CN103447940B - Substrate positioning and processing method and its device - Google Patents
Substrate positioning and processing method and its device Download PDFInfo
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- CN103447940B CN103447940B CN201210190038.0A CN201210190038A CN103447940B CN 103447940 B CN103447940 B CN 103447940B CN 201210190038 A CN201210190038 A CN 201210190038A CN 103447940 B CN103447940 B CN 103447940B
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- tool
- substrate
- dividing plate
- substrates
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Abstract
The present invention provides a kind of substrate positioning and processing method, including puts the substrate of an at least non-magnetic on a tool with magnetizing assembly；The dividing plate of a stacked at least magnetic conductivity suppresses the substrate；The magnetic switch on the tool is opened, wherein, the tool is attracted each other with dividing plate so that the substrate between tool and dividing plate is positioned on the tool；Then the substrate is processed using a cutter.The present invention also provides a kind of substrate positioning processing device, so that the disposable stacked many plurality of substrates of positioning receive disposable processing.
Description
Technical field
The present invention relates to a kind of processing technique field of substrate, substrate is positioned on machining machine and tool more particularly to a kind of
Method and device.
Background technology
In general, the substrate (Substrate) of the electronic equipment of common name, can be laid with touching for sensor electrode array
Control the touch base plate or protective substrate (Cover Lens) of panel (Touch Panel), or general common be used as the sun
The substrate that energy panel (Solar Panel) is used.These above-mentioned substrates, typically from the glass with good light transmittance
(Glass) it is made.In addition, being made this in some special-purposes or with hard plastic sheet or other hard materials
Substrate.
Aforesaid substrate includes the rule needed for must being cut into according to the demand of user during processing and manufacturing
Lattice.Substrate after due to cutting, its surrounding end edge is formed with sharp keen end angle, and processer would generally use a kind of grinding equipment
Edging processing is carried out to substrate, flattened in order to which sharp tip angle is ground, it is to avoid the sharp keen end angle scratch personnel cut bad
The article on periphery.
And know, the seen machining machine and tool of tradition, all it is the mode using vacuum suction by base wherein particularly grinding equipment
Plate is positioned on tool, but the tool can only once fix a plate base in single position and receive edging processing, therefore is existed
The problem of grinding efficiency is not evident, so it is unfavorable for a large amount of production and processings of factory.
The content of the invention
In view of this, invention applies the finder that magnetic field effect principle improves substrate, so solve tool without
Method is the problem of single position one-time positioning multi-piece substrate receives to grind.
According to one embodiment of the invention there is provided a kind of substrate positioning and processing method, its technological means includes：
The substrate of an at least non-magnetic is put on a tool with magnetizing assembly；
The dividing plate of a stacked at least magnetic conductivity suppresses the substrate；
The magnetic switch on the tool is opened, wherein, the tool attracts each other with magnetic conductivity dividing plate so that positioned at tool
The substrate between dividing plate is positioned on the tool, and
One cutter is processed to the substrate.
Further, the magnetizing assembly is fixed on the bottom of tool, and the magnetizing assembly includes a magnetisable sucker, a magnetic
Switch and a power supply, the magnetisable sucker, magnetic switch, power supply are electrically connected with the form of connecting.The magnetic is opened
Close after connecting, in the presence of power supply, the magnetisable sucker is magnetized, produce magnetic field, and then produce the magnetic line of force.
Further, wherein the magnetizing assembly is embedded in the tool.
Further, the magnetizing assembly and the tool are integrally-formed.
Further, the tool also includes the cutter groove around the substrate surrounding end edge, and cutter is around the cutter groove one
Circle is processed operation.Further, the dividing plate is metal partion (metp).
Further, the substrate and the dividing plate be respectively it is many several pieces, and the substrate is that interval is folded with the dividing plate
It is placed on the tool.
Further, the substrate for it is many several pieces and it is superposed, the dividing plate is single and is stacked and placed on top substrate
Top and suppress many plurality of substrates.
Further, pad is provided with a sept between the superposed substrate.
Further, the sept is one of magnetic conductivity, non-magnetic.
