CN103392227A - Mobile, transportable electrostatic substrate retaining arrangement - Google Patents
Mobile, transportable electrostatic substrate retaining arrangement Download PDFInfo
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- CN103392227A CN103392227A CN2011800598823A CN201180059882A CN103392227A CN 103392227 A CN103392227 A CN 103392227A CN 2011800598823 A CN2011800598823 A CN 2011800598823A CN 201180059882 A CN201180059882 A CN 201180059882A CN 103392227 A CN103392227 A CN 103392227A
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- substrate holder
- carrier
- holding apparatus
- substrate holding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A mobile, transportable electrostatic substrate retaining arrangement (1) for thin, wafer-like workpieces and for use at high temperatures with a substrate retainer (2, 20, 30, 40), which comprises at least one retaining device (31 - 34, 41 - 44) which comprises an electrode pair (31.1, 31.2, 32.1, 32.2, 33.1, 33.2, 34.1, 34.2; 41.1, 41.2, 42.1, 42.2, 43.1, 43.2, 44.1, 44.2), and with a support (3) for the substrate retainer (2, 20, 30, 40) is characterized in that the substrate retainer (2, 20, 30, 40) is mechanically connected to the support (3) via at least one lateral edge (2a, 2b, 2c, 2d) in a manner that is at least mostly thermally decoupled.
Description
Technical field
The present invention relates to movement, transportable electrostatic substrate maintenance equipment for thin sheet-like workpiece and at high temperature use, the carrier that this electrostatic substrate maintenance equipment has substrate holder and is used for substrate holder, this substrate holder has at least one and comprises the holding device of electrode pair.
Background technology
Static static retainer be known and in the situation that process sheet, conductor and Semiconductor substrate, especially use in the production equipment of semi-conductor industry.The use of static static retainer has following shortcoming: at first substrate must be positioned on static retainer and must again from this static retainer, take away after processing.Therefore, it is impossible being transported to outside next-door neighbour's equipment region together with the static retainer.
By the DE 203 11 625 known a kind of movements of U1, transportable electrostatic substrate retainer.Substrate can be disposed in this retainer place and with electrostatic force, maintain.This substrate can and be positioned on static retainer with the substrate holder associated movement.This means, transportable retainer does not have energy or the voltage supply device of oneself.Therefore, by transportable retainer, only transporting safely of substrate just may under certain condition.The frequent problem that occurs is limited serviceability temperature in all types of static retainers, mostly＜200 ℃.
In addition, when known electrostatic substrate retainer should in a vacuum and use under the temperature conditions that is improving, there is restriction in these electrostatic substrate retainers.For mobile retainer, the electric insulation effect of crucial especially is nearly all common used material is in temperature〉reduce in 300 ℃ of situations.Cause thus the leakage current that improves also to cause again thus the quick consumption of institute's stored energy.
Summary of the invention
Task of the present invention is to provide mobile transportable electrostatic substrate and keeps equipment, and it is guaranteed transportation reliably and guarantees reliable maintenance to substrate substrate being processed with In transit.This substrate holding apparatus should be constructed to make the result of substrate can or seldom not to be subject to the impact of substrate holding apparatus and be reproducible thus in addition.
Movement, the transportable electrostatic substrate maintenance equipment solution of this task by being used for thin sheet-like workpiece and at high temperature using, the carrier that this electrostatic substrate maintenance equipment has substrate holder and is used for substrate holder, this substrate holder has at least one and comprises the holding device of electrode pair, wherein at least at utmost hot decoupling of substrate holder ground and described carrier mechanical connection.Unlike the prior art, (additional) carrier regularly with the substrate holder mechanical connection, but with substrate holder decoupling (aspect heat and space), make this carrier not be placed in identical reverse procedure condition.Even thus in the situation that (substrate) temperature greatly about 400 ℃ and highlyer also can realize mobile, transportable substrate holding apparatus.
Carrier is mobile and movable equally, and can cancel the static substrate holder in process equipment.Carrier can be positioned in addition outside actual machining area, thereby carrier does not need to be placed in completely under processing temperature.Substrate holding apparatus of the present invention is thus suitable for transporting and keeps thin and frangible workpiece thus.Application in a vacuum is possible.Also can be for example〉apply under the temperature conditions of the raising of 400 ℃.The transportation of substrate and maintenance are possible, need not the front of part or even complete coating workpieces (being substrate).Be avoided by covering of mechanical holder.Keeping (loose keep flat or keep fixture or hook), the attendant advantages that static keeps with respect to pure machinery is to avoid chip back surface do not expected coating.Another advantage is higher setting accuracy/more accurate location positioning, significantly simplify in solar industry thus commonly used, automation fast (wafer the processing time＜1s).
Transportation and the maintenance of workpiece in low pressure plasma is also possible.Can use in many aspects substrate holding apparatus of the present invention thus.Can keep substrate in different processing stations with same substrate holding apparatus in addition.Substrate need to be not unclamped from substrate holder between processing station, and this makes can be reliably and the crackly substrate of full automation ground transportation.Especially can be under high-temperature condition, for example in the solar cell manufacturing, substrate holding apparatus of the present invention is used in (vacuum) coating procedure.The advantage of using in the solar cell manufacturing is by the possibility of the possibility of unsheltered coating, automatic transportation and be used for keeping the possibility of substrate to draw under vacuum and high temperature substrate holding apparatus.
