CN103440958B - The encapsulating structure of Wound-rotor type electronic device and chip inductor - Google Patents
The encapsulating structure of Wound-rotor type electronic device and chip inductor Download PDFInfo
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- CN103440958B CN103440958B CN201310351910.XA CN201310351910A CN103440958B CN 103440958 B CN103440958 B CN 103440958B CN 201310351910 A CN201310351910 A CN 201310351910A CN 103440958 B CN103440958 B CN 103440958B
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Abstract
A kind of encapsulating structure of Wound-rotor type electronic device, encapsulating structure relative to traditional Wound-rotor type electronic device, particularly with respect to traditional coiling chip inductor, the improvement is that the complete packed glue cladding of its coil, and the space between lead-out wires of coil and inducer core body is also filled with packaging plastic.Such structure, is extremely improved shortcomings such as tradition coiling chip impaired, the termination electrode solder joint damages of inductor coil enamel covered wire paint film.
Description
Technical field
The present invention relates to the encapsulating structure of electronic device, particularly relate to the encapsulating structure of a kind of Wound-rotor type electronic device.
Background technology
The Wound-rotor type electronic device of traditional structure, the particularly coiling chip inductor of traditional structure, in operation, enamel covered wire paint film is easily damaged, and lead-out wires of coil and the solder joint on termination electrode are easily damaged, some broken string that even can come off, causes fraction defective and relatively low reliability that product is higher.
Summary of the invention
Based on this, it is necessary to provide the encapsulating structure of a kind of Wound-rotor type electronic device that can protect enamel covered wire and termination electrode solder joint, raising product yield and reliability.
The encapsulating structure of a kind of Wound-rotor type electronic device, including coiling matrix, coil and packaging plastic, described coil is wrapped on described coiling matrix, and described packaging plastic is coated with whole described coil.
Wherein in an embodiment, described electronic device is coiling chip inductor, and described coiling matrix is inductance core.
Wherein in an embodiment, described inductance core includes the core body of concave character type and two termination electrodes, and said two termination electrode lays respectively at two protruding ends of described core body, and described coil includes being wound around the coil main body that the recess of described core body is formed.
Wherein in an embodiment, described coil also includes extending the lead-out wire drawn from coil main body two ends, and described lead-out wire electrically connects with said two termination electrode respectively, is filled with described packaging plastic between described lead-out wire and described core body.
Wherein in an embodiment, described packaging plastic is coated with described core body.
Wherein in an embodiment, described packaging plastic material is thermosetting resin or uv-hardening resin.
Wherein in an embodiment, described core body material is pottery or ferrite.
Wherein in an embodiment, described termination electrode is copper electrode or silver electrode.
It addition, also provide for the chip inductor of a kind of encapsulating structure including described Wound-rotor type electronic device.
The encapsulating structure of above-mentioned Wound-rotor type electronic device, packaging plastic is all coated with coil, it is to avoid coil directly contacts with extraneous, and enamel covered wire forms good protection.
Additionally; packaging plastic has also filled up the space between lead-out wire and core body, secures originally unsettled lead-out wire, makes lead-out wire will not occur big loosening under the effect of external force; so also would not cause loosening of termination electrode solder joint, protect the solder joint on lead-out wire and termination electrode well.The encapsulating structure of above-mentioned Wound-rotor type electronic device, protects the solder joint on enamel covered wire and termination electrode preferably, improves product yield and reliability.
Accompanying drawing explanation
Fig. 1 is the encapsulating structure side view of tradition coiling chip inductor；
Fig. 2 is the encapsulating structure side view of the coiling chip inductor of one embodiment of the invention；
Fig. 3 is the encapsulating structure upward view of the coiling chip inductor shown in Fig. 2.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the encapsulating structure side view of tradition coiling chip inductor; owing to coil sections is only coated with by packaging plastic 130; so exposed coil out is not effectively protected; and between lead-out wires of coil and inductance core, there is space 140 and space 150, lead-out wires of coil does not obtain the fixing protection of packaging plastic.
Fig. 2 is the encapsulating structure side view of the coiling chip inductor of one embodiment of the invention, and Fig. 3 is the encapsulating structure upward view of the coiling chip inductor shown in Fig. 2.
Referring to figs. 2 and 3, the encapsulating structure of the coiling chip inductor of the present embodiment includes inductance core 110, coil 120 and packaging plastic 130.Packaging plastic 130 material is uv-hardening resin (UVCurableResin), can also be thermosetting resin in other embodiments.
Inductance core 110 includes the core body 112 of concave character type and two termination electrodes, is termination electrode 114 and termination electrode 116 respectively.Core body 112 material is pottery, can also be ferrite in other embodiments.Termination electrode 114 and termination electrode 116 are copper electrode, can also be silver electrode in other embodiments.Two termination electrodes lay respectively at two protruding ends of core body 112, are protruding end 113 and protruding end 115 respectively, and termination electrode 114 is positioned on protruding end 113, and termination electrode 116 is positioned on protruding end 115.
Coil 120 is wrapped on core body 112.Coil 120 includes coil main body 122, lead-out wire 124 and lead-out wire 126, and packaging plastic 130 is coated with coil main body 122 and core body 112.Packaging plastic 130 is coated with coil main body 122 and core body 112, it is to avoid coil main body 122 directly contact with extraneous with core body 112, enamel covered wire is formed good fixing and protects.
