liquid that described monomer (B) comprises to have the monomer (b-1) of polyoxy alkane diyl and at least 2 amino and 25 DEG C 2),

HO₂C-R¹-CO₂H (A-1)

137. applications according to claim 115, wherein, described monomer (A) comprises the chemical combination shown in following formula (A-1) Compound shown in thing, following formula (A-2) and the compound shown in following formula (A-3) composition group in select at least one, And 25 DEG C be liquid or 25 DEG C of anhydride are the monomer (a-1) of liquid, described monomer (B) comprises with polyoxy alkane diyl and at least The monomer (b-1) of 2 amino, HO2C-R1-CO2H (A-1)

138. applications according to claim 115, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, Comprise isophorone diamine, the double aminopropylpiperazine of 1,4-, [double (1- the Aminoheptyl) -6- hexyl -5- (1- octenyl) of 3,4-] Cyclohexene, oxyalkylene diamidogen, double amino methyl norcamphane, alkyl diamine, polyoxy alkylene diamine or siloxane diamine.

139. applications according to claim 115, wherein, described monomer (B), is the monomer (b-2) of liquid as 25 DEG C, Comprise ethylenediamine or propane diamine.

140. applications according to claim 115, wherein, described monomer (A), as 25 DEG C be liquid or 25 DEG C of anhydride are The monomer (a-1) of liquid, comprises 3- methylhexahydrophthaacid acid anhydride, 4- methylhexahydrophthaacid acid anhydride, 3- ethyl Hexahydrophthalic acid anhydride, 4- ethyl hexahydrophthalic acid anhydride, 3- methyl isophthalic acid, the acid of 2,3,6- tetrahydrophthalic acid Acid anhydride, 4- methyl isophthalic acid, 2,3,6- tetrahydrophthalic acid anhydride, methyl -3,6- methylene -1,2,3,6- tetrahydrophthalic acid Anhydride or double (bicyclic [2.2.1] heptane-outer -2,3- of 5,5 '-outer-(1,1,3,3,5,5- hexam ethylcyclotrisiloxane -1,5- diyl) Dicarboxylic acids) dicarboxylic anhydride.

141. applications according to claim 115, wherein, in described polymerizable monomer, 25 DEG C in described monomer (A) are In liquid or monomer (a-1) that 25 DEG C of anhydride are liquid and described monomer (B) 25 DEG C are that the totals of the monomer (b-2) of liquid contain Amount, is 15～60mol% with respect to the total amount of described monomer (A) and described monomer (B).

142. applications according to claim 115, wherein, the described monomer (A) in described polymerizable monomer and described list The content of body (B), is more than 30mol% with respect to the total amount of described polymerizable monomer.

143. applications according to claim 115, wherein, described condensation resin comprise by polyamide-imide resin, At least one selected in the group of polyimide resin and polyamide composition.

144. applications according to claim 143, wherein, described condensation resin is polyamide.

145. applications according to claim 115, wherein, described condensation resin comprises the diamidogen with polyoxy alkane diyl Unit.

146. applications according to claim 145, wherein, the described diamine unit with polyoxy alkane diyl is poly (oxyalkylene) Base diamine unit.

147. applications according to claim 145 or 146, wherein, the containing of the described diamine unit with polyoxy alkane diyl Amount, is calculated as 2.5～10mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

148. applications according to claim 115, wherein, described condensation resin has the aromatic rings of bivalence further Base.

149. applications according to claim 148, wherein, the fragrant ring group of described bivalence is benzene diyl.

150. applications according to claim 115, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 1～10.

151. applications according to claim 115, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 2～4.

152. applications according to claim 115, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit be Isosorbide-5-Nitrae- Double (3- aminopropyl) piperazine unit.

153. applications according to claim 115, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit It is calculated as 15～60mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

154. applications according to claim 115, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit It is calculated as 20～50mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

155. applications according to claim 115, wherein, the content of described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit It is calculated as 25～45mol% on the basis of the total amount of described monomer (A) unit and described monomer (B) unit.

156. applications according to claim 115, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 2～40.

157. applications according to claim 115, wherein, in described condensation resin, Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine The mol ratio of the content with respect to the diamine unit with polyoxy alkane diyl for the content of piperazine unit is 4～20.

158. applications according to claim 115, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

159. applications according to claim 115, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 50 mass % 100 mass %.

160. applications according to claim 115, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

161. applications according to claim 159 or 160, wherein, the content of described condensation resin is total with sticker It is calculated as below 96 mass % on the basis of amount.

162. applications according to claim 115, wherein, described sticker is to be pasted onto on adherend and be heated to 200 The thermostability sticker peeled off from this adherend after more than DEG C.

A kind of 163. applications as sticker for the condensation resin with polyoxy alkane diyl, described condensation resin is selected from poly- The group of amide resin, polyamide-imide resin and polyimide resin composition, wherein, described condensation resin comprises there is 1, The diamine unit of 4- piperazine diyl, the described diamine unit with Isosorbide-5-Nitrae-piperazine diyl is Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine Unit.

164. applications according to claim 163, wherein, described condensation resin is polyamide.

165. applications according to claim 163 or 164, wherein, described polyoxy alkane diyl is the base shown in following formula (2) Group,

166. applications according to claim 165, wherein, described R⁵Alkane diyl for carbon number 2～4.

167. applications according to claim 166, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1,4- fourth diyl.

168. applications according to claim 165, wherein, described n is 2～70.

169. applications according to claim 163, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- Glyceryl.

170. applications according to claim 163, wherein, described condensation resin comprises the diamidogen with polyoxy alkane diyl Unit.