In addition, substrate holder is via the at utmost hot decoupling of at least one lateral edges ground and carrier mechanical connection., as long as the heat conductivility of substrate holder in plane that is constructed to smooth and plane basically be less than the heat conductivility being parallel on the direction that its plane normal extends, via the mechanical connection of lateral edges, be exactly favourable.Thereby only via the machinery that just can complete the hot decoupling of degree greatly that interconnects of edge side, fixing of substrate holder and carrier.
The substrate holder that is fixed on the carrier place at edge side can also be transferred in the processing or processing region of substrate processing station fully thus, carrier can remain on outside the processing or machining area of processing station simultaneously.Carrier and substrate holder are preferred in the case to be electrically connected to mutually.
The substrate holder on plane is appreciated that such geometry at this, and it has than extension larger on the direction perpendicular to this plane in plane.Therefore substrate holder has the extension that overlaps with substrate plane, and this extends remarkable thickness greater than substrate holder.
Can stipulate according to preferred configuration of the present invention, with carrier, be connected to the substrate holder point-like.Especially can consider substrate holder only is connected with carrier at one or two some place.Draw thus the further hot decoupling of carrier and substrate holder.
Can consider in addition substrate holder is connected with carrier by one or more, as to have heat insulator contact pin.Can at least farthest suppress thus the heat conduction of substrate holder to carrier.
At least one contact pin also can be comprised of heat insulator fully.But it is also conceivable that in addition with substrate holder via unique, on whole lateral edges and the contact pin of towards carrier, extending be connected with carrier.This contact pin can have in the case at least partly can be relatively or the thickness less than substrate holder with substrate holder, and only due to its geometric configuration and only little and almost the smaller cross-sectional area on insignificant degree just helped inevitable heat transmission between substrate holder and carrier.
It is also conceivable that in the case, the integrated component part that at least one contact pin is constructed to substrate holder divide or over all Integration in substrate holder.Also contact pin for example can be configured to stretch out the convex shoulder of the lateral edges of smooth substrate holder, described convex shoulder for example provides electricity and/or Mechanical Contact or the coupling between substrate holder and carrier.As long as substrate holder has substrate for example and is arranged in electric insulation layer on this substrate and the layer structure of conductive layer form, at least one contact pin just can for example be constructed to stretching out at least partly of this substrate be positioned at above substrate layer the convex shoulder of lateral edges.
The thermal insulation mechanical connection of substrate holder and carrier provides at least one imaginary hot separation plane, and described hot separation plane preferred parallel is extended towards the lateral edges of carrier at least in substrate holder.Especially stipulate, this separation plane is hypothetically passed by at least one thermal insulation contact pin.The plane normal that therefore described one or more contact pin be parallel to the hot separation plane that can consider at least between carrier and substrate holder extends.
Carrier can have the energy storage device of oneself, typically with the form of charge accumulator, and can be electrically connected to at least one holding device or with at least one holding device, be electrically connected to.This means, can be in carrier and thus with substrate holder spatially have distance ground to arrange to use charge accumulator (for example one or more capacitors, battery or storage battery) especially oneself or autonomous voltage supply device.Especially can arrange charge accumulator and may add the electronic installation that needs in the carrier under being placed in the temperature lower than substrate holder, for example transformer be as the parts of voltage supply device.Can guarantee thus the more reliable function of substrate holder.In addition can with this electronic installation and charge accumulator through encapsulation be arranged in carrier, thereby protect them to avoid the process environment of the course of processing.The layout of separating on especially can the space by carrier and substrate holding apparatus, prevent that carrier from being crossed and forced heat and prevent the coated or etching of carrier.Carrier spatially can be separated with substrate holder in processing station thus, but however also with substrate holder, arrange with being connected.Can consider in addition the machinery between substrate holder and carrier and/or be electrically connected to and can get loose.Can change when needed carrier or substrate holder thus.
Carrier can have circuit, so that conversion is at the voltage at least one holding device place and/or carry out controlled ON/OFF.Expansion favourable according to another, charge accumulator or connected circuit are configured to the electrode of at least one holding device is carried out asymmetrical electromotive force supply.Can adjust the electromotive force of substrate thus.For example can apply at an electrode place+electromotive force of 200 volts, and apply the electromotive force of-600 volts at another electrode place.At this, substrate potential=(electromotive force of the electromotive force+electrode 2 of electrode 1)/2.This circuit can also be configured to confining force is controlled (controlled " ON/OFF " with short as far as possible switching time) targetedly.The electric charge that for example may occur in insulator under high-temperature condition moves also and can be balanced by controlling targetedly electrode.In another favourable configuration modification, can arrange in substrate holder and allow to pass substrate holder and handle the opening of substrate.Thereby for example can substrate be mentioned to take away from substrate holder by pin or pressure., for substrate is unclamped, can also stipulate electrode pair is discharged., if set up permanent charge in substrate holder, can change these permanent charges are carried out balance by voltage/polarity targetedly, to eliminate confining force fully.
