CN103442529B - A kind of printed circuit high density folds hole interconnecting method - Google Patents
A kind of printed circuit high density folds hole interconnecting method Download PDFInfo
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- CN103442529B CN103442529B CN201310369365.7A CN201310369365A CN103442529B CN 103442529 B CN103442529 B CN 103442529B CN 201310369365 A CN201310369365 A CN 201310369365A CN 103442529 B CN103442529 B CN 103442529B
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Abstract
The present invention relates to a kind of printed circuit high density and fold hole interconnecting method, the method grinds platen surface after clogging resin, removal lead-free solder after plating thin copper, substrate coating lead-free solder with boring, hole wall, resin surface copper-plating technique forms high density and folds hole interconnection structure, overcome employing conducting filler and serve as folded hole conducting medium, because of the oxidation of conducting filler, aging and cause printed circuit board functional reliability difference problem, simultaneously, hole wall only need to be plated thin copper layer by folded hole interconnection structure, copper-plating technique is simple, technological requirement is low, the shortest, reduce manufacturing cost.The operation grinding platen surface after substrate coating lead-free solder after filling resin, removal lead-free solder completes resin filling, effectively prevent filling resin solidification rear surface and caves in excessive and cause the out-of-flatness of plate face；The present invention is applicable to flexible printed-circuit board, rigid printed circuit boards manufacture.
Description
Technical field
The invention belongs to printed circuit board and manufacture field, relate to printed circuit hole interconnecting method, especially printed circuit high density folded
Hole interconnecting method.
Background technology
The electronics and IT products of high-intelligentization are continuously subject to meagreization of form construction design, and printed circuit board produces as electronic information
The carrier that product electric function realizes, it is electric that the integration density that its wiring density and interlayer hole interconnect will directly affect electronics and IT products
The performance of performance and the meagreization degree of contour structures.Therefore, in printed-circuit board manufacturing technology, high density folds hole interconnection to be become
The development trend of interlayer hole interconnection technique.
Traditional printed circuit board uses through-hole approaches to realize the interconnection of adjacent interlayer circuit, can be only applied in simple electronic equipment；HD
I(High Density Interconnection) printed circuit board has less aperture and fine-line, carries to a certain extent
High wiring density, but still without meeting the signal of telecommunication high-speed transfer of electronics and IT products, high frequency operation and intelligentized design
Requirement, and its internal layer buries through hole and outer layer blind hole separates design and cannot reduce the size of product further with manufacturing process.Lamination
The appearance of printed circuit board has adapted to the high-intelligentization requirement of electronics and IT products further, and it realizes electricity by the interconnection of high density hole
Quick, the transmitting of signal.At present in the interconnection technique of interlayer hole, random layer inner via hole (Any Layer Inner Via Hol
E, ALIVH) the technology special pre-preg materials of employing, by laser drill, fill conductive filler, lamination Copper Foil, etching
Circuit, it is achieved that arbitrarily interlayer hole interconnection；Utilize conductive filler to realize interlayer and fold hole interconnection, transmission signal true is greatly improved
Property, reduces the pitch of holes of high-density array in BGA simultaneously, but conductive filler oxidation can reduce electric conductivity and the signal of telecommunication is transmitted across
Heat produced by journey can accelerate the aging of conductive filler, causes printed circuit functional reliability poor.Such as Publication No. US20110
289774, publication date is that the patent documentation of 2011-12-01 discloses employing conducting filler filling boring and serves as conducting medium
The method realizing the interconnection of folded hole；Conductive filler solidification is easily caused the oxidation of conductive particle and reduces the electric conductivity in hole, and conducts electricity
The heat that the filler compactness that causes of solvent volatilization of filler is bad, produce in work process all can accelerate the aging of conductive filler,
Reduce printed circuit board functional reliability.
The most folded hole interconnection (Free Via Stacked Up Structure, FVSS) technology is then boring to be filled up with copper electroplating layer,
Boring is made to be stacked up again；Fill up owing to needs carry out whole hole to boring, so electroplating process requires height to copper plating process,
And electroplating time is long, cost is high.Patent documentation such as Publication No. CN102427684A, publication date 2012-04-05 is open
Fill out copper mode by plating and make the copper billet of deposition compact in boring, utilize the method that copper billet realizes interlayer interconnection；Although filling out copper hole
Stable, but electroplating technology requires high, the longest, and electroplating solution expends many, causes printed circuit board manufacturing cost expensive.
