CN103425340B - One-layer multi-point touch control screen and its one-layer multi-point conducting film - Google Patents
One-layer multi-point touch control screen and its one-layer multi-point conducting film Download PDFInfo
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- CN103425340B CN103425340B CN201310325505.0A CN201310325505A CN103425340B CN 103425340 B CN103425340 B CN 103425340B CN 201310325505 A CN201310325505 A CN 201310325505A CN 103425340 B CN103425340 B CN 103425340B
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Abstract
A kind of one-layer multi-point conducting film, including transparent substrates, decoration conductive layer, the first conductive layer, insulating barrier, the second conductive layer, the first lead electrode and the second lead electrode；Transparent substrates include body and extend at least flexible connecting portion formed by the side of body, and decoration conductive layer is located at the view field of rim area on a transparent substrate；The flexible connecting portion is provided with conducting circuit, and the body is provided with induction zone and positioned at the rim area of the sensing area edge；First conductive layer is arranged at the induction zone；Insulating barrier is located above the first conductive thread and is embedded in the grid groove；Second conductive layer is arranged at the induction zone of the transparent substrates, and is separated with first conductive layer by the insulating barrier, and the first lead electrode and the second lead electrode are positioned at the surface of the decoration conductive layer.Above-mentioned one-layer multi-point conducting film has lower-cost feature.Additionally provide a kind of one-layer multi-point touch control screen using above-mentioned one-layer multi-point conducting film simultaneously.
Description
Technical field
It is more particularly to a kind of one-layer multi-point conducting film and more using the individual layer the present invention relates to a kind of touch control conductive film
The one-layer multi-point touch control screen of point type conducting film.
Background technology
Nesa coating is that have a kind of film of high transmission rate with satisfactory electrical conductivity, and in visible light wave range.At present
Nesa coating is widely used to the fields such as FPD, photovoltaic device, contact panel and electromagnetic shielding, has extremely wide
The market space.
Nesa coating is the sensing element that the input signals such as touch are received in touch-screen.At present, ITO（Tin indium oxide）Layer
It is vital part in nesa coating.The manufacturing technology of touch-screen is at a tremendous pace to be developed rapidly, but right
In traditional one-layer multi-point conducting film, it is connected during touch-screen is made due to needing with external device, so
Need to be bonded flexible PCB（Flexible Printed Circuit, FPC）, and need to carry out attaching process, add
The cost of manpower and materials.Meanwhile in the corresponding techniques of ITO, the whole face ito film plated need to be etched, to form ITO pattern,
In this process, substantial amounts of ITO is etched, and causes substantial amounts of noble metal to waste, and then product cost is remained high, and is led
Cause the cost of traditional one-layer multi-point conducting film higher.
The content of the invention
Based on this, it is necessary to provide a kind of lower-cost one-layer multi-point conducting film.
A kind of one-layer multi-point conducting film, including：
Transparent substrates, including body and extend at least flexible connecting portion formed by the side of the body, it is described to scratch
Property connecting portion width be less than the width that the body is extended with the side of the flexible connecting portion, the flexible connecting portion is set
There is conducting circuit, the body is provided with induction zone and positioned at the rim area of the sensing area edge, and the transparent substrates are glass
Glass substrate；
Conductive layer is decorated, positioned at view field of the rim area in the transparent substrates；
First conductive layer, in latticed, the induction zone is arranged at, first conductive layer includes cross one another first
Conductive thread, the induction zone offer grid groove, and first conductive layer is contained in the grid groove；
Insulating barrier, above the first conductive thread and it is embedded in the grid groove；
Second conductive layer, in latticed, the induction zone of the transparent substrates is arranged at, and pass through with first conductive layer
The insulating barrier separates, and second conductive layer includes cross one another second conductive thread；
First lead electrode, the rim area being arranged at, the first lead electrode electrically connects with first conductive layer,
The conducting circuit is electrically connected by the first lead electrode with first conductive layer, and the first lead electrode includes the
One conductive lead wire, first conductive lead wire are located at the decoration conductive layer surface；And
Second lead electrode, the rim area being arranged at, the second lead electrode electrically connects with second conductive layer,
The conducting circuit is electrically connected by the second lead electrode with second conductive layer, and the second lead electrode includes the
Two conductive lead wires, second conductive lead wire are located at the decoration conductive layer surface.