For the electric connection construction with between carrier and substrate holder for not only by mechanical protection but also electric insulation, this electrical connection favourablely can be surrounded by heat insulator at least partly.Especially extension in the contact pin mentioned or point-like connection can electricity be connected in this electrical connection in the above with thermal insulation.In addition, this electrical connection can be constructed carrier and the interconnective contact pin of substrate holder discretely with at least one, perhaps also can be integrated in the contact pin that hot decoupling is provided.
According to favourable configuration, carrier can be configured to shaped as frame.Carrier in the case can be along the sealing or surround substrate holder fully on circumferential direction of whole lateral edges, wherein the carrier frame with remain on the carrier frame in substrate holder between be connected preferably and undertaken by one or more thermal insulation contact pin.Except around the carrier frame, the carrier that only surrounds partly lateral edges can also be set, for example L shaped carrier or U-shaped carrier, these carriers can be assigned with respectively two or three lateral edges that directly adjoin each other of substrate holder.
Replace or add, can consider carrier is constituted socket.This socket can have basically square profile and extend the lateral edges towards this socket of substrate holder.That is to say, this socket can have the longitudinal extension longer than the lateral edges of substrate holder.
This socket can be constructed to, and makes it allow substrate holding apparatus to be connected to (straight line) transportation system (for example bus system, rolling-operation device, transport tape).Replace, the transportation system that this socket can also be designed to rotate, wherein carrier moves or swings along the circle band.Especially, substrate holding apparatus can be built as for the transportation system based on one or more revolving feed tables, and each substrate that wherein is maintained at the substrate holder place can move to next processing or treating stations from a processing or treating stations by rotation or the oscillating motion of revolving feed table.
Substrate holder can be disposed on arbitrary orientation with respect to carrier.The socket of hot decoupling also can be as the interface/accessing points of other transportation system's type, such as lift unit or swing unit, robots arm etc.This allows in ongoing automatic change in service position.In all modification of the connection to transmission system, hot decoupling is important aspect, because such system generally is unsuitable for the high temperature that substrate holder has.Therefore can process the substrate (and retainer of heat) of heat, and can not make transportation system overheated or by too high (to transportation system) thermal losses, than expecting, make quickly substrate cooling.Result exists high potential to save the energy in producing at this.If substrate holder is vertically oriented, advantageous particularly.This means, the substrate that is disposed in the substrate holder place is vertically oriented equally.Substrate can vertically be arranged in processing station thus.Can avoid thus the error that causes by the particle that may keep flat on the substrate of horizontal alignment.Whole electric parts such as circuit or charge accumulator can be arranged in socket by protectorate.Possible is that substrate holder self can be constructed to have relatively little thermal mass thus.
Advantageously, carrier can have electric contact points and/or be used for the device that inductive energy transmits.If carrier has electric contact points, these electric contact points can be connected to charging station especially simply so that charge accumulator is charged.In addition, can be via the electric contact points signal transmission.But it is also conceivable that contactlessly charge accumulator is charged.For this reason advantageously, be provided for the device of inductive energy transmission.
When having a plurality of holding device, substrate holder draws special advantage.Thus can be simultaneously with a plurality of substrate arrangement with remain on this substrate holder place.Consequently, a plurality of substrates can be transported and be processed in a processing station simultaneously.
At this, a plurality of holding devices can be connected to same charge accumulator concurrently, and perhaps each holding device can be connected to the charge accumulator of oneself.The advantage of only using a charge accumulator that is connected to a plurality of holding devices to have is, must use less charge accumulator, can reduce structure size thus.The advantage of using charge accumulator to have for each holding device is, can be separately to the substrate charging and discharging, because holding device can be controlled separately.
The link of the electrode of (one or more) holding device can outwards be drawn on the front of substrate holder, perhaps by hole or around the seamed edge of substrate holder, be drawn out on the back side of substrate holder.Therefore, can select suitable link according to the configuration of substrate holding apparatus.A plurality of holding devices can also be in substrate holder/just interconnect on substrate holder.
According to another preferred configuration, at least one holding device is arranged in the smooth plane of substrate holder flatwise, wherein the smooth plane of substrate holder is limited by at least one lateral edges in side, and substrate holder is via described at least one lateral edges and carrier mechanical connection.Therefore substrate holder has the flat and smooth basic structure in large as far as possible degree ground, and wherein lateral edges is compared and had smaller plane with the holding device in the plane that is arranged on substrate holder.Geometrical basic shape by substrate holder and by it, with the edge side of carrier, being connected, only because this geometrical relationship just can be carried out the at utmost hot decoupling of carrier and substrate holder, even substrate holder should be also like this via its whole lateral edges and carrier mechanical connection.
According to another preferred configuration, substrate holder has respectively at least one holding device in front and at the back side that deviates from front.That is to say, substrate holder mirror image basically builds symmetrically, and both can also can keep simultaneously a plurality of substrates at its back side in its front.In this way and method, can process simultaneously double so much substrate in a processing or treating stations, perhaps can process simultaneously substrate in two treating stations.
In the case, according to a kind of expansion, especially can stipulate, be arranged on front and be arranged on accordingly the back side and the holding device that arranges of overlapping each other has at least one common electrode or corresponding electrode pair therewith.Thereby only utilize unique at the front and back place, for example can get loose simultaneously at least two substrates and static of the electrode pair of equipment placed in the middle keeps at least two substrates between front and back.In the case, this electrode can replace the substrate of the substrate holder that builds in each layer.
