CN103412423A - 一种低温印刷钛化硅的工艺 - Google Patents
一种低温印刷钛化硅的工艺 Download PDFInfo
- Publication number
- CN103412423A CN103412423A CN2013103798447A CN201310379844A CN103412423A CN 103412423 A CN103412423 A CN 103412423A CN 2013103798447 A CN2013103798447 A CN 2013103798447A CN 201310379844 A CN201310379844 A CN 201310379844A CN 103412423 A CN103412423 A CN 103412423A
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- Prior art keywords
- printing
- titanizing silicon
- polyimide
- titanizing
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000004642 Polyimide Substances 0.000 claims abstract description 22
- 229920001721 polyimide Polymers 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 11
- 238000003854 Surface Print Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 32
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007711 solidification Methods 0.000 abstract description 5
- 230000008023 solidification Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 abstract 1
- 238000010981 drying operation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012749 thinning agent Substances 0.000 description 1
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310379844.7A CN103412423B (zh) | 2013-08-27 | 2013-08-27 | 一种低温印刷钛化硅的工艺 |
Applications Claiming Priority (1)
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CN201310379844.7A CN103412423B (zh) | 2013-08-27 | 2013-08-27 | 一种低温印刷钛化硅的工艺 |
Publications (2)
Publication Number | Publication Date |
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CN103412423A true CN103412423A (zh) | 2013-11-27 |
CN103412423B CN103412423B (zh) | 2016-05-11 |
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CN201310379844.7A Expired - Fee Related CN103412423B (zh) | 2013-08-27 | 2013-08-27 | 一种低温印刷钛化硅的工艺 |
Country Status (1)
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CN (1) | CN103412423B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109228711A (zh) * | 2018-09-28 | 2019-01-18 | 东莞市银泰丰光学科技有限公司 | 一种玻璃背板图案印刷工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855252A (en) * | 1988-08-22 | 1989-08-08 | International Business Machines Corporation | Process for making self-aligned contacts |
CN1395299A (zh) * | 2001-06-28 | 2003-02-05 | 东部电子株式会社 | 半导体元件的硅化物膜的形成方法 |
JP2004223794A (ja) * | 2003-01-21 | 2004-08-12 | Teijin Dupont Films Japan Ltd | 積層ポリエステルフィルム |
CN1734747A (zh) * | 2004-08-13 | 2006-02-15 | 上海华虹Nec电子有限公司 | 常温淀积钛的硅化钛在cmos工艺中的实现方法 |
US20060091489A1 (en) * | 2004-11-01 | 2006-05-04 | International Business Machines Corporation | Trench photodetector |
CN101178549A (zh) * | 2006-11-09 | 2008-05-14 | 联华电子股份有限公司 | 移除光致抗蚀剂层的方法以及开口的形成方法 |
CN101819934A (zh) * | 2009-02-26 | 2010-09-01 | 中芯国际集成电路制造(上海)有限公司 | 在器件的掺杂多晶硅沟槽上形成钛化硅层的方法 |
-
2013
- 2013-08-27 CN CN201310379844.7A patent/CN103412423B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855252A (en) * | 1988-08-22 | 1989-08-08 | International Business Machines Corporation | Process for making self-aligned contacts |
CN1395299A (zh) * | 2001-06-28 | 2003-02-05 | 东部电子株式会社 | 半导体元件的硅化物膜的形成方法 |
JP2004223794A (ja) * | 2003-01-21 | 2004-08-12 | Teijin Dupont Films Japan Ltd | 積層ポリエステルフィルム |
CN1734747A (zh) * | 2004-08-13 | 2006-02-15 | 上海华虹Nec电子有限公司 | 常温淀积钛的硅化钛在cmos工艺中的实现方法 |
US20060091489A1 (en) * | 2004-11-01 | 2006-05-04 | International Business Machines Corporation | Trench photodetector |
CN101178549A (zh) * | 2006-11-09 | 2008-05-14 | 联华电子股份有限公司 | 移除光致抗蚀剂层的方法以及开口的形成方法 |
CN101819934A (zh) * | 2009-02-26 | 2010-09-01 | 中芯国际集成电路制造(上海)有限公司 | 在器件的掺杂多晶硅沟槽上形成钛化硅层的方法 |
Non-Patent Citations (1)
Title |
---|
王巍强等: "COG工艺的LCD模块电极腐蚀的控制", 《液晶与显示》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109228711A (zh) * | 2018-09-28 | 2019-01-18 | 东莞市银泰丰光学科技有限公司 | 一种玻璃背板图案印刷工艺 |
Also Published As
Publication number | Publication date |
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CN103412423B (zh) | 2016-05-11 |
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Address after: 343700 Taihe County, Jiangxi Province Industrial Park Applicant after: JIANGXI HELITAI TECHNOLOGY CO., LTD. Address before: 343700 Taihe County, Jiangxi Province Industrial Park Applicant before: Jiangxi Holitech Technology Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: JIANGXI HOLITECH TECHNOLOGY CO., LTD. TO: JIANGXI HELITAI TECHNOLOGY CO., LTD. |
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Effective date of registration: 20190212 Address after: 225000 room 103, Wanke golden street, East Road, Szeto temple, Yangzhou, Jiangsu, 103 Patentee after: Jiangsu Huadong culture and technology Financing Leasing Co., Ltd. Address before: 343700 Taihe County Industrial Park, Jiangxi Province Patentee before: JIANGXI HELITAI TECHNOLOGY CO., LTD. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20190827 |