CN103465543B - The enhanced boiling heat transfer preparation method of double-hole structural porous copper product - Google Patents
The enhanced boiling heat transfer preparation method of double-hole structural porous copper product Download PDFInfo
- Publication number
- CN103465543B CN103465543B CN201310460362.4A CN201310460362A CN103465543B CN 103465543 B CN103465543 B CN 103465543B CN 201310460362 A CN201310460362 A CN 201310460362A CN 103465543 B CN103465543 B CN 103465543B
- Authority
- CN
- China
- Prior art keywords
- copper
- heat transfer
- boiling heat
- double
- fibrofelt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention provides a kind of preparation method of enhanced boiling heat transfer double-hole structural porous copper product, comprise the following steps: one, Copper substrate and copper fibrofelt are carried out Ultrasonic Cleaning respectively and dry; Two, copper fibrofelt paving is overlying on Copper substrate surface, then carries out sintering processes, at Copper substrate surface attachment one deck copper fiber multihole layer; Three, the Copper substrate being attached with copper fiber multihole layer is carried out anodized, strengthened boiling heat transfer double-hole structural porous copper product.Preparation method of the present invention is simple, reasonable in design, is easy to realize, workable, is suitable for large-scale production; The Porous Cu material adopting the present invention to prepare is double-hole structure, and specific area is large, and nucleus of boiling number is many, and heat-transfer effect is good, has important practical value and dissemination.
Description
Technical field
The invention belongs to metal polyporous material technical field, be specifically related to a kind of preparation method of enhanced boiling heat transfer double-hole structural porous copper product.
Background technology
Along with the progress of science and technology, people propose more and more higher performance requirement to boiling heat transfer.Current scholars has carried out theory analysis, experimental study and technology exploration widely to boiling heat transfer, propose the Theories and methods of multiple enhanced boiling heat transfer, wherein the most effective enhanced boiling heat transfer method adopts various types of enhanced boiling heat transfer material.Existing enhanced boiling heat transfer material is usually with the groove of various shape, fin or porous surface, wherein with the enhanced boiling heat transfer material of porous surface, paid close attention to widely with its high boiling heat transfer efficiency, Low Temperature Difference boiling, high critical heat flux density and good anti-blocking ability.The manufacture method of this kind of material is also arisen at the historic moment, as sintering process, mechanical processing method, flame spraying, electrochemical erosion method, galvanoplastic etc.But the heat transfer sheet area of the enhanced boiling heat transfer material adopting conventional method to prepare is relatively little, and nucleus of boiling number is few, and the frequency generating bubble is low, makes enhanced boiling heat transfer inefficiency.
Therefore, need research and development badly a kind ofly to increase heat transfer sheet area, nucleus of boiling number, generate the preparation method of the boiling enhanced heat-transfer matcrial that frequency is high, heat-transfer effect is good of bubble.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, provides a kind of preparation method of enhanced boiling heat transfer double-hole structural porous copper product.The method preparation method is simple, reasonable in design, is easy to realize, workable, is suitable for large-scale production; The Porous Cu material adopting the method to prepare is double-hole structure, and specific area is large, and nucleus of boiling number is many, and the frequency generating bubble is high, and heat-transfer effect is good, has important practical value and dissemination.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of preparation method of enhanced boiling heat transfer double-hole structural porous copper product, and it is characterized in that, the method comprises the following steps:
Step one, Copper substrate and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; Described copper fibrofelt is copper fiber blank felt or copper fiber sintering felt serving;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the Copper substrate after oven dry, then Copper substrate paving being covered with copper fibrofelt puts into sintering furnace, sinter under the protection of hydrogen atmosphere, naturally be 0.5mm ~ 3mm in Copper substrate surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 80% ~ 95%; The temperature of described sintering is 850 DEG C ~ 1000 DEG C, and the time of described sintering is 1h ~ 2h;
Step 3, be anodic oxidation electrolyte with KOH solution, to be attached with the Copper substrate of copper fiber multihole layer in step 2 for anode, taking corrosion resistant plate as negative electrode, is 0.5mA/cm in current density
2~ 2mA/cm
2, voltage is the condition anodic oxygen 5min ~ 20min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product.
