CN103474555A - 一种led灯珠 - Google Patents

一种led灯珠 Download PDF

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Publication number
CN103474555A
CN103474555A CN2013104088040A CN201310408804A CN103474555A CN 103474555 A CN103474555 A CN 103474555A CN 2013104088040 A CN2013104088040 A CN 2013104088040A CN 201310408804 A CN201310408804 A CN 201310408804A CN 103474555 A CN103474555 A CN 103474555A
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CN
China
Prior art keywords
pins
led lamp
chip
containing cavity
accommodating cavity
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Pending
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CN2013104088040A
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English (en)
Inventor
潘静
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Xiamen Xindeco Optoelectronics Co Ltd
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Xiamen Xindeco Optoelectronics Co Ltd
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Priority to CN2013104088040A priority Critical patent/CN103474555A/zh
Publication of CN103474555A publication Critical patent/CN103474555A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)

Abstract

本发明公开一种LED灯珠，包括设有容置腔的导热外壳、倒装芯片、荧光片及两管脚；两管脚分别嵌入导热外壳的容置腔中；倒装芯片贴装在两管脚上，分别与两管脚电性连接，且位于容置腔中；荧光片固定于导热外壳上。本发明采用导热外壳和荧光片技术，无需在容置腔中灌封树脂胶体，从而使得本发明整体厚度较薄，散热效果较好，且不会发生色漂移；倒装芯片无需焊线和点固晶胶水，使得本发明厚度也会较薄。

Description

一种LED灯珠
技术领域
本发明涉及一种LED灯珠。
背景技术
如图1及图2所示，现有技术揭示的一种LED灯珠，包括设有容置腔的外壳10、两管脚20、芯片30及两金线40；两管脚20对称嵌入外壳10的容置腔中，分别位于外壳10两侧，一侧管脚20作为正极，另一侧管脚20作为负极；芯片安装两管脚20上，且位于容置腔中，芯片30分别通过金线40与正极管脚20及负极管脚20连接。
由于外壳10为不具导热特性的普通外壳，其散热主要由两管脚20导出散热，为了使LED灯珠发出白光，通常在容置腔中灌封具有导热特性的树脂胶体50，并在树脂胶体50中加入荧光粉，荧光粉的颜色与芯片30发光颜色互补而发出白光。由于两管脚20散热面积过小，使得容置中灌封材料树脂胶体50温度过高，荧光粉沉淀，进而也会使得LED灯珠发生色漂移。
发明内容
本发明的目的在于提供一种厚度较薄、散热效果较好且色温稳定的LED灯珠。
为达成上述目的，本发明的解决方案为：
一种LED灯珠，包括设有容置腔的导热外壳、倒装芯片、荧光片及两管脚；两管脚分别嵌入导热外壳的容置腔中；倒装芯片贴装在两管脚上，分别与两管脚电性连接，且位于容置腔中；荧光片固定于导热外壳上。
进一步，容置腔侧壁上形成台阶，台阶上设置凹槽，凹槽中灌封密封胶水，荧光片通过密封胶水安装在台阶上。
采用上述方案后，本发明倒装芯片贴装在两管脚上，导热外壳本身具有导热特性，无需再额外设置散热器，倒装芯片产生的热量可以通过导热外壳和两管脚扩散出去。而且，倒装芯片无需焊线和点固晶胶水。因此，无需在容置腔中灌封树脂胶体，从而使得本发明整体厚度较薄，且散热效果较好；倒装芯片无需焊线和点固晶胶水，使得本发明厚度也会较薄。
而且，本发明在导热外壳上安装荧光片，荧光片也不会因为温度上升而发生荧光粉沉淀使得发生色漂移；由于荧光片本身厚度较薄，进一步使得本发明厚度较薄。 
附图说明
图1为现有技术立体分解图；
图2为现有技术剖面图；
图3为本发明立体分解图；
图4为本发明剖面图；
图5为本发明外观图。
标号说明
外壳10              管脚20
芯片30              金线40
树脂胶体50
导热外壳1           容置腔11
台阶12              凹槽121
倒装芯片2           管脚3
荧光片4。
具体实施方式
以下结合附图及具体实施例对本发明做详细描述。
参阅图3至图5所示，本发明揭示的一种LED灯珠，包括设有容置腔11的导热外壳1、倒装芯片2、两管脚3及荧光片4。
两管脚3分别嵌入导热外壳1的容置腔11中，将容置腔11底部密封，两管脚3分别位于导热外壳1两侧，一侧管脚3作为正极，另一侧管脚3作为负极。
倒装芯片2贴装在两管脚3上，分别与两管脚3电性连接，即倒装芯片2分别与正极管脚3及负极管脚3电性连接，且倒装芯片2位于容置腔11中。
倒装芯片2贴装在两管脚3上，无需焊线和点固晶胶水，使得本发明LED灯珠厚度会较薄。导热外壳1本身具有导热特性，倒装芯片2产生的热量通过导热外壳1和两管脚3扩散出去。因此，无需如现有技术在容置腔中11灌封树脂胶体，从而使得本发明整体厚度较薄，且散热效果较好。
荧光片4固定安装在导热外壳1上，将容置腔11密封，与嵌入的两管脚3配合，使容置腔11成为密封腔体，倒装芯片2位于密封腔体中。荧光片4的颜色与倒装芯片2的发光颜色互补而发出白光，通常倒装芯片2发蓝光，而荧光片4设置为黄光，使得LED灯珠发出白光；而且，荧光片不会因为导热外壳温度上升而荧光粉沉淀，进而发生色漂移。
本实施中，容置腔11侧壁上形成台阶12，台阶12上设置凹槽121，凹槽121中灌封密封胶水，荧光片4通过密封胶水安装在台阶12上，当然也可以用卡扣的方式固定，由于荧光片4本身厚度较薄，进一步使得本发明厚度较薄。 
以上所述仅为本发明的较佳实施例，并非对本案设计的限制，凡依本案的设计关键所做的等同变化，均落入本案的保护范围。

Claims (2)

1.一种LED灯珠，其特征在于：包括设有容置腔的导热外壳、倒装芯片、荧光片及两管脚；两管脚分别嵌入导热外壳的容置腔中；倒装芯片贴装在两管脚上，分别与两管脚电性连接，且位于容置腔中；荧光片固定于导热外壳上。
2.如权利要求1所述的一种LED灯珠，其特征在于：容置腔侧壁上形成台阶，台阶上设置凹槽，凹槽中灌封密封胶水，荧光片通过密封胶水安装在台阶上。
CN2013104088040A 2013-09-10 2013-09-10 一种led灯珠 Pending CN103474555A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104916762A (zh) * 2015-07-07 2015-09-16 宏齐光电子(深圳)有限公司 一种白光led面光源及其制备方法
JP2019013887A (ja) * 2017-07-07 2019-01-31 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 光照射装置
CN111244249A (zh) * 2020-03-04 2020-06-05 宁波升谱光电股份有限公司 一种发光组件的密封器件及其制作方法、发光组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268323A (ja) * 2004-03-16 2005-09-29 Sumitomo Electric Ind Ltd 半導体発光装置
JP2007200949A (ja) * 2006-01-23 2007-08-09 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
US20070194336A1 (en) * 2006-02-17 2007-08-23 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
US20130181243A1 (en) * 2012-01-17 2013-07-18 Nan Ya Photonics Inc. Solid State Lighting Device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268323A (ja) * 2004-03-16 2005-09-29 Sumitomo Electric Ind Ltd 半導体発光装置
JP2007200949A (ja) * 2006-01-23 2007-08-09 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
US20070194336A1 (en) * 2006-02-17 2007-08-23 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same
US20130181243A1 (en) * 2012-01-17 2013-07-18 Nan Ya Photonics Inc. Solid State Lighting Device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104916762A (zh) * 2015-07-07 2015-09-16 宏齐光电子(深圳)有限公司 一种白光led面光源及其制备方法
JP2019013887A (ja) * 2017-07-07 2019-01-31 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 光照射装置
CN111244249A (zh) * 2020-03-04 2020-06-05 宁波升谱光电股份有限公司 一种发光组件的密封器件及其制作方法、发光组件

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Application publication date: 20131225