CN103402319A - Double-layer sealed printing chassis structure - Google Patents
Double-layer sealed printing chassis structure Download PDFInfo
- Publication number
- CN103402319A CN103402319A CN2013103277219A CN201310327721A CN103402319A CN 103402319 A CN103402319 A CN 103402319A CN 2013103277219 A CN2013103277219 A CN 2013103277219A CN 201310327721 A CN201310327721 A CN 201310327721A CN 103402319 A CN103402319 A CN 103402319A
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- Prior art keywords
- chassis
- double
- flat
- chassis structure
- needle body
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a double-layer sealed printing chassis structure which comprises a chassis, wherein the central position of the chassis is provided with a pin hole, a flat-top pin body is inserted into the pin hole, and a plurality of locating pins are uniformly distributed at the periphery of the flat-top pin body; a bottom plate is horizontally paved at the bottom surface of the chassis; meanwhile, a plurality of flitches are sequentially arranged below the bottom plate from top to bottom; the part, connected with the bottom plate, of the lower end of each locating pin is additionally provided with a sealing strip; a circle of sealing sleeve is paved between the outer edge of each sealing strip and the outer edge of the chassis and connected with the upper surface of the bottom plate. The double-layer sealed printing chassis structure has the beneficial effects of capability of avoiding adhesive residues left on the surface of a base and solving the production quality problem possibly caused by the adhesive residues, has the advantages of convenience in disassembly and assembly, convenience in cleaning, improved circuit board printing efficiency, and the like, and is conductive to realizing the multi-functional purpose of the printing chassis.
Description
Technical field
The present invention relates to printing technology, relate in particular to a kind of Double-layer seal type printing chassis structure.
Background technology
Printing technology is all processes of vision, tactile data print reproduction, is to process the technology by the demand batch duplicating fine arts, word, image by pool, photography, word processing and artistic design, editor, color separation, plate-making, printing, seal aftershaping.Printed circuit board develops into double sided board, multi-layer sheet and flex plate from individual layer, and constantly to high accuracy, high density and high reliability future development, continuous reduced volume, Cost reduction, raising performance.Printed circuit board manufacturing technology development trend is to high density, high accuracy, fine pore, thin wire, little spacing, highly reliable, multiple stratification, high-speed transfer, light weight, slim future development on performance.The wire of single sided board wherein only appears at wherein one side, and double sided board is the extension of single sided board, can carry out the circuit of conducting between two-layer by via hole, makes it to form needed network and connects.At present, during the printing process of conducting transmission line plate, usually adopt double faced adhesive tape that locking pin and plastic edge strip are sticked on the seat surface of base, in operation, complete locking pin need to be pulled down the time, can be on seat surface the cull of residual lower double faced adhesive tape; When wiring board is carried out to printed on both sides, these culls be easy to be stained with wiring board on the surface of that side of base, thereby cause the problems such as upper tin is bad, when serious, finally can cause scrapping of product; It is important to point out that between each needle body bottom and base plate, be easy to occur the phenomenons such as cull overflows between base plate and chassis, sealing is poor.Therefore, for above aspect, need to make rational improvement.
Summary of the invention
The purpose of this invention is to provide and a kind ofly strengthen sealing and stability between needle body bottom, base plate, pasting board, can avoid leaving over cull, easy accessibility, be convenient to clean, be conducive to improve the Double-layer seal type printing chassis structure of wiring board printing efficiency, to solve many deficiencies of prior art.
Purpose of the present invention is carried out specific implementation by the following technical programs:
A kind of Double-layer seal type printing chassis structure, comprise chassis, and a pin hole and flat-top needle body of the inner insertion of this pin hole are offered in described center chassis position, are positioned at this flat-top needle body periphery and are uniformly distributed some pilot pins;
Be positioned at chassis bottom surface level and lay a base plate, simultaneously, described floor below sets gradually some pasting boards from top to bottom, be positioned at each pilot pin lower end and base plate connecting position place sets up a sealing strip, at the sealing strip outer edge, between the outer edge on chassis, laying a circle sealing shroud and this sealing shroud and plate upper surface, join.
Correspondingly, the distance between each pilot pin and flat-top needle body is 12.8mm, and each pilot pin top is with an apex, and each pilot pin and flat-top needle body bottom surface are closely attached on plate upper surface.
The beneficial effect of Double-layer seal type printing chassis structure of the present invention is:
⑴ without using double faced adhesive tape locking pin can be fixed on base, can avoid leaving over cull in susceptor surface, can avoid the product quality problems that may cause due to cull;
⑵ by the structures such as base plate and pilot pin are set, have easy accessibility, be convenient to clean, be conducive to improve the advantages such as wiring board printing efficiency;
⑶ by below pilot pin and between base plate, setting up independently sealing strip, simultaneously, set up a circle sealing shroud between this sealing strip outer edge and chassis bottom surface, be conducive to strengthen sealing and the stability between needle body bottom, base plate, pasting board.