The preparation method of above-mentioned enhanced boiling heat transfer double-hole structural porous copper product, it is characterized in that, Copper substrate described in step one is copper coin or copper pipe.
The preparation method of above-mentioned enhanced boiling heat transfer double-hole structural porous copper product, it is characterized in that, the thickness of described copper coin is 1mm ~ 5mm, the external diameter of described copper pipe is 6mm ~ 20mm, and the wall thickness of described copper pipe is 1mm ~ 2mm.
The preparation method of above-mentioned enhanced boiling heat transfer double-hole structural porous copper product, is characterized in that, the string diameter of the fiber blank felt of copper described in step one and copper fiber sintering felt serving is 30 μm ~ 160 μm.
The preparation method of above-mentioned enhanced boiling heat transfer double-hole structural porous copper product, it is characterized in that, cleaning agent described in step one is acetone or absolute ethyl alcohol.
The preparation method of above-mentioned enhanced boiling heat transfer double-hole structural porous copper product, is characterized in that, the concentration of KOH solution described in step 3 is 0.5mol/L ~ 2mol/L.
The present invention compared with prior art has the following advantages:
1, first copper fibrofelt paving is overlying on Copper substrate surface by the present invention, carry out sintering processes again, Copper substrate and copper fibrofelt are sintered to one, and the copper fiber multihole surface with high porosity is formed on Copper substrate surface, and the hole formed is micron order macropore, then carry out anodized, by the control of technological parameter and optimization, make numerous nanometer level microporous of copper fiber surface quantity of formation.Owing to having micron order macropore and the nanometer level microporous double-hole structure coexisted, the Porous Cu material prepared by the present invention has the more nucleus of boiling number of larger heat-exchange surface sum, and boiling heat transfer effect is significantly improved.
2, the surface of enhanced boiling heat transfer Porous Cu material of the present invention is double-hole structure, and by micron order macropore with nanometer level microporously to form, the specific area of this double-hole structure is large, and nucleus of boiling number is many, and heat-transfer effect is good.The boiling heat transfer performance of enhanced boiling heat transfer material of the present invention improves more than 5 times than the boiling heat transfer performance of light plane materiel material, improves more than 1 times than the material with traditional single hole arrangements.
3, the present invention adopts copper pipe or copper coin to be matrix material, copper fibrofelt is adopted to be that stephanoporate framework prepares enhanced boiling heat transfer material, make full use of the heat conductivility that metallic copper is excellent, prepared enhanced boiling heat transfer material heat-conductive characteristic is excellent, and boiling heat transfer efficiency is high.
4, preparation method of the present invention is simple, reasonable in design, is easy to realize.
5, the present invention is workable, is suitable for large-scale production, has important practical value and dissemination.
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the electron micrograph of enhanced boiling heat transfer double-hole structural porous copper product under enlargement ratio is 50 times of conditions prepared by the embodiment of the present invention 1.
Fig. 2 is the electron micrograph of enhanced boiling heat transfer double-hole structural porous copper product under enlargement ratio is 15000 times of conditions prepared by the embodiment of the present invention 1.
Fig. 3 is the electron micrograph of enhanced boiling heat transfer double-hole structural porous copper product under enlargement ratio is 50 times of conditions prepared by the embodiment of the present invention 5.
Fig. 4 is the electron micrograph of enhanced boiling heat transfer double-hole structural porous copper product under enlargement ratio is 10000 times of conditions prepared by the embodiment of the present invention 5.