Summary of the invention
The present invention is directed to the defect in the interconnection technique of existing interlayer hole provides a kind of printed circuit high density to fold hole interconnecting method, the party
Method forms high density fold hole interconnection structure with boring, the hole wall thin copper of plating, filling resin, resin surface copper-plating technique.Overcome and adopt
Serve as folded hole conducting medium with conducting filler, because of conducting filler oxidation, aging cause printed circuit board functional reliability poor
Problem；Meanwhile, only hole wall need to be plated thin copper layer in the interconnection structure of folded hole, copper-plating technique is simple, technological requirement is low, the shortest,
Reduce manufacturing cost.Technical solution of the present invention is as follows:
A kind of printed circuit high density folds hole interconnecting method, it is characterised in that comprise the following steps:
Step 1: be provided with on the double-sided copper-clad substrate of lower layers of copper, insulating medium layer and upper layers of copper employing laser drilling in overlapping successively
The method in hole offers internal layer hole, and it is lower layers of copper that the opening in internal layer hole is at the bottom of layers of copper, hole；
Step 2: processed the inside cleaning internal layer hole by desmearing；
Step 3: step 2 gained substrate is carried out hole metallization, first carries out chemical plating to upper layers of copper and internal layer hole wall and forms conduction
Thin copper layer, re-plating thickeies conductive thin layers of copper, it is achieved the conducting interconnection in internal layer hole, forms via；
Step 4: after step 3 gained substrate heat is pressed dry film, uses laser direct imaging or photographic film imaging to make via
Dry film generation photochemical reaction on opening surface, then there is not photochemical dry film through development removal, it is thus achieved that blocking via
Blocking layer；
Step 5: step 4 gained substrate surface is coated lead-free solder, and carries out hot air leveling process；
Step 6: to step 5 gained substrate striping, expose via；
Step 7: use vacuum taphole machine to through step 6 gained substrate filling resin in via, and solidify filling resin；
Step 8: use high-temperature hot-air to remove lead-free solder to through step 7 gained substrate, exposes layers of copper and filling resin, and
Use nog plate technique mill platen surface；
Step 9: the upper layers of copper of step 8 gained substrate is carried out electroplating surface copper with filling resin surface, makes filling resin surface
Form the copper plate being connected with conducting orifice ring；
Step 10: in the layers of copper of two outer surfaces of step 9 gained substrate, forms required circuitous pattern through figure transfer,
I.e. circuitous pattern layer；
Step 11: two circuitous pattern layers of step 10 gained substrate are carried out lamination increasing layer, first to two circuit diagrams simultaneously
Shape layer carries out surface coarsening process, then by binding agent hot press by outer layer pure copper foil and substrate pressing, binding agent after pressing
As new insulating medium layer, outer layer pure copper foil as new upper layers of copper；
Step 12: in each new upper layers of copper of step 11 gained substrate, with the internal layer hole correspondence position set by step 1
It is respectively adopted method for drilling holes and offers folded hole；
Step 13: the folded hole offered through step 12 gained substrate is carried out step 2, step 3 respectively；
Step 14: repeat step 4-13, until the high density needed for being formed folds hole interconnection structure.
Described: in step 1, double-sided copper-clad substrate is flexible or rigid double-face copper-clad base plate；And use power auger when internal layer hole is set
Hole method, then gained internal layer hole is through hole.In step 2, desmearing processes and uses dry method desmearing or wet method desmearing.Step 5
The lead-free solder of middle substrate coating is nonwetting with resin, and when can prevent clogging resin, non-hole site adsorbent resin, increases filling simultaneously
Resin height and prevent in resin curing process solvent volatilization to cause resin shape indent.Resin used by step 7 be heat curing-type or
Light curable type resin；The scraper filling resin of vacuum taphole machine is entered in hole, and vacuum filling resin is it can be avoided that produce in air access holes
Life is empty and affects the compactness of resin filling.In step 11, adhesive therefor is prepreg or hot-setting adhesive.Step 12 is opened
If folded hole is two-sided to cover using the new insulating medium layer of step 10 gained circuitous pattern layer, step 11 gained and upper layers of copper as new
Copper base, the opening in folded hole is in new upper layers of copper, is circuitous pattern layer at the bottom of hole.
