WO2012079750A1

WO2012079750A1 - Mobile, transportable electrostatic substrate retaining arrangement

Info

Publication number: WO2012079750A1
Application number: PCT/EP2011/006307
Authority: WO
Inventors: Florian Schwarz
Original assignee: Manz Ag
Priority date: 2010-12-14
Filing date: 2011-12-14
Publication date: 2012-06-21
Also published as: CN103392227B; CN103392227A; EP2652781A1; DE102010054483A1

Abstract

A mobile, transportable electrostatic substrate retaining arrangement (1) for thin, wafer-like workpieces and for use at high temperatures with a substrate retainer (2, 20, 30, 40), which comprises at least one retaining device (31 - 34, 41 - 44) which comprises an electrode pair (31.1, 31.2, 32.1, 32.2, 33.1, 33.2, 34.1, 34.2; 41.1, 41.2, 42.1, 42.2, 43.1, 43.2, 44.1, 44.2), and with a support (3) for the substrate retainer (2, 20, 30, 40) is characterized in that the substrate retainer (2, 20, 30, 40) is mechanically connected to the support (3) via at least one lateral edge (2a, 2b, 2c, 2d) in a manner that is at least mostly thermally decoupled.

Description

Mobile, portable electrostatic substrate holder assembly

Description

The invention relates to a mobile, transportable electrostatic Substratathalteanordnung for thin, disc-shaped workpieces and the use at high temperatures with a substrate holder having at least one holding pair comprising a pair of electrodes, and with a support for the substrate holder.

Stationary electrostatic chucks are known and used in the handling of disk-like, conductive and semiconducting substrates, especially in semiconductor industry manufacturing facilities. The use of stationary electrostatic holders has the disadvantage that a substrate first has to be positioned on the stationary holder and has to be removed again after processing. A transport together with the electrostatic holder outside the immediate area of the plant is therefore not possible.

From DE 203 11 625 U1 a mobile, portable, electrostatic substrate holder is known. A substrate can be placed on this holder and held with electrostatic forces. The substrate can be moved together with the substrate holder and positioned on a stationary holder. This means that the transportable holder does not have its own power or voltage supply. A secure transport of a substrate by means of the transportable holder is therefore only possible to a limited extent. A common problem with all types of electrostatic holders is a limited operating temperature, usually <200 ° C.

In addition, there are limitations with known electrostatic substrate holders when they are to be used in vacuum and at elevated temperatures. Particularly critical for mobile holders is the decreasing electrical insulation effect of almost all common materials at temperatures> 300 ° C. This leads to increased leakage currents and thereby in turn to a faster consumption of stored energy.

The object of the present invention is to provide a mobile transportable electrostatic substrate holding assembly which ensures reliable transport and reliable support of substrates during their processing and transportation. In addition, the Substratathalteanordung should be designed so that the processing result of a substrate by the substrate holding assembly is not or only slightly affected and thereby reproducible.

This object is achieved by a mobile, transportable electrostatic Substratathalteanordnung for thin, disc-shaped workpieces and use at high temperatures with a substrate holder having at least one holding pair comprising a pair of electrodes, and with a support for the substrate holder, the substrate holder at least largely thermally decoupled is mechanically connected to the carrier. Unlike the prior art, the (additional) carrier is firmly bonded to the substrate holder but decoupled (thermally and spatially) from the substrate holder such that it is not exposed to the same adverse process conditions. As a result, a mobile, transportable Substratathalteanordnung also at (substrate) temperatures around 400 ° C and above possible. The carrier is also mobile and movable, and a stationary substrate holder in a processing plant can be omitted. In addition, it is possible to position the carrier outside the actual processing area, so that the carrier does not have to be exposed to the full processing temperature. The substrate holder assembly according to the invention is thus suitable for transport and for holding thin and thus fragile workpieces. An application in vacuum is possible. Also, applications at elevated temperatures, for example,> 400 ° C are possible. The transport and the mounting of a substrate is possible without covering the front of the workpiece, ie the substrate, partially or even completely. Shading by mechanical brackets are avoided. An additional advantage of the electrostatic support over a purely mechanical support (loose support or retaining clips or hooks) is the avoidance of an unwanted coating on the wafer back. A further advantage is the higher position accuracy / more precise position determination, which greatly simplifies the fast automation (handling time of a wafer <1 s) which is usual in the solar industry.