Detailed description of the invention
Embodiment 1
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper coin and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with acetone respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The thickness of described copper coin is 2mm, described copper fibrofelt to be string diameter the be copper fiber blank felt of 60 μm;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the copper coin after oven dry, then the copper coin that paving is covered with copper fibrofelt is put into sintering furnace to sinter, naturally be 2mm in copper coin surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 90%; The temperature of described sintering is 900 DEG C, and the time of described sintering is 1h;
Step 3, be the KOH solution of 1mol/L with concentration be anodic oxidation electrolyte, be attached with the copper coin of copper fiber multihole layer for anode with upper surface in step 2, taking corrosion resistant plate as negative electrode, is 1mA/cm in current density
2, voltage is the condition anodic oxygen 10min of 300V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilizing electron microscope to observe the present embodiment Porous Cu material, is that electron micrograph under 50 times of conditions is shown in Fig. 1 at enlargement ratio, is that electron micrograph under 15000 times of conditions is shown in Fig. 2 at enlargement ratio.From Fig. 1 and Fig. 2, the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 6 times than the boiling heat transfer performance of light face copper coin, improves 1.5 times than traditional boiling heat transfer performance with single hole arrangements copper coin.
Embodiment 2
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper coin and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with absolute ethyl alcohol respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The thickness of described copper coin is 2mm, described copper fibrofelt to be string diameter the be copper fiber sintering felt serving of 160 μm;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the copper coin after oven dry, then the copper coin that paving is covered with copper fibrofelt is put into sintering furnace to sinter, naturally be 0.5mm in copper coin surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 95%; The temperature of described sintering is 1000 DEG C, and the time of described sintering is 2h;
Step 3, be the KOH solution of 0.5mol/L with concentration be anodic oxidation electrolyte, be attached with the copper coin of copper fiber multihole layer for anode with upper surface in step 2, taking corrosion resistant plate as negative electrode, is 0.5mA/cm in current density
2, voltage is the condition anodic oxygen 5min of 380V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5 times than the boiling heat transfer performance of light face copper coin, improves 1 times than traditional boiling heat transfer performance with single hole arrangements copper coin.
Embodiment 3
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper coin and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with absolute ethyl alcohol respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The thickness of described copper coin is 2mm, described copper fibrofelt to be string diameter the be copper fiber blank felt of 30 μm;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the copper coin after oven dry, then the copper coin that paving is covered with copper fibrofelt is put into sintering furnace to sinter, naturally be 3mm in copper coin surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 80%; The temperature of described sintering is 850 DEG C, and the time of described sintering is 2h;
Step 3, be the KOH solution of 2mol/L with concentration be anodic oxidation electrolyte, be attached with the copper coin of copper fiber multihole layer for anode with upper surface in step 2, taking corrosion resistant plate as negative electrode, is 2mA/cm in current density
2, voltage is the condition anodic oxygen 20min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5.5 times than the boiling heat transfer performance of light face copper coin, improves 2 times than traditional boiling heat transfer performance with single hole arrangements copper coin.
Embodiment 4
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper coin and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with acetone respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The thickness of described copper coin is 5mm, described copper fibrofelt to be string diameter the be copper fiber sintering felt serving of 120 μm;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the copper coin after oven dry, then the copper coin that paving is covered with copper fibrofelt is put into sintering furnace to sinter, naturally be 1.5mm in copper coin surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 85%; The temperature of described sintering is 950 DEG C, and the time of described sintering is 1.5h;
Step 3, be the KOH solution of 1.5mol/L with concentration be anodic oxidation electrolyte, be attached with the copper coin of copper fiber multihole layer for anode with upper surface in step 2, taking corrosion resistant plate as negative electrode, is 1.5mA/cm in current density
2, voltage is the condition anodic oxygen 15min of 380V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 6.5 times than the boiling heat transfer performance of light face copper coin, improves 1.5 times than traditional boiling heat transfer performance with single hole arrangements copper coin.