In one of the embodiments, in addition to hypothallus, the hypothallus are located at the transparent substrates surface, the sense
Area and the rim area is answered to be located at side of the hypothallus away from transparent substrates, first conductive layer and second conduction
Layer may be contained within the induction zone of the hypothallus.
In one of the embodiments, the first lead electrode and the second lead electrode are linear.
In one of the embodiments, the material of the insulating barrier is dielectric ink or insulating cement.
In one of the embodiments, first conductive lead wire is the shape that intersects, and second conductive lead wire is phase
Mutual cross-like.
In one of the embodiments, the first lead electrode is located at the surface of the rim area, or the rim area
On open up the first groove, first lead, which is contained in, to be opened in first groove.
In one of the embodiments, the second lead electrode is located at the surface of the rim area, or the rim area
On open up the second groove, second lead, which is contained in, to be opened in second groove.
In one of the embodiments, the grid of first conductive layer and second conductive layer be regular grid or with
Machine grid.
In one of the embodiments, the width of the grid groove is d1, depth h, wherein, 1 μm≤d1≤5 μm,
2 μm≤h≤6 μm, h/d1 ＞ 1.
In one of the embodiments, the grid groove is that bottom is " V " font, " W " font, arc or corrugated
Micro-groove.
In one of the embodiments, the depth of the micro-groove is 500nm~1 μm.
In one of the embodiments, the material of the hypothallus is UV glue, impressing glue or makrolon.
In one of the embodiments, the material of first conductive thread and second conductive thread is silver, copper, led
Electric polymer or ITO.
In one of the embodiments, the protective clear layer of covering second conductive layer surface is included.
In one of the embodiments, the material of the protective clear layer is UV glue, impressing glue or makrolon.
A kind of one-layer multi-point touch control screen, including one-layer multi-point conducting film and display module, the one-layer multi-point are led
Electrolemma is one-layer multi-point conducting film described above, and the conductor planes of one-layer multi-point conducting film are bonded to display module.
Above-mentioned one-layer multi-point conducting film, its flexible connecting portion form integral structure, one-layer multi-point with transparent substrates
Conducting film is electrically connected by flexible connecting portion and outside, saves flexible PCB and the work related to flexible PCB
Skill so that the cost of one-layer multi-point conducting film is relatively low.Meanwhile above-mentioned one-layer multi-point conducting film on hypothallus formed with net
Lattice groove, grid groove the first conductive thread of interior filling form the first conductive layer.Therefore, tradition is substituted with embedded grider structure
ITO process structures, follow-up etch process is eliminated, saved substantial amounts of noble metal, reduce further cost.
Brief description of the drawings
Fig. 1 is the structural representation of the one-layer multi-point touch control screen of embodiment of the present invention；
Fig. 2 is the top view of the transparent substrates in Fig. 1；
Fig. 3 is the top view of body and oar connecting portion in transparent substrates shown in Fig. 2；
Fig. 4 is the profile of the one-layer multi-point conducting film in Fig. 1；
Fig. 5（a）To Fig. 5（d）For the different embodiments of the bottom of the grid groove of the one-layer multi-point conducting film shown in Fig. 4
Structural representation；
Fig. 6（a）To Fig. 6（d）For the structural representation of the different embodiments of the grid of the one-layer multi-point conducting film shown in Fig. 4
Figure；
Fig. 7 is the profile of the one-layer multi-point conducting film of another embodiment；
Fig. 8 is the profile of one-layer multi-point conducting film in another embodiment in Fig. 1；
Fig. 9 is the profile of one-layer multi-point conducting film in another embodiment in Fig. 1；
Figure 10 is the profile of one-layer multi-point conducting film in another embodiment in Fig. 1；
Figure 11 is the profile of one-layer multi-point conducting film in another embodiment in Fig. 1.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more
The arbitrary and all combination of related Listed Items.