In summary, because present invention utilizes magnetic field effect, the magnetic conductivity dividing plate compacting substrate is fixed on tool,
Therefore it can disposably be stacked single or many plurality of substrates in the magnetic field space that the tool is provided and consolidated
It is fixed, in order to disposably grind the surrounding end edge of many plurality of substrates, and then lift the processing efficiency and profit of grinding equipment
With rate, and contribute to a large amount of productions, to improve production capacity.
Technological means, characteristic and expected effect included in the above method of the present invention, can be through a kind of dress
Put technology and realized, therefore, there is provided a kind of substrate positioning processing device, its technology according to another embodiment of the present invention
Means include：
One tool containing magnetizing assembly；The one magnetic conductivity dividing plate for suppressing substrate, wherein, the substrate is placed in tool
On；And
One cutter for grinding the substrate end edge.
Further, be formed with the tool one around the substrate surrounding end edge cutter groove.
Further, magnetizing assembly includes a magnetisable sucker, magnetic switch and a power supply, the magnetisable sucker, the magnetic
Switch, power supply are electrically connected with the form of connecting.After the magnetic switch is connected, in the presence of power supply, this is magnetisable
Sucker is magnetized, and produces magnetic field, and then produce the magnetic line of force.
Further, wherein the magnetizing assembly is embedded in the tool.
Further, wherein the magnetizing assembly and the tool are integrally-formed.
Further, wherein the dividing plate is metal partion (metp).
Further, wherein the substrate and the dividing plate be respectively it is many several pieces, and between the substrate and the dividing plate are
Every being stacked and placed on the tool.
Further, wherein the substrate for it is many several pieces and it is superposed, the dividing plate is single to be stacked and placed on top base
The top of plate and suppress many plurality of substrates.Further, wherein pad is provided between one between the superposed substrate
Parting.The sept is one of magnetic conductivity, non-magnetic.
The efficiency of substrate edging processing can be lifted in the above method of the present invention, and lifts the utilization rate of edging equipment,
In favor of a large amount of productions, and improve production capacity.
The technological means of method and apparatus described above and its specific implementation details for producing efficiency, refer to following reality
Apply example and schema is illustrated.
Brief description of the drawings
Fig. 1 is the flow chart of substrate positioning and processing method of the present invention；
Fig. 2 is the dynamic configuration cut-away view that the present invention performs Fig. 1 steps；
Fig. 3 a to Fig. 3 f are configuration cut-away views of the Fig. 2 in distinct embodiments respectively；
Fig. 4 is the perspective exploded view of substrate positioning processing device of the present invention；
Fig. 5 is Fig. 4 group deep cutting diagram；
Fig. 6 is the enlarged diagram of the substrate after edging processing；And
Fig. 7 a to Fig. 7 b are the machining sketch chart of compares figure 3e to Fig. 3 f embodiments respectively.
Embodiment
Implement the substrate positioning and processing method of the present invention and its purpose of device, be in order to before substrate processing, can
Aforehand substrate is securely positioned on machining machine and tool, in favor of the progress of processing.Described substrate may, for example, be conduct
Touch-control purposes or the substrate for protecting purposes, or the substrate used as solar panel, these substrates are generally all by glass
It is made, therefore glass substrate can also be referred to as.The characteristic of the substrate being made due to glass without magnetic conduction in itself (that is, is possessed
Non-magnetic), and it is available for the magnetic line of force to be stretched through, therefore be appropriate to and put in magnetic field environment, do not done by the magnetic line of force
Disturb.In addition, described machining machine and tool, can be for example the grinding equipment used for the surrounding end edge of grinding glass substrate.However,
Actual substrate and machining machine and tool is not limited with above-mentioned, is first chatted bright herein.
