CN103465543A - Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function - Google Patents
Method for preparing dual-hole-structure multi-hole copper materials strengthening boiling heat transfer function Download PDFInfo
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Abstract
The invention provides a method for preparing dual-hole-structure multi-hole copper materials strengthening a boiling heat transfer function. The method comprises the following steps that (1) ultrasonic cleaning and drying are respectively carried out on a copper matrix and a copper fiber mat; (2) the copper fiber mat is laid on and covers the surface of the copper matrix, then sintering is carried out, and a copper fiber multi-hole layer is attached to the surface of the copper matrix; (3) anodic oxidation treatment is carried out on the copper matrix with the copper fiber multi-hole layer in an attached mode to obtain the dual-hole-structure multi-hole copper materials strengthening the boiling heat transfer function. The method is simple, reasonable in design, easy to implement, strong in operability and suitable for large-scale production. The multi-hole copper materials prepared through the method are of a dual-hole structure, the specific surface area is large, a large amount of nucleate boiling is achieved, the heat transfer effect is good, and important practical value and important popularization significance are achieved.
Description
Technical field
The invention belongs to the metal polyporous material technical field, be specifically related to the preparation method of a kind of enhanced boiling heat transfer with double-hole structure Porous Cu material.
Background technology
Along with scientific and technological progress, people have proposed more and more higher performance requirement to boiling heat transfer.The various countries scholar has carried out theory analysis, experimental study and technology exploration widely to boiling heat transfer at present, proposed theory and the method for multiple enhanced boiling heat transfer, wherein the most effective enhanced boiling heat transfer method is to adopt various types of enhanced boiling heat transfer materials.Existing enhanced boiling heat transfer material is usually with groove, fin or the porous surface of various shapes, wherein, with the enhanced boiling heat transfer material of porous surface, with its high boiling heat transfer efficiency, Low Temperature Difference boiling, high critical heat flux density and good anti-blocking ability, paid close attention to widely.The manufacture method of this kind of material is also arisen at the historic moment, as sintering process, mechanical processing method, flame spraying, electrochemical erosion method, galvanoplastic etc.Yet, the heat transfer sheet area less of the enhanced boiling heat transfer material that adopts conventional method to prepare, nucleus of boiling number is few, and the frequency that generates bubble is low, makes the enhanced boiling heat transfer inefficiency.
Therefore, need a kind of preparation method who increases heat transfer sheet area, nucleus of boiling number, generates the boiling enhanced heat-transfer matcrial that frequency is high, heat-transfer effect is good of bubble of research and development badly.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, and the preparation method of a kind of enhanced boiling heat transfer with double-hole structure Porous Cu material is provided.The method preparation method is simple, reasonable in design, is easy to realize, workable, is suitable for large-scale production; The Porous Cu material that adopts the method to prepare is the double-hole structure, and specific area is large, and nucleus of boiling number is many, and the frequency that generates bubble is high, and heat-transfer effect is good, has important practical value and dissemination.
For solving the problems of the technologies described above, the technical solution used in the present invention is: the preparation method of double-hole structure Porous Cu material for a kind of enhanced boiling heat transfer, it is characterized in that, and the method comprises the following steps:
Step 1, copper matrix and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; Described copper fibrofelt is copper fiber blank felt or copper fiber sintering felt serving;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper matrix surface after oven dry, then the copper matrix that paving is covered with to the copper fibrofelt is put into sintering furnace, carry out sintering under the protection of hydrogen atmosphere, naturally adhering to a layer thickness at the copper matrix surface after cooling is 0.5mm～3mm, the copper fiber multihole layer that porosity is 80%～95%; The temperature of described sintering is 850 ℃～1000 ℃, and the time of described sintering is 1h～2h;
Step 3, take KOH solution as anodic oxidation electrolyte, the copper matrix that is attached with copper fiber multihole layer of take in step 2 is anode, take corrosion resistant plate as negative electrode, in current density, is 0.5mA/cm
2～2mA/cm
2, anodic oxidation 5min～20min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
The preparation method of double-hole structure Porous Cu material for above-mentioned enhanced boiling heat transfer is characterized in that the matrix of copper described in step 1 is copper coin or copper pipe.
