CN103399622A - Manufacturing process of radiating module - Google Patents
Manufacturing process of radiating module Download PDFInfo
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- CN103399622A CN103399622A CN2013102729168A CN201310272916A CN103399622A CN 103399622 A CN103399622 A CN 103399622A CN 2013102729168 A CN2013102729168 A CN 2013102729168A CN 201310272916 A CN201310272916 A CN 201310272916A CN 103399622 A CN103399622 A CN 103399622A
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- radiating module
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Abstract
The invention discloses a manufacturing process of a radiating module. The manufacturing process includes the following steps: (1) copper block screen printing is carried out through a screen printing screen, die-casting fittings, riveting elements and fins in the radiating module are respectively provided with lead-free tin cream, heat conductive pipes, the die-casting fittings, the riveting elements and a protective cover are assembled and put into a baking jig, a CPU is locked, and after the fins are clamped by dovetail clips to be placed into a reflow oven and a cooling oven, product appearance is tested; (2) the temperature drop performance of a semi-finished product which undergoes baking and passes a test is tested, a fan is locked, the die-casting fittings and the riveting elements are buckled through E-type buckles, an insulating adhesive tape and a product label are attached, automatic scanning is carried out, buffering foam and auxiliary materials are attached, parallel degree detection of hole positions is carried out, an abnormal sound test of the fan is carried out, heat conductive cream screen printing is carried out, paint repair operations are carried out, a final test is carried out, and then the radiating module is packed as a qualified finished product. The steps of the manufacturing process is reasonable, scientific and efficient, humanized management is achieved, manufacturing efficiency of the radiating module is improved, and meanwhile production assembly line work is achieved, and production efficiency is improved.
Description
Technical field
The invention belongs to the laptop heat-dissipation technical field, be specifically related to a kind of manufacture craft of heat radiation module of notebook computer.
Background technology
Along with the fast development of electronic industry, the high speed of electronic component, high frequency and integrated its thermal value that makes increase severely, and therefore, heat radiation has become the problem that dealer institute emphasis is considered.
Heat radiation module (Thermal Module), as its name suggests, be to apply to the module group unit that system/device/apparatus etc. is made heat transmission, and this patent refers to use the heat abstractors (Cooler) such as the desktop computer of heat pipe and projector.Inner space characteristic because of notebook computer, palpus employing RHE(Remote Heat Exchanger) heat interchange concept solves the problem of system used heat, therefore, the heat abstractor of notebook computer consists of heat conduction section, radiating segment and the large main part of elastic force locked mechanism three and attached subsides part basically, wherein, heat pipe is shouldered quick heat conducting role in the heat conduction section, fan provides forced convertion required air-flow for radiating segment, is respectively the technological core of heat conduction section and radiating segment.
Convention is as can be known, and area of dissipation is larger, and conduction efficiency is higher, just distribute heat more effectively.At present common heat radiation module is the thin heat-dissipating aluminium plate measure-alike with it that be sticked on components and parts to be dispelled the heat, on this aluminium sheet, has the copper conductor tube of a high thermal conductivity, and in the other end of copper conductor tube, some heat radiator are set, this heat radiator is connected to the computer side, from then on heat is shed outside computer, and by radiator fan, these some heat radiator are forced to heat interchange, improve radiating effect.
Yet, but for this heat radiation module, also form at present the manufacture craft of the ripe streamline production of a cover, cause existing method for making at random, without chapters and sections, be not suitable for modern industrial flow-line operation.
Summary of the invention
The invention provides a kind of manufacture craft of the module that dispels the heat, intactly formed the making of this heat radiation module, processing step is reasonable, and scientific and effective, and human-based management has improved the make efficiency of heat radiation module, simultaneously, has realized the production line operation.
In order to reach above purpose, the technical scheme of employing: a kind of manufacture craft of the module that dispels the heat, it comprises the following steps,
1), adopt the wire mark web plate to carry out wire mark to copper billet, and after the die casting in the module that will dispel the heat, riveted spare, fin put lead-free tin cream respectively, by in the baking tool of packing into after heat pipe, die casting, riveted spare, over cap assembling, sealed CPU, and with after dovetail clip clamping fin Overwelding and rewelding furnace, cool furnace, half product appearance of testing;
2), will toast and semi-manufacture temperature drop performance test after the assay was approved, fan is sealed, on die casting and riveted spare, carry out the E type and buckle fastening, carry out being placed with of insulating tape, Product labelling, automatic scanning, after being placed with of buffering foam, supplies again, carry out hole bit parallel degree check, the different sound test of fan, then heat-conducting cream wire mark, touch-up paint is inspection eventually, and certified products are packed and are got product.
Beneficial effect of the present invention: intactly formed the making of heat radiation module, processing step is reasonable, and scientific and effective, and human-based management has improved the make efficiency of heat radiation module, simultaneously, has realized the production line operation, has improved production efficiency.
The accompanying drawing explanation
Fig. 1 making process flow diagram of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.
