CN103454734A - Optical transmission module and transmission assemblies thereof - Google Patents
Optical transmission module and transmission assemblies thereof Download PDFInfo
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- CN103454734A CN103454734A CN2012101814351A CN201210181435A CN103454734A CN 103454734 A CN103454734 A CN 103454734A CN 2012101814351 A CN2012101814351 A CN 2012101814351A CN 201210181435 A CN201210181435 A CN 201210181435A CN 103454734 A CN103454734 A CN 103454734A
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Abstract
An optical transmission module comprises two optical transmission assemblies and a plurality of optical waveguides, wherein the optical waveguides are connected to the two optical transmission assemblies to conduct optical transmission. Each optical transmission assembly comprises a CMOS substrate, an integrated driving chip, a light emitting element array and a plurality of light receiving elements, wherein each integrated driving chip, the corresponding light emitting element array and the corresponding light receiving elements are arranged on one of the CMOS substrates at intervals, and the light emitting element arrays and the plurality of light receiving elements are electrically connected with the integrated driving chips. One end of each optical waveguide is arranged on the CMOS substrate of the corresponding optical transmission assembly and optically coupled with the light emitting element array of the corresponding optical transmission assembly through optical fibers. The other end of each optical waveguide is arranged on the CMOS substrate of the other corresponding optical transmission assembly and optically coupled with the light receiving elements of the other corresponding optical transmission assembly through optical fibers so that the optical signal transmission between the two optical transmission assemblies can be achieved. The optical transmission module is simple in structure, and high-speed bidirectional data transmission can be achieved.
Description
Technical field
The present invention relates to a kind of light transmission module, relate in particular to a kind of integrated light transmission module and transmission assembly thereof.
Background technology
In recent years, optical communication has the development trend of high speed, high capacity.During normal light transmission module packaging, optical element is packaged on circuit substrate, one plastic cover solidifies glue by UV and is fixed in circuit substrate and is positioned at optical element top, and optical fiber solidifies glue by UV and is fixed on lid also scioptics and optical element and carries out optically-coupled.Yet the light transmission module of this kind of structure class, because each element does not belong to same processing procedure, after it need be assembled fully, just can carry out the photoelectric characteristic test, once product is defective, needs to carry out whole replacements of element.Therefore, cause that product yield is lower and manufacturing cost is high.
Summary of the invention
In view of foregoing, be necessary to provide a kind of light transmission module that improves product yield, reduces production costs.
Necessary a kind of optical transmission module be applied in this photoelectricity transmission module that provides also is provided.
A kind of light transmission module, it comprises two optical transmission modules and is connected in some optical waveguides that two optical transmission modules carry out the light transmission.This optical transmission module comprises the CMOS substrate, integrates driving chip, light-emitting device array and some photo detectors.This integration drives chip, this light-emitting device array and this some photo detectors interval to be installed on this CMOS substrate, and this light-emitting device array and some photo detectors drive chip to be electrically connected with this integration respectively.Each optical waveguide one end is installed on the CMOS substrate of an optical transmission module, and by the light-emitting device array optically-coupled of optical fiber and this optical transmission module.This optical waveguide other end is installed on the CMOS substrate of another optical transmission module, and by the photo detector optically-coupled of optical fiber and this optical transmission module, to carry out the light signal transmission of two optical transmission modules.
A kind of optical transmission module, it comprises the CMOS substrate, integrates driving chip, light-emitting device array and some photo detectors; This integration drives chip, this light-emitting device array and this some photo detectors interval to be installed on this CMOS substrate, between this light-emitting device array and some photo detectors, with this integration, drives chip to be electrically connected respectively.
Light provided by the invention transmits module, simple in structure, can realize the high-speed transfer of data double-way.The substrate of optical transmission module adopts the CMOS substrate, be used in conjunction with optical waveguide and assembled, thereby all elements all can be tested in the manufacture of semiconductor process.If there is any element that problem is arranged, can detect immediately and reject, reduced fraction defective and production cost.
The accompanying drawing explanation
The schematic diagram of the light transmission module that Fig. 1 is embodiment of the present invention.
The main element symbol description
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| Optical fiber | 29 |
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Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, the light transmission module 100 of present embodiment comprises that two optical transmission modules 20 reach in order to connect eight optical waveguides 60 of these two optical transmission modules 20.