Embodiment 5
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper pipe and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The wall thickness of described copper coin is 2mm, and external diameter is 50mm, described copper fibrofelt to be string diameter the be copper fiber blank felt of 100 μm;
Step 2, the copper fibrofelt after drying in step one is coated on the outer surface of the copper pipe after oven dry, then the copper pipe being coated with copper fibrofelt is put into sintering furnace to sinter, naturally adhering to a layer thickness at copper pipe outer surface after cooling is 2mm, and porosity is the copper fiber multihole layer of 85%; The temperature of described sintering is 950 DEG C, and the time of described sintering is 2h;
Step 3, be the KOH solution of 01mol/L with concentration be anodic oxidation electrolyte, have the copper pipe of copper fiber multihole layer for anode with surface attachment in step 2, taking corrosion resistant plate as negative electrode, is 1.5mA/cm in current density
2, voltage is the condition anodic oxygen 5min of 380V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilizing electron microscope to observe the present embodiment Porous Cu material, is that electron micrograph under 50 times of conditions is shown in Fig. 3 at enlargement ratio, is that electron micrograph under 10000 times of conditions is shown in Fig. 4 at enlargement ratio.From Fig. 3 and Fig. 4, the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5 times than the boiling heat transfer performance of light face copper pipe, improves 1 times than traditional boiling heat transfer performance with single hole arrangements copper pipe.
Embodiment 6
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper pipe and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; The wall thickness of described copper coin is 1mm, and external diameter is 20mm, described copper fibrofelt to be string diameter the be copper fiber sintering felt serving of 30 μm;
Step 2, the copper fibrofelt after drying in step one is coated on the outer surface of the copper pipe after oven dry, then the copper pipe being coated with copper fibrofelt is put into sintering furnace to sinter, naturally adhering to a layer thickness at copper pipe outer surface after cooling is 2mm, and porosity is the copper fiber multihole layer of 90%; The temperature of described sintering is 850 DEG C, and the time of described sintering is 2h;
Step 3, be the KOH solution of 1mol/L with concentration be anodic oxidation electrolyte, have the copper pipe of copper fiber multihole layer for anode with surface attachment in step 2, taking corrosion resistant plate as negative electrode, is 1mA/cm in current density
2, voltage is the condition anodic oxygen 10min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5 times than the boiling heat transfer performance of light face copper pipe, improves 1 times than traditional boiling heat transfer performance with single hole arrangements copper pipe.
Embodiment 7
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper pipe and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; Wall thickness is 1mm, and the external diameter of described copper coin is 200mm, described copper fibrofelt to be string diameter the be copper fiber blank felt of 160 μm;
Step 2, the copper fibrofelt after drying in step one is coated on the outer surface of the copper pipe after oven dry, then the copper pipe being coated with copper fibrofelt is put into sintering furnace to sinter, naturally adhering to a layer thickness at copper pipe outer surface after cooling is 2mm, and porosity is the copper fiber multihole layer of 90%; The temperature of described sintering is 1000 DEG C, and the time of described sintering is 1h;
Step 3, be the KOH solution of 1mol/L with concentration be anodic oxidation electrolyte, have the copper pipe of copper fiber multihole layer for anode with surface attachment in step 2, taking corrosion resistant plate as negative electrode, is 1mA/cm in current density
2, voltage is the condition anodic oxygen 10min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5 times than the boiling heat transfer performance of light face copper pipe, improves 1 times than traditional boiling heat transfer performance with single hole arrangements copper pipe.
Embodiment 8
The preparation method of the present embodiment enhanced boiling heat transfer double-hole structural porous copper product comprises the following steps:
Step one, copper pipe and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; Wall thickness is 5mm, and the external diameter of described copper coin is 300mm, described copper fibrofelt to be string diameter the be copper fiber sintering felt serving of 80 μm;
Step 2, the copper fibrofelt after drying in step one is coated on the outer surface of the copper pipe after oven dry, then the copper pipe being coated with copper fibrofelt is put into sintering furnace to sinter, naturally adhering to a layer thickness at copper pipe outer surface after cooling is 2mm, and porosity is the copper fiber multihole layer of 95%; The temperature of described sintering is 900 DEG C, and the time of described sintering is 1.5h;
Step 3, be the KOH solution of 1.5mol/L with concentration be anodic oxidation electrolyte, have the copper pipe of copper fiber multihole layer for anode with surface attachment in step 2, taking corrosion resistant plate as negative electrode, is 1.5mA/cm in current density
2, voltage is the condition anodic oxygen 15min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product.