The present invention provides a kind of high efficiency, low cost, the printed circuit high density of high reliability to fold hole interconnecting method, to hole,
Hole wall is clogged resin, is removed mill platen surface, resin surface copper-plating technique after lead-free solder after plating thin copper, substrate coating lead-free solder
Formed high density fold hole interconnection structure, overcome employing conducting filler serve as folded hole conducting medium, because of conducting filler oxidation,
Aging and cause the problem of printed circuit board functional reliability difference, meanwhile, hole wall only need to be plated thin copper layer by folded hole interconnection structure,
Copper-plating technique is simple, technological requirement is low, the shortest, reduce manufacturing cost.While ensureing printed circuit functional reliability
Reduce cost, and use formation via blocking layer, coating lead-free solder, striping, filling resin, removal after hot pressing dry film
Grind the operation of platen surface after lead-free solder and complete resin filling, it is to avoid filling resin solidification rear surface depression is excessive and causes plate face
Out-of-flatness；Vacuum taphole machine filling resin is used also to avoid resin to solidify interior void problem, to printed circuit hole interconnection technique
Densification provides feasibility.The present invention is applicable to flexible printed-circuit board, rigid printed circuit boards manufacture.
Accompanying drawing explanation
Fig. 1 is embodiment 1 schematic flow sheet step by step:
Fig. 1-a is that step 1 completes structural representation after boring, and wherein 101 is rigid double-face copper-clad base plate；
Fig. 1-b is that step 3 completes structural representation after hole metallization, and wherein 102 is copper plate；
Fig. 1-c is that step 4 forms structural representation after blocking layer, and wherein 103 is blocking layer；
Fig. 1-d is that step 5 completes to coat structural representation after lead-free solder, and wherein 104 is lead-free solder；
Fig. 1-e is that step 6 completes structural representation after striping；
Fig. 1-f is that step 7 clogs structural representation after resin, and wherein 105 is filling resin；
Fig. 1-g is that step 8 removes structural representation after lead-free solder；
Fig. 1-h is that step 8 completes structural representation after nog plate；
Fig. 1-i is that step 9 completes structural representation after copper electroplating layer；
Fig. 1-j is that step 11 completes lamination and increases structural representation after layer, 106 be wherein prepreg, 107 is outer layer pure copper foil；
Fig. 1-k is that step 12 forms structural representation behind folded hole；
Fig. 1-l is that hole schematic diagram is folded on rigid printed circuit 7 rank being finally completed.
Fig. 2 is that hole schematic diagram is folded on flexible printed circuit 5 rank that embodiment 2 is finally completed.
Detailed description of the invention
Implement 1
Step 1: be provided with on the rigid double-face copper-clad base plate of lower layers of copper, insulating medium layer and upper layers of copper employing in overlapping successively and swash
The method of light boring offers internal layer hole, and boring only drills through the dielectric of double-sided copper-clad substrate and upper layers of copper, forms opening and is in
It it is the internal layer hole of lower layers of copper at the bottom of layers of copper, hole；
Step 2: with plasma cleaner (CF4: O2Ratio be 4:1) remove that the brill in internal layer hole is dirty and burr；
Step 3: step 2 gained substrate is placed on chemical plating production line, through oil removing, decontamination, washing, electroless copper,
It is 1～3 μm conductive thin layers of copper that the operations such as washing plate thickness at upper layers of copper and internal layer hole wall, then is placed on electroplating assembly line, passes through
The operation thickening conductive thin layers of copper such as oil removing, decontamination, washing, electro-coppering, washing, to 10～20 μm, form copper plate 102, real
The conducting interconnection in existing internal layer hole, obtains via；
Step 4: make with laser direct imaging or photographic film imaging after the substrate heat of step 3 gained hole metallization is pressed dry film
Dry film generation photochemical reaction on face, hole, then there is not photochemical dry film through development removal, it is thus achieved that the resistance of blocking via
Plug layer 103；
Step 5: step 4 gained is blocked the copper-clad base plate coating lead-free solder 104 of via, and carries out hot air leveling process；