, if the carrier that is connected with substrate holder also has the symmetry of regulation, it is also conceivable that transport substrates keeps equipment at least two different orientations of processing station except substrate holder.Thereby for example can consider to come transport substrates keep equipment and be orientated by turning to second of same or another processing station the transport substrates maintenance equipment that comes up accordingly according to the first orientation of processing station.Can reduce thus the quantity of needed treating stations and/or extend and for example processing station be cleaned needed service intervals.In the case, especially can stipulate, substrate holder and/or carrier are that substrate holder and carrier extend about passing, for example imaginary axle is symmetrically constructed.This axle in the case can be abreast greatly between the lateral edges that extends away from carrier of substrate holder medially and be parallel to these lateral edges and extend., by preferred 180 ° of the described axle rotation around as rotating shaft, can transport substrates keep equipment on the postrotational orientation of the processing station that correspondence configures.
Configuration preferred according to another, substrate holder and/or carrier are also constructed symmetrically about the plane that overlaps with substrate holder picture substantially on show.
Finally, according to another preferred configuration regulation, socket be connected with substrate holder connection have less than 100W/K, preferably less than 10W/K, preferably less than the thermal conductance value of 1W/K, preferred have less than 0.1W/K or less than the thermal conductance value of 0.01W/K.The absolute hot decoupling of substrate holder and carrier possibly can't be provided due to mechanical connection certainly.Therefore the above-mentioned parameter scope has been showed the different hot decoupling degree that will consider between carrier and substrate holder.
According to another preferred configuration, at least one, with substrate holder and the interconnective contact pin of carrier also can have less than 100W/ (m*K), preferably less than 30W/ (m*K), be more preferably less than the specific heat conductance of 5W/ (m*K).Thereby can consider, material that thermal insulation effect be provided different for contact pin.Thereby at least one contact pin for example has following material or even basically by this material, is formed fully: stainless steel, titanium, Al
2O
3, quartz, glass, glass ceramics or other ceramic material or be applicable to the plastics of serviceability temperature.
According to another preferred configuration, at least one of substrate holder also can be at least 10:1 towards the area of the lateral edges of carrier with the size of the cross-sectional area of the contact pin that is adjacent, and is preferably 100:1 at least., by the structure contact pin smaller with respect to the cross-sectional area of lateral edges, the thermal conductance of contact pin can be minimized and improve or maximize thus the hot decoupling of carrier and substrate holder.
According to another preferred configuration, at least one contact pin also can have the length greater than the thickness of substrate holder.Under current situation, thickness refers to the extension of substrate holder along its plane normal.
Also can arrange heat shield element between carrier and substrate holder, the hot separation plane of this heat shield element preferred parallel between substrate holder and carrier extended.This heat shield element can and especially act as the type of heat reflector with the outside dimension coupling of the outside dimension of carrier and substrate holder in the case, by this heat shield element, can protect carrier to exempt from thermal radiation.
Heat shield element preferably has one or more barricades, and it preferably extends at the plane normal of the substrate holder that is parallel to flatly structure and in being parallel to the plane of the lateral edges towards carrier of substrate holder.Heat shield element in the case preferred arrangements between carrier and substrate holder and can be passed by at least one contact pin.
In this external scope of the present invention, transportation system has a plurality of substrate holding apparatus of the present invention, have substrate holding apparatus wherein can swing between transporting position and charge/discharge position charging and/or discharge station, and have for substrate holding apparatus is transported to the conveying arrangement of substrate processing station from the charge/discharge station.Such transportation system has the following advantages: substrate do not need directly at machining location processed or there on static holding device/from static holding device charging and discharging.Especially can consider, when manufacture process starts, for example when solar cell is made, substrate arrangement be passed through and had the equipment of a plurality of substrate processing stations at the substrate holding apparatus place and then, and need not to change substrate holding apparatus., by using charging station and/or discharge station, can, with being used for the substrate holder horizontal alignment of charging and discharging, make substrate to be applied on substrate holder simply.After the electrode application voltage to holding device, substrate is remained on the substrate holder place reliably, so make the position that can change substrate holding apparatus, thereby substrate holder and the substrate that is fixed on thus in substrate holder for example can be vertically oriented.In this position, substrate can betransported and process.
In order, to the charging memory charging of carrier, advantageously charging station to be set in transportation system.
Other features and advantages of the present invention are by following figure by accompanying drawing to the description of the embodiment of the present invention and by claim, drawn, and described accompanying drawing illustrates the details important to the present invention.Each feature can be respectively individually or a plurality of form with combination in any play a role in modification of the present invention.