The preparation method of double-hole structure Porous Cu material for above-mentioned enhanced boiling heat transfer is characterized in that the thickness of described copper coin is 1mm～5mm, and the external diameter of described copper pipe is 6mm～20mm, and the wall thickness of described copper pipe is 1mm～2mm.
The preparation method of double-hole structure Porous Cu material for above-mentioned enhanced boiling heat transfer is characterized in that the string diameter of the fiber blank felt of copper described in step 1 and copper fiber sintering felt serving is 30 μ m～160 μ m.
The preparation method of double-hole structure Porous Cu material for above-mentioned enhanced boiling heat transfer is characterized in that cleaning agent described in step 1 is acetone or absolute ethyl alcohol.
The preparation method of double-hole structure Porous Cu material for above-mentioned enhanced boiling heat transfer is characterized in that the concentration of the solution of KOH described in step 3 is 0.5mol/L～2mol/L.
The present invention compared with prior art has the following advantages:
1, at first the present invention is overlying on the copper matrix surface by copper fibrofelt paving, carry out again sintering processes, copper matrix and copper fibrofelt are sintered to one, and form the copper fiber multihole surface with high porosity at the copper matrix surface, and formed hole is the micron order macropore, then carry out anodized, by the control to technological parameter and optimization, make numerous nanometer level microporous of copper fiber surface quantity of formation.Owing to having micron order macropore and the nanometer level microporous double-hole structure coexisted, the prepared Porous Cu material of the present invention has larger heat exchange area and more nucleus of boiling number, and the boiling heat transfer effect is significantly improved.
2, enhanced boiling heat transfer of the present invention is the double-hole structure with the surface of Porous Cu material, and by micron order macropore and nanometer level microporous the composition, the specific area of this double-hole structure is large, and nucleus of boiling number is many, and heat-transfer effect is good.The boiling heat transfer performance of enhanced boiling heat transfer material of the present invention has improved more than 5 times than the boiling heat transfer performance of light plane materiel material, than the material with traditional single hole structure, has improved more than 1 times.
3, to adopt copper pipe or copper coin be matrix material in the present invention, adopting the copper fibrofelt is that stephanoporate framework prepares the enhanced boiling heat transfer material, take full advantage of the good heat conductivility of metallic copper, prepared enhanced boiling heat transfer material heat-conductive characteristic is good, and boiling heat transfer efficiency is high.
4, preparation method of the present invention is simple, reasonable in design, is easy to realize.
5, the present invention is workable, is suitable for large-scale production, has important practical value and dissemination.
Below in conjunction with drawings and Examples, the present invention is described in further detail.
The accompanying drawing explanation
The enhanced boiling heat transfer that Fig. 1 is the embodiment of the present invention 1 preparation is 50 times of Electronic Speculum microphotos under condition with double-hole structure Porous Cu material at enlargement ratio.
The enhanced boiling heat transfer that Fig. 2 is the embodiment of the present invention 1 preparation is 15000 times of Electronic Speculum microphotos under condition with double-hole structure Porous Cu material at enlargement ratio.
The enhanced boiling heat transfer that Fig. 3 is the embodiment of the present invention 5 preparations is 50 times of Electronic Speculum microphotos under condition with double-hole structure Porous Cu material at enlargement ratio.
The enhanced boiling heat transfer that Fig. 4 is the embodiment of the present invention 5 preparations is 10000 times of Electronic Speculum microphotos under condition with double-hole structure Porous Cu material at enlargement ratio.