A transport and a mounting of the workpiece in low-pressure plasmas is possible. Thus, the Substratathalteanordnung invention can be used in many ways. Moreover, it is possible to hold a substrate having the same substrate holding arrangement in different processing stations. Substrates do not need to be detached from the substrate holders between the processing stations, allowing for reliable and complete automated transport of the fragile substrates. In particular, the substrate holding arrangement according to the invention can be used in (vacuum) coating processes at high temperatures, for example in solar cell production. The advantages of using in solar cell manufacture are the possibility of coating without shadowing, the possibility of automated transport, and the possibility of using the substrate holding assembly to hold substrates in vacuum and at high temperatures. Furthermore, the substrate holder is largely thermally decoupled from at least one side edge mechanically connected to the carrier. The mechanical connection over the side edge is already advantageous to the extent that the thermal conductivity of a substantially planar and planar formed substrate holder in the plane is less than in a direction parallel to its surface normal direction. For example, a largely thermally decoupled mechanical fastening can take place via the edge-side mutual connection of substrate holder and carrier.

It is thereby further made possible to completely transfer the substrate holder fixed to the edge of the carrier into a processing or treatment area of a substrate processing station, while the carrier can remain outside a treatment or processing area of the processing station. The carrier and the substrate holder are in this case preferably electrically connected to one another.

In the present case, a planar substrate holder is to be understood as meaning those geometries which have a greater extent in one plane than in a direction perpendicular thereto. The substrate holder consequently has an extension which coincides with the substrate plane, which extent is substantially greater than the thickness of the substrate holder.

According to a preferred embodiment of the invention can be provided that the substrate holder is selectively connected to the carrier. In particular, it is conceivable that the substrate holder is connected to the carrier only at one or two points. This results in a further thermal decoupling of carrier and substrate holder.

Moreover, it is conceivable that the substrate holder is connected by one or more, a thermally insulating material having webs with the carrier. Thus, heat conduction from the substrate holder to the carrier can be at least largely prevented. Also, the at least one web may consist entirely of a thermally insulating material. In addition, however, it is also conceivable to connect the substrate holder to the carrier via a single web which extends over the entire side edge and the carrier. The web can in this case at least partially have a substrate holder comparable or smaller thickness than the substrate holder and alone contribute due to its geometric configuration and a comparatively small cross-sectional area only to a small and almost negligible extent to an inevitable heat transfer between the substrate holder and the carrier.

It is also conceivable here that the at least one web is formed as an integral part of the substrate holder or integrated in one piece. Also, the bridge z. B. may be formed as an over the side edge of the planar substrate holder out projecting extension, which z. B. provides an electrical and / or mechanical contact, respectively coupling between substrate holder and carrier. If the substrate holder has a layer structure, for example in the form of a base plate with electrically insulating and electrically conductive layers arranged thereon, the at least one web can be z. B. as an at least partially over the side edge of the overlying layers protruding extension of the base plate may be formed.

The thermally insulating mechanical connection of substrate holder and carrier provides at least one imaginary thermal separation plane, which preferably extends parallel to the at least side of the substrate holder facing the carrier. It is provided in particular that the parting plane is penetrated by the at least one thermally insulating web thought. The web or webs extend in this respect parallel to the surface normal of an at least conceivable thermal separation plane between the carrier and the substrate holder.