Description of drawings
The preferred embodiments of the present invention are schematically shown in the accompanying drawings, and figure with reference to the accompanying drawings sets forth.Wherein:
Fig. 1 illustrates the extreme of substrate holding apparatus schematically to scheme;
Fig. 2 illustrates the sectional view of substrate holder;
Fig. 3 illustrates the partial cross section figure of substrate holder;
Fig. 4 illustrates be used to showing a kind of partial cross section figure that replaces the substrate holder of contact;
Fig. 5 illustrates the partial cross section figure of the substrate holder with another contact modification;
Fig. 6 illustrates the partial cross section figure with another substrate holder that contacts modification;
Fig. 7 illustrates and shows that a plurality of holding devices are connected to the schematic diagram of single voltage supply device or charging memory (electronic installation);
Fig. 8 illustrates the schematic diagram that contacts each holding device by single voltage supply device or charging memory (electronic installation) for showing;
Fig. 9 illustrates the extreme of transportation system schematically to scheme;
Figure 10 illustrates the vertical view of the substrate holding apparatus with shielding element;
Figure 11 illustrates the end view according to the substrate holding apparatus of Figure 10;
Figure 12 illustrates the substrate holding apparatus with the carrier that is configured to shaped as frame;
Figure 13 illustrates the cross-sectional view according to the substrate holding apparatus of Figure 12;
Figure 14 illustrates the cross-sectional view of the substrate holding apparatus that is arranged in the substrate processing station with the first configuration;
Figure 15 illustrates the substrate holding apparatus in the substrate processing station according to the second configuration;
Figure 16 illustrates the cross section of another substrate processing station, and this another substrate processing station has the processing unit that is arranged on the substrate holding apparatus both sides;
Figure 17 illustrates the substrate holding apparatus that is added with symmetrical plane according to Fig. 1;
Figure 18 illustrates the substrate holding apparatus with shielding element according to Figure 10 with perspective view, and
Figure 19 illustrates the sectional view of double-sided substrate retainer.
Embodiment
Fig. 1 illustrates the substrate holding apparatus 1 with substrate holder 2 and carrier 3.Substrate holder 2 is connected with carrier 3 via two contact pin 4,5 point-like ground of being made by heat insulator in this embodiment.Substrate holder 2 has basically smooth profile, and this profile has four lateral edges 2a, 2b, 2c and 2d, wherein lower edge 2d towards carrier 3 ground via two contact pin 4,5 and carrier 3 mechanical connections.Contact pin 4,5 is arranged in the outside angle of being in of lower edge 2d in the case, lower edge 2d via these angles be transitioned into lower edge 2d vertically or the lateral edges 2a that extends vertically, in 2b.
Arrange that in carrier 3 static keeps needed electronic installation or circuit and charge accumulator.This electronic installation or charge accumulator are via in the inner electric line of extending of contact pin 4,5, with the counter electrode at substrate holder 2 places, being connected.In this embodiment, substrate holder 2 is designed to keep 4 substrates 6 to 9.Carrier 3 has contact-making surface 10, and carrier 3 can be positioned on this contact-making surface or utilize this contact-making surface to be connected with transportation system.Substrate holder 2 is orthogonally oriented with this carrier.Therefore substrate 6 to 9 is orthogonally oriented equally.They only are maintained at substrate holder 2 places because of electrostatic force.
Fig. 2 illustrates the sectional view of substrate holder 20.Substrate holder 20 has electrically insulating base 21.Arrange alternatively electric insulation layer 22 on substrate 21.Substrate 21 for example can be configured to glass ceramics and electric insulation layer 22 for example can be configured to pottery.Apply conductive layer 23 on layer 22, described conductive layer is structured to, and makes the electrode 25,26 that has two that be electrically insulated from each other, areas of preferably having formed objects for each substrate to be kept 24.Other electric insulation layer 27 is set above conductive layer 23.This layer can be applied only on the front of substrate holder 20 or surround substrate holder 20 fully, as example as shown in FIG. 3.In addition, layer 27 can be comprised of the many levels of different materials, to reach the characteristic of expectation.The link of electrode 25,26 can or outwards be drawn on front, as schematically showing in Fig. 4, or by hole directs, arrive the back side, as schematically showing in Fig. 5.Replace, electrode can guide and be directed to around the seamed edge of substrate holder 20 back side of substrate holder.This is shown in Figure 6., for contact electrode 25,26, space 28 is set in case of necessity in insulating barrier 27, for example referring to Fig. 4.
Schematically show substrate holder 30 in Fig. 7, it has 4 holding devices 31 to 34.Each holding device 31 to 34 has the electrode 31.1,31.2,32.1,32.2,33.1,33.2,34.1,34.2 of two about formed objects.Electrode 31.3,32.1 in the embodiment of Fig. 7, and 33.1 and 34.1 are connected in series mutually.This external electrode 31.2,32.2,33.2 and 34.2 is connected in series mutually.Draw thus the parallel circuits of holding device.Therefore only need two links 35,36 that must be connected with charge accumulator.Can adopt unique charge accumulator thus in order to be that 4 holding devices, 31 to 34 supply voltages also remain on substrate holder 30 places with 4 substrates thus.
Figure 10 illustrates with respect to the other substrate holding apparatus 11 of substrate holding apparatus shown in Figure 11 through revising, this substrate holding apparatus 11 has the heat shield element 52 that extends in parallel with lower edge 2d in addition as Figure 18 illustrates with having an X-rayed, for example with the form of barricade.Barricade 52 extends as the plane that is substantially perpendicular in addition substrate holder 2 can seeing in Figure 11 and 13, and therefore can provide substantially perpendicularly by the hot separation plane of along the mutual spaced contact pin 4,5 of lateral edges 2d, passing.
Preferable configuration is that the shielding element 52 of heat shield plate can hinder the zone that is arranged in substrate holder 2 and act on substrate 6,7, and 8,9 thermal radiation arrives the carrier 3 that is positioned at the substrate below and correspondingly reflects this thermal radiation.