The lead-free solder of copper-clad base plate coating is nonwetting with resin, and when can prevent clogging resin, non-hole site adsorbent resin, also can increase and fill out
Fill in resin height and prevent owing to resin solidification, solvent volatilization cause resin shape indent；
Step 6: by the copper-clad base plate striping of step 5 gained coating lead-free solder, expose via；
Step 7: the copper-clad base plate that step 6 gained exposes via carries out clogging resin 105, and solidifies filling resin；Used
Resin be heat curing-type or light curable type resin, in hole clog resin process be that step 6 gained substrate is vertically fixed, use vacuum
The scraper filling resin of hole plugging machine is entered in via, vacuum filling resin can be prevented effectively from air access holes produce cavity and
Affect the compactness of resin filling；
Step 8: step 7 gained substrate is removed lead-free solder with high-temperature hot-air, exposes layers of copper and solidification resin, and uses
Nog plate technique mill platen surface；
Step 9: layers of copper on the substrate of step 8 gained is carried out electroplating surface copper with filling resin surface, makes filling resin surface
The copper plate that upper formation is connected with conducting orifice ring；
Step 10: in the layers of copper of two outer surfaces of step 9 gained substrate, forms required circuitous pattern through figure transfer,
I.e. circuitous pattern layer；
Step 11: two circuitous pattern layers of step 10 gained substrate are carried out lamination increasing layer, first to two circuit diagrams simultaneously
Shape layer carries out surface coarsening process, then by prepreg 106(binding agent) with hot press by outer layer pure copper foil 107 and base
Plate pressing, after pressing prepreg as new insulating medium layer, outer layer pure copper foil as new upper layers of copper；
Step 12: in each new upper layers of copper of step 11 gained substrate, with the internal layer hole correspondence position set by step 1
Being respectively adopted method for drilling holes and offer folded hole, folded hole is situated between with step 10 gained circuitous pattern layer, insulation that step 11 gained is new
Matter layer and upper layers of copper only drill through dielectric and upper layers of copper as new double-sided copper-clad substrate, boring, form opening and are in new upper
It it is the folded hole of circuitous pattern layer at the bottom of layers of copper, hole；
Step 13: the folded hole offered in each new upper layers of copper of step 12 gained substrate is carried out step 2, step 3 respectively；
Step 14: repeat step 4-13, is repeated 2 times formation 7 rank high density and folds hole interconnection structure, as shown in Fig. 1-l.
Embodiment 2
Step 1: be provided with on the flexibility double face copper-clad base plate of lower layers of copper, insulating medium layer and upper layers of copper with machinery in overlapping successively
Boring machine drills through copper-clad base plate, is formed as the internal layer hole of through hole；
Step 2: remove the brill dirt in internal layer hole and burr with potassium permanganate cleaning solution；
Step 3-10 is corresponding identical with step 3-10 in embodiment 1；
Step 11: two circuitous pattern layers of step 10 gained substrate are carried out lamination increasing layer, first to two circuit diagrams simultaneously
Shape layer carries out surface coarsening process, then by thermosetting glued membrane (binding agent) with hot press by outer layer pure copper foil and substrate pressing,
After pressing thermosetting glued membrane as new insulating medium layer, outer layer pure copper foil as new upper layers of copper；
Step 12: in each new upper layers of copper of step 11 gained substrate, with the internal layer hole correspondence position set by step 1
Being respectively adopted method for drilling holes and offer folded hole, folded hole is situated between with step 10 gained circuitous pattern layer, insulation that step 11 gained is new
Matter layer and upper layers of copper only drill through dielectric and upper layers of copper as new double-sided copper-clad substrate, boring, form opening and are in new upper
It it is the folded hole of circuitous pattern layer at the bottom of layers of copper, hole；
Step 13: the folded hole offered in each new upper layers of copper of step 12 gained substrate is carried out step 2, step 3 respectively；
Step 14: repeat step 4-13, is repeated 1 times formation 5 rank high density and folds hole interconnection structure, as shown in Figure 2.
In sum, the present invention provides a kind of printed circuit high density to fold hole interconnecting method, is ensureing printed circuit board high reliability
While work, reduce printed circuit manufacturing cost.