In view of implementing the method for the present invention, please refer to Fig. 1, Fig. 2 and Fig. 3 a to Fig. 3 f.Wherein, Fig. 1 discloses the present invention
The flow chart of substrate positioning and processing method, Fig. 2 discloses the dynamic configuration cut-away view that the present invention performs Fig. 1 steps, Fig. 3 a to Fig. 3 f
The configuration cut-away view in Fig. 2 distinct embodiments is disclosed respectively.Substrate 10 in above-mentioned schema embodiment, is enumerated with touch-control or guarantor
The glass substrate of shield purposes is explained.Sheet body is presented in the substrate 10, and its surrounding end edge has sharp keen end angle 101, and
A kind of edging processing must be received by enumerating the substrate 10, and end angle 101 is flattened into fillet.Because the substrate 10 is receiving edging
Before processing, it is necessary to be positioned in advance on tool 20, the tool 20 has been fixed on grinding equipment 40 in advance, and the edging equipment
40 process the cutter 41 used comprising an edging, and the cutter 41 substantially can be the crusher or milling cutter of a rotary type；This is controlled
Tool 20 grinds the end edge of the substrate comprising the cutter 41 is accommodated.
Wherein, for the mode of positioning substrate processing 10, the invention provides a kind of substrate positioning and processing method, its skill
Art means include：The substrate 10 of an at least non-magnetic is put on the tool 20 with magnetizing assembly；A stacked at least magnetic conduction
Property dividing plate 30 compacting substrate 10；The magnetic switch 28 on tool is opened, wherein, tool 20 attracts each other with dividing plate 30 so that position
Substrate 10 between tool 20 and dividing plate 30 is positioned on the tool 20；Then substrate 10 is added using a cutter 41
Work.
Implementation steps shown in reference picture 1, the above-mentioned technological means of the present embodiment can be through step S1 to step S4
Specific implementation, wherein：
Step S1：Put substrate.
In the embodiment shown in Fig. 3 a, the substrate 10 of a piece of non-magnetic is taken, and put this substrate 10 is flat
On tool 20, wherein tool 20 and magnetizing assembly (not shown) is integrally-formed, and magnetizing assembly is arranged at the interior of tool 20
Portion.
The configuration relation of magnetizing assembly and tool 20 can also be other modes, and as shown in Figure 3 b, the magnetizing assembly also may be used
It is embedded in the storage tank 24 of tool 20, the embedded magnetizing assembly is by a magnetizable body 21 and the power supply being connected with magnetizable body 21
Composition (not shown), wherein, the magnetic of magnetizable body 21 must be controllable, and the low soft magnetic bodies of remanent magnetism rate may be selected in its material,
For example, silicon steel sheet and soft magnet core.
In addition, except the implementation exception shown in Fig. 3 a and 3b, magnetizing assembly can also be arranged on the bottom of tool 20.Tie below
Close Fig. 3 c and Fig. 3 d and illustrate that magnetizing assembly is arranged on the position relationship of the bottom of tool 20, Fig. 3 d disclose the structure of magnetizing assembly
Schematic diagram, the magnetizing assembly include magnetisable sucker 22, magnetic switch 28, power supply 29, the magnetisable sucker 22, magnetic switch 28,
Power supply 29 is electrically connected with the form of series connection.Magnetisable sucker 22 is made up of coil 221 and iron core 223, the coil 221
Around the iron core 223, the wherein magnetic of iron core must be controllable, and the low soft magnetic bodies of remanent magnetism rate may be selected in its material, for example, silicon
Steel disc and soft magnet core.Tool 20 is controlling of providing that substrate 10 puts by non-permeable material (be, for example, acryl) is made
Tool.Fixed form between tool 20 and magnetisable sucker 22 is as shown in Figure 3 c, i.e. bolt 27, which runs through, to be arranged on tool 20
Bolt hole 25 and correspondence the position of bolt hole 25 and be arranged on the alveolus 26 on magnetisable sucker 22, make tool 20 with it is magnetisable inhale
Disk 22 is fixed together.
In the embodiment shown in Fig. 3 e and Fig. 3 f, illustrate disposably put the substrate of several pieces many non-magnetics
10 is superposed on tool 20.
Step S2：Stacked dividing plate.
