CN103434031A - Method for cutting silicon ingot - Google Patents
Method for cutting silicon ingot Download PDFInfo
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- CN103434031A CN103434031A CN2013103054297A CN201310305429A CN103434031A CN 103434031 A CN103434031 A CN 103434031A CN 2013103054297 A CN2013103054297 A CN 2013103054297A CN 201310305429 A CN201310305429 A CN 201310305429A CN 103434031 A CN103434031 A CN 103434031A
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Abstract
The invention relates to a method for cutting a silicon ingot, which belongs to the technical field of processing solar photovoltaic silicon ingots. The method for cutting the silicon ingot has the technical scheme that (1) the silicon ingot is put into a tray, and a positioning block of a positioning fixture is adjusted, so that the distance between the positioning block and the edge of the tray is consistent; (2) a positioning line is marked on the silicon ingot by using the edge of the positioning fixture on the silicon ingot as a benchmark; (3) when the silicon ingot is put on a machine and aligned to be cut, the position of a wire mesh of a cutter coincides with the positioning line. According to the method for cutting the silicon ingot, when the silicon ingot is squared to be cut, the position of the wire mesh of the cutter coincides with the positioning line, so that an ingot body can be equally divided, and all crucible surface ingots can be kept away from the edge of the silicon ingot, thereby integrally prolonging the service life of a minority carrier of the squared silicon ingot, increasing the effective stick length of the silicon ingot and stabilizing the primary utilization rate of silicon and the quality of recycled materials.
Description
Technical field
The invention belongs to photovoltaic silicon ingot processing technique field, relate in particular to a kind of method of silicon ingot cutting.
Background technology
In the silicon materials process, the silicon ingot evolution is one critical process before the silicon materials cutting processing, and the silicon ingot evolution often adopts scroll saw or band saw, the cutting of monoblock silicon ingot is divided into to the cuboid of certain specification.
In photovoltaic silicon ingot evolution field, the overwhelming majority uses the scroll saw evolution, and its incision principle is that the ingot body position is fixed, and uses gauze to carry out the press-down type cutting.Under the trend of current constantly pursuit silicon chip conversion efficiency, improve the evolution quality, directly have influence on utilization rate of silicon material, silicon material recovery effective rate of utilization and silicon chip conversion efficiency.At present, under the pattern that adopts mortar line evolution, described silicon ingot cutting position is offset, the ingot of deflection crucible face one side, and its few sub-bulk life time value descends, and directly causes the effective length of silicon ingot to descend, thereby makes a utilization rate of silicon material reduce.The silicon chip that described silicon ingot processing goes out, its transformation efficiency reduces.The flaw-piece reclaimed materials that described silicon ingot cutting produces will have influence on the stability of throwing stove ingot conversion efficiency.
Summary of the invention
For above-mentioned technical problem, the invention provides a kind of method of silicon ingot cutting.
For solving the problems of the technologies described above, the technical scheme that the method for silicon ingot cutting of the present invention adopts is:
(1) silicon ingot is put into to pallet, regulate the locating piece of positioning fixture, make locating piece consistent to the distance of tray edge;
(2) take the edge of positioning fixture on silicon ingot is benchmark, delimits bit line on silicon ingot;
(3), when on silicon ingot, the machine cutting is carried out line, cutting machine gauze position and position line are coincide.
The method of silicon ingot cutting of the present invention, when the silicon ingot evolution cuts, cutting machine gauze position and position line are coincide, can divide equally the ingot body, make all crucible face ingots away from the silicon ingot edge, thereby improve on the whole the minority carrier life time of evolution silicon ingot, the effective rod that improves silicon ingot is long, a utilization rate of stable silicon material, stablize the quality of reclaimed materials.
The accompanying drawing explanation
The method that accompanying drawing is silicon ingot of the present invention cutting is fixed on silicon ingot after pallet the schematic diagram of delimiting bit line.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is made and further illustrating.
As shown in the figure, sticky ingot pallet 1 surrounding is equipped with positioning fixture 2, and positioning fixture 2 upsides are used traveling nut 3, can 360 ° of rotations.Silicon ingot 4 is put on pallet 1, rotated traveling nut 3, regulate the adjusting locating piece 5 of positioning fixture 2, make locating piece 5 consistent to the distance of tray edge; Take the edge 6 of positioning fixture 2 on silicon ingot is benchmark, delimits bit line 7 on silicon ingot 4; Silicon ingot be adhesively fixed the time more than 4 hours after, when on silicon ingot, machine cutting is carried out line, cutting machine gauze position and position line 7 are coincide, can guarantee that silicon ingot cuts centering.
The method of silicon ingot cutting of the present invention, by sticky ingot pallet surrounding, fixing tool being installed, used positioning tool to regulate the position of silicon ingot, centering while guaranteeing the silicon ingot cutting.Use centering method, can divide equally the ingot body, make all crucible face ingots rationalize away from the silicon ingot edge, thereby improve on the whole the minority carrier life time of evolution silicon ingot, the effective rod that improves silicon ingot is long, a utilization rate of stable silicon material is stablized the quality of reclaimed materials.