Referring to Fig. 1, the one-layer multi-point touch control screen 10 in present pre-ferred embodiments includes the display mould stacked gradually
Group 100 and one-layer multi-point conducting film 200, the conductor planes of one-layer multi-point conducting film 200 are bonded with display module 100.
Fig. 2 and Fig. 3 is referred to, transparent substrates 210 include body 212 and extend the flexibility formed by the side of body 212
Connecting portion 214.Body 212 is provided with the induction zone 212a and rim area 212b positioned at induction zone 212a edges.Flexible connecting portion
214 width is less than the width that body 212 is extended with the side of flexible connecting portion 214, and flexible connecting portion 214 is provided with conductive line
Road.Flexible connecting portion 214 is at least one, and forms integral structure with transparent substrates 210.Flexible connecting portion 214 be used for
External part is connected.Flexible connecting portion 214 can be connected with external part by the way of being directly bonded, in addition, flexible
Connecting portion 214 can also be male end or female end directly and external part carries out socket connection.
Referring to Fig. 4, one-layer multi-point conducting film 200 include transparent substrates 210, hypothallus 220, the first conductive layer 230,
The conductive layer 250 of insulating barrier 240 and second.
Transparent substrates 210 include first surface and the second surface being oppositely arranged with first surface.Transparent substrates 210
Shape can be set according to the shape of one-layer multi-point conducting film 100, for example, transparent substrates 210 are rectangle.Transparent substrates
210 be substrate of glass.
Hypothallus 220 is located at the first surface of transparent substrates 210.Hypothallus 220 includes induction zone 212a and and induction zone
Rim area 212b adjacent 212a.In present embodiment, induction zone 212a is located at the middle part of hypothallus 220.Induction zone 212a is opened
Provided with grid groove 221.The material of hypothallus 220 is UV glue, impressing glue or makrolon.
Filled with conductive material to form cross one another first conductive thread in grid groove 221, cross one another the
One conductive thread forms the first conductive layer 230.Conductive material is silver, copper, conducting polymer or ITO.Preferably, the first conductive layer
230 and grid groove 221 formed by way of impressing.
Further, grid groove 221 is that bottom is rough surface, and grid groove 221 is that bottom is " V " font, " W "
Font, arc or corrugated micro-groove.Refer to Fig. 5（a）To Fig. 5（d）, Fig. 5（a）Shown grid groove 221 is bottom
Portion be " V " font micro-groove, Fig. 5（b）Shown grid groove 221 be bottom be " W " font micro-groove, Fig. 5（c）It is shown
Grid groove 221 be micro-groove that bottom is arc, Fig. 5（d）Shown grid groove 221 is that bottom is corrugated miniature
Groove.Preferably, the depth of micro-groove is 500nm~1 μm.
Preferably, the width of grid groove 221 is d1, depth h, wherein, 1 μm≤d1≤5 μm, 2 μm≤h≤6 μm,
H/d1 ＞ 1.
Grid groove 221 is that bottom is " V " font, " W " font, arc or corrugated micro-groove, such grid groove
For conductive ink in 221 groove when drying, the conductive material that conductive ink polycondensation is not easy after appearance drying will not
There is the phenomenon disconnected.