Lead-out wire 124 is welded on termination electrode 114, and lead-out wire 126 is welded on termination electrode 116.Space 140 between lead-out wire 124, termination electrode 114 and protruding end 113 is filled with packaging plastic；Space 150 between lead-out wire 126, termination electrode 116 and protruding end 115 is filled with packaging plastic.Packaging plastic is filled with the space 140 between lead-out wire 124, termination electrode 114 and core body 112; secure originally unsettled lead-out wire 124; in like manner also secure originally unsettled lead-out wire 126; make lead-out wire 124 and lead-out wire 126 that big loosening will not occur under the effect of external force; so also would not cause loosening of solder joint on termination electrode 114 and termination electrode 116, protect the solder joint on lead-out wire and termination electrode well.
So, whole coil 120 just obtains cladding and the protection of packaging plastic.
In actual sealing process, the inductance core 110 being wound with coil 120 is placed in sealing container, when packaging plastic submergence coil main body 122 and core body 112, packaging plastic is under the surface tension effects of liquid, along lead-out wire 124 and the automatic packing space 140 of lead-out wire 126 and space 150, largely can reduce the workload of this operation of space even ignored between hand-stuff lead-out wire, termination electrode and core body.Certainly, in order to product is relatively reliable, it is possible to increase this hand-stuff work on demand, lead-out wire is made better to be fixed and protect.
The encapsulating structure of above-mentioned Wound-rotor type electronic device, packaging plastic is all coated with coil main body, it is to avoid coil directly contacts with extraneous, and enamel covered wire forms good protection.Packaging plastic has also filled up the space between lead-out wire, termination electrode and core body; secure originally unsettled lead-out wire; make lead-out wire that big loosening will not occur under the effect of external force, so also would not cause loosening of termination electrode solder joint, protect the solder joint on lead-out wire and termination electrode well.The encapsulating structure of above-mentioned Wound-rotor type electronic device, protects the solder joint on enamel covered wire and termination electrode preferably, improves product yield and reliability.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (5)
1. an encapsulating structure for Wound-rotor type electronic device, including coiling matrix, coil and packaging plastic, described coil is wrapped on described coiling matrix, it is characterised in that
Described electronic device is coiling chip inductor, and described coiling matrix is inductance core；
Described inductance core includes the core body of concave character type and two termination electrodes, and said two termination electrode lays respectively at two protruding ends of described core body, and described coil includes being wound around the coil main body that the recess of described core body is formed, and described packaging plastic is coated with described coil main body；Described packaging plastic is also coated with described core body；Described coil also includes extending the lead-out wire drawn from coil main body two ends, and described lead-out wire electrically connects with said two termination electrode respectively, is filled with described packaging plastic between described lead-out wire and described core body.
2. the encapsulating structure of Wound-rotor type electronic device according to claim 1, it is characterised in that described core body material is pottery or ferrite.
3. the encapsulating structure of Wound-rotor type electronic device according to claim 1, it is characterised in that described termination electrode is copper electrode or silver electrode.
4. the encapsulating structure of Wound-rotor type electronic device according to claim 1, it is characterised in that described packaging plastic material is thermosetting resin or uv-hardening resin.
5. a chip inductor, including the encapsulating structure of the Wound-rotor type electronic device as described in any one of Claims 1 to 4.
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| CN201310351910.XA CN103440958B (en) | 2013-08-13 | 2013-08-13 | The encapsulating structure of Wound-rotor type electronic device and chip inductor |
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| CN201310351910.XA CN103440958B (en) | 2013-08-13 | 2013-08-13 | The encapsulating structure of Wound-rotor type electronic device and chip inductor |
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| CN103440958B true CN103440958B (en) | 2016-07-06 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6766697B2 (en) * | 2017-03-07 | 2020-10-14 | 株式会社村田製作所 | Coil parts |
| KR102653200B1 (en) * | 2018-10-29 | 2024-04-01 | 삼성전기주식회사 | Inductor |
| CN111446062A (en) * | 2020-04-08 | 2020-07-24 | 王国义 | Winding type rectangular chip inductor |
| CN113012910B (en) * | 2021-03-16 | 2022-06-03 | 墨尚电子科技(江苏)有限公司 | Patch magnetic element and manufacturing method thereof |
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| JP2002324714A (en) * | 2001-02-21 | 2002-11-08 | Tdk Corp | Coil sealed dust core and its manufacturing method |
| CN101615481A (en) * | 2009-05-15 | 2009-12-30 | 梁耀国 | The manufacture method of miniature high-quality wound chip inductor |
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| CN102867614A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Wafer inductor with preformed shell and manufacturing method of wafer inductor |
| CN203552846U (en) * | 2013-08-13 | 2014-04-16 | 深圳振华富电子有限公司 | Packaging structure of winding type electronic device and chip inductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101441923A (en) * | 2007-11-21 | 2009-05-27 | 达考越有限公司 | Power inductor and assembling method thereof |
| CN201655472U (en) * | 2009-10-27 | 2010-11-24 | 深圳顺络电子股份有限公司 | Winding inductance coil part |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002324714A (en) * | 2001-02-21 | 2002-11-08 | Tdk Corp | Coil sealed dust core and its manufacturing method |
| CN101615481A (en) * | 2009-05-15 | 2009-12-30 | 梁耀国 | The manufacture method of miniature high-quality wound chip inductor |
| CN102867614A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Wafer inductor with preformed shell and manufacturing method of wafer inductor |
| CN102856037A (en) * | 2012-09-17 | 2013-01-02 | 深圳顺络电子股份有限公司 | Power inductance element formed by molding and manufacturing method thereof |
| CN203552846U (en) * | 2013-08-13 | 2014-04-16 | 深圳振华富电子有限公司 | Packaging structure of winding type electronic device and chip inductor |
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