Claims (5)
1. a printed circuit high density folds hole interconnecting method, it is characterised in that comprise the following steps:
Step 1: be provided with on the double-sided copper-clad substrate of lower layers of copper, insulating medium layer and upper layers of copper employing laser drilling in overlapping successively
The method in hole offers internal layer hole, and it is lower layers of copper that the opening in internal layer hole is at the bottom of layers of copper, hole；
Step 2: processed the inside cleaning internal layer hole by desmearing；
Step 3: step 2 gained substrate is carried out hole metallization, first carries out chemical plating to upper layers of copper and internal layer hole wall and forms conduction
Thin copper layer, re-plating thickeies conductive thin layers of copper, it is achieved the conducting interconnection in internal layer hole, forms via；
Step 4: after step 3 gained substrate heat is pressed dry film, uses laser direct imaging or photographic film imaging to make via
Dry film generation photochemical reaction on opening surface, then there is not photochemical dry film through development removal, it is thus achieved that blocking via
Blocking layer；
Step 5: step 4 gained substrate surface is coated lead-free solder, and carries out hot air leveling process；
Step 6: to step 5 gained substrate striping, expose via；
Step 7: use vacuum taphole machine to through step 6 gained substrate filling resin in via, and solidify filling resin；
Step 8: use high-temperature hot-air to remove lead-free solder to through step 7 gained substrate, exposes layers of copper and filling resin, and
Use nog plate technique mill platen surface；
Step 9: the layers of copper of step 8 gained substrate is carried out electroplating surface copper with filling resin surface, makes filling resin surface shape
Become the copper plate being connected with conducting orifice ring；
Step 10: in the layers of copper of two outer surfaces of step 9 gained substrate, forms required circuitous pattern through figure transfer,
I.e. circuitous pattern layer；
Step 11: two circuitous pattern layers of step 10 gained substrate are carried out lamination increasing layer, first to two circuit diagrams simultaneously
Shape layer carries out surface coarsening process, then by binding agent hot press by outer layer pure copper foil and substrate pressing, binding agent after pressing
As new insulating medium layer, outer layer pure copper foil as new upper layers of copper；
Step 12: in each new upper layers of copper of step 11 gained substrate, with the internal layer hole correspondence position set by step 1
It is respectively adopted method for drilling holes and offers folded hole；
Step 13: the folded hole offered through step 12 gained substrate is carried out step 2, step 3 respectively；
Step 14: repeat step 4-13, until the high density needed for being formed folds hole interconnection structure.
2. fold hole interconnecting method according to a kind of printed circuit high density described in claim 1, it is characterised in that step 1 is offered
Internal layer hole also can use mechanical drilling method, then the internal layer hole offered is through hole.
3. a kind of printed circuit high density as described in claim 1 or 2 folds hole interconnecting method, it is characterised in that described is two-sided
Copper-clad base plate is rigid double-face copper-clad base plate or flexibility double face copper-clad base plate.
4. a kind of printed circuit high density as described in claim 1 or 2 folds hole interconnecting method, it is characterised in that described step 7
Middle filling resin is heat curing-type or light curable type resin.
5. a kind of printed circuit high density as described in claim 1 or 2 folds hole interconnecting method, it is characterised in that described step 11
Middle adhesive therefor is prepreg or hot-setting adhesive.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310369365.7A CN103442529B (en) | 2013-08-22 | 2013-08-22 | A kind of printed circuit high density folds hole interconnecting method |
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| CN201310369365.7A CN103442529B (en) | 2013-08-22 | 2013-08-22 | A kind of printed circuit high density folds hole interconnecting method |
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| CN103442529A CN103442529A (en) | 2013-12-11 |
| CN103442529B true CN103442529B (en) | 2016-08-10 |
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| CN201310369365.7A Expired - Fee Related CN103442529B (en) | 2013-08-22 | 2013-08-22 | A kind of printed circuit high density folds hole interconnecting method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104270888B (en) * | 2014-09-28 | 2017-10-17 | 广州兴森快捷电路科技有限公司 | Disk product and preparation method thereof in high-density packages substrate aperture |
| CN106961787A (en) * | 2017-04-17 | 2017-07-18 | 四川深北电路科技有限公司 | A kind of preparation technology of the thick copper foil circuit plate of high heat conduction |
| CN109788663B (en) * | 2017-11-10 | 2021-08-24 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board manufactured by same |
| CN109287063A (en) * | 2018-11-24 | 2019-01-29 | 开平依利安达电子第三有限公司 | A kind of double-sided multi-layer pcb board and its technique |
| CN112312649A (en) * | 2019-08-01 | 2021-02-02 | 中兴通讯股份有限公司 | Hole stacking structure, heat dissipation structure and manufacturing method of printed circuit board |
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| CN1302693C (en) * | 2002-12-12 | 2007-02-28 | 三星电机株式会社 | Combined printed circuit board with superposed through holes and producing method thereof |
| CN101453838A (en) * | 2007-11-29 | 2009-06-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN102762041A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for post-processing blind hole of circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087656A (en) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | Method for manufacturing printed wiring board |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302693C (en) * | 2002-12-12 | 2007-02-28 | 三星电机株式会社 | Combined printed circuit board with superposed through holes and producing method thereof |
| CN101453838A (en) * | 2007-11-29 | 2009-06-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN102762041A (en) * | 2012-07-12 | 2012-10-31 | 深圳崇达多层线路板有限公司 | Method for post-processing blind hole of circuit board |
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