Referring to Fig. 4, insulating barrier 240 is formed at the surface of the first conductive layer 230, and is embedded at grid groove 221
It is interior.Insulating barrier 240 is used to separate the first conductive layer 230 and the second conductive layer 250, makes the first conductive layer 230 and second conductive
Mutually it is not turned between layer 250.The material of insulating barrier 240 is some insulating materials such as dielectric ink or insulating cement.Because of conduction material
It is liquid before material filling, when the conductive material of liquid is filled in into grid groove 221, grid groove 221 is that bottom is thick
Rough surface, and grid groove 221 is that bottom is " V " font, " W " font, arc or corrugated micro-groove, is advantageous to decompose
Tension force of the conductive material of liquid when being contacted with the bottom of grid groove 221, makes the conduction material of liquid to avoid overtension
Material shrink be in some spherical or almost spherical structure, reduce it is sintered after conductive material be in it is some apart from one another by it is spherical or
The probability of almost spherical, the connectedness inside conductive material after sintering is improved, ensure the electric conductivity of nesa coating.
Second conductive layer 250 is formed at the induction zone 212a of hypothallus 220.Second conductive layer 250 is convexly equipped in hypothallus 220
A side surface away from transparent substrates 210, and separated by insulating barrier 240 and the first conductive layer 230.Second conductive layer 250 wraps
Include cross one another second conductive thread.Second conductive layer 250 is completed by modes such as exposure imaging, silk-screen printings.Second
The material of conductive layer 250 is silver, copper, conducting polymer or ITO.
Further, the first conductive layer 230 and the second conductive layer 250 are comb teeth-shaped or latticed.Refer to Fig. 6（a）Extremely
Fig. 6（d）, the grid of the first conductive layer 230 and the second conductive layer 250 is regular grid or random grid.Such as Fig. 6（a）Shown in
Grid be random grid, Fig. 6（b）To Fig. 6（d）Shown in grid be respectively regular hexagonal cell, network and pros
Shape grid.
In the embodiment shown in Fig. 4, the first conductive layer 230 and the second conductive layer 250 are by multiple array arrangements
Conductive strips form.Direction of the conductive strips of first conductive layer 230 along the first dimension extends, the conductive bar of the second conductive layer 250
Direction of the band along the second dimension extends, one-dimensional square and two-dimensional directional oblique.Certainly, in other implementations, first
Dimension direction is mutually perpendicular to two-dimensional directional.Please refer to Fig. 7, it is illustrated that embodiment in, the conduction of the first conductive layer 230
Direction of the band along the first dimension extends, and the direction of the conductive strips of the second conductive layer 250 along the second dimension extends, one-dimensional square with
Two-dimensional directional is mutually perpendicular to.
Referring to Fig. 8, one-layer multi-point conducting film 200 also includes decoration conductive layer 290, the located at rim area 212b
One lead electrode 260 and the second lead electrode 270.Decoration conductive layer 290 is located at throwings of the rim area 212b in transparent substrates 210
Shadow zone domain.Specifically, decoration conductive layer 290, between transparent substrates 210 and hypothallus 220, decoration conductive layer 290 is single
Color.First lead electrode 260 electrically connects with the first conductive layer 230, and the second lead electrode 270 is electrically connected with the second conductive layer 250
Connect.Conducting circuit is electrically connected by the first lead electrode 260 with the first conductive layer 230.Conducting circuit passes through the second lead electrode
270 electrically connect with the second conductive layer 250.Specifically, the first lead electrode 260 is contained in the rim area for being opened in hypothallus 220
In 212b the first groove 223, it is second recessed to be contained in the rim area 212b for being opened in hypothallus 220 for the second lead electrode 270
In groove 225.It is appreciated that in other embodiments, the first lead electrode 260 and the second lead electrode 270 can also be directly convex
Located at rim area 212b surface.First lead electrode 260 and the second lead electrode 270 can by silk-screen printing, impressing or
The modes such as inkjet printing are formed.
Specifically in the present embodiment, the first lead electrode 260 includes cross one another first conductive lead wire, the second lead electricity
Pole 270 includes cross one another second conductive lead wire, and the first lead electrode 260 and the second lead electrode 270 are network.