Also show in Figure 10, electrically contacting between carrier 3 and substrate holder 2 14,15 also can be extended outside contact pin 4,5.
Figure 12 and 13 illustrates the replacement configuration of substrate holding apparatus 11, wherein utilizes 4 contact pin 4a altogether, 5a, and 4b, 5b remains on shaped as frame carrier 54 places with substrate holder 2.So 4 lateral edges 2a of substrate holder 2,2b, 2c, 2d fully by around framework 54 surround, wherein at the inboard of framework 54 and the lateral edges 2a of substrate holder 2,2b, 2c, arrange the shielding element 52 of at least one corresponding moulding between 2d, for example with the form of a plurality of barricades.
Make and can transport substrates keep equipment 11 on the different orientation for the treatment of stations 104,105 as the shaped as frame configuration as shown in Figure 12 and 13.Thereby Figure 14 to 16 illustrates different processing station 104,105,106, and for example substrate holding apparatus 1,11 can successively be transported to these processing stations.Processing or treating stations 104,105,106 have respectively shell 110, and this shell has for holding fragment 112 under the carrier 3 of substrate holding apparatus 1,11.
Be set to substrate 6,7 processing unit 115 that 8,9 coatings are set below for example and in processing that Figure 15 medium-height grass is painted or treating stations 105.In the case, substrate holding apparatus 11 enters or passes treating stations 105 with an orientation, the front 12 of substrate holder 2 on this orientation towards processing unit 115.
Figure 16 illustrates the configuration of other substrate holder 50 finally, this substrate holder 50 both comprised the holding device of electrode pair also having at least one on it deviates from positive 12 the back side 13 on its front 12, to be used for keeping respectively at least one substrate 6a, 6b, 9a, 9b.By being configured to substrate holder 12 at bilateral and keeping simultaneously a plurality of substrate 6a, 6b, 9a, 9b, substrate holder 12 can be arranged in for example for coating or heating and in the space between two processing units 115 that arrange for the treatment of stations 106, thereby can process simultaneously the substrate 6a that keeps on 13 on positive 12 and overleaf, 9a or 6b, 9b.
Also can consider according to the configuration of replacing, the holding device that is arranged on the relative side of substrate holder 50 has shared electrode pair, thereby same electrode is not only as the parts of front holding device but also as the parts of back side holding device.Kind electrode in the case can be as substrate and coated on insulation ground, both sides.
But draw the cross-sectional view of the ergosphere structure of such double-sided substrate retainer 50 Figure 19 medium-height grass.Thereby substrate holder 50 has substrate 21 and has respectively electric insulation layer 22a, 22b in both sides.At insulating barrier 22a, on 22b, in the side that mutually deviates from, apply respectively conductive layer 23a, 23b, for each substrate 24a to be kept, 24b embeds respectively the electrode 25a of two electrically insulated from one another, 26a or 25b, 26b in described conductive layer.
At conductive layer 23a, the 23b top arranges respectively other electric insulation layer 27a, 27b.Bilateral layer structure as shown in Figure 19 in the case basically with bilateral layer structural correspondence according to Fig. 2, thereby the general type of action that keeps with regard to static is similarly with reference to the embodiment according to Fig. 2 to 8.
Last symmetrical plane shown in Figure 17 16, substrate holding apparatus 1, substrate holder 2 and/or carrier 3 can substantially symmetrically be constructed about this symmetrical plane 16.It is also conceivable that, substrate holder 2 and/or carrier 3 be also about imaginary axis 17 point symmetries or structure symmetrically, and this imaginary axis extends in mid-plane or symmetrical plane 16 and the connection that is arranged essentially parallel to contact pin 4,5 is extended ground and is orientated.
Thereby especially can also stipulate, substrate holding apparatus 1 or its substrate holder 2 and/or its carrier 3 are by being transitioned on the orientation that is suitable for respective handling station 104,105 about 17 rotations of mid point axle.
Claims (26)
1. electrostatic substrate maintenance equipment (1 movement that is used for thin sheet-like workpiece and at high temperature uses, transportable; 11), this electrostatic substrate maintenance equipment has substrate holder (2; 20; 30; 40; 50) and be used for substrate holder (2; 20; 30; 40; 50) carrier (3), described substrate holder comprise that at least one comprises electrode pair (31.1,31.2,32.1,32.2,33.1,33.2,34.1,34.2; 41.1,41.2,42.1,42.2,43.1,43.2,44.1,44.2) holding device (31,32,33,34; 41,42,43,44), substrate holder (2 wherein; 20; 30; 40; 50) via at least at utmost hot decoupling of at least one lateral edges (2a, 2b, 2c, 2d) ground and described carrier (3) mechanical connection.
2. according to the substrate holding apparatus of one of the claims, wherein substrate holder (2,20,30,40; 50) be connected with carrier (3) by one or more, as to have heat insulator contact pin (4,5).
3. according to the substrate holding apparatus of one of the claims, wherein carrier (3) has the energy storage device of oneself, and this energy storage device has charge accumulator, and carrier (3) can with at least one holding device (31,32,33,34; 41,42,43,44) be electrically connected to.
4. according to claim 3 substrate holding apparatus, is characterized in that, carrier (3) has circuit, so that the voltage that conversion is located at least one holding device (31-34,41-44) and/or carry out controlled turning on and off.