Each optical waveguide 60 comprises two stiff ends 63 that are arranged at two ends.Two stiff ends 63 are installed in respectively on the CMOS substrate 22 of two optical transmission modules 20.A stiff end 63 of optical waveguide 60 and a photo detector of an optical transmission module 20 26 are by optical fiber 29 couplings, and another stiff end 63 passes through optical fiber 29 optically-coupled with the light modulator 25 of another optical transmission module 20.In present embodiment, optical waveguide 60 is made for semiconductor material.
During assembling, first will integrate and drive chip 23 to be installed on CMOS substrate 22, the more contiguous output terminal 231 of integrating driving chip 23 of light-emitting device array 24 is installed on CMOS substrate 22 and by electrical lead 27 and output terminal 231 and is electrically connected.Four light modulators 25 are installed in CMOS substrate 22 at interval and in parallel, and by optical fiber 29 and light-emitting device array 24 optically-coupled.Four contiguous integration of photo detector 26 drive the input end 233 of chip 23 to be installed on CMOS substrate 22, and are electrically connected by electrical lead 27 and input end 233, complete the assembling of an optical transmission module 20.Afterwards, complete the assembling of another optical transmission module 20 with same method.Finally, eight optical waveguides 60 are connected between two optical transmission modules 20, and two stiff ends 63 of each optical waveguide 60 by optical fiber 29 respectively with a photo detector 26 and light modulator 25 optically-coupled, complete the assembling of light transmission module 100.
During use, two optical transmission modules 20 are installed in respectively on different electronic installation or electronic equipment.When the light-emitting device array 24 of an optical transmission module 20 receives the electric signal of integrating output terminal 231 outputs that drive chip 23, it is converted to the light signal by this electric signal, and transfers to light modulator 25.Light modulator 25 becomes the high-speed light signal to be optically coupled to optical waveguide 60 through optical fiber 29 again this light signal changing.This high-speed light signal transfers in the photo detector 26 in another optical transmission module 20 through optical waveguide 60, through photo detector 26, is converted to electric signal and imports in the integration driving chip 23 in this optical transmission module 20.So, realized that data are transferred to another optical transmission module 20 from an optical transmission module 20.If the light-emitting device array 24 of two optical transmission modules 20 is all exported the light signal, can realize the high-speed transfer of data double-way between two optical transmission modules.
Light provided by the invention transmits module 100, simple in structure, can realize the high-speed transfer of data double-way.The substrate of optical transmission module 20 adopts CMOS substrate 22, be used in conjunction with optical waveguide 60 and assembled, thereby all elements all can be tested in the manufacture of semiconductor process.If there is any element that problem is arranged, can detect immediately and reject, reduced fraction defective and production cost.Optical transmission module 20 also is provided with light modulator 25, thereby the light signal changing that light-emitting device array 24 can be sent becomes the high-speed light signal to be transmitted, and has accelerated the transmission of light transmission module 100 data.In addition, use optical waveguide 60 to replace optical fiber and the direct coupling light of lens and transmit and can effectively reduce the signal transmission loss, but and then also improving product high-speed transfer photoelectric characteristic.
Be appreciated that the quantity of photo detector 26, the quantity of light modulator 25, the quantity of optical waveguide 60 correspondences, can be arranged according to actual needs.
Be appreciated that and can omit light modulator 25.
Those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (10)
1. a light delivery module light transmits module, it comprises two optical transmission modules and be connected between these two optical transmission modules to carry out some optical waveguides of light transmission, it is characterized in that: each optical transmission module comprises the CMOS substrate, integrate and drive chip, light-emitting device array, some photo detectors and some optical fiber; This integration drives chip, this light-emitting device array and this some photo detectors interval to be installed on this CMOS substrate, this integration drives chip to be provided with output terminal and input end, this light-emitting device array and this output terminal are electrically connected, and these some photo detectors and this input end are electrically connected; Each optical waveguide one end is installed on the CMOS substrate of an optical transmission module, and by the light-emitting device array optically-coupled of optical fiber and this optical transmission module; This optical waveguide other end is installed on the CMOS substrate of another optical transmission module, and by the photo detector optically-coupled of optical fiber and this optical transmission module, to carry out the light signal transmission of two optical transmission modules.
2. light as claimed in claim 1 transmits module, and it is characterized in that: this optical transmission module also comprises light modulator, and this light modulator is by this some optical fiber and this optical waveguide and light-emitting device array optically-coupled.
3. light delivery module light as claimed in claim 1 transmits module, and it is characterized in that: this light-emitting device array is diode laser matrix.