First conductive lead wire and the second conductive lead wire are respectively positioned on the surface of decoration conductive layer 290.First groove 223 and the second groove 225
Structure and parameter and grid groove 221 structure and parameter all same.Certainly, in other examples, the first lead electricity
The lead electrode 270 of pole 260 and second can also be the line width of linear, the first lead electrode 260 and the second lead electrode 270
It it is highly 5 μm~10 μm for 50 μm~200 μm.
Preferably, the material of the first lead electrode 260 and the second lead electrode 270 is silver, copper, conducting polymer or ITO.
Referring to Fig. 9, further, one-layer multi-point conducting film 200 also includes being covered in the surface of the second conductive layer 250
Protective clear layer 280.Protective clear layer 280 covers the table of the second conductive layer 250 and hypothallus 220 away from transparent substrates 210
Face.Because the second conductive layer 250 is convexly equipped in the surface of hypothallus 220, therefore, formed on the surface of the second conductive layer 250 transparent
Protective layer 280 is protected with being formed to the second conductive layer 250, is prevented plowing from.Preferably, the material of protective clear layer 280 be UV glue,
Imprint glue or makrolon.Finally, the transmitance of whole one-layer multi-point conducting film 200 is not less than 86%.
Also referring to Figure 10 and Figure 11, in other examples, hypothallus 220 can be omitted, and transparent substrates 210 are wrapped
Include the induction zone 212a and rim area 212b adjacent with induction zone 212a.Now grid groove 221 is opened in transparent substrates 210
Induction zone 212a, the second conductive layer 250 be located at transparent substrates 210 induction zone 212a.
Compared to traditional one-layer multi-point conducting film, above-mentioned one-layer multi-point conducting film 200 at least has advantages below：
（1）Flexible connecting portion 214 forms integral structure with transparent substrates 210, and one-layer multi-point conducting film 200 passes through
Flexible connecting portion 214 is electrically connected with outside, saves flexible PCB and the technique related to flexible PCB so that single
The cost of layer multipoint mode conducting film 200 is relatively low.Meanwhile above-mentioned one-layer multi-point conducting film 200 on hypothallus 220 formed with net
Lattice groove 221, the first conductive thread of interior filling of grid groove 221 forms the first conductive layer 230, therefore, with embedded grider knot
Structure substitutes traditional ITO process structures, eliminates follow-up etch process, has saved substantial amounts of noble metal, reduce further into
This.
（2）By forming the first conductive layer 230 and the second conductive layer 250, the first conductive layer 230 and the second conductive layer 250
Separated by insulating barrier 240, the inductive effects of two conductive layers are more preferable.
（3）The first conductive thread is filled by forming grid groove 221 on hypothallus 220, in grid groove 221 to be formed
First conductive layer 230, so as to reduce the thickness of one-layer multi-point conducting film 100；Designed simultaneously using this flush type, to list
The performance of layer multipoint mode conducting film 100 is protected well.
（4）By forming protective clear layer 280 on the surface of the second conductive layer 250, the second conductive layer 250 can be protected to keep away
Exempt to be scratched, while can prevent conductive material from aoxidizing.
（5）Grid groove 221 is that bottom is " V " font, " W " font, arc or corrugated micro-groove, such grid
For conductive ink in the groove of groove 221 when drying, conductive ink polycondensation is not easy the conductive material for occurring after drying
It is not in the phenomenon of disconnection.