In Fig. 3 a to Fig. 3 c illustrated embodiments, being all disclosed in the stacked on top of aforesaid substrate 10 has single magnetic conductivity
Dividing plate 30 suppresses single plate base 10, and the dividing plate 30 can be substantially a metal partion (metp), dividing plate 30 is had magnetic conductivity.Implement
In, the width W3 of dividing plate 30 is necessarily less than the width W1 of substrate 10, manifests the surrounding end edge of substrate 10 and waits for edging
The end angle 101 of processing.
In the embodiment shown in Fig. 3 e, the top on several pieces many superposed substrates 10 is stacked single dividing plate
30, and many plurality of substrates 10 are suppressed on tool 20 using the piece dividing plate 30.Further, superposed most chip bases
It can respectively be padded between plate 10 and set a sept 11.Due to the consistent thickness of sept 11 so that each plate base 10
Between formed one be beneficial to cutter carry out edging processing gap h.In addition, in embodiment shown in Fig. 3 f, further illustrating
Gap h shown in Fig. 3 e, can also be set by the pad of dividing plate 30 with uniformity thickness and formed；In other words, it is described superposed
Substrate 10 and dividing plate 30 be respectively it is many several pieces, and the substrate 10 is that interval is stacked and placed on the tool 20 with dividing plate 30,
So that the gap h for carrying out edging processing beneficial to cutter is respectively formed between superposed each plate base 10.
Usual skill can be either folded with single dividing plate 30 as in above-described embodiment shown in Fig. 3 a to Fig. 3 f, understanding
Single plate base 10 is put, or many plurality of substrates 10 are stacked with single dividing plate 30, or with several pieces many dividing plates 30 and many arts
Plate base 10 is superposed, is all feasible embodiment, and sept 11 or dividing plate 30 with uniformity thickness
Being placed on tool 20 for the stabilization of substrate 10 itself can be also suppressed all with specific weight, or even when being mutually stacked.
Step S3：Start magnetic switch 28.
The coil 221 of magnetisable device is powered, and iron core 223 is magnetized, and magnetic field is formed around magnetisable device, the magnetic
Field absorption dividing plate 30 so that substrate 10 is firmly fixed on tool 20, without producing movement, and then realizes that substrate 10 is determined
It is that follow-up processing procedure processing is prepared positioned at the purpose of tool 20.
In the embodiment shown in Fig. 3 a to Fig. 3 c and Fig. 3 f, no matter substrate 10 or dividing plate 20 are single or most
Piece, the magnetic line of force M of magnetisable device formation through the tool 20 and can be placed in substrate 10 thereon, make magnetic conductivity every
Plate 30 is acted in magnetic field S by magnetic line of force M magnetic conduction；Alleged magnetic conduction effect, refers to the dividing plate 30 of the magnetic conductivity in magnetic field
Influenceed by the magnetic line of force M magnetic field effects produced, and then produce N poles and the effect of the S poles magnetic that there is a natural attraction between the sexes.According to this so that folded
The single dividing plate 30 of single or the top of many plurality of substrates 10 are placed in, or interval is stacked and placed between many plurality of substrates 10
Several pieces many dividing plates 30, can be by the magnetic effect after magnetic conduction and then close and firmly press against the substrate 10 and be fixed on this and control
On tool 20.
In the embodiment shown in Fig. 3 e, it (is, for example, metal that the sept 11 can be made from the material of magnetic conductivity
Block), in order to receive magnetic line of force M magnetic conduction simultaneously with the dividing plate of magnetic conductivity in magnetic field S, so that it is close and firmly press against institute
Substrate 10 is stated to be fixed on the tool 20.In addition, it is enough strong in the intensity of magnetic field S, top base can by sticking securely
In the case of the dividing plate 30 at the top of plate 10, it (is, for example, acryl that the sept 11 can also be made from the material of non-magnetic
Block).
Step S4：Tool sharpening substrate.
Position after the completion of substrate 10, cutter 41 starts processing, cutter 41 moves along cutter groove 23 and grinds the substrate 10
Surrounding end edge, and sharp keen end angle 101 is flattened into fillet.