4. light as claimed in claim 1 transmits module, and it is characterized in that: this photo detector is photodiode.
5. light delivery module light as claimed in claim 1 transmits module, it is characterized in that: this optical transmission module also comprises some electrical leads, this light-emitting device array and this output terminal are electrically connected by this electrical lead, and these some photo detectors and this input end are electrically connected by this electrical lead.
6. an optical transmission module is characterized in that: this optical transmission module comprises the CMOS substrate, integrate and drive chip, light-emitting device array and some photo detectors; This integration drives chip, this light-emitting device array and this some photo detectors interval to be installed on this CMOS substrate, between this light-emitting device array and some photo detectors, with this integration, drives chip to be electrically connected respectively.
7. optical transmission module as claimed in claim 6, it is characterized in that: this optical transmission module also comprises some optical fiber and some light modulators, this light modulator is by this some optical fiber and this optical waveguide and light-emitting device array optically-coupled.
8. optical transmission module as claimed in claim 6, it is characterized in that: this light-emitting device array is diode laser matrix.
9. optical transmission module as claimed in claim 6, it is characterized in that: this photo detector is photodiode.
10. optical transmission module as claimed in claim 6, it is characterized in that: this optical transmission module also comprises some electrical leads, this light-emitting device array and this output terminal are electrically connected by this electrical lead, and these some photo detectors and this input end are electrically connected by this electrical lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101814351A CN103454734A (en) | 2012-06-05 | 2012-06-05 | Optical transmission module and transmission assemblies thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101814351A CN103454734A (en) | 2012-06-05 | 2012-06-05 | Optical transmission module and transmission assemblies thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103454734A true CN103454734A (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101814351A Pending CN103454734A (en) | 2012-06-05 | 2012-06-05 | Optical transmission module and transmission assemblies thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105403967A (en) * | 2014-09-12 | 2016-03-16 | 祥茂光电科技股份有限公司 | Optical transmission sub-assembly and manufacturing method thereof |
| WO2017161602A1 (en) * | 2016-03-24 | 2017-09-28 | Huawei Technologies Co., Ltd. | Photonic elements driven by common electrical driver |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004020978A (en) * | 2002-06-18 | 2004-01-22 | Sumitomo Electric Ind Ltd | Element for optical communications and method for manufacturing element for optical communications |
| JP2004157558A (en) * | 1997-06-25 | 2004-06-03 | Matsushita Electric Ind Co Ltd | Optical semiconductor module |
| US20060210215A1 (en) * | 2005-03-15 | 2006-09-21 | Shigenori Aoki | Optical transceiver array |
| US20090154615A1 (en) * | 2007-02-16 | 2009-06-18 | Katsumasa Hijikata | Integrated circuit for processing multi-channel radio signal |
| CN102106089A (en) * | 2008-08-22 | 2011-06-22 | 欧姆龙株式会社 | Parallel-serial converter for optical transmission, optical transmission system, and electronic apparatus |
-
2012
- 2012-06-05 CN CN2012101814351A patent/CN103454734A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004157558A (en) * | 1997-06-25 | 2004-06-03 | Matsushita Electric Ind Co Ltd | Optical semiconductor module |
| JP2004020978A (en) * | 2002-06-18 | 2004-01-22 | Sumitomo Electric Ind Ltd | Element for optical communications and method for manufacturing element for optical communications |
| US20060210215A1 (en) * | 2005-03-15 | 2006-09-21 | Shigenori Aoki | Optical transceiver array |
| US20090154615A1 (en) * | 2007-02-16 | 2009-06-18 | Katsumasa Hijikata | Integrated circuit for processing multi-channel radio signal |
| CN102106089A (en) * | 2008-08-22 | 2011-06-22 | 欧姆龙株式会社 | Parallel-serial converter for optical transmission, optical transmission system, and electronic apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105403967A (en) * | 2014-09-12 | 2016-03-16 | 祥茂光电科技股份有限公司 | Optical transmission sub-assembly and manufacturing method thereof |
| WO2017161602A1 (en) * | 2016-03-24 | 2017-09-28 | Huawei Technologies Co., Ltd. | Photonic elements driven by common electrical driver |
| US10914968B2 (en) | 2016-03-24 | 2021-02-09 | Huawei Technologies Canada Co., Ltd. | Photonic elements driven by common electrical driver |
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Application publication date: 20131218 |
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