The specific embodiment
Embodiment 1
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper coin and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with acetone carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The thickness of described copper coin is 2mm, and described copper fibrofelt is the copper fiber blank felt that string diameter is 60 μ m;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper coin surface after oven dry, then the copper coin that paving is covered with to the copper fibrofelt is put into the sintering furnace sintering, naturally after cooling, in copper coin surface attachment a layer thickness, be 2mm, the copper fiber multihole layer that porosity is 90%; The temperature of described sintering is 900 ℃, and the time of described sintering is 1h;
The KOH solution that step 3, the concentration of take are 1mol/L is anodic oxidation electrolyte, and the copper coin that the upper surface in step 2 of take is attached with copper fiber multihole layer is anode, take corrosion resistant plate as negative electrode, in current density, is 1mA/cm
2, anodic oxidation 10min under the condition that voltage is 300V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilizing electron microscope to be observed the present embodiment Porous Cu material, is that Fig. 1 is shown in by 50 times of Electronic Speculum microphotos under condition at enlargement ratio, at enlargement ratio, is that Fig. 2 is shown in by 15000 times of Electronic Speculum microphotos under condition.From Fig. 1 and Fig. 2, the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 6 times than the boiling heat transfer performance of light face copper coin, than traditional boiling heat transfer performance with single hole structure copper coin, has improved 1.5 times.
Embodiment 2
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper coin and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with absolute ethyl alcohol carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The thickness of described copper coin is 2mm, and described copper fibrofelt is the copper fiber sintering felt serving that string diameter is 160 μ m;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper coin surface after oven dry, then the copper coin that paving is covered with to the copper fibrofelt is put into the sintering furnace sintering, naturally after cooling, in copper coin surface attachment a layer thickness, be 0.5mm, the copper fiber multihole layer that porosity is 95%; The temperature of described sintering is 1000 ℃, and the time of described sintering is 2h;
The KOH solution that step 3, the concentration of take are 0.5mol/L is anodic oxidation electrolyte, and the copper coin that the upper surface in step 2 of take is attached with copper fiber multihole layer is anode, take corrosion resistant plate as negative electrode, in current density, is 0.5mA/cm
2, anodic oxidation 5min under the condition that voltage is 380V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5 times than the boiling heat transfer performance of light face copper coin, than traditional boiling heat transfer performance with single hole structure copper coin, has improved 1 times.
Embodiment 3
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper coin and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with absolute ethyl alcohol carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The thickness of described copper coin is 2mm, and described copper fibrofelt is the copper fiber blank felt that string diameter is 30 μ m;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper coin surface after oven dry, then the copper coin that paving is covered with to the copper fibrofelt is put into the sintering furnace sintering, naturally after cooling, in copper coin surface attachment a layer thickness, be 3mm, the copper fiber multihole layer that porosity is 80%; The temperature of described sintering is 850 ℃, and the time of described sintering is 2h;
The KOH solution that step 3, the concentration of take are 2mol/L is anodic oxidation electrolyte, and the copper coin that the upper surface in step 2 of take is attached with copper fiber multihole layer is anode, take corrosion resistant plate as negative electrode, in current density, is 2mA/cm
2, anodic oxidation 20min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5.5 times than the boiling heat transfer performance of light face copper coin, than traditional boiling heat transfer performance with single hole structure copper coin, has improved 2 times.
Embodiment 4
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper coin and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with acetone carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The thickness of described copper coin is 5mm, and described copper fibrofelt is the copper fiber sintering felt serving that string diameter is 120 μ m;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper coin surface after oven dry, then the copper coin that paving is covered with to the copper fibrofelt is put into the sintering furnace sintering, naturally after cooling, in copper coin surface attachment a layer thickness, be 1.5mm, the copper fiber multihole layer that porosity is 85%; The temperature of described sintering is 950 ℃, and the time of described sintering is 1.5h;
The KOH solution that step 3, the concentration of take are 1.5mol/L is anodic oxidation electrolyte, and the copper coin that the upper surface in step 2 of take is attached with copper fiber multihole layer is anode, take corrosion resistant plate as negative electrode, in current density, is 1.5mA/cm
2, anodic oxidation 15min under the condition that voltage is 380V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 6.5 times than the boiling heat transfer performance of light face copper coin, than traditional boiling heat transfer performance with single hole structure copper coin, has improved 1.5 times.