Summary step S1 to step S4 explanation, usual knowledge should will be seen that, the magnetic produced using the magnetic line of force
Field-effect principle, dividing plate compacting substrate is fixed on tool described in magnetic conduction, is feasible technical scheme；Wherein, especially
It is that can disposably position many plurality of substrates in the magnetic field space that tool is provided, in this way, contributing to many plurality of substrates energy
The enough processing for disposably receiving machining machine and tool；Wherein, the surrounding end edge of many plurality of substrates can disposably connect in particular
Processed by edging, to lift the processing efficiency and utilization rate of the equipment, and contribute to a large amount of productions, to improve production capacity.
Then, referring to Fig. 4, disclosing perspective exploded view of the substrate positioning of the present invention plus device, as illustrated, this
Embodiment offer is a kind of can to implement the device technique of aforesaid substrate positioning and processing method, and substrate positioning processing device includes：One
Magnetizing assembly, the tool 20 being fixed on the magnetizing assembly, and for suppressing the dividing plate 30 of substrate 10, wherein, the base
Plate 10 is placed on tool 20.
Due in above method embodiment, be enumerate the substrate 10 must receive edging processing and position substrate 10 in
On tool 20, so as to which end angle 101 is flattened into fillet.For this purpose, please refer to Fig. 5 to Fig. 6；Wherein, Fig. 5 discloses Fig. 4
Group deep cutting diagram, Fig. 6 disclose edging processing after substrate enlarged diagram；As shown in figure 5, illustrating that the tool 20 is advance
It is fixed on grinding equipment 40, and it (is, for example, the emery wheel of rotary type that the edging equipment 40, which processes the cutter 41 used comprising edging,
Knife or milling cutter), be formed with the tool 20 one around the surrounding end edge of substrate 10 cutter groove 23, and the cutter 41 can
Moved along cutter groove 23 and grind the surrounding end edge of substrate 10, and sharp keen end angle 101 is flattened into fillet 102.
The structure configuration of the substrate positioning processing device can be diversified, and Fig. 3 a to Fig. 3 c are refer to below to describe this in detail
The structure configuration state of processing unit (plant).
In the embodiment shown in Fig. 3 a, what the body interior of tool 20 contained that magnetisable device produces magnetic line of force M can
Magnetizing assembly and the Integral moulding of tool 20, the tool 20 are also contained in the cutter groove 23 that ring-type is integrally formed on the tool 20,
The cutter groove 23 enable around the surrounding end edge of substrate 10.
In the embodiment shown in Fig. 3 b, the tool 20 is made up of non-permeable material (being, for example, acryl), and
The cutter groove 23 and storage tank 24 of ring-type are formed with, the storage tank 24 provides magnetizable body 21 and is embedded in the tool 20.
In the embodiment shown in Fig. 3 c, the tool 20 is by non-permeable material (being, for example, acryl) system in the same manner
Into, and then magnetisable sucker 22 is installed in the bottom of tool 20, controlled to be produced magnetic line of force M by magnetisable sucker 22 and penetrated
Have 20 and provide；Wherein, the mode that magnetisable sucker 22 is installed in the bottom of tool 20 can be bolted, specifically,
The tool 20, which is provided with more several bolts hole 25, the magnetisable sucker 22, corresponds to the position of bolt hole 25 and provided with alveolus 26,
In order to locking bolt 27 in bolt hole 25, and then magnetisable sucker 22 is fixed in the bottom of tool 20.Further, this is magnetisable
Sucker 22 can be made up of coil 221 and iron core 223, and in the present invention device on a magnetic switch 28, a power supply are set
29.The magnetisable sucker 22, magnetic switch 28, power supply 29 are electrically connected with the form of series connection.The magnetic switch 28 is connected
Afterwards, in the presence of power supply, the magnetisable sucker is magnetized, and produces magnetic field, and then produce magnetic line of force M.
Because magnetic line of force M can be in the generation magnetic field effect that there is a natural attraction between the sexes in the placing space of substrate 10, or even dividing plate 30
It is adsorbed and substrate 10 is fixed on tool 20, and in substrate processing 10, is unlikely to produce movement.