A kind of manufacture craft of the module that dispels the heat comprises the following steps,
1), adopt the wire mark web plate to carry out the copper billet wire mark, after die casting, riveted spare, fin in the heat radiation module are put to lead-free tin cream respectively, again assembling heat conductivity pipe, die casting, riveted spare, over cap pack into the baking tool in, and sealed CPU, with after dovetail clip clamping fin Overwelding and rewelding furnace, cool furnace, check semi-manufacture outward appearance;
2) the semi-manufacture temperature drop performance test that, will toast and be up to the standards, fan is sealed, and on die casting and riveted spare, carries out the E type and fasten, and then carries out insulating tape respectively, Product labelling is placed with, automatic scanning, being placed with of buffering foam, supplies, then carry out hole bit parallel degree check, the different sound test of fan, after the heat-conducting cream wire mark, touch-up paint, inspection eventually, the certified products packing is finished product.
Specifically, as shown in Figure 1, the manufacture craft of this heat radiation module comprises:
1), will dispel the heat heat pipe, die casting, copper billet, fin in module put respectively after lead-free tin cream in the assembling parts tool of packing into, and it is sealed to carry out C type folder, successively Overwelding and rewelding furnace, cool furnace cooling after, remove C type folder, and carry out semi-finished product inspection, and then carry out the temperature drop performance test, then carry out sealed carry out hole bit parallel degree check, the different sound test of fan with fan, carry out again the heat-conducting cream wire mark, reach being placed with of insulating tape, buffering foam, packing fan and auxiliary material;
2), after adopting the wire mark web plate to carry out copper billet wire mark assembling heat conductivity pipe, die casting, over cap, fin is put to tin cream, over cap and die casting carry out craft point tin, then after sealed CPU, toast, afterwards through reflow stove, cool furnace, after semi-manufacture and baking tool classifys and separated, check qualified and underproof product are separated;
3), assembling: the semi-manufacture after toasting carry out cooling test, carry out again fan sealed, assembling E type is buckled and clasp on die casting, automatic scanning, after pasting successively the wire mark, acetic acid adhesive plaster at CPU, radiating pad seat, CPU insulating tape, CPU place, after carrying out fan functionality test, the product depth of parallelism and hole bit test, certified products are finished product.
4), finished product is carried out to surface treatment after, touch-up paint, the packing.
The above technical scheme that the embodiment of the present invention is provided is described in detail, applied specific case herein principle and the embodiment of the embodiment of the present invention are set forth, the explanation of above embodiment is only applicable to help to understand the principle of the embodiment of the present invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the present invention, on embodiment and range of application, all will change, in sum, this description should not be construed as limitation of the present invention.
Claims (1)
1. the manufacture craft of the module that dispels the heat, is characterized in that, comprise the following steps,
1), adopt the wire mark web plate to carry out wire mark to copper billet, and after the die casting in the module that will dispel the heat, riveted spare, fin put lead-free tin cream respectively, by in the baking tool of packing into after heat pipe, die casting, riveted spare, over cap assembling, sealed CPU, and with after dovetail clip clamping fin Overwelding and rewelding furnace, cool furnace, half product appearance of testing;
2), will toast and semi-manufacture temperature drop performance test after the assay was approved, fan is sealed, on die casting and riveted spare, carry out the E type and buckle fastening, carry out being placed with of insulating tape, Product labelling, automatic scanning, after being placed with of buffering foam, supplies again, carry out hole bit parallel degree check, the different sound test of fan, then heat-conducting cream wire mark, touch-up paint is inspection eventually, and certified products are packed and are got product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013102729168A CN103399622A (en) | 2013-07-02 | 2013-07-02 | Manufacturing process of radiating module |
Applications Claiming Priority (1)
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CN2013102729168A CN103399622A (en) | 2013-07-02 | 2013-07-02 | Manufacturing process of radiating module |
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CN103399622A true CN103399622A (en) | 2013-11-20 |
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CN2013102729168A Pending CN103399622A (en) | 2013-07-02 | 2013-07-02 | Manufacturing process of radiating module |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2193561Y (en) * | 1994-03-11 | 1995-03-29 | 协禧电机股份有限公司 | Improved radiator for C.P.U of Computer |
US5603374A (en) * | 1996-04-05 | 1997-02-18 | Malico Inc. | Heat sink assembly for an integrated circuit |
CN1348679A (en) * | 1998-11-04 | 2002-05-08 | 扎尔曼技术株式会社 | Heatsink for electronic component, and apparatus and method for manufacturing the same |
JP3162275U (en) * | 2010-06-15 | 2010-08-26 | 奇▲こう▼科技股▲ふん▼有限公司 | Heat dissipation module |
-
2013
- 2013-07-02 CN CN2013102729168A patent/CN103399622A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2193561Y (en) * | 1994-03-11 | 1995-03-29 | 协禧电机股份有限公司 | Improved radiator for C.P.U of Computer |
US5603374A (en) * | 1996-04-05 | 1997-02-18 | Malico Inc. | Heat sink assembly for an integrated circuit |
CN1348679A (en) * | 1998-11-04 | 2002-05-08 | 扎尔曼技术株式会社 | Heatsink for electronic component, and apparatus and method for manufacturing the same |
JP3162275U (en) * | 2010-06-15 | 2010-08-26 | 奇▲こう▼科技股▲ふん▼有限公司 | Heat dissipation module |
Non-Patent Citations (2)
Title |
---|
彭鸣刚: "手动SMT生产线工艺作业升华", 《网印工业 》 * |
彭鸣刚: "手动SMT生产线工艺作业升华", 《网印工业》 * |
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Application publication date: 20131120 |