5. according to claim 3 or 4 substrate holding apparatus, is characterized in that, holding device (31,32,33,34; 41,42,43,44) and the electrical connection between carrier (3) surrounded by heat insulator at least partly.
6. the substrate holding apparatus of one of according to claim 3 to 5, is characterized in that, charge accumulator or connected circuit are configured at least one holding device (31,32,33,34; 41,42,43,44) electrode (31.1,31.2,32.1,32.2,33.1,33.2,34.1,34.2; 41.1,41.2,42.1,42.2,43.1,43.2,44.1,44.2) and carry out asymmetrical electromotive force supply.
7., according to the substrate holding apparatus of one of the claims, it is characterized in that, carrier (3) is configured to shaped as frame.
8., according to the substrate holding apparatus of one of the claims, it is characterized in that, carrier (3) constitutes socket.
9., according to the substrate holding apparatus of one of the claims, it is characterized in that, carrier (3) has electric contact points and/or is used for the device of inductive energy transmission.
10., according to the substrate holding apparatus of one of the claims, it is characterized in that substrate holder (2,20,30,40; 50) have a plurality of holding devices (31,32,33,34; 41,42,43,44).
11. substrate holding apparatus according to claim 10, is characterized in that, a plurality of holding devices (31,32,33,34) are connected to same charge accumulator concurrently, and perhaps each holding device (41,42,43,44) is connected to the charge accumulator of oneself.
12. the substrate holding apparatus according to one of the claims, is characterized in that, one or more holding devices (31,32,33,34; The link of electrode 41,42,43,44) is at substrate holder (2,20,30,40; 50) outwards draw on front, perhaps by hole or around substrate holder (2,20,30,40; 50) seamed edge is drawn out to substrate holder (2,20,30,40; 50) on the back side.
13. the substrate holding apparatus according to one of the claims, is characterized in that, a plurality of holding devices (31,32,33,34; 41,42,43,44) at substrate holder (2; 20; 30; 40; 50) in or at substrate holder (2; 20; 30; 40; 50) interconnect on.
14. according to the substrate holding apparatus of one of the claims, wherein at least one holding device (31,32,33,34; 41,42,43,44) be arranged in flatwise substrate holder (2; 20; 30; 40; 50) in smooth plane, wherein the smooth plane of substrate holder is limited by at least one lateral edges (2a, 2b, 2c, 2d) in side.
15. according to the substrate holding apparatus of one of the claims, wherein substrate holder (50) is gone up and is being deviated from the positive back side (13) in positive (12) and has respectively at least one holding device (31,32,33,34; 41,42,43,44).
16. substrate holding apparatus according to claim 15, wherein be arranged on the holding device (31,32,33,34 that front (12) and the back side (13) are upper and overlap each other and arrange; 41,42,43,44) has at least one common electrode.
17. according to the substrate holding apparatus of one of the claims, wherein substrate holder (2; 20; 30; 40; 50) and/or carrier (3) about passing substrate holder (2; 20; 30; 40; Construct symmetrically on the plane (16) of 50) extending mirror image basically.
18. according to the substrate holding apparatus of one of the claims, wherein substrate holder (2; 20; 30; 40; 50) and/or carrier (3) symmetrically construct about the axle (17) that passes substrate holder and carrier and extend.
19. according to the substrate holding apparatus of one of the claims, wherein socket (3) and substrate holder (2; 20; 30; 40; 50) connection have less than 100W/K, preferably less than 10W/K, preferably less than 1W/K, preferably less than 0.1W/K, be more preferably less than the thermal conductance value of 0.01W/K.
20. according to the substrate holding apparatus of one of the claims 2 to 19, wherein the specific heat conductance of at least one contact pin (4,5) less than 100W/ (m*K), preferably less than 30W/ (m*K), be more preferably less than 5W/ (m*K).
21. according to the substrate holding apparatus of one of the claims 2 to 20, wherein the area of lateral edges (2a, 2b, 2c, 2d) is at least 10:1 with the size of cross-sectional area with the contact pin (4,5) of its adjacency, is preferably 100:1 at least.
22. according to the substrate holding apparatus of one of the claims 2 to 21, wherein at least one contact pin (4,5) has greater than substrate holder (2; 20; 30; 40; The length of thickness 50).
23. according to the substrate holding apparatus of one of the claims, wherein at carrier (3) and substrate holder (2; 20; 30; 40; 50) arrange heat shield element (52) between.
24. transportation system (100), have a plurality of substrate holding apparatus according to one of the claims (1), have substrate holding apparatus (1) wherein can swing between transporting position and charge/discharge position charging and/or discharge station (102), and have for substrate holding apparatus (1) is transported to the conveying arrangement (103) of substrate processing station (104,105) from charging and/or discharge station (102).
25. transportation system according to claim 24, is characterized in that, is provided for the charging station (101) of the charging memory of carrier (3).
