CN103447940A - Substrate positioning and processing method and substrate positioning and processing device - Google Patents
Substrate positioning and processing method and substrate positioning and processing device Download PDFInfo
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- CN103447940A CN103447940A CN2012101900380A CN201210190038A CN103447940A CN 103447940 A CN103447940 A CN 103447940A CN 2012101900380 A CN2012101900380 A CN 2012101900380A CN 201210190038 A CN201210190038 A CN 201210190038A CN 103447940 A CN103447940 A CN 103447940A
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Abstract
The invention provides a substrate positioning and processing method. The method includes placing at least one non-magnetoconductivity substrate on a jig with a magnetizer; superposing at least one magnetoconductivity partition plates to press the substrates; turning on a magnetic switch on the jig, wherein the jig and the partition palates are attracted mutually to enable the substrates located between the jig and the partition plates to be positioned on the jig; using a tool to process the substrates. The invention further provides a substrate positioning and processing device so as to facilitate one-time processing of multiple substrates superposed and positioned at one time.
Description
Technical field
The present invention relates to a kind of processing technique field of substrate, particularly relevant a kind of on machining machine and tool method and the device of positioning baseplate.
Background technology
Generally speaking; the substrate (Substrate) of the electronic equipment of common name; can be touch base plate or the protective substrate (Cover Lens) of the contact panel (Touch Panel) that is laid with sensor electrode array, or the general common substrate used as solar panel (Solar Panel).Above-mentioned these substrates, normally select the glass (Glass) with good light transmittance to make.In addition, on some special-purposes, can be also with hard plastic sheet or other hard materials this substrate that is made.
Aforesaid substrate, in the process of processing and manufacturing, comprises and must cut into according to user's demand required specification.Due to the substrate after cutting; its surrounding end limit is formed with sharp keen end angle; the processer can use a kind of grinding facility to carry out edging processing to substrate usually, so that leveling is ground in the sharp tip angle, avoids described sharp keen end angle scratch personnel or cuts bad peripheral article.
And know, the being seen machining machine and tool of tradition, wherein particularly grind facility, be all utilize vacuum suction mode by substrate orientation on tool, but this tool once can only be fixed in single position a plate base and accept edging processing, therefore there is the unclear problem of grinding efficiency, and even be unfavorable for a large amount of production and processings of factory.
Summary of the invention
In view of this, the present invention has applied the magnetic field effect principle and has improved the finder of substrate, and then solves the problem that tool can't grind in the acceptance of single position one-time positioning multi-piece substrate.
According to one embodiment of the invention, a kind of substrate orientation processing method is provided, its technological means comprises:
The substrate of putting at least one non-magnetic has on the tool of magnetizing assembly in one;
The dividing plate of stacked at least one magnetic conductivity is suppressed described substrate;
Open the magnetic switch on described tool, wherein, described tool and magnetic conductivity dividing plate attract each other, make in the described substrate orientation between tool and dividing plate on this tool, and
One cutter is processed described substrate.
Further, described magnetizing assembly is fixed in the bottom of tool, and this magnetizing assembly comprises a magnetisable sucker, a magnetic switch and a power supply, and this described magnetisable sucker, magnetic switch, power supply are electrically connected with the form of series connection.After this described magnetic switch is connected, under the effect of power supply, this magnetisable sucker is magnetized, and produces magnetic field, and then produces the magnetic line of force.
Further, wherein said magnetizing assembly is embedded in described tool.
Further, described magnetizing assembly and the integrated formation of described tool.
Further, described tool also comprises around the cutter groove on described substrate surrounding end limit, and cutter is processed operation around described cutter groove one circle.Further, described dividing plate is metal partion (metp).
Further, described substrate and described dividing plate are respectively most sheets, and described substrate and described dividing plate are that interval is stacked and placed on described tool.
Further, described substrate is most sheets and mutually stacked, and this dividing plate is single and is stacked and placed on the top of top layer substrate and suppresses described most plate base.