The accompanying drawing explanation
Below according to drawings and embodiments the present invention is described in further detail.
Fig. 1 is the structure chart of the described Double-layer seal type printing of embodiment of the present invention chassis structure.
In figure: 1, chassis; 2, pilot pin; 3, flat-top needle body; 4, base plate; 5, apex; 6, pin hole; 7, pasting board; 8, sealing strip; 9, sealing shroud.
Embodiment
As shown in Figure 1, the described Double-layer seal type printing of embodiment of the present invention chassis structure, comprise chassis 1, described chassis 1 center position is offered a pin hole 6 and flat-top needle body 3 of this pin hole 6 inner insertions vertically downward, be positioned at these flat-top needle body 3 peripheries and be uniformly distributed some pilot pins 2 and these pilot pins 2 point circular array formula distribution centered by flat-top needle body 3, the apex 5 that each pilot pin 2 top is triangular structure with a cross section;
Be positioned at chassis 1 a bottom surface level base plate 4 of laying and each pilot pin 2 and be closely attached on base plate 4 upper surfaces with flat-top needle body 3 bottom surfaces, the distance between each pilot pin 2 and flat-top needle body 3 is 12.8mm;
Simultaneously, described base plate 4 belows set gradually some pasting boards 7 from top to bottom, be positioned at each pilot pin 2 lower end and base plate 4 connecting position places set up a sealing strip 8, at sealing strip 8 outer edges, between the outer edge on chassis 1, laying a circle sealing shroud 9 and this sealing shroud 9, with base plate 4 upper surfaces, join.
Claims (4)
1. a Double-layer seal type printing chassis structure, comprise chassis, it is characterized in that:
A pin hole and flat-top needle body of the inner insertion of this pin hole are offered in described center chassis position, are positioned at this flat-top needle body periphery and are uniformly distributed some pilot pins;
Be positioned at chassis bottom surface level and lay a base plate, simultaneously, described floor below sets gradually some pasting boards from top to bottom, be positioned at each pilot pin lower end and base plate connecting position place sets up a sealing strip, at the sealing strip outer edge, between the outer edge on chassis, laying a circle sealing shroud and this sealing shroud and plate upper surface, join.
2. a kind of Double-layer seal type as claimed in claim 1 prints chassis structure, it is characterized in that: the distance between each pilot pin and flat-top needle body is 12.8mm.
3. a kind of Double-layer seal type as claimed in claim 1 prints chassis structure, and it is characterized in that: each pilot pin top is with an apex.
4. a kind of Double-layer seal type as claimed in claim 1 prints chassis structure, and it is characterized in that: each pilot pin and flat-top needle body bottom surface are closely attached on plate upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103277219A CN103402319A (en) | 2013-07-31 | 2013-07-31 | Double-layer sealed printing chassis structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103277219A CN103402319A (en) | 2013-07-31 | 2013-07-31 | Double-layer sealed printing chassis structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103402319A true CN103402319A (en) | 2013-11-20 |
Family
ID=49565803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103277219A Pending CN103402319A (en) | 2013-07-31 | 2013-07-31 | Double-layer sealed printing chassis structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103402319A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143530A (en) * | 1984-08-07 | 1986-03-03 | Seiko Epson Corp | Injection molding die for printed circuit board |
| CN1068728C (en) * | 1997-09-19 | 2001-07-18 | 日本胜利株式会社 | Motor, structure of stator of motor and assembly method of stator |
| CN201286196Y (en) * | 2008-09-24 | 2009-08-05 | 昆山鼎鑫电子有限公司 | Printed substrate for circuit board |
| CN203340433U (en) * | 2013-07-31 | 2013-12-11 | 无锡市伟丰印刷机械厂 | Double sealed printing chassis structure |
-
2013
- 2013-07-31 CN CN2013103277219A patent/CN103402319A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6143530A (en) * | 1984-08-07 | 1986-03-03 | Seiko Epson Corp | Injection molding die for printed circuit board |
| CN1068728C (en) * | 1997-09-19 | 2001-07-18 | 日本胜利株式会社 | Motor, structure of stator of motor and assembly method of stator |
| CN201286196Y (en) * | 2008-09-24 | 2009-08-05 | 昆山鼎鑫电子有限公司 | Printed substrate for circuit board |
| CN203340433U (en) * | 2013-07-31 | 2013-12-11 | 无锡市伟丰印刷机械厂 | Double sealed printing chassis structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131120 |
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| RJ01 | Rejection of invention patent application after publication |