The description of above embodiment is comparatively concrete, detailed; but can not therefore be interpreted as the restriction to this patent scope; it should be noted that; for the person of ordinary skill of the art; without departing from the inventive concept of the premise; can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (1)
1. the method for silicon ingot cutting is characterized in that comprising the following steps:
(1) silicon ingot is put into to pallet, regulate the locating piece of positioning fixture, make locating piece consistent to the distance of tray edge;
(2) take the edge of positioning fixture on silicon ingot is benchmark, delimits bit line on silicon ingot;
(3), when on silicon ingot, the machine cutting is carried out line, cutting machine gauze position and position line are coincide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103054297A CN103434031A (en) | 2013-07-19 | 2013-07-19 | Method for cutting silicon ingot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103054297A CN103434031A (en) | 2013-07-19 | 2013-07-19 | Method for cutting silicon ingot |
Publications (1)
| Publication Number | Publication Date |
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| CN103434031A true CN103434031A (en) | 2013-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013103054297A Pending CN103434031A (en) | 2013-07-19 | 2013-07-19 | Method for cutting silicon ingot |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802224A (en) * | 2014-03-11 | 2014-05-21 | 天津英利新能源有限公司 | Squaring method for silicon ingot |
| CN105444637A (en) * | 2015-12-04 | 2016-03-30 | 海润光伏科技股份有限公司 | Apparatus for measuring edge skins of polycrystalline ingot before squaring |
| CN105444638A (en) * | 2015-12-04 | 2016-03-30 | 海润光伏科技股份有限公司 | Method for measuring edge skins of polycrystalline ingot before squaring |
| CN107538631A (en) * | 2017-11-03 | 2018-01-05 | 江阴东升新能源股份有限公司 | Small-sized side's silicon core hi-precision cutting technique |
| CN107555437A (en) * | 2017-10-11 | 2018-01-09 | 江阴东升新能源股份有限公司 | The high polycrystalline silicon rod of cutting accuracy |
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| CN101913210A (en) * | 2010-08-19 | 2010-12-15 | 英利能源（中国）有限公司 | Polycrystalline silicon ingot ripping method |
| JP2011000665A (en) * | 2009-06-17 | 2011-01-06 | Mitsubishi Plastics Inc | Main roller for wire saw, roller body, and manufacturing method |
| CN101973081A (en) * | 2010-07-28 | 2011-02-16 | 常州天合光能有限公司 | Method for cutting head other than tail of 8-inch polycrystalline block by MB wire saw |
| CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
| CN202053393U (en) * | 2011-03-16 | 2011-11-30 | 常州市万阳光伏有限公司 | Wafer holder for cutting polycrystalline silicon ingot |
| CN102626961A (en) * | 2012-04-25 | 2012-08-08 | 江苏兆晶光电科技发展有限公司 | Locating crystal support for cutting polycrystalline silicon ingot |
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2013
- 2013-07-19 CN CN2013103054297A patent/CN103434031A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011000665A (en) * | 2009-06-17 | 2011-01-06 | Mitsubishi Plastics Inc | Main roller for wire saw, roller body, and manufacturing method |
| CN101973081A (en) * | 2010-07-28 | 2011-02-16 | 常州天合光能有限公司 | Method for cutting head other than tail of 8-inch polycrystalline block by MB wire saw |
| CN101913210A (en) * | 2010-08-19 | 2010-12-15 | 英利能源（中国）有限公司 | Polycrystalline silicon ingot ripping method |
| CN102079113A (en) * | 2010-11-25 | 2011-06-01 | 保定天威英利新能源有限公司 | Equipment and method for solving squaring quality problem of silicon ingot |
| CN202053393U (en) * | 2011-03-16 | 2011-11-30 | 常州市万阳光伏有限公司 | Wafer holder for cutting polycrystalline silicon ingot |
| CN102626961A (en) * | 2012-04-25 | 2012-08-08 | 江苏兆晶光电科技发展有限公司 | Locating crystal support for cutting polycrystalline silicon ingot |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802224A (en) * | 2014-03-11 | 2014-05-21 | 天津英利新能源有限公司 | Squaring method for silicon ingot |
| CN105444637A (en) * | 2015-12-04 | 2016-03-30 | 海润光伏科技股份有限公司 | Apparatus for measuring edge skins of polycrystalline ingot before squaring |
| CN105444638A (en) * | 2015-12-04 | 2016-03-30 | 海润光伏科技股份有限公司 | Method for measuring edge skins of polycrystalline ingot before squaring |
| CN107555437A (en) * | 2017-10-11 | 2018-01-09 | 江阴东升新能源股份有限公司 | The high polycrystalline silicon rod of cutting accuracy |
| CN107538631A (en) * | 2017-11-03 | 2018-01-05 | 江阴东升新能源股份有限公司 | Small-sized side's silicon core hi-precision cutting technique |
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Application publication date: 20131211 |