In the embodiment shown in Fig. 3 e to Fig. 3 f, can disposably in positioning many plurality of substrates 10 on tool 20, with
Profit receives disposable edging processing；Wherein：
Refer to shown in Fig. 7 a, disclose the machining sketch chart of Fig. 3 e illustrated embodiments, illustrate to utilize single dividing plate 30
Compacting, and it is stacked using the interval of sept 11, and magnetic conduction is fixed on many plurality of substrates 10 on tool 20, based on gap h's
Formed, be conducive to being formed with the cutter 41b of multiple angle grooves using a tandem, disposably grind superposed majority
The sharp tip angle 101 of the surrounding end edge of plate base 10, and then sharp keen end angle 101 is flattened into gentle circle as shown in Figure 6
Angle 102.
Refer to shown in Fig. 7 b, disclose the machining sketch chart of Fig. 3 f illustrated embodiments, illustrate to utilize several pieces many dividing plates 30
Interval is stacked and magnetic conduction is fixed on many plurality of substrates 10 on tool 20, based on gap h formation, and the dividing plate 30 provide by
Layer magnetic conduction and the effect of stable compacting, more are conducive to being formed with the cutter 41c of multiple angle grooves, one using a tandem
The sharp tip angle 101 of the surrounding end edge for grinding superposed many plurality of substrates 10 of secondary property, so sharp keen end angle 101 is whole
Heisei fillet 102 as shown in Figure 6.
To sum up institute is old, and usual skill be able to should be further appreciated that, the technology hand included in the above method of the present invention
Section, characteristic and expected effect, abundant and specifically enough can be realized, in particular through above-mentioned device technique
Beneficial to the disposable stacked many plurality of substrates of positioning to receive the technical scheme disposably processed, in addition to it can be embodied,
The efficiency of substrate edging processing can actually be lifted, and lifts the utilization rate of edging equipment, in favor of a large amount of productions, and is improved
Production capacity.
However, above-mentioned glass substrate, magnetisable device, edging processing and edging equipment all simply the present invention in enumerated
Several embodiments, can not therefore and be interpreted as the limitation to the scope of the claims of the present invention.It should be further noted that
It is that usual skill without departing from the inventive concept of the premise, can also make complex deformation and improvement, these belong to this
The protection domain of invention.Therefore, the claims content that the present invention should be limited in claim is defined.
Claims (13)
1. a kind of substrate positioning and processing method, it is characterised in that including：
The substrate of several pieces stacked many non-magnetics is on a tool with magnetizing assembly；
The dividing plate of a stacked at least magnetic conductivity suppresses many plurality of substrates, and superposed many plurality of substrates it
Between respectively pad set a magnetic conductivity sept, wherein, the sept is formed from the same material with the dividing plate, the tool magnetic
Property attract the sept and the dividing plate so that it is described many between the tool, the sept and the dividing plate
Plurality of substrates is positioned on the tool；And
Many plurality of substrates are processed using a cutter.
2. substrate positioning and processing method as claimed in claim 1, it is characterised in that the magnetizing assembly is fixed on the bottom of tool
Portion, the magnetizing assembly includes a magnetisable sucker, a magnetic switch and a power supply, and the magnetisable sucker, magnetic switch, power supply are to connect
Form be electrically connected with.
3. substrate positioning and processing method as claimed in claim 1, it is characterised in that the magnetizing assembly embeds the tool
In.
4. substrate positioning and processing method as claimed in claim 1, it is characterised in that the magnetizing assembly and tool one
Change and formed.
5. substrate positioning and processing method as claimed in claim 1, it is characterised in that the tool is also included around described many
The cutter groove of plurality of substrates surrounding end edge, cutter is processed operation around the cutter groove one circle.
6. substrate positioning and processing method as claimed in claim 1, it is characterised in that the dividing plate is metal partion (metp).
7. substrate positioning and processing method as claimed in claim 1, it is characterised in that the dividing plate is single and is stacked and placed on top
The top of substrate and suppress many plurality of substrates.