171. applications according to claim 170, wherein, the described diamine unit with polyoxy alkane diyl is poly (oxyalkylene) Base diamine unit.

172. applications according to claim 163, wherein, described condensation resin has the aromatic rings of bivalence further Base.

173. applications according to claim 172, wherein, the fragrant ring group of described bivalence is benzene diyl.

174. applications according to claim 172 or 173, wherein, described condensation resin comprises the fragrance with bivalence The dicarboxylic acid units of ring group.

175. applications according to claim 163, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 1～10.

176. applications according to claim 163, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 2～4.

177. applications according to claim 163, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit be Isosorbide-5-Nitrae- Double (3- aminopropyl) piperazine unit.

178. applications according to claim 163, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

179. applications according to claim 163, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 50 mass % 100 mass %.

180. applications according to claim 163, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

181. applications according to claim 179 or 180, wherein, the content of described condensation resin is total with sticker It is calculated as below 96 mass % on the basis of amount.

182. applications according to claim 163, wherein, described sticker is to be pasted onto on adherend and be heated to 200 The thermostability sticker peeled off from this adherend after more than DEG C.

A kind of application in the manufacture of sticker for 183. condensation resins with polyoxy alkane diyl, described condensation resin choosing The group of free polyamide, polyamide-imide resin and polyimide resin composition, wherein, described condensation resin comprises There is the diamine unit of Isosorbide-5-Nitrae-piperazine diyl, the described diamine unit with Isosorbide-5-Nitrae-piperazine diyl is Isosorbide-5-Nitrae-bis- (omega-amino alkane Base) piperazine unit.

184. applications according to claim 183, wherein, described condensation resin is polyamide.

185. applications according to claim 183 or 184, wherein, described polyoxy alkane diyl is the base shown in following formula (2) Group,

186. applications according to claim 185, wherein, described R⁵Alkane diyl for carbon number 2～4.

187. applications according to claim 186, wherein, described R⁵For ethylidene, 1,2- glyceryl, 1,3- glyceryl or 1,4- fourth diyl.

188. applications according to claim 185, wherein, described n is 2～70.

189. applications according to claim 183, wherein, described polyoxy alkane diyl is polyoxyethylene groups or polyoxy -1,2- Glyceryl.

190. applications according to claim 183, wherein, described condensation resin comprises the diamidogen with polyoxy alkane diyl Unit.

191. applications according to claim 190, wherein, the described diamine unit with polyoxy alkane diyl is poly (oxyalkylene) Base diamine unit.

192. applications according to claim 183, wherein, described condensation resin has the aromatic rings of bivalence further Base.

193. applications according to claim 192, wherein, the fragrant ring group of described bivalence is benzene diyl.

194. applications according to claim 192 or 193, wherein, described condensation resin comprises the fragrance with bivalence The dicarboxylic acid units of ring group.

195. applications according to claim 183, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 1～10.

196. applications according to claim 183, wherein, in described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit, ω- The carbon number of aminoalkyl is 2～4.

197. applications according to claim 183, wherein, described Isosorbide-5-Nitrae-bis- (omega-amino alkyl) piperazine unit be Isosorbide-5-Nitrae- Double (3- aminopropyl) piperazine unit.

198. applications according to claim 183, wherein, the weight average molecular weight of described condensation resin is 20000～ 100000.

199. applications according to claim 183, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 50 mass % 100 mass %.

200. applications according to claim 183, wherein, the content of described condensation resin is with the total amount of sticker as base Standard is calculated as below more than 70 mass % 100 mass %.

201. applications according to claim 199 or 200, wherein, the content of described condensation resin is total with sticker It is calculated as below 96 mass % on the basis of amount.

202. applications according to claim 183, wherein, described sticker is to be pasted onto on adherend and be heated to 200 The thermostability sticker peeled off from this adherend after more than DEG C.

A kind of 203. sticky materials, it possess supporter and be arranged on this supporter containing arbitrary in claim 1～66 The adhesion coating of the sticker described in.

A kind of 204. usings method of sticker, it possesses：

Adhering processes, via the adhesion coating of the sticker any one of claim 1～66, the second adherend are glued It is affixed on the first adherend；

Heating process, under conditions of the temperature of described adhesion coating becomes more than 200 DEG C, heats described first adherend and described Second adherend；With

Stripping process, peels off described adhesion coating and described second from described first adherend that experienced described heating process and is glued Thing.

205. usings method according to claim 204, wherein, in described adhering processes, paste described the at 0～50 DEG C One adherend and described second adherend.

206. usings method according to claim 204, wherein, in described stripping process, at 0～50 DEG C from described first Adherend peels off described adhesion coating and described second adherend.

207. usings method according to any one of claim 204～206, wherein, will in described stripping process quilt The described adhesion coating peeled off is reused in described adhering processes.

A kind of 208. usings method of sticky material, it possesses：

Adhering processes, are configured in the mode near adherend side according to described adhesion coating, by the adhesion described in claim 203 Material is pasted on described adherend；

Heating process, under conditions of the temperature of described sticky material becomes more than 200 DEG C, heats described adherend；With

Stripping process, peels off described sticky material from the described adherend that experienced described heating process.

209. usings method according to claim 208, wherein, in described adhering processes, at 0～50 DEG C by described adhesion Material is pasted on described adherend.

210. usings method according to claim 208, wherein, in described stripping process, are glued from described at 0～50 DEG C Thing peels off described sticky material.

211. usings method according to any one of claim 208～210, wherein, will in described stripping process quilt The described sticky material peeled off is reused in described adhering processes.