Utilize electron microscope to observe the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really double-hole structure, by micron order macropore with nanometer level microporously to form.Enhanced boiling heat transfer test is carried out to the present embodiment Porous Cu material, the boiling heat transfer performance recording the present embodiment Porous Cu material improves 5 times than the boiling heat transfer performance of light face copper pipe, improves 1 times than traditional boiling heat transfer performance with single hole arrangements copper pipe.
The above is only preferred embodiment of the present invention, not imposes any restrictions the present invention.Every above embodiment is done according to invention technical spirit any simple modification, change and equivalence change, all still belong in the protection domain of technical solution of the present invention.
Claims (5)
1. an enhanced boiling heat transfer preparation method for double-hole structural porous copper product, it is characterized in that, the method comprises the following steps:
Step one, Copper substrate and copper fibrofelt are put into the supersonic wave cleaning machine being loaded with cleaning agent respectively carry out Ultrasonic Cleaning, be then placed in baking oven and dry; Described copper fibrofelt is copper fiber blank felt or copper fiber sintering felt serving;
Step 2, the copper fibrofelt paving after drying in step one is overlying on the surface of the Copper substrate after oven dry, then Copper substrate paving being covered with copper fibrofelt puts into sintering furnace, sinter under the protection of hydrogen atmosphere, naturally be 0.5mm ~ 3mm in Copper substrate surface attachment a layer thickness after cooling, porosity is the copper fiber multihole layer of 80% ~ 95%; The temperature of described sintering is 850 DEG C ~ 1000 DEG C, and the time of described sintering is 1h ~ 2h;
Step 3, be anodic oxidation electrolyte with KOH solution, to be attached with the Copper substrate of copper fiber multihole layer in step 2 for anode, taking corrosion resistant plate as negative electrode, is 0.5mA/cm in current density
2~ 2mA/cm
2, voltage is the condition anodic oxygen 5min ~ 20min of 220V, and strengthened boiling heat transfer double-hole structural porous copper product;
The concentration of KOH solution described in step 3 is 0.5mol/L ~ 2mol/L.
2. the preparation method of enhanced boiling heat transfer double-hole structural porous copper product according to claim 1, it is characterized in that, Copper substrate described in step one is copper coin or copper pipe.
3. the preparation method of enhanced boiling heat transfer double-hole structural porous copper product according to claim 2, is characterized in that, the thickness of described copper coin is 1mm ~ 5mm, and the external diameter of described copper pipe is 6mm ~ 20mm, and the wall thickness of described copper pipe is 1mm ~ 2mm.
4. the preparation method of enhanced boiling heat transfer double-hole structural porous copper product according to claim 1, is characterized in that, the string diameter of the fiber blank felt of copper described in step one and copper fiber sintering felt serving is 30 μm ~ 160 μm.
5. the preparation method of enhanced boiling heat transfer double-hole structural porous copper product according to claim 1, it is characterized in that, cleaning agent described in step one is acetone or absolute ethyl alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310460362.4A CN103465543B (en) | 2013-09-29 | 2013-09-29 | The enhanced boiling heat transfer preparation method of double-hole structural porous copper product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310460362.4A CN103465543B (en) | 2013-09-29 | 2013-09-29 | The enhanced boiling heat transfer preparation method of double-hole structural porous copper product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103465543A CN103465543A (en) | 2013-12-25 |
| CN103465543B true CN103465543B (en) | 2015-07-29 |
Family
ID=49790691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310460362.4A Active CN103465543B (en) | 2013-09-29 | 2013-09-29 | The enhanced boiling heat transfer preparation method of double-hole structural porous copper product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103465543B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104475740B (en) * | 2014-11-12 | 2016-04-13 | 华南理工大学 | A kind of copper fibrous felt materials with nano-porous surface structure and preparation method thereof |