8. a kind of substrate positioning processing device, it is characterised in that including：
One tool containing magnetizing assembly；
The dividing plate of the magnetic conductivity of one many plurality of substrates for suppressing non-magnetic, wherein, many plurality of substrates are superposed
In on the tool, and between superposed many plurality of substrates, pad sets a magnetic conductivity sept, the interval respectively
Thing is formed from the same material with the dividing plate；And
One cutter for grinding many plurality of substrates end edges.
9. substrate positioning processing device as claimed in claim 8, it is characterised in that one is formed with the tool around described
The cutter groove of many plurality of substrates surrounding end edges.
10. substrate positioning processing device as claimed in claim 8, it is characterised in that magnetizing assembly comprising a magnetisable sucker,
One magnetic switch and a power supply, the magnetisable sucker, magnetic switch, power supply are electrically connected with the form of connecting.
11. substrate positioning processing device as claimed in claim 8, it is characterised in that the magnetizing assembly is embedded in described control
In tool.
12. substrate positioning processing device as claimed in claim 8, it is characterised in that the magnetizing assembly and the tool one
Body is formed.
13. substrate positioning processing device as claimed in claim 8, it is characterised in that the dividing plate is metal partion (metp).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190038.0A CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
| TW101217557U TWM449054U (en) | 2012-06-02 | 2012-09-12 | Device for fixing and processing substrate(s) |
| TW101133230A TW201351554A (en) | 2012-06-02 | 2012-09-12 | Method for fixing and processing substrate(s) and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210190038.0A CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103447940A CN103447940A (en) | 2013-12-18 |
| CN103447940B true CN103447940B (en) | 2017-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210190038.0A Expired - Fee Related CN103447940B (en) | 2012-06-02 | 2012-06-02 | Substrate positioning and processing method and its device |
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| Country | Link |
|---|---|
| CN (1) | CN103447940B (en) |
| TW (2) | TWM449054U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436997A (en) * | 2014-08-26 | 2016-03-30 | 无锡格瑞斯精密机械有限公司 | Machining process for large sheet parts |
| JP6469627B2 (en) * | 2016-11-04 | 2019-02-13 | カネテック株式会社 | Magnet chuck |
| CN109048546B (en) * | 2018-08-31 | 2020-08-14 | 巫溪县玉帛石材有限公司 | Circular stone edge grinding machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202825506U (en) * | 2012-06-02 | 2013-03-27 | 瑞士达光学(厦门)有限公司 | Baseplate locating and processing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5128281A (en) * | 1991-06-05 | 1992-07-07 | Texas Instruments Incorporated | Method for polishing semiconductor wafer edges |
| JP3119358B1 (en) * | 1999-10-18 | 2000-12-18 | 株式会社石井表記 | Edge polishing equipment for semiconductor wafers |
| JP2006272482A (en) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | Brittle material machining tool |
| US8210903B2 (en) * | 2006-09-29 | 2012-07-03 | Hoya Corporation | Method of manufacturing glass substrate for magnetic disk, method of manufacturing magnetic disk, and polishing apparatus of glass substrate for magnetic disk |
| CN102350661A (en) * | 2011-06-30 | 2012-02-15 | 浙江星星瑞金科技股份有限公司 | Ultrathin glass corner machining method and special computerized numerical control (CNC) cutter |
| CN202240858U (en) * | 2011-08-19 | 2012-05-30 | 威鸿(厦门)光学有限公司 | Polishing machine for inner wall of glass hole |
-
2012
- 2012-06-02 CN CN201210190038.0A patent/CN103447940B/en not_active Expired - Fee Related
- 2012-09-12 TW TW101217557U patent/TWM449054U/en not_active IP Right Cessation
- 2012-09-12 TW TW101133230A patent/TW201351554A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202825506U (en) * | 2012-06-02 | 2013-03-27 | 瑞士达光学(厦门)有限公司 | Baseplate locating and processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103447940A (en) | 2013-12-18 |
| TW201351554A (en) | 2013-12-16 |
| TWM449054U (en) | 2013-03-21 |
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