The carrier may have its own energy storage device, typically in the form of a charge storage device, and may also be electrically connected to the at least one holding device can be connected or connected. This means that a particular own or autonomous power supply with a charge storage, such as one or more capacitors, a battery or an accumulator, may be arranged in the carrier and thus spatially remote from the substrate holder. In particular, the charge store and possibly additionally required electronics, for example a voltage converter as part of a voltage supply, can be arranged in the carrier which is exposed to lower temperatures than the substrate holder. Thereby, a more reliable function of the substrate holder can be ensured. In addition, the electronics and the charge storage may be encapsulated within the carrier so that they are protected from a process environment of a process of processing. In particular, the spatially separated arrangement of the support from the substrate holding assembly can prevent the support from overheating and coating or etching. In a processing station, the carrier can thus be spatially separated from the substrate holder, but nevertheless arranged connected thereto. Furthermore, it is conceivable that the mechanical and / or electrical connection between substrate holder and carrier is releasable. As a result, if necessary, the carrier or the substrate holder can be exchanged.

The carrier may have a circuit for carrying out a conversion of the voltage to at least one holding device and / or a controlled on / off switching. According to a further advantageous development, the charge store or an electrical circuit connected thereto can be designed for the asymmetrical potential supply of the electrodes of at least one holding device. This allows the potential of the substrate to be adjusted. For example, a potential of +200 volts can be applied to one electrode and a potential of -600 volts to the other electrode. Substrate potential = (potential electrode 1 + potential electrode 2) 12. The electrical circuit can also be designed for a specific control of the holding force (controlled on / off with the shortest possible switching times) Temperatures in the insulator can occur through targeted Control of the electrodes are compensated. In a further advantageous embodiment, openings may be provided in the substrate holder, which allow a manipulation of the substrate through the substrate holder. For example, the substrate could be lifted by pins or compressed air for removal from the substrate holder. For releasing a substrate can also be provided that the electrode pairs are discharged. If permanent charges have built up in the substrate holder, they can be compensated by a targeted voltage / polarity reversal to completely reduce the holding force.

In order to form an electrical connection between the carrier and the substrate holder both mechanically protected and electrically insulated, the electrical connection can advantageously be surrounded at least in regions by thermally insulating material. In particular, the electrical connection may be electrically and thermally insulated in the above-mentioned webs or point connections. Furthermore, the electrical connection may be formed separately from the at least one web interconnecting the carrier and the substrate holder, or may also be integrated into the web providing a thermal decoupling.

According to an advantageous embodiment, the carrier may be formed like a frame. In this case, the carrier can completely enclose or surround the substrate holder along all lateral edges in the circumferential direction, wherein a connection between the carrier frame and the substrate holder held therein preferably takes place via one or more thermally insulating webs. In addition to a peripheral support frame, only marginally encompassing supports, such as an L-shaped support or a U-shaped support, can be provided, which can each be assigned two or three directly adjacent side edges of the substrate holder.

Alternatively or additionally, it is conceivable that the carrier is designed as a base. The base may have a substantially cuboidal contour and extend beyond the side edge of the substrate holder facing it. Ie. the pedestal may have a longitudinal extent that is greater than the side edge of the substrate holder.

The base can be designed so that it allows the connection of the substrate holding arrangement to a (linear) transport system (for example, rail system, roller conveyor, conveyor belt). Alternatively, the base may also be designed for a rotary transport system in which the carrier is moved or pivoted along a circular path. In particular, the substrate holder assembly may be constructed for a transport system based on one or more turntables wherein the individual substrates to be held on the substrate holder are movable from one to the next processing station by a pivotal movement of the turntable.

The substrate holder may be arranged in any orientation to the carrier. The thermally decoupled pedestal may also serve as an interface / point of attack for another type of transport system, such as a lift or pivot unit, robotic arm, etc. This allows an automated change of position during operation. In all variants of the connection to a transport system, the thermal decoupling is an important aspect, since such systems are generally not suitable for the high temperatures as the substrate holder has. It is therefore the handling of hot substrates (and the holder) possible without the transport system overheats or cool the substrates due to excessive heat losses (to the transport system) faster than intended. Ultimately, there is a high potential for saving energy in production. Particular advantages arise when the substrate holder is vertically aligned. This means that the substrates, which are arranged on the substrate holder, are also vertically aligned. Thus, the substrates can be arranged vertically in a processing station. Errors caused by particles that can remain on a horizontally aligned substrate can be avoided. All of the electrical components, such as an electrical circuit or a charge storage device, may be protected within the socket become. This makes it possible to form the substrate holder itself with a relatively low thermal mass.