| JP6065058B2 (en) * | 2015-06-12 | 2017-01-25 | 三菱マテリアル株式会社 | Copper porous body and copper porous composite member |
| CN109023459B (en) * | 2018-08-04 | 2021-03-16 | 中山大学 | Double-layer multi-scale enhanced boiling surface structure and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000015875A1 (en) * | 1998-09-14 | 2000-03-23 | Mitsui Mining & Smelting Co., Ltd. | Porous copper foil, use thereof and method for preparation thereof |
| US20080081007A1 (en) * | 2006-09-29 | 2008-04-03 | Mott Corporation, A Corporation Of The State Of Connecticut | Sinter bonded porous metallic coatings |
| CN101329146A (en) * | 2008-07-17 | 2008-12-24 | 华东理工大学 | Porous surface U type heat exchange tube |
| CN101644549B (en) * | 2009-07-28 | 2011-06-15 | 华南理工大学 | Compound porous structure of micro groove and fiber and preparation method thereof |
| CN102430752B (en) * | 2011-12-03 | 2013-01-23 | 西北有色金属研究院 | Preparation method of metal fiber composite porous surface of metal fiber for heat transfer |
| CN102689014A (en) * | 2012-06-15 | 2012-09-26 | 西北有色金属研究院 | Preparation method of metal fiber porous surface heat exchange tube |
-
2013
- 2013-09-29 CN CN201310460362.4A patent/CN103465543B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103465543A (en) | 2013-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103426648B (en) | A kind of MOS2/TiO2Nano composite material and preparation method thereof | |
| CN103046088B (en) | A kind of micro-nano compound porous copper surface tissue and preparation method thereof and device | |
| Wang et al. | Copper vertical micro dendrite fin arrays and their superior boiling heat transfer capability | |
| CN106400067A (en) | Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof | |
| Wang et al. | Fabrication of nanosheets Co3O4 by oxidation-assisted dealloying method for high capacity supercapacitors | |
| CN103465543B (en) | The enhanced boiling heat transfer preparation method of double-hole structural porous copper product | |
| CN108376614B (en) | A kind of NiCo2O4/ carbon nano-tube combination electrode material and preparation method thereof | |
| CN203080093U (en) | Electro-deposition device for manufacturing micro-nano composite porous copper surface structure | |
| CN106207099B (en) | A kind of three-dimensional LiMn2O4The preparation method of film positive electrode and three-dimensional solid-State Thin Film Li-Ion Batteries | |
| CN204097585U (en) | A kind of supplementary unit for cylindrical shell deep hole differential arc oxidation | |
| CN101775586A (en) | Preparation method of electrochemical oriented growth of polyporous Al2O3 film on non-aluminum base | |
| CN104505509A (en) | Carbon-coated porous vanadium nitride nanowire film and preparation method thereof | |
| CN102262989A (en) | Method for manufacturing anodic aluminum oxide template and method for manufacturing field emission cathode array material by using template | |
| Zhang et al. | Hierarchically porous nickel oxide nanoflake arrays grown on carbon cloth by chemical bath deposition as superior flexible electrode for supercapacitors | |
| CN110808171A (en) | Super capacitor electrode material, super capacitor and preparation methods of super capacitor electrode material and super capacitor | |
| CN104269283A (en) | Preparation method of high-specific-capacitance graphene supercapacitor electrode material | |
| CN103451713B (en) | The corrosion pretreating method of mesohigh electric aluminum foil anodic oxidation deposition zinc or tin nucleus | |
| CN104867680B (en) | NiCo as electrode of super capacitor2O4@NiCo2O4Nano material and preparation method thereof | |
| CN103606683A (en) | Coiling-type germanium nanomaterial and preparation method thereof | |
| CN103938249B (en) | A kind of method preparing the biggest construction unit pellumina | |
| CN104269279A (en) | Self-standing type composite electrode plate for supercapacitor and manufacturing method thereof | |
| CN110284112A (en) | A kind of fuel battery double plates carbon coating Multicarity depositing system and its application | |
| CN105355468B (en) | A kind of preparation method of manganese sesquioxide managnic oxide multi-pore micron piece/nickel foam combination electrode material | |
| CN110408977A (en) | The multiple dimensioned reinforcing boiling function surface of one kind and composite preparation process | |
| CN103943836B (en) | Lithium ion battery negative material hollow Ge nano-tube array electrode and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |