CN103410235A - Composite thermal-insulation board of foaming cement board and foaming phenolic board - Google Patents
Composite thermal-insulation board of foaming cement board and foaming phenolic board Download PDFInfo
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- CN103410235A CN103410235A CN2013102569563A CN201310256956A CN103410235A CN 103410235 A CN103410235 A CN 103410235A CN 2013102569563 A CN2013102569563 A CN 2013102569563A CN 201310256956 A CN201310256956 A CN 201310256956A CN 103410235 A CN103410235 A CN 103410235A
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- China
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- board
- foaming
- phenolic board
- foaming phenolic
- foam cement
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/244—Structural elements or technologies for improving thermal insulation using natural or recycled building materials, e.g. straw, wool, clay or used tires
Abstract
The invention provides a composite thermal-insulation board of a foaming cement board and a foaming phenolic board. The foaming phenolic board is bonded to one side or each of the two sides of the foaming cement board through an adhesive layer or the foaming cement board is bonded to one side or each of the two sides of the foaming phenolic board through an adhesive layer, and thus the composite thermal-insulation board is formed. 0.9 part of cement and 0.1 part of sisal hemp short fibers are added into 1 part of 50% aqueous solution of polyvinyl formal by mass, and then the adhesive layer is formed. The composite thermal-insulation board has the advantages of being high in strength, easy to bond, light in volume weight, low in heat conductivity coefficient, low in cost and suitable for being used as a thermal-insulation board for walls.
Description
Technical field
What the present invention proposed is the heat insulating material of building materials field, specifically a kind of foam cement and foaming phenolic board composite insulation boards.
Background technology
Development along with building energy conservation science and technology, various foaming insulation boards are all being used, foaming insulation board is divided into organic plates and inorganic plate, organic plates is commonly used foamed propylene plate, foamed extruded sheet, polyurethane sheet, and the disadvantage that organic plates exists is easy burning, and the smog after burning is harmful to human body and environment, in some organic plates, added fire retardant, but in the situation that high temperature, organic matter also can decomposition combustion, so poor stability.Inorganic plate is commonly used calcium silicate board with microporous, rock cotton board and foam cement plate, and inorganic plate usually can both be fire-retardant and high temperature resistant, can not produce fire, is that unit weight is large but all there is fatal weakness, and intensity is low, and coefficient of thermal conductivity is high.Therefore how the advantage of organic plates and inorganic plate being combined is the purpose of this area development.
Cement foam board toughness is low at present, and coefficient of thermal conductivity is high, and the foaming phenolic board is fire-retardant, flexible, and coefficient of thermal conductivity is low, but involves great expense, and impact is used.
Summary of the invention
Fire-retardant in order to realize wall insulated board, reduce heat insulating coefficient, the present invention proposes a kind of foam cement and foaming phenolic board composite insulation boards.This warming plate is by the bonding by foam cement plate and foaming phenolic board, the technical problem that solves warming plate intensity, toughness and reduction coefficient of thermal conductivity and reduce costs.
The scheme that technical solution problem of the present invention adopts is:
One or both sides at the foam cement plate are bonded with the foaming phenolic board or by adhesive-layer, are bonded with the foam cement plate in foaming phenolic board one or both sides by adhesive-layer, form composite insulation boards.
Adhesive-layer forms: in the polyvinyl formal solution of 1 part of quality 50% content, add 0.9 part of cement and 0.1 part of sisal hemp short fibre.
Good effect, it is high that composite insulation boards of the present invention has intensity, easily pastes, and unit weight is light, and coefficient of thermal conductivity hangs down and the low advantage of cost.Suitablely as wall insulated board, apply.
The accompanying drawing explanation
Fig. 1 is both sides of the present invention clamping foaming phenolic board structure chart
Fig. 2 is the one-sided bonding foaming phenolic board structure chart of the present invention
Fig. 3 is clamping foaming phenolic board structure chart in the middle of the present invention
In figure, 1. composite insulation boards, the 1.1. phenolic board that foams, 1.2. foam cement plate, 1.3. adhesive-layer.
The specific embodiment
According to shown in Figure 1, by adhesive-layer 1.3, be bonded with foaming phenolic board 1.1 in the both sides of foam cement plate 1.2.
According to shown in Figure 2, by adhesive-layer 1.3, be bonded with foaming phenolic board 1.1 in foam cement plate 1.2 1 sides.
According to shown in Figure 3, by adhesive-layer 1.3, be bonded with foaming phenolic board 1.1 between both sides foam cement plate 1.2.
Adhesive-layer forms: in the polyvinyl formal solution of 1 part of quality 50% content, add 0.9 part of cement and 0.1 part of sisal hemp short fibre.
Embodiment 1:
Select 150 kilograms of coefficient of thermal conductivity of unit weight be 0.05 foam cement plate as the compound foam cement plate of use, select coefficient of thermal conductivity be 0.025 foaming phenolic board as compound with the phenolic board that foams.
The both sides clamping foaming phenolic board of take is example, and both sides foam cement plate thickness is chosen as 2 centimetres, and the foaming phenolic board of middle clamping is chosen as 2 centimetres, and the composite plate thickness of formation is 6 centimetres.
Through coefficient of thermal conductivity, detect, the composite plate coefficient of thermal conductivity of this kind structure is 0.038.
Embodiment 2:
Select 150 kilograms of coefficient of thermal conductivity of unit weight be 0.05 foam cement plate as the compound foam cement plate of use, select coefficient of thermal conductivity be 0.025 foaming phenolic board as compound with the phenolic board that foams.