Embodiment 5
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper pipe and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The wall thickness of described copper coin is 2mm, and external diameter is 50mm, and described copper fibrofelt is the copper fiber blank felt that string diameter is 100 μ m;
Step 2, the copper fibrofelt after drying in step 1 is coated on to the outer surface of the copper pipe after oven dry, the copper pipe that then will be coated with the copper fibrofelt is put into the sintering furnace sintering, naturally adhering to a layer thickness at the copper pipe outer surface after cooling is 2mm, the copper fiber multihole layer that porosity is 85%; The temperature of described sintering is 950 ℃, and the time of described sintering is 2h;
The KOH solution that step 3, the concentration of take are 01mol/L is anodic oxidation electrolyte, and it is anode that the surface attachment of take in step 2 has the copper pipe of copper fiber multihole layer, take corrosion resistant plate as negative electrode, in current density, is 1.5mA/cm
2, anodic oxidation 5min under the condition that voltage is 380V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilizing electron microscope to be observed the present embodiment Porous Cu material, is that Fig. 3 is shown in by 50 times of Electronic Speculum microphotos under condition at enlargement ratio, at enlargement ratio, is that Fig. 4 is shown in by 10000 times of Electronic Speculum microphotos under condition.From Fig. 3 and Fig. 4, the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5 times than the boiling heat transfer performance of light face copper pipe, than traditional boiling heat transfer performance with single hole structure copper pipe, has improved 1 times.
Embodiment 6
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper pipe and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; The wall thickness of described copper coin is 1mm, and external diameter is 20mm, and described copper fibrofelt is the copper fiber sintering felt serving that string diameter is 30 μ m;
Step 2, the copper fibrofelt after drying in step 1 is coated on to the outer surface of the copper pipe after oven dry, the copper pipe that then will be coated with the copper fibrofelt is put into the sintering furnace sintering, naturally adhering to a layer thickness at the copper pipe outer surface after cooling is 2mm, the copper fiber multihole layer that porosity is 90%; The temperature of described sintering is 850 ℃, and the time of described sintering is 2h;
The KOH solution that step 3, the concentration of take are 1mol/L is anodic oxidation electrolyte, and it is anode that the surface attachment of take in step 2 has the copper pipe of copper fiber multihole layer, take corrosion resistant plate as negative electrode, in current density, is 1mA/cm
2, anodic oxidation 10min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5 times than the boiling heat transfer performance of light face copper pipe, than traditional boiling heat transfer performance with single hole structure copper pipe, has improved 1 times.
Embodiment 7
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper pipe and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; Wall thickness is 1mm, and the external diameter of described copper coin is 200mm, and described copper fibrofelt is the copper fiber blank felt that string diameter is 160 μ m;
Step 2, the copper fibrofelt after drying in step 1 is coated on to the outer surface of the copper pipe after oven dry, the copper pipe that then will be coated with the copper fibrofelt is put into the sintering furnace sintering, naturally adhering to a layer thickness at the copper pipe outer surface after cooling is 2mm, the copper fiber multihole layer that porosity is 90%; The temperature of described sintering is 1000 ℃, and the time of described sintering is 1h;
The KOH solution that step 3, the concentration of take are 1mol/L is anodic oxidation electrolyte, and it is anode that the surface attachment of take in step 2 has the copper pipe of copper fiber multihole layer, take corrosion resistant plate as negative electrode, in current density, is 1mA/cm
2, anodic oxidation 10min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5 times than the boiling heat transfer performance of light face copper pipe, than traditional boiling heat transfer performance with single hole structure copper pipe, has improved 1 times.