Further, between described mutual stacked substrate, pad is provided with a sept.
Further, described sept is one of them of magnetic conductivity, non-magnetic.
In sum, because the present invention has utilized magnetic field effect, described magnetic conductivity dividing plate compacting substrate is fixed on tool, therefore can be in the magnetic field space that this tool provides, disposable stacked single or most plate base and fixed, so that the surrounding end limit of the described most plate bases of disposable grinding, and then promote working (machining) efficiency and the utilization rate of grinding facility, and contribute to a large amount of production, to improve production capacity.
The technological means comprised in said method of the present invention, characteristic and expected effect, can obtain realization through a kind of device technique, for this reason, according to another embodiment of the present invention, provides a kind of substrate orientation processing unit (plant), and its technological means comprises:
One tool that contains magnetizing assembly; One for suppressing the magnetic conductivity dividing plate of substrate, and wherein, described substrate is placed on tool; And
One for grinding the cutter on described edge of substrate limit.
Further, be formed with a cutter groove around described substrate surrounding end limit on this tool.
Further, magnetizing assembly comprises a magnetisable sucker, magnetic switch and a power supply, and this described magnetisable sucker, magnetic switch, power supply are electrically connected with the form of series connection.After this described magnetic switch is connected, under the effect of power supply, this magnetisable sucker is magnetized, and produces magnetic field, and then produces the magnetic line of force.
Further, wherein said magnetizing assembly is embedded in described tool.
Further, wherein said magnetizing assembly and the integrated formation of described tool.
Further, wherein said dividing plate is metal partion (metp).
Further, wherein said substrate and described dividing plate are respectively most sheets, and described substrate and described dividing plate are that interval is stacked and placed on described tool.
Further, wherein said substrate is most sheets and mutually stacked, and this dividing plate is singlely be stacked and placed on the top of top layer substrate and suppress described most plate base.Further, between wherein said mutual stacked substrate, pad is provided with a sept.Described sept is one of them of magnetic conductivity, non-magnetic.
Can promote the efficiency of substrate edging processing in said method of the present invention, and promote the utilization rate of edging facility, be beneficial to a large amount of production, and improve production capacity.
The concrete implementation detail of the technological means of the method and apparatus of the above and generation usefulness thereof, please refer to the following example and graphic being illustrated.
The accompanying drawing explanation
Fig. 1 is the flow chart of substrate orientation processing method of the present invention;
Fig. 2 is the dynamic-configuration cut-away view of execution graph 1 step of the present invention;
Fig. 3 a to Fig. 3 f is respectively the configuration cut-away view of Fig. 2 in different embodiment;
Fig. 4 is the perspective exploded view of substrate orientation processing unit (plant) of the present invention;
Fig. 5 is the group deep cutting diagram of Fig. 4;
Fig. 6 is the enlarged diagram of the substrate after edging processing; And
Fig. 7 a to Fig. 7 b is respectively the machining sketch chart of contrast Fig. 3 e to Fig. 3 f embodiment.
The specific embodiment
Implementing the purpose of substrate orientation processing method of the present invention and device thereof, is for before substrate processing, can aforehand substrate firmly be positioned on machining machine and tool, is beneficial to the carrying out of processing.Described substrate can be for example the substrate as touch-control purposes or protection purposes, or the substrate used as solar panel, and these substrates are all to be made by glass usually, therefore also can be referred to as glass substrate.The substrate itself of making due to glass does not have the characteristic (that is possessing non-magnetic) of magnetic conduction, and can be stretched through for the magnetic line of force, therefore is appropriate to be put in magnetic field environment, is not subject to the interference of the magnetic line of force.In addition, described machining machine and tool, can be for example the grinding facility that use for the surrounding end limit of grinding glass substrate.Yet actual substrate and machining machine and tool are not limited with above-mentioned, are first chatted bright at this.
In view of implementing method of the present invention, please merge and consult Fig. 1, Fig. 2 and Fig. 3 a to Fig. 3 f.Wherein, Fig. 1 discloses the flow chart of substrate orientation processing method of the present invention, and Fig. 2 discloses the dynamic-configuration cut-away view of execution graph 1 step of the present invention, and Fig. 3 a to Fig. 3 f discloses respectively the configuration cut-away view in the different embodiment of Fig. 2.Substrate 10 in above-mentioned graphic embodiment is that the glass substrate exemplified with touch-control or protection purposes explains.This substrate 10 presents the sheet body, and its surrounding end limit has sharp keen end angle 101, and exemplifies a kind of edging processing of the necessary acceptance of this substrate 10, and will hold angle 101 to flatten into fillet.Because this substrate 10 is being accepted the edging first being processed, must be positioned in advance on tool 20, this tool 20 is fixed in advance and grinds on facility 40, and these edging facility 40 comprise the cutter 41 that an edging processing is used, and these cutter 41 tools can be in fact crusher or the milling cutters of a rotary type; This tool 20 comprises and holds the end limit that this cutter 41 grinds described substrate.
Wherein, the mode for location substrate processing 10, the invention provides a kind of substrate orientation processing method, and its technological means comprises: put the substrate 10 of at least one non-magnetic on the tool 20 with magnetizing assembly; The dividing plate 30 compacting substrates 10 of stacked at least one magnetic conductivity; Open the magnetic switch 28 on tool, wherein, tool 20 attracts each other with dividing plate 30, makes at the substrate 10 between tool 20 and dividing plate 30 and is positioned on this tool 20; Then use 41 pairs of substrates 10 of a cutter to be processed.
With reference to the implementation step shown in Fig. 1, the above-mentioned technological means of the present embodiment, can see through step S1 to step S4 and concrete enforcement, wherein:
Step S1: put substrate.
In the embodiment shown in Fig. 3 a, take the substrate 10 of a slice non-magnetic, and smooth being placed on tool 20 by this substrate 10, wherein this tool 20 and integrated formation of magnetizing assembly (not shown), magnetizing assembly is arranged at the inside of tool 20.
The configuration relation of magnetizing assembly and tool 20 can be also other modes, as shown in Fig. 3 b, this magnetizing assembly also can be embedded in the storage tank 24 of tool 20, this embedded magnetizing assembly reaches by a magnetizable body 21 power supply (not shown) be connected with magnetizable body 21 and forms, wherein, the magnetic of magnetizable body 21 must be controlled, and its material can be selected the soft magnetic bodies that the remanent magnetism rate is low, for example, silicon steel sheet and soft magnet core.
In addition, except the embodiment shown in Fig. 3 a and 3b, magnetizing assembly can also be arranged on the bottom of tool 20.Illustrate that below in conjunction with Fig. 3 c and Fig. 3 d magnetizing assembly is arranged on the position relationship of the bottom of tool 20, Fig. 3 d has disclosed the structural representation of magnetizing assembly, this magnetizing assembly comprises magnetisable sucker 22, magnetic switch 28, power supply 29, and described magnetisable sucker 22, magnetic switch 28, power supply 29 are electrically connected with the form of series connection.Magnetisable sucker 22 is comprised of coil 221 and iron core 223, and this coil 221 is around this iron core 223, and wherein the magnetic of iron core must be controlled, and its material can be selected the soft magnetic bodies that the remanent magnetism rate is low, for example, and silicon steel sheet and soft magnet core.Tool 20 is for example, to be made and the tool that provides substrate 10 to put by non-magnetic material (being acryl).Fixed form between tool 20 and magnetisable sucker 22 as shown in Figure 3 c,, bolt 27 run through the bolt hole 25 that is arranged on tool 20 and corresponding bolt hole 25 positions and be arranged on magnetisable sucker 22 alveolus 26, tool 20 and magnetisable sucker 22 are fixed together.
In the embodiment shown in Fig. 3 e and Fig. 3 f, it is mutually stacked on tool 20 that the substrate 10 of most sheet non-magnetics can be disposablely put in explanation.
Step S2: stacked dividing plate.