（6）In conventional monolayers multipoint mode conducting film, its transparent substrates is made up of thin-film material, finally also needs to be bonded glass
Glass is to be used as conductive layer.In above-mentioned one-layer multi-point conducting film 200, transparent substrates 210 are glass substrate, and in transparent base
Decoration conductive layer 290 is set on bottom 210, without being bonded glass, has further saved cost.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (16)
- A kind of 1. one-layer multi-point conducting film, it is characterised in that including：Transparent substrates, including body and extend at least flexible connecting portion formed by the side of the body, it is described it is flexible even The width of socket part is less than the width that the body is extended with the side of the flexible connecting portion, and the flexible connecting portion, which is provided with, leads Logical circuit, the body are provided with induction zone and positioned at the rim areas of the sensing area edge, and the transparent substrates are glass base Bottom；Conductive layer is decorated, positioned at view field of the rim area in the transparent substrates；First conductive layer, in latticed, the induction zone is arranged at, it is conductive that first conductive layer includes cross one another first Silk thread, the induction zone offer grid groove, and first conductive layer is contained in the grid groove；Insulating barrier, above the first conductive thread and all it is embedded in the grid groove；Second conductive layer, in latticed, the induction zone of the transparent substrates is arranged at, is directly convexly equipped in induction zone away from transparent base The side at bottom is simultaneously separated with first conductive layer by the insulating barrier, and second conductive layer includes cross one another second Conductive thread；First lead electrode, the rim area is arranged at, the first lead electrode electrically connects with first conductive layer, described Conducting circuit is electrically connected by the first lead electrode with first conductive layer, and the first lead electrode is led including first Electrical lead, first conductive lead wire are located at the decoration conductive layer surface；AndSecond lead electrode, the rim area is arranged at, the second lead electrode electrically connects with second conductive layer, described Conducting circuit is electrically connected by the second lead electrode with second conductive layer, and the second lead electrode is led including second Electrical lead, second conductive lead wire are located at the decoration conductive layer surface.
- 2. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that also set including hypothallus, the hypothallus In the transparent substrates surface, the induction zone and the rim area are located at side of the hypothallus away from transparent substrates, institute State the first conductive layer and second conductive layer may be contained within the induction zone of the hypothallus.
- 3. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that the first lead electrode and described second Lead electrode is linear.
- 4. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that the material of the insulating barrier is dielectric ink Or insulating cement.
- 5. one-layer multi-point conducting film as claimed in claim 3, it is characterised in that first conductive lead wire is to intersect Shape, second conductive lead wire are the shape that intersects.
- 6. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that the first lead electrode is located at the side The first groove is opened up on the surface in frame area, or the rim area, first lead, which is contained in, to be opened in first groove.
- 7. one-layer multi-point conducting film as claimed in claim 6, it is characterised in that the second lead electrode is located at the side The second groove is opened up on the surface in frame area, or the rim area, second lead, which is contained in, to be opened in second groove.
- 8. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that first conductive layer and described second lead The grid of electric layer is regular grid or random grid.
- 9. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that the width of the grid groove is d1, deep Spend for h, wherein, 1 μm≤d1≤5 μm, 2 μm≤h≤6 μm, h/d1 ＞ 1.
- 10. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that the grid groove is that bottom is " V " word Shape, " W " font, arc or corrugated micro-groove.
- 11. one-layer multi-point conducting film as claimed in claim 10, it is characterised in that the depth of the micro-groove is 500nm ~1 μm.
- 12. one-layer multi-point conducting film as claimed in claim 2, it is characterised in that the material of the hypothallus is UV glue, pressure Print glue or makrolon.
- 13. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that first conductive thread and described The material of two conductive threads is silver, copper, conducting polymer or ITO.
- 14. one-layer multi-point conducting film as claimed in claim 1, it is characterised in that also include covering second conductive layer The protective clear layer on surface.
- 15. one-layer multi-point conducting film as claimed in claim 14, it is characterised in that the material of the protective clear layer is UV Glue, impressing glue or makrolon.
- 16. a kind of one-layer multi-point touch control screen, including one-layer multi-point conducting film and display module, it is characterised in that the list Layer multipoint mode conducting film is the one-layer multi-point conducting film as described in claim any one of 1-15, and the one-layer multi-point is led The conductor planes of electrolemma are bonded to the display module.
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