Embodiment 8
The present embodiment enhanced boiling heat transfer comprises the following steps by the preparation method of double-hole structure Porous Cu material:
Step 1, copper pipe and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; Wall thickness is 5mm, and the external diameter of described copper coin is 300mm, and described copper fibrofelt is the copper fiber sintering felt serving that string diameter is 80 μ m;
Step 2, the copper fibrofelt after drying in step 1 is coated on to the outer surface of the copper pipe after oven dry, the copper pipe that then will be coated with the copper fibrofelt is put into the sintering furnace sintering, naturally adhering to a layer thickness at the copper pipe outer surface after cooling is 2mm, the copper fiber multihole layer that porosity is 95%; The temperature of described sintering is 900 ℃, and the time of described sintering is 1.5h;
The KOH solution that step 3, the concentration of take are 1.5mol/L is anodic oxidation electrolyte, and it is anode that the surface attachment of take in step 2 has the copper pipe of copper fiber multihole layer, take corrosion resistant plate as negative electrode, in current density, is 1.5mA/cm
2, anodic oxidation 15min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
Utilize electron microscope to be observed the present embodiment Porous Cu material, known the present embodiment Porous Cu material is really the double-hole structure, by micron order macropore and nanometer level microporous the composition.The present embodiment Porous Cu material is carried out to the enhanced boiling heat transfer test, the boiling heat transfer performance that records the present embodiment Porous Cu material has improved 5 times than the boiling heat transfer performance of light face copper pipe, than traditional boiling heat transfer performance with single hole structure copper pipe, has improved 1 times.
The above, be only preferred embodiment of the present invention, not the present invention imposed any restrictions.Every any simple modification of above embodiment being done according to the invention technical spirit, change and equivalence change, and all still belong in the protection domain of technical solution of the present invention.
Claims (6)
1. the preparation method of an enhanced boiling heat transfer use double-hole structure Porous Cu material, is characterized in that, the method comprises the following steps:
Step 1, copper matrix and copper fibrofelt are put into respectively to the supersonic wave cleaning machine that is loaded with cleaning agent carry out Ultrasonic Cleaning, then be placed in baking oven and dry; Described copper fibrofelt is copper fiber blank felt or copper fiber sintering felt serving;
Step 2, the copper fibrofelt paving after drying in step 1 is overlying on to the copper matrix surface after oven dry, then the copper matrix that paving is covered with to the copper fibrofelt is put into sintering furnace, carry out sintering under the protection of hydrogen atmosphere, naturally adhering to a layer thickness at the copper matrix surface after cooling is 0.5mm～3mm, the copper fiber multihole layer that porosity is 80%～95%; The temperature of described sintering is 850 ℃～1000 ℃, and the time of described sintering is 1h～2h;
Step 3, take KOH solution as anodic oxidation electrolyte, the copper matrix that is attached with copper fiber multihole layer of take in step 2 is anode, take corrosion resistant plate as negative electrode, in current density, is 0.5mA/cm
2～2mA/cm
2, anodic oxidation 5min～20min under the condition that voltage is 220V, double-hole structure Porous Cu material for the boiling heat transfer that strengthened.
2. the preparation method of double-hole structure Porous Cu material for enhanced boiling heat transfer according to claim 1, is characterized in that, the matrix of copper described in step 1 is copper coin or copper pipe.
3. the preparation method of double-hole structure Porous Cu material for enhanced boiling heat transfer according to claim 2, is characterized in that, the thickness of described copper coin is 1mm～5mm, and the external diameter of described copper pipe is 6mm～20mm, and the wall thickness of described copper pipe is 1mm～2mm.
4. the preparation method of double-hole structure Porous Cu material for enhanced boiling heat transfer according to claim 1, is characterized in that, the string diameter of the fiber blank felt of copper described in step 1 and copper fiber sintering felt serving is 30 μ m～160 μ m.
5. the preparation method of double-hole structure Porous Cu material for enhanced boiling heat transfer according to claim 1, is characterized in that, cleaning agent described in step 1 is acetone or absolute ethyl alcohol.
6. the preparation method of double-hole structure Porous Cu material for enhanced boiling heat transfer according to claim 1, is characterized in that, the concentration of the solution of KOH described in step 3 is 0.5mol/L～2mol/L.
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| CN103465543B (en) | 2015-07-29 |
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