In Fig. 3 a to Fig. 3 c illustrated embodiment, the stacked on top that all is disclosed in aforesaid substrate 10 has the single plate base 10 of dividing plate 30 compacting of single magnetic conductivity, and this dividing plate 30 can be a metal partion (metp) in fact, makes dividing plate 30 have magnetic conductivity.In enforcement, the width W 3 of dividing plate 30 must be less than the width W 1 of substrate 10, the end angle 101 of the pending edging processing such as the surrounding end limit of substrate 10 is manifested.
In the embodiment shown in Fig. 3 e, most sheets are the stacked single dividing plate 30 of top on stacked substrate 10 mutually, and utilize this sheet dividing plate 30 to suppress described most plate base 10 on tool 20.Further, can pad respectively and establish a sept 11 between mutual stacked most plate bases 10.Due to the consistent thickness of this sept 11, make formation one between each plate base 10 be beneficial to the gap h that cutter carries out edging processing.In addition, in the embodiment shown in Fig. 3 f, further illustrate the gap h shown in Fig. 3 e, also can establish and form by dividing plate 30 pads with uniformity thickness; In other words, described stacked substrate 10 and dividing plate 30 mutually is respectively most sheets, and described substrate 10 is that interval is stacked and placed on described tool 20 with dividing plate 30, makes to do well out of the gap h that cutter carries out edging processing and be formed at respectively between each mutually stacked plate base 10.
Usually know that the knowledgeable can be in the above-described embodiment shown in Fig. 3 a to Fig. 3 f, no matter understand is with the single stacked single plate base 10 of dividing plate 30, or with the single stacked most plate bases 10 of dividing plate 30, or mutually stacked with most sheet dividing plates 30 and many arts plate base 10, it is all feasible embodiment, and sept 11 or dividing plate 30 with uniformity thickness itself also all have specific weight, and even can suppress stable the putting on tool 20 of described substrate 10 when mutually stacked.
Step S3: start magnetic switch 28.
In the embodiment shown in Fig. 3 a to Fig. 3 c and Fig. 3 f, no matter substrate 10 or dividing plate 20 are single or most sheet, the magnetic line of force M that magnetisable device forms can see through this tool 20 and put substrate 10 thereon, makes the dividing plate 30 of magnetic conductivity be subject to the magnetic conduction effect of magnetic line of force M in magnetic field S; Alleged magnetic conduction effect, refer to that the dividing plate 30 of this magnetic conductivity is subject to the magnetic field effect impact that magnetic line of force M produces in magnetic field, and then produce the N utmost point and the magnetic effect that there is a natural attraction between the sexes of the S utmost point.According to this, make the single dividing plate 30 that is stacked and placed on single or most plate base 10 tops, or interval is stacked and placed on the most sheet dividing plates 30 between most plate bases 10, can be subject to magnetic effect after magnetic conduction and then tight and firm pressure holding and described substrate 10 and be fixed on this tool 20.
In the embodiment shown in Fig. 3 e, this sept 11 can select the material of magnetic conductivity to make (being for example metal derby), so that accept the magnetic conduction of magnetic line of force M with the dividing plate of magnetic conductivity in magnetic field S simultaneously, and then tight and firm pressure holding described substrate 10 and is fixed on this tool 20.In addition, enough strong in the intensity of magnetic field S, sticking in the situation of dividing plate 30 at top layer substrate 10 tops securely, and this sept 11 also can select the material of non-magnetic to make (being for example the acryl piece).
Step S4: tool sharpening substrate.
After positioning baseplate 10 completes, cutter 41 starts processing, and cutter 41 moves and grinds described substrate 10 surrounding end limits along cutter groove 23, and sharp keen end angle 101 is flattened into to fillet.
Comprehensive above-mentioned steps S1 is to the explanation of step S4, and knowledge should be understood usually, the magnetic field effect principle of utilizing the magnetic line of force to produce, and the described dividing plate compacting of magnetic conduction substrate is fixed on tool, is feasible technical scheme; Wherein, in the magnetic field space that can provide at tool in particular, the most plate bases in disposable location, so, contribute to most plate bases can disposablely accept the processing of machining machine and tool; Wherein, edging processing can be disposablely accepted on the surrounding end limit of most plate bases in particular, in order to promote working (machining) efficiency and the utilization rate of described facility, and contributes to a large amount of production, to improve production capacity.
Then, refer to Fig. 4, disclose the perspective exploded view that substrate orientation of the present invention adds device, as shown in the figure, the present embodiment provides a kind of device technique that can implement the aforesaid substrate positioning and processing method, and the substrate orientation processing unit (plant) comprises: a magnetizing assembly, be fixed in the tool 20 on described magnetizing assembly, and the dividing plate 30 for suppressing substrate 10, wherein, described substrate 10 is placed on tool 20.
Due in said method embodiment, be exemplify that this substrate 10 must be accepted edging processing and positioning baseplate 10 on tool 20, in order to will hold angle 101 to flatten into fillet.For this purpose, please merge and consult Fig. 5 to Fig. 6; Wherein, Fig. 5 discloses the group deep cutting diagram of Fig. 4, and Fig. 6 discloses the enlarged diagram of the substrate after edging processing; As shown in Figure 5, illustrate that this tool 20 is fixed on grinding facility 40 in advance, and these edging facility 40 comprise the cutter 41 (being for example crusher or the milling cutter of rotary type) that edging processing is used, be formed with a cutter groove 23 around described substrate 10 surrounding end limits on this tool 20, and this cutter 41 can move and grind described substrate 10 surrounding end limits along cutter groove 23, and sharp keen end angle 101 is flattened into to fillet 102.
The structure configuration of this substrate orientation processing unit (plant) can be diversified, below please refer to Fig. 3 a to Fig. 3 c to describe the structure configuration state of this processing unit (plant) in detail.
In the embodiment shown in Fig. 3 a, these tool 20 body interior contain magnetisable device and tool 20 Integral mouldings that magnetisable device produces magnetic line of force M, this tool 20 also is contained in the cutter groove 23 of integrally formed ring-type on this tool 20, makes this cutter groove 23 can be around described substrate 10 surrounding end limits.
In the embodiment shown in Fig. 3 b, this tool 20 is for example, to be made by non-magnetic material (being acryl), and is formed with cutter groove 23 and the storage tank 24 of ring-type, and this storage tank 24 provides magnetizable body 21 to be embedded in this tool 20.
In the embodiment shown in Fig. 3 c, this tool 20 is for example, to be made by non-magnetic material (being acryl) in the same manner, and then in described tool 20 bottoms, magnetisable sucker 22 is installed, in order to produce magnetic line of force M and penetrate tool 20 and provide by magnetisable sucker 22; Wherein, the mode that magnetisable sucker 22 is installed in these tool 20 bottoms can be to be bolted, specifically, this tool 20 is provided with most bolts hole 25, corresponding bolt hole 25 positions and be provided with alveolus 26 on this magnetisable sucker 22, so that the interior locking bolt 27 of bolt hole 25, and then fix magnetisable sucker 22 in tool 20 bottoms.Further, this magnetisable sucker 22 can be comprised of coil 221 and iron core 223, and magnetic switch 28, one power supplys 29 are set on device of the present invention.This magnetisable sucker 22, magnetic switch 28, power supply 29 are electrically connected with the form of series connection.After this described magnetic switch 28 is connected, under the effect of power supply, this magnetisable sucker is magnetized, and produces magnetic field, and then produces magnetic line of force M.
Because magnetic line of force M can be in produce the magnetic field effect that there is a natural attraction between the sexes in substrate 10 placing space, and even dividing plate 30 is adsorbed and substrate 10 is fixed on tool 20, and, when substrate processing 10, is unlikely to produce mobile.
In the embodiment shown in Fig. 3 e to Fig. 3 f, can disposablely on tool 20, locate most plate bases 10, in order to accepting disposable edging processing; Wherein:
Refer to shown in Fig. 7 a, disclose the machining sketch chart of Fig. 3 e illustrated embodiment, illustrate and utilize 30 compactings of single dividing plate, and utilize sept 11 intervals stacked, and magnetic conduction is fixed on the most plate bases 10 on tool 20, formation based on gap h, be conducive to use a tandem to be formed with the cutter 41b of a plurality of angle grooves, disposable grinding is the sharp tip angle 101 on the surrounding end limit of stacked most plate bases 10 mutually, and then sharp keen end angle 101 is flattened into to mild fillet 102 as shown in Figure 6.
Refer to shown in Fig. 7 b, disclose the machining sketch chart of Fig. 3 f illustrated embodiment, illustrate and utilize that most sheet dividing plates 30 intervals are stacked and magnetic conduction is fixed on the most plate bases 10 on tool 20, formation based on gap h, and described dividing plate 30 provides successively magnetic conduction and the stable effect of suppressing, more be conducive to use a tandem to be formed with the cutter 41c of a plurality of angle grooves, disposable grinding is the sharp tip angle 101 on the surrounding end limit of stacked most plate bases 10 mutually, and then sharp keen end angle 101 is flattened into to oblique angle 102 as shown in Figure 6.
To sum up institute is old, usually know that the knowledgeable should further understand, the technological means comprised in said method of the present invention, characteristic and expected effect, can fully and particularly enough through above-mentioned device technique, obtain realization, be beneficial in particular the most plate bases in disposable stacked location to accept the technical scheme of disposable processing, except can specifically implementing, really can promote the efficiency of substrate edging processing, and promote the utilization rate of edging facility, be beneficial to a large amount of production, and improve production capacity.
Yet above-mentioned glass substrate, magnetisable device, edging processing are all several embodiments that exemplify in the present invention with the edging facility, can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should further be pointed out that, usually know the knowledgeable without departing from the inventive concept of the premise, can also make complex deformation and improvement, these all belong to protection scope of the present invention.Therefore, the present invention should be as the criterion with the claims content limited in claim.
Claims (20)
1. a substrate orientation processing method, is characterized in that, comprising:
The substrate of putting at least one non-magnetic has on the tool of magnetizing assembly in one;
The dividing plate of stacked at least one magnetic conductivity is suppressed described substrate, and wherein, described tool and dividing plate magnetic attraction, make in the described substrate orientation between tool and dividing plate on this tool; And
Use a cutter to be processed described substrate.
2. substrate orientation processing method as claimed in claim 1, it is characterized in that, described magnetizing assembly is fixed in the bottom of tool, and this magnetizing assembly comprises a magnetisable sucker, a magnetic switch and a power supply, and this magnetisable sucker, magnetic switch, power supply are electrically connected with the form of series connection.
3. substrate orientation processing method as claimed in claim 1, is characterized in that, described magnetizing assembly is embedded in described tool.
4. substrate orientation processing method as claimed in claim 1, is characterized in that, described magnetizing assembly and the integrated formation of described tool.
5. substrate orientation processing method as claimed in claim 1, is characterized in that, described tool also comprises around the cutter groove on described substrate surrounding end limit, and cutter is processed operation around described cutter groove one circle.
6. substrate orientation processing method as claimed in claim 1, is characterized in that, described dividing plate is metal partion (metp).
7. substrate orientation processing method as claimed in claim 1, is characterized in that, described substrate and described dividing plate are respectively most sheets, and described substrate and described dividing plate are that interval is stacked and placed on described tool.
8. substrate orientation processing method as claimed in claim 1, is characterized in that, described substrate is most sheets and mutually stacked, and this dividing plate is single and is stacked and placed on the top of top layer substrate and suppresses described most plate base.
9. substrate orientation processing method as claimed in claim 5, is characterized in that, between described mutual stacked substrate, pad is provided with a sept.
10. substrate orientation processing method as claimed in claim 9, is characterized in that, described sept is one of them of magnetic conductivity, non-magnetic.
11. a substrate orientation processing unit (plant), is characterized in that, comprising:
One tool that contains magnetizing assembly;
One dividing plate for the magnetic conductivity of suppressing substrate, wherein, described substrate is placed on tool; And
One for grinding the cutter on described edge of substrate limit.
12. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, is formed with a cutter groove around described substrate surrounding end limit on this tool.
13. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, magnetizing assembly comprises a magnetisable sucker, a magnetic switch and a power supply, and this magnetisable sucker, magnetic switch, power supply are electrically connected with the form of series connection.
14. substrate orientation processing unit (plant) as claimed in claim 11 is characterized in that described magnetizing assembly is embedded in described tool.
15. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, described magnetizing assembly and the integrated formation of described tool.
16. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, described dividing plate is metal partion (metp).
17. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, described substrate and described dividing plate are respectively most sheets, and described substrate and described dividing plate are that interval is stacked and placed on described tool.
18. substrate orientation processing unit (plant) as claimed in claim 11, is characterized in that, described substrate is most sheets and mutually stacked, and this dividing plate is singlely be stacked and placed on the top of top layer substrate and suppress described most plate base.
19. substrate orientation processing unit (plant) as claimed in claim 18, is characterized in that, between described mutual stacked substrate, pad is provided with a sept.
20. substrate orientation processing unit (plant) as claimed in claim 19, is characterized in that, described sept is one of them of magnetic conductivity, non-magnetic.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190038.0A CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
| TW101217557U TWM449054U (en) | 2012-06-02 | 2012-09-12 | Device for fixing and processing substrate(s) |
| TW101133230A TW201351554A (en) | 2012-06-02 | 2012-09-12 | Method for fixing and processing substrate(s) and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190038.0A CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
Publications (2)
| Publication Number | Publication Date |
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| CN103447940A true CN103447940A (en) | 2013-12-18 |
| CN103447940B CN103447940B (en) | 2017-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210190038.0A Expired - Fee Related CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
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| Country | Link |
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| CN (1) | CN103447940B (en) |
| TW (2) | TWM449054U (en) |
Cited By (3)
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| CN105436997A (en) * | 2014-08-26 | 2016-03-30 | 无锡格瑞斯精密机械有限公司 | Machining process for large sheet parts |
| JP2018069426A (en) * | 2016-11-04 | 2018-05-10 | カネテック株式会社 | Magnet chuck |
| CN109048546A (en) * | 2018-08-31 | 2018-12-21 | 巫溪县玉帛石材有限公司 | round stone edge grinding machine |
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2012
- 2012-06-02 CN CN201210190038.0A patent/CN103447940B/en not_active Expired - Fee Related
- 2012-09-12 TW TW101217557U patent/TWM449054U/en not_active IP Right Cessation
- 2012-09-12 TW TW101133230A patent/TW201351554A/en unknown
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| US5128281A (en) * | 1991-06-05 | 1992-07-07 | Texas Instruments Incorporated | Method for polishing semiconductor wafer edges |
| US6921455B1 (en) * | 1999-10-18 | 2005-07-26 | Kabushiki Kaisha Ishii Hyoki | Device for polishing outer peripheral edge of semiconductor wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436997A (en) * | 2014-08-26 | 2016-03-30 | 无锡格瑞斯精密机械有限公司 | Machining process for large sheet parts |
| JP2018069426A (en) * | 2016-11-04 | 2018-05-10 | カネテック株式会社 | Magnet chuck |
| CN109048546A (en) * | 2018-08-31 | 2018-12-21 | 巫溪县玉帛石材有限公司 | round stone edge grinding machine |
| CN109048546B (en) * | 2018-08-31 | 2020-08-14 | 巫溪县玉帛石材有限公司 | Circular stone edge grinding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM449054U (en) | 2013-03-21 |
| TW201351554A (en) | 2013-12-16 |
| CN103447940B (en) | 2017-07-28 |
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