Advantageously, the carrier can have electrical contact points and / or means for inductive energy transmission. If the carrier has electrical contact points, it can be connected in a particularly simple manner to a charging station for charging the charge store. In addition, signals can be transmitted via electrical contact points. However, it is also conceivable that the charge storage is charged contactless. For this purpose, it is advantageous if means for inductive energy transmission are provided.

Particular advantages arise when the substrate holder has a plurality of holding devices. As a result, a plurality of substrates can be arranged and held on the substrate holder at the same time. This has the consequence that several substrates can be transported simultaneously and processed in a processing station.

In this case, a plurality of holding devices may be connected in parallel to the same charge storage or each holding device may be connected to a separate charge storage. The use of only one charge storage device, to which a plurality of holding devices are connected, has the advantage that less charge storage device must be used, whereby the size can be reduced. The use of a charge storage device for each holding device has the advantage that substrates can be individually loaded and unloaded, since the holding devices can be controlled individually.

The terminals of the electrodes of the holding device (s) may be led to the outside on the front side of the substrate holder or may be guided through holes or around an edge of the substrate holder onto the rear side of the substrate holder. Depending on the configuration of the Substratathaltanordnung therefore a suitable connection can be selected. Several holding devices can also already be interconnected within / on the substrate holder. According to a further preferred embodiment, the at least one holding device is arranged lying in a planar plane of the substrate holder, wherein the planar plane of the substrate holder is bounded laterally by at least one side edge, via which the substrate holder is mechanically connected to the carrier. In that regard, the substrate holder has a substantially flat and planar basic structure, wherein the side edges have comparatively small area in comparison to the holding devices provided in the plane of the substrate holder. Due to the geometrical basic shape of the substrate holder and its edge-side connection to the carrier, a thermal decoupling of the carrier and the substrate holder can take place as far as possible, even if the substrate holder should be mechanically connected to the carrier over its entire side edge.

According to a further preferred embodiment, the substrate holder has at least one holding device on a front side and on a rear side facing away therefrom. Ie. The substrate holder is constructed essentially mirror-symmetrically and can hold several substrates both on its front side and on its rear side. In this way twice as many substrates can be treated in one processing or treatment station at the same time, or substrates can be treated simultaneously in two treatment stations.

In this case, according to a development, it can be provided, in particular, that the holding devices provided on a front side and correspondingly on the rear side and overlapping each other have at least one common electrode or a corresponding electrode pair. Thus, at least two substrates can be held detachably and electrostatically at the same time with only a single pair of electrodes provided approximately centrally between the front and rear side. In this case, the electrode can replace a base plate of the substrate holder constructed in individual layers. If, in addition to the substrate holder, the carrier connected therewith also has an intended symmetry, it is also conceivable to supply the substrate holding arrangement in at least two different orientations to a processing station. So z. B. conceivable to supply the substrate holder assembly according to a first orientation of a processing station and thereafter supply by turning in a second orientation of the same or another processing station. This can reduce the number of treatment stations required and / or extend the maintenance intervals, which require, for example, a cleaning of the processing station. In this case, provision can be made, in particular, for the substrate holder and / or the carrier to be rotationally symmetrical with respect to an approximately imaginary axis extending through the substrate holder and the carrier. The axis may in this case run parallel approximately in the middle between and parallel to those side edges of the substrate holder, which extend away from the carrier. By a rotation of preferably 180 ° with the axis as the axis of rotation, the substrate holding arrangement can be supplied in a rotated orientation of a correspondingly configured processing station.

Also, according to a further preferred embodiment, the substrate holder and / or the carrier are formed with respect to a plane coincident with the substrate holder substantially mirror-symmetrical.