The one-sided bonding foaming phenolic board of take is example, and the foam cement plate thickness is selected 4 centimetres, and foaming phenolic board thickness is selected 2 centimetres, and the composite plate thickness of formation is 6 centimetres.
Through coefficient of thermal conductivity, detecting is 0.045.
Embodiment 3:
Selecting 150 kilograms of coefficient of thermal conductivity of unit weight is that 0.05 foam cement plate is as the compound foam cement plate of using
,Select coefficient of thermal conductivity be 0.025 foaming phenolic board as compound with the foaming phenolic board.
The middle clamping foaming phenolic board of take is example, and the foam cement plate thickness is chosen as 2 centimetres, and foaming phenolic board thickness is chosen as 2 centimetres, and the composite plate thickness of formation is 6 centimetres.
Through Measured Results of Thermal Conductivity, coefficient of thermal conductivity is 0.045.
According to the actual needs of coefficient of thermal conductivity, the thickness of thickening foaming phenolic board, can reduce coefficient of thermal conductivity, reduces the integral thickness of composite plate.The thickness of thickening foam cement plate, can reduce costs.
Advantage of the present invention:
The wall insulating composite board that adopts technical scheme of the present invention to make, utilized that foam cement plate intensity is high is easy to the characteristics bonding with metope, utilized again the light and low characteristics of coefficient of thermal conductivity of foaming phenolic board quality simultaneously, makes both be combined into plate.Both guarantee intensity and cementability, and can reduce again coefficient of thermal conductivity and reduce unit weight, also had simultaneously heat-proof combustion-resistant fireproof effect.Meet very much the energy-conservation actual needs of wall thermal insulating.
Claims (2)
1. a foam cement and foaming phenolic board composite insulation boards, it is characterized in that: the one or both sides at foam cement plate (1.2) are bonded with foaming phenolic board (1.1) or by adhesive-layer, are bonded with the foam cement plate in foaming phenolic board one or both sides by adhesive-layer (1.3), form composite insulation boards (1).
2. a kind of foam cement according to claim 1 and foaming phenolic board composite insulation boards, is characterized in that: adhesive-layer composition: in the polyvinyl formal solution of 1 part of quality 50% content, add 0.9 part of cement and 0.1 part of sisal hemp short fibre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102569563A CN103410235A (en) | 2013-06-26 | 2013-06-26 | Composite thermal-insulation board of foaming cement board and foaming phenolic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102569563A CN103410235A (en) | 2013-06-26 | 2013-06-26 | Composite thermal-insulation board of foaming cement board and foaming phenolic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103410235A true CN103410235A (en) | 2013-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102569563A Pending CN103410235A (en) | 2013-06-26 | 2013-06-26 | Composite thermal-insulation board of foaming cement board and foaming phenolic board |
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| CN (1) | CN103410235A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112343189A (en) * | 2020-10-30 | 2021-02-09 | 江苏春迈建筑科技有限公司 | Fireproof and heat-insulation integrated plate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2190613A1 (en) * | 1972-07-06 | 1974-02-01 | Tardy James | Phenolic foam insulation slabs - strengthened with integral surface layers of glass fibre |
| FR2312621A1 (en) * | 1975-05-29 | 1976-12-24 | Casquel Jean Pierre | Moulded roofing tiles with rigid foam core - to reduce weight and provide integral insulation |
| CN2277431Y (en) * | 1996-12-31 | 1998-04-01 | 飞泰科化学建材(北京)有限公司 | Foamed composite wall board |
| CN101481227A (en) * | 2009-01-20 | 2009-07-15 | 李雪菲 | Preparation of sisal hemp short fibre for building material |
| CN101891436A (en) * | 2010-07-07 | 2010-11-24 | 葫芦岛东方实业有限公司 | Saponin-foamed and sisal fiber-enhanced wall body heat preservation mortar |
| CN202081525U (en) * | 2011-05-26 | 2011-12-21 | 赵振儒 | Multilayered composite flame-retardant and fire-proof insulation board |
| CN102383502A (en) * | 2011-10-19 | 2012-03-21 | 谢文靖 | Composite light fireproof insulation board and production method thereof |
-
2013
- 2013-06-26 CN CN2013102569563A patent/CN103410235A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2190613A1 (en) * | 1972-07-06 | 1974-02-01 | Tardy James | Phenolic foam insulation slabs - strengthened with integral surface layers of glass fibre |
| FR2312621A1 (en) * | 1975-05-29 | 1976-12-24 | Casquel Jean Pierre | Moulded roofing tiles with rigid foam core - to reduce weight and provide integral insulation |
| CN2277431Y (en) * | 1996-12-31 | 1998-04-01 | 飞泰科化学建材(北京)有限公司 | Foamed composite wall board |
| CN101481227A (en) * | 2009-01-20 | 2009-07-15 | 李雪菲 | Preparation of sisal hemp short fibre for building material |
| CN101891436A (en) * | 2010-07-07 | 2010-11-24 | 葫芦岛东方实业有限公司 | Saponin-foamed and sisal fiber-enhanced wall body heat preservation mortar |
| CN202081525U (en) * | 2011-05-26 | 2011-12-21 | 赵振儒 | Multilayered composite flame-retardant and fire-proof insulation board |
| CN102383502A (en) * | 2011-10-19 | 2012-03-21 | 谢文靖 | Composite light fireproof insulation board and production method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112343189A (en) * | 2020-10-30 | 2021-02-09 | 江苏春迈建筑科技有限公司 | Fireproof and heat-insulation integrated plate |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131127 |