26. the method for the treatment of at least one substrate, described at least one substrate is brought at least one processing station (104 by the substrate holding apparatus according to one of the claims 1 to 23,105,106) in zone and releasably remain on substrate holding apparatus (1; 11) locate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201010054483 DE102010054483A1 (en) | 2010-12-14 | 2010-12-14 | Mobile, portable electrostatic substrate holder assembly |
| DE102010054483.3 | 2010-12-14 | ||
| PCT/EP2011/006307 WO2012079750A1 (en) | 2010-12-14 | 2011-12-14 | Mobile, transportable electrostatic substrate retaining arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103392227A true CN103392227A (en) | 2013-11-13 |
| CN103392227B CN103392227B (en) | 2016-09-21 |
Family
ID=45470504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180059882.3A Active CN103392227B (en) | 2010-12-14 | 2011-12-14 | Electrostatic substrate movement, transportable keeps equipment |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2652781A1 (en) |
| CN (1) | CN103392227B (en) |
| DE (1) | DE102010054483A1 (en) |
| WO (1) | WO2012079750A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018054471A1 (en) * | 2016-09-22 | 2018-03-29 | Applied Materials, Inc. | Carrier for supporting a substrate, apparatus for processing a substrate and method therefore |
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| JPH05315429A (en) * | 1992-05-07 | 1993-11-26 | Hitachi Ltd | Conveying equipment of semiconductor device manufacturing equipment |
| US5683561A (en) * | 1991-04-04 | 1997-11-04 | Conner Peripherals, Inc. | Apparatus and method for high throughput sputtering |
| US20020110449A1 (en) * | 2000-12-23 | 2002-08-15 | Joachim Arlt | Method of manipulating wafers |
| US20030012885A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Method of processing and plating planar articles |
| US20040037692A1 (en) * | 2000-08-02 | 2004-02-26 | Christof Landesberger | Mobile holder for a wafer |
| CN1531054A (en) * | 2003-03-13 | 2004-09-22 | ��̩�˷���Ͷ������ҵ��ѯ����˾ | Movable portable electrostatic substrate holder |
| JP2005005503A (en) * | 2003-06-12 | 2005-01-06 | Showa Denko Kk | System and method for epitaxial growth |
| DE102004041049A1 (en) * | 2004-07-02 | 2006-01-26 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung mbH | Mobile, electrostatic substrate click for wafers in semiconductor manufacture, comprises additional capacitor structures for charge storage, extending over several electrode levels, on support substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4139549A1 (en) * | 1991-11-30 | 1993-06-03 | Leybold Ag | DEVICE FOR THE TRANSPORT OF SUBSTRATES |
| US5746928A (en) * | 1996-06-03 | 1998-05-05 | Taiwan Semiconductor Manufacturing Company Ltd | Process for cleaning an electrostatic chuck of a plasma etching apparatus |
| US20030047283A1 (en) * | 2001-09-10 | 2003-03-13 | Applied Materials, Inc. | Apparatus for supporting a substrate and method of fabricating same |
| DE10232080B4 (en) * | 2002-07-15 | 2015-10-01 | Integrated Dynamics Engineering Gmbh | Electrostatic gripper and method for its production |
| AT6926U1 (en) | 2003-03-13 | 2004-05-25 | Ventec Ges Fuer Venturekapital | MOBILE TRANSPORTABLE ELECTROSTATIC SUBSTRATE HOLDER |
| DE102004019231A1 (en) * | 2004-04-16 | 2005-11-17 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH | Delivery and loading station e.g. for mobile, electrostatic substrate holders, has thin substrates placed manually, by mobile, electrostatic handling equipment with table having nozzles for producing air cushion by substrates |
| US20070169703A1 (en) * | 2006-01-23 | 2007-07-26 | Brent Elliot | Advanced ceramic heater for substrate processing |
-
2010
- 2010-12-14 DE DE201010054483 patent/DE102010054483A1/en not_active Withdrawn
-
2011
- 2011-12-14 CN CN201180059882.3A patent/CN103392227B/en active Active
- 2011-12-14 EP EP11807640.5A patent/EP2652781A1/en not_active Withdrawn
- 2011-12-14 WO PCT/EP2011/006307 patent/WO2012079750A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683561A (en) * | 1991-04-04 | 1997-11-04 | Conner Peripherals, Inc. | Apparatus and method for high throughput sputtering |
| JPH05315429A (en) * | 1992-05-07 | 1993-11-26 | Hitachi Ltd | Conveying equipment of semiconductor device manufacturing equipment |
| US20040037692A1 (en) * | 2000-08-02 | 2004-02-26 | Christof Landesberger | Mobile holder for a wafer |
| US20020110449A1 (en) * | 2000-12-23 | 2002-08-15 | Joachim Arlt | Method of manipulating wafers |
| US20030012885A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Method of processing and plating planar articles |
| CN1531054A (en) * | 2003-03-13 | 2004-09-22 | ��̩�˷���Ͷ������ҵ��ѯ����˾ | Movable portable electrostatic substrate holder |
| JP2005005503A (en) * | 2003-06-12 | 2005-01-06 | Showa Denko Kk | System and method for epitaxial growth |
| DE102004041049A1 (en) * | 2004-07-02 | 2006-01-26 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung mbH | Mobile, electrostatic substrate click for wafers in semiconductor manufacture, comprises additional capacitor structures for charge storage, extending over several electrode levels, on support substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012079750A1 (en) | 2012-06-21 |
| EP2652781A1 (en) | 2013-10-23 |
| CN103392227B (en) | 2016-09-21 |
| DE102010054483A1 (en) | 2012-06-14 |
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