Finally, according to a further preferred embodiment, it is provided that the connection of base and substrate holder has a heat conductivity less than 100 W / K, preferably less than 10 W / K, preferably less than 1 W / K, more preferably a heat conductivity less than 0.1 W / K or has a thermal conductivity less than 0.01 W / K. Of course, due to the mechanical connection, no absolute thermal decoupling of substrate holder and carrier can be provided. In that regard, the aforesaid parameter ranges exhibit different candidate thermal decoupling degrees between the carrier and the substrate holder. Also, according to a further preferred embodiment of the at least one, the substrate holder and the carrier interconnecting web has a specific thermal conductivity of less than 100 W / (m * K), preferably less than 30 W / (m * K), more preferably less than 5 W / (m * K). Thus, for the web various, a thermal insulation material providing materials conceivable. So the at least one bridge z. Example, the following materials or even almost completely formed from this: stainless steel, titanium, Al ₂ 0 _3, quartz, glass, glass ceramic or other ceramic materials, or plastic, which is suitable for the operating temperatures

Also, according to a further preferred embodiment, the size ratio of the area of the at least one side edge of the substrate holder facing the carrier to the cross-sectional area of a web adjacent thereto is at least 10: 1, preferably at least 100: 1. By forming a relative to the cross-sectional area of the side edge comparatively small web, the heat conduction of the web can be minimized and thus improves the thermal decoupling of the carrier and substrate holder, or be maximized.

Also, according to a further preferred embodiment, the at least one web has a length which is greater than the thickness of the substrate holder. Thickness in the present context means the extent of the substrate holder along its surface normal.

It is also possible to arrange a thermal shielding element between the carrier and the substrate holder, which preferably extends parallel to the thermal separation plane between substrate holder and carrier. The thermal shielding element can in this case be adapted to the outer dimensions of the carrier as well as that of the substrate holder and, in particular, act as a type of thermal reflector by means of which the carrier can be protected against thermal radiation. The thermal shielding element preferably has one or more shielding plates and preferably extends in a plane parallel to the surface normal of the planar substrate holder and parallel to the side edge of the substrate holder facing the carrier. The thermal shielding element is in this case preferably arranged between the carrier and the substrate holder and can be penetrated by the at least one web.

The scope of the invention also includes a transport system with a plurality of substrate holding arrangements according to the invention, with a loading and / or unloading station in which a substrate holding arrangement can be pivoted between a transport position and a loading / unloading position and a transport device for transporting a substrate holding arrangement of a loading and unloading station / or unloading station to a substrate processing station. Such a transport system has the advantage that substrates do not have to be handled directly at the place of processing or have to be loaded and unloaded there on / from static holding devices. In particular, it is conceivable that at the beginning of a production process, for example in the production of solar cells, a substrate is arranged on a substrate holding arrangement and then passes through an installation with a plurality of substrate processing stations, without having to change the substrate holding arrangement. By using the loading and / or unloading station, it is possible to align the substrate holder horizontally for loading and unloading so that substrates can be easily placed on the substrate holder. After applying the voltage to the electrodes of the holding device, the substrate is reliably held on the substrate holder, so that it is then possible to change the position of the substrate holding arrangement, so that the substrate holder and thus the substrates mounted therein, for example, can be vertically aligned. In this position, the substrates can be transported and processed.

In order to charge the charge storage of the carrier, advantageously, an electrical charging station can be provided in the transport system. Further features and advantages of the invention will become apparent from the following description of an embodiment of the invention, with reference to the figures of the drawing, the invention essential details show, and from the claims. The individual features can be realized individually for themselves or for several in any combination in a variant of the invention.

A preferred embodiment of the invention is shown schematically in the drawing and will be explained below with reference to the figures of the drawings. Show it:

Fig. 1 highly schematic representation of a

Substrate support assembly;

FIG. 2 is a sectional view through a substrate holder; FIG.

Fig. 3 is a partial sectional view through a substrate holder;

Fig. 4 is a partial sectional view through a substrate holder for

Clarification of an alternative contacting;

5 shows a partial sectional view through a substrate holder with a further variant of the contacting;

6 is a partial sectional view through a substrate holder with a further variant of the contacting;

7 is a schematic representation to illustrate the

Connecting a plurality of holding devices to a (n) individual power supply or charge storage (-elektronik);

FIG. 8 is a schematic illustration showing the contacting of each holding device by a single power supply or charge storage device (electronic unit); FIG. a highly schematic representation of a transport system; a plan view of a Substrathaltalteanordnung with a shielding element; a side view of the Substrathaltalteanordnung of FIG. 10; a substrate holding assembly having a frame-like carrier; a cross-sectional view through the substrate holding assembly of FIG. 12; a cross-sectional view of a substrate holding assembly located in a substrate processing station in a first configuration; a substrate holding assembly in the substrate processing station according to a second configuration; a cross section through another

Substrate processing station with treatment units provided on both sides of the substrate holding assembly; 1 with an added plane of symmetry, the substrate holder arrangement according to FIG. 10 in perspective view with the shielding element and a sectional view through a double-sided substrate holder. 1 shows a substrate holder assembly 1 with a substrate holder 2 and a carrier 3. The substrate holder 2 is in the exemplary embodiment via two webs 4, 5 of thermally insulating material selectively connected to the carrier 3. The substrate holder 2 has a substantially planar contour with four side edges 2a, 2b, 2c and 2d, of which the lower side edge 2d facing the carrier 3 is mechanically connected to the carrier 3 via the two webs 4, 5. The webs 4, 5 are in this case in outer corners of the lower side edge 2d, via which the lower side edge 2d merges into the perpendicular or vertical side edges 2a, 2b.

In the support 3, the necessary for an electrostatic support electronics or circuit and a charge storage are arranged. The electronics or the charge storage are connected via electrical lines that run within the webs 4, 5, with corresponding electrodes on the substrate holder 2. In the exemplary embodiment, the substrate holder 2 is designed to hold four substrates 6 to 9. The carrier 3 has a footprint 10 on which it can be placed or with which it can be connected to a transport system. The substrate holder 2 is oriented orthogonal thereto. Therefore, the substrates 6 to 9 are also aligned orthogonally. They are held on the substrate holder 2 solely due to electrostatic forces.

2 shows a sectional view through a substrate holder 20. The substrate holder 20 has an electrically insulating base plate 21. Optionally, an electrically insulating layer 22 is arranged on the base plate 21. The base plate 21 may be formed, for example, as a glass ceramic and the electrically insulating layer 22, for example, as a ceramic. On the layer 22, an electrically conductive layer 23 is applied, which is structured such that for each substrate to be held 24 two mutually electrically insulated electrodes 25, 26 with preferably the same size surface are present. Above the electrically conductive layer 23, a further electrically insulating layer 27 is provided. This layer can either be mounted only on the front side of the substrate holder 20 or the Substrate holder 20 completely enclose, as shown for example in FIG. In addition, the layer 27 may consist of several layers of different materials to achieve the desired properties. The terminals of the electrodes 25, 26 may either be led outwards on the front side, as shown schematically in FIG. 4, or be guided through holes to the rear side, as shown schematically in FIG. Alternatively, the electrodes may be passed around the edge of the substrate holder 20 and guided onto the back side of the substrate holder. This is shown in FIG. 6. If appropriate, recesses 28, see, for example, FIG. 4, are provided in the insulating layer 27 for contacting the electrodes 25, 26.

FIG. 7 schematically shows a substrate holder 30 which has four holding devices 31 to 34. Each holding device 31 to 34 has two electrodes 31.1, 31.2, 32.1, 32.2, 33.1, 33.2, 34.1, 34.2 of approximately the same size. In the embodiment of FIG. 7, the electrodes 31.1, 32.1, 33.1 and 34.1 are connected in series. In addition, the electrodes 31.2, 32.2, 33.2 and 34.2 are connected in series. This results in a parallel connection of the holding devices. There are therefore only two connections 35, 36 necessary, which must be connected to a charge storage. Thus, a single charge storage device may be employed to energize four retainers 31-34 to hold four substrates to the substrate holder 30.

