CN103441318A - Balun based on ultra-wideband gradual change from microstrip lines to coplanar striplines - Google Patents
Balun based on ultra-wideband gradual change from microstrip lines to coplanar striplines Download PDFInfo
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- CN103441318A CN103441318A CN2013103324050A CN201310332405A CN103441318A CN 103441318 A CN103441318 A CN 103441318A CN 2013103324050 A CN2013103324050 A CN 2013103324050A CN 201310332405 A CN201310332405 A CN 201310332405A CN 103441318 A CN103441318 A CN 103441318A
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Abstract
The invention discloses a balun based on ultra-wideband gradual change from microstrip lines to coplanar striplines. The balun comprises a microstrip line structure, a coplanar structure, a coplanar stripline structure, five metallized through holes and input output ports, wherein the microstrip line structure, the coplanar structure and the coplanar stripline structure are formed by lower-surface metal gradient earth plates, medium substrates and six upper-surface metal sheets. The conversion from the microstrip line structure to the coplanar stripline structure (CPS) structure is achieved through the gradual change of the lower-surface earth plates and earthing signals of the metallized through holes and the upper-surface metal sheets are in the same plane, and 180-degree phase difference is achieved, the conversion of the signals from unbalance to balance is finished, and phase stability and amplitude balance are good. The balun has the advantages of being compact in structure, small in size, low in consumption and the like. In addition, the balun is easily integrated with microwave circuits. The coplanar striplines are widely applied in filters, frequency mixers and phase shifters.
Description
Technical field
The present invention relates to a kind of ultra broadband Ba Lun, the particularly a kind of microstrip line super-broadband graded ground Ba Lun to coplanar stripline.
Background technology
In the modern microwave circuit design, conversion that usually need to be from non-equilibrium to balanced transmission line.In Antenna Design, the impedance matching between the balanced feeding of feed and antenna and feeder line also necessarily requires, as slot antenna, and Vivaldi antenna, the design of Archimedes's antenna etc.Ideal situation is that a size of design is little, the balanced impedance converter of high impedance no-load voltage ratio.Along with the development of current mechanics of communication, the continuous expansion of traffic capacity, require antenna to work in wider frequency band.Yet, because the theory analysis of irregularly shaped Ba Lun is still very difficult, the design and use of this class Ba Lun can only be leaned on experience and experiment.
Summary of the invention
The object of the present invention is to provide there is compact conformation, volume is little, low-loss, be easy to microwave circuit integrated based on microstrip line to the super-broadband graded ground Ba Lun of coplanar stripline.
The technical scheme that realizes the object of the invention is: a kind of super-broadband graded ground Ba Lun that arrives coplanar stripline based on microstrip line, comprise medium substrate, the lower surface metal ground plate, the first plated-through hole, the second plated-through hole, the 3rd plated-through hole, the 4th plated-through hole, the 5th plated-through hole and input port, output the first port in upper surface the first sheet metal, the second sheet metal, the 3rd sheet metal, the 4th sheet metal, the 5th sheet metal, the 6th sheet metal and dielectric substrate, export the second port; Wherein, dielectric substrate lower surface metal ground plate is spliced by three parts, the metal ground plate that first is the corresponding lower surface position of upper surface the first sheet metal place crossfades into the width same with the 3rd sheet metal from rectangle along half ridged, the corresponding lower surface of the first sheet metal fades to without metal floor, and the 3rd sheet metal, the 4th sheet metal lower surface corresponding position are without grounding plate; Second portion is that upper surface the 5th sheet metal, the 6th sheet metal have respectively symmetrical gradual change ridged metal ground plate corresponding to lower surface position; Third part, for connecting the metal floor of second portion and first, connects respectively front two parts along the lower surface dielectric boundaries, realizes altogether; The first plated-through hole, the second plated-through hole, the 3rd plated-through hole, the 4th plated-through hole, the 5th plated-through hole all are connected with the upper and lower medium surface; The second sheet metal is affixed on the first plated-through hole, the second plated-through hole, the 3rd plated-through hole, the 4th plated-through hole, the 5th plated-through hole, and ground corresponding under the first sheet metal is guided to and its same layer, realizes coplanar ground; The tap that input port is drawn by the first sheet metal, exporting the first port is the tap of being drawn by the 3rd sheet metal, exporting the second port is the tap of being drawn by the 4th sheet metal; The second sheet metal is connected with the 3rd sheet metal, and the 3rd sheet metal is connected with the 5th sheet metal, finally outputs to the first port; Input upper surface the first sheet metal is connected with the 4th sheet metal, and the 4th sheet metal is connected with the 6th sheet metal, finally outputs to the second port.
Compared with prior art, its remarkable advantage is in the present invention: (1) bandwidth is greatly improved; (2) production cost is low, only adopts inner a small amount of through hole and sheet metal to form, and can greatly reduce process costs like this; (3) volume is little, compact conformation; (4) simple in structure, on technique, be easy to realize, planar structure, be easy to microwave circuit integrated.(5) loss is less.
The accompanying drawing explanation
Fig. 1 is the structure chart of microstrip line of the present invention to the super-broadband graded ground barron device of coplanar stripline.
Fig. 2 is the vertical view of microstrip line of the present invention to the super-broadband graded ground barron device of coplanar stripline.
Fig. 3 is the back to back test structure chart of microstrip line of the present invention to the super-broadband graded ground barron device of coplanar stripline.
Fig. 4 is first output port and the phase difference simulation result figure of second output port signal and the amplitude difference simulation result figure of first output port and second output port signal of microstrip line of the present invention to the super-broadband graded ground barron device of coplanar stripline.
Fig. 5 is microstrip line of the present invention to the return loss simulation result figure under the super-broadband graded ground barron device back-to-back topology of coplanar stripline.
Fig. 6 is microstrip line of the present invention to the insertion loss simulation result figure under the super-broadband graded ground barron device back-to-back topology of coplanar stripline.
embodiment:
Below in conjunction with accompanying drawing, the present invention is described in further detail.
In conjunction with Fig. 1, Fig. 2, microstrip line of the present invention is to the super-broadband graded ground barron device of coplanar stripline, comprise medium substrate, the lower surface metal ground plate, upper surface the first sheet metal (S1), the second sheet metal (S2), the 3rd sheet metal (S3), the 4th sheet metal (S4), the 5th sheet metal (S5), the first plated-through hole (V1) in the 6th sheet metal (S6) and dielectric substrate, the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) and input port (P1), export the first port (P2), export the second port (P3).Wherein, dielectric substrate lower surface metal ground plate is spliced by three parts, the metal ground plate that first is the corresponding lower surface position of upper surface the first sheet metal (S1) place crossfades into the width same with the 3rd sheet metal (S3) from rectangle along half ridged, the corresponding lower surface of the first sheet metal (S1) fades to without metal floor, and the 3rd sheet metal (S3), the 4th sheet metal (S4) lower surface corresponding position are without grounding plate; Second portion is that upper surface the 5th sheet metal (S5), the 6th sheet metal (S6) have respectively symmetrical gradual change ridged metal ground plate corresponding to lower surface position.Third part, for connecting the metal floor of second portion and first, connects respectively front two parts along the lower surface dielectric boundaries, realizes altogether.The first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) all are connected with the upper and lower medium surface.The second sheet metal (S2) is affixed on the first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5), the lower corresponding ground of the first sheet metal (S1) is guided to and its same layer, realized coplanar ground.The tap that input port (P1) is drawn by the first sheet metal (S1), exporting the first port (P2) is the tap of being drawn by the 3rd sheet metal (S5), exporting the second port (P3) is the tap of being drawn by the 4th sheet metal (S6).The second sheet metal (S2) is connected with the 3rd sheet metal (S3), and the 3rd sheet metal (S3) is connected with the 5th sheet metal (S5), finally outputs to the first port (P2).Input upper surface the first sheet metal (S1) is connected with the 4th sheet metal (S4), and the 4th sheet metal (S4) is connected with the 6th sheet metal (S6), finally outputs to the second port (P3).
In conjunction with Fig. 1, Fig. 2, microstrip line of the present invention is in the super-broadband graded ground barron device of coplanar stripline, and upper surface the first sheet metal (S1), the 5th sheet metal (S5), the 6th sheet metal (S6) are microstrip line construction, corresponding lower surface metal ground plate.The 3rd sheet metal (S3), the 4th sheet metal (S4) are the coplanar stripline structure, and corresponding lower surface is without metal floor.Wherein upper surface the first sheet metal (S1) and its corresponding lower surface metal ground form microstrip line construction, the floor of the corresponding lower surface of the first sheet metal (S1) crossfades into the width same with the 3rd sheet metal (S3) by rectangle along half ridged, for realizing that the signal transmission is converted to the even transition of coplanar stripline from microstrip line construction, guarantee electric field transformation to parallel medium by perpendicular media, realize that signal never equilibrates to the conversion gradually of balance, facilitate print production simultaneously, reduce costs, take the structure on coplanar ground, the earth signal of metal floor is passed through to the first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) is guided to dielectric surface, reduce reflection simultaneously.The gradual change by floor from microstrip line construction again, from having to nothing, be converted into the coplanar stripline structure of the 3rd sheet metal (S3), the 4th sheet metal (S4) formation, corresponding lower surface is without metal floor, and the signal phase in the 3rd sheet metal (S3), the 4th sheet metal (S4) differs 180 °.
For convenience of being connected with follow-up system, be converted into again microstrip line construction, the 5th sheet metal (S5), the 6th sheet metal (S6) and gradual change ridged metal floor corresponding to difference thereof, realize the even transition of coplanar stripline to microstrip line.
Microstrip line of the present invention is summarized as follows to the operation principle of the super-broadband graded ground barron device of coplanar stripline:
The broadband microwave signal enters microstrip line from input port (P1), realize coplanar ground by gradual change metal floor and through hole, be converted to the coplanar stripline transmission by the microstrip line transmission, realize that the two paths of signals phase difference is 180 degree, be converted to again microstrip line construction and conveniently be connected with follow-up system, totally realized that signal never equilibrates to the conversion of balance.
Microstrip line of the present invention is of a size of 10.16mm * 25.4mm * 0.508mm to the super-broadband graded ground barron device of coplanar stripline.Its performance can as can be seen from Figure 4 realize the ultra wideband from 12.8GHz to 47.2GHz, and bandwidth is 34.4GHz, and phase balance is for being less than 11.6 °, and amplitude balance is for being less than 2.07dB.By Fig. 5, can be obtained, under back-to-back topology, the return loss plot performance is fairly good, and the Insertion Loss performance is also good.
Claims (3)
1. one kind is arrived super-broadband graded ground of coplanar stripline Ba Lun based on microstrip line
deviceit is characterized in that: comprise medium substrate, the lower surface metal ground plate, the first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) and input port (P1) in upper surface the first sheet metal (S1), the second sheet metal (S2), the 3rd sheet metal (S3), the 4th sheet metal (S4), the 5th sheet metal (S5), the 6th sheet metal (S6) and dielectric substrate, export the first port (P2), export the second port (P3); Wherein, dielectric substrate lower surface metal ground plate is spliced by three parts, the metal ground plate that first is the corresponding lower surface position of upper surface the first sheet metal (S1) place crossfades into the width same with the 3rd sheet metal (S3) from rectangle along half ridged, the corresponding lower surface of the first sheet metal (S1) fades to without metal floor, and the 3rd sheet metal (S3), the 4th sheet metal (S4) lower surface corresponding position are without grounding plate; Second portion is that upper surface the 5th sheet metal (S5), the 6th sheet metal (S6) have respectively symmetrical gradual change ridged metal ground plate corresponding to lower surface position; Third part, for connecting the metal floor of second portion and first, connects respectively front two parts along the lower surface dielectric boundaries, realizes altogether; The first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) all are connected with the upper and lower medium surface; The second sheet metal (S2) is affixed on the first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5), the lower corresponding ground of the first sheet metal (S1) is guided to and its same layer, realized coplanar ground; The tap that input port (P1) is drawn by the first sheet metal (S1), exporting the first port (P2) is the tap of being drawn by the 3rd sheet metal (S5), exporting the second port (P3) is the tap of being drawn by the 4th sheet metal (S6); The second sheet metal (S2) is connected with the 3rd sheet metal (S3), and the 3rd sheet metal (S3) is connected with the 5th sheet metal (S5), finally outputs to the first port (P2); Input upper surface the first sheet metal (S1) is connected with the 4th sheet metal (S4), and the 4th sheet metal (S4) is connected with the 6th sheet metal (S6), finally outputs to the second port (P3).
According to claim 1 based on microstrip line to super-broadband graded ground of coplanar stripline Ba Lun
device, it is characterized in that: upper surface the first sheet metal (S1), the 5th sheet metal (S5), the 6th sheet metal (S6) are microstrip line construction, corresponding lower surface metal ground plate; The 3rd sheet metal (S3), the 4th sheet metal (S4) are the coplanar stripline structure, and corresponding lower surface is without metal floor; Wherein the floor of the corresponding lower surface of the first sheet metal (S1) crossfades into the width same with the 3rd sheet metal (S3) along half ridged, for realizing that the signal transmission is converted to the even transition of coplanar stripline from microstrip line construction, guarantee electric field transformation to parallel medium by perpendicular media, realize that signal never equilibrates to the conversion gradually of balance; The first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) connect upper and lower surface simultaneously, guide to the earth signal of lower surface with the upper surface sheet metal coplanar, in order to guarantee the even transition of electromagnetic field from the microstrip line to the coplanar stripline, reduce reflection.
According to claim 1 and 2 based on microstrip line to super-broadband graded ground of coplanar stripline Ba Lun
device, it is characterized in that: upper surface the first sheet metal (S1) and its corresponding lower surface metal ground form microstrip line construction, for convenience of print production, reduce costs, take the structure on coplanar ground, the earth signal of metal floor is passed through to the first plated-through hole (V1), the second plated-through hole (V2), the 3rd plated-through hole (V3), the 4th plated-through hole (V4), the 5th plated-through hole (V5) is guided to dielectric surface, the gradual change by floor from microstrip line construction again, from having to nothing, be converted into the 3rd sheet metal (S3), the coplanar stripline structure that the 4th sheet metal (S4) forms, corresponding lower surface is without metal floor, the 3rd sheet metal (S3), signal phase in the 4th sheet metal (S4) differs 180 °, for convenience of being connected with follow-up system, be converted into again microstrip line construction, the 5th sheet metal (S5), the 6th sheet metal (S6) and gradual change ridged metal floor corresponding to difference thereof, realize the even transition of coplanar stripline to microstrip line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310332405.0A CN103441318B (en) | 2013-08-01 | 2013-08-01 | Based on microstrip line to coplanar stripline super-broadband graded ground barron device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310332405.0A CN103441318B (en) | 2013-08-01 | 2013-08-01 | Based on microstrip line to coplanar stripline super-broadband graded ground barron device |
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| Publication Number | Publication Date |
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| CN103441318A true CN103441318A (en) | 2013-12-11 |
| CN103441318B CN103441318B (en) | 2016-09-21 |
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| CN201310332405.0A Expired - Fee Related CN103441318B (en) | 2013-08-01 | 2013-08-01 | Based on microstrip line to coplanar stripline super-broadband graded ground barron device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106469843A (en) * | 2015-08-20 | 2017-03-01 | 南京理工大学 | A kind of ultra wide band balun based on transition structure |
| CN110380168A (en) * | 2019-06-18 | 2019-10-25 | 南京理工大学 | Non-equilibrium double broadband function filter-dividers to balance |
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| AU6062180A (en) * | 1979-07-20 | 1981-02-05 | Siemens Aktiengesellschaft | Balance converter |
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2013
- 2013-08-01 CN CN201310332405.0A patent/CN103441318B/en not_active Expired - Fee Related
Patent Citations (7)
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| AU6062180A (en) * | 1979-07-20 | 1981-02-05 | Siemens Aktiengesellschaft | Balance converter |
| US6100853A (en) * | 1997-09-10 | 2000-08-08 | Hughes Electronics Corporation | Receiver/transmitter system including a planar waveguide-to-stripline adapter |
| CN1599126A (en) * | 2004-07-30 | 2005-03-23 | 东南大学 | Microstrip balance-unbalance inverter |
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Non-Patent Citations (1)
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| YONGSHENG DAI: "A LTCC Miniaturized Broadband Modified Marchand Balun", 《2012 INTERNATIONAL SYMPOSIUM ON COMMUNICATIONS AND INFORMATION TECHNOLOGIES (ISCIT)》, 31 December 2012 (2012-12-31) * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106469843A (en) * | 2015-08-20 | 2017-03-01 | 南京理工大学 | A kind of ultra wide band balun based on transition structure |
| CN110380168A (en) * | 2019-06-18 | 2019-10-25 | 南京理工大学 | Non-equilibrium double broadband function filter-dividers to balance |
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| Publication number | Publication date |
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| CN103441318B (en) | 2016-09-21 |
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