CN103460423A - 具有铁电驻极体特性的聚合物复合层及其制造方法 - Google Patents

具有铁电驻极体特性的聚合物复合层及其制造方法 Download PDF

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Publication number
CN103460423A
CN103460423A CN2011800533532A CN201180053353A CN103460423A CN 103460423 A CN103460423 A CN 103460423A CN 2011800533532 A CN2011800533532 A CN 2011800533532A CN 201180053353 A CN201180053353 A CN 201180053353A CN 103460423 A CN103460423 A CN 103460423A
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CN
China
Prior art keywords
polymer layer
layer structure
polymer
hollow space
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800533532A
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English (en)
Chinese (zh)
Inventor
W·延宁格
D·洛维拉-普里托
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
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Bayer Pharma AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Pharma AG filed Critical Bayer Pharma AG
Publication of CN103460423A publication Critical patent/CN103460423A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B32B3/20—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side of hollow pieces, e.g. tubes; of pieces with channels or cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/084—Shaping or machining of piezoelectric or electrostrictive bodies by moulding or extrusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/24996—With internal element bridging layers, nonplanar interface between layers, or intermediate layer of commingled adjacent foam layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
CN2011800533532A 2010-11-03 2011-10-28 具有铁电驻极体特性的聚合物复合层及其制造方法 Pending CN103460423A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20100189897 EP2450974A1 (de) 2010-11-03 2010-11-03 Polymerschichtenverbund mit Ferroelektret-Eigenschaften und Verfahren zu dessen Herstellung
EP10189897.1 2010-11-03
PCT/EP2011/069043 WO2012059437A1 (de) 2010-11-03 2011-10-28 Polymerschichtenverbund mit ferroelektret-eigenschaften und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
CN103460423A true CN103460423A (zh) 2013-12-18

Family

ID=43750603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800533532A Pending CN103460423A (zh) 2010-11-03 2011-10-28 具有铁电驻极体特性的聚合物复合层及其制造方法

Country Status (7)

Country Link
US (1) US20140009039A1 (https=)
EP (2) EP2450974A1 (https=)
JP (1) JP2013543273A (https=)
KR (1) KR20130108409A (https=)
CN (1) CN103460423A (https=)
TW (1) TW201231284A (https=)
WO (1) WO2012059437A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014037451A (ja) * 2012-08-10 2014-02-27 Sekisui Chem Co Ltd エレクトレットシート
WO2014193493A2 (en) * 2013-02-15 2014-12-04 The Florida State University Research Foundation, Inc. Polymer foam-based piezoelectric materials and method of manufacture
DE102015224778B4 (de) * 2015-12-10 2021-03-11 Bayerische Motoren Werke Aktiengesellschaft Druckbolzen einer Presse sowie Presse mit Druckbolzen
WO2019008921A1 (ja) * 2017-07-06 2019-01-10 ソニー株式会社 トランスデューサ装置、関節装置、並びにアクチュエータ装置
US10962791B1 (en) 2018-03-22 2021-03-30 Facebook Technologies, Llc Apparatuses, systems, and methods for fabricating ultra-thin adjustable lenses
US11245065B1 (en) 2018-03-22 2022-02-08 Facebook Technologies, Llc Electroactive polymer devices, systems, and methods
US10914871B2 (en) 2018-03-29 2021-02-09 Facebook Technologies, Llc Optical lens assemblies and related methods
US11502240B2 (en) * 2019-08-30 2022-11-15 Meta Platforms Technologies, Llc Structured actuators: shaped electroactive polymers
US20220350063A1 (en) * 2021-04-29 2022-11-03 Meta Platforms Technologies, Llc High surface quality optical film
WO2022231825A1 (en) * 2021-04-29 2022-11-03 Meta Platforms Technologies, Llc High surface quality optical film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006053528A1 (de) * 2004-11-22 2006-05-26 Technische Universität Darmstadt Elektroakustischer wandler
CN101237021A (zh) * 2006-11-03 2008-08-06 丹佛斯公司 介电复合物和制造介电复合物的方法
WO2010066348A2 (de) * 2008-12-13 2010-06-17 Bayer Materialscience Ag Ferroelektret-zwei- und mehrschichtverbund und verfahren zu dessen herstellung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661817B2 (ja) * 1989-12-05 1994-08-17 大日本プラスチックス株式会社 中空成形品及びその製造方法
EP0988329B1 (de) * 1997-06-13 2002-11-06 Ticona GmbH Elektrete
US20080003869A1 (en) * 2006-06-30 2008-01-03 Inteplast Group, Ltd. Extruded thermoplastic boards having enhanced mechanical strength
JP5567030B2 (ja) * 2009-07-15 2014-08-06 バイエル・マテリアルサイエンス・アクチェンゲゼルシャフト フェロエレクトレット２層および多層コンポジットおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006053528A1 (de) * 2004-11-22 2006-05-26 Technische Universität Darmstadt Elektroakustischer wandler
CN101237021A (zh) * 2006-11-03 2008-08-06 丹佛斯公司 介电复合物和制造介电复合物的方法
WO2010066348A2 (de) * 2008-12-13 2010-06-17 Bayer Materialscience Ag Ferroelektret-zwei- und mehrschichtverbund und verfahren zu dessen herstellung

Also Published As

Publication number Publication date
WO2012059437A1 (de) 2012-05-10
JP2013543273A (ja) 2013-11-28
US20140009039A1 (en) 2014-01-09
KR20130108409A (ko) 2013-10-02
TW201231284A (en) 2012-08-01
EP2636084A1 (de) 2013-09-11
EP2450974A1 (de) 2012-05-09

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Application publication date: 20131218