In the embodiment according to FIG. 8 of a substrate holder 40, four holding devices 41 to 44 are likewise provided, which each have two electrodes 41.1, 41.2, 42.1, 42.2, 43.1, 43.2, 44.1, 44.2. Here, however, each holding device 41 to 44 connections, so that each holding device 41 to 44 a separate charge storage can be connected.

FIG. 9 shows a transport system 100 which has a charging station 101 for substrate holding arrangements. Furthermore, a loading and / or unloading station 102 is provided, in which the substrate holding arrangements can be pivoted so that the substrate holders are aligned horizontally are. In this position, the substrate holding arrangement can be loaded or unloaded. Subsequently, the substrate holding assemblies are pivoted by 90 ° so that the substrate holders are vertically aligned. The charging station 101 and the loading and / or unloading station 102 may be combined in one unit. By means of a transport device 103, the substrate holding arrangements can be transported to a substrate processing station 104 and optionally to a further substrate processing station 105 _. ,

FIG. 10 shows a further modified substrate holding arrangement 11 compared with the substrate holding arrangement 1 shown in FIG. 1, which further comprises, as shown in perspective in FIG. 18, a thermal shielding element 52 extending parallel to the lower side edge 2d, for example in the form of a shielding plate , The shielding plate 52 extends, as can also be seen in FIGS. 11 and 13, substantially perpendicular to the plane of the substrate holder 2 and can thus provide a thermal separation plane which is substantially perpendicular to the webs 4, 5 spaced apart along the side edge 2d is interspersed.

The shielding element 52, which is preferably in the form of a thermal shielding plate, can keep heat radiation present in the region of the substrate holder 2 and act on the substrates 6, 7, 8, 9 from the underlying carrier 3 and reflect it accordingly.

In Fig. 10 is further illustrated that an electrical contact 14, 15 between the carrier 3 and substrate holder 2 can also extend outside the webs 4, 5.

FIGS. 12 and 13 show an alternative embodiment of a substrate holding arrangement 11, in which the substrate holder 2 is held on a frame-like carrier 54 with a total of four webs 4a, 5a, 4b, 5b. Consequently, the four side edges 2a, 2b, 2c, 2d of the substrate holder 2 are completely surrounded by the peripheral frame 54, wherein between the inside of the frame 54 and the side edges 2a, 2b, 2c, 2d of the substrate holder. 2 at least one correspondingly shaped shielding element 52, for example in the form of a plurality of shielding plates is arranged.

The frame-like configuration, as shown in FIGS. 12 and 13, makes it possible to feed the substrate holding assembly 11 in different orientations to a treatment station 104, 105. Thus, Figs. 14-16 show various processing stations 104, 105, 106, which are e.g. the substrate holder assembly 1, 11 can be fed successively. The processing or treatment stations 104, 105, 106 each have a housing 110 with a lower receiving portion 112 for the support 3 of the substrate holder assembly 1, 11.

The carrier 3 as well as the receiving section 112 and the thermal shielding element 52 are matched to one another in such a way that the carrier 3 can largely be thermally decoupled or at least thermally insulated from the treatment space 108 in which the treatment unit 114, 115 is arranged. So z. For example, the treatment station 104 outlined in FIG. 14 is provided with a treatment unit 114 designed as a heater, which applies thermal energy to the rear side 13 of the substrate holder 2 to bring the substrates 6, 7, 8, 9 held on the front side 12 to a predetermined temperature level heat.

In a e.g. Following and in Fig. 15 outlined processing or treatment station 105 is provided for coating the substrates 6, 7, 8, 9 provided treatment unit 115. In this case, the substrate holding arrangement 11 can be inserted or guided in an orientation into the treatment station 105, in which the front side 12 of the substrate holder 2 faces the treatment unit 115.

Finally, FIG. 16 shows a configuration of a further substrate holder 50, which has both at its front side 12 and at its rear side facing away therefrom at least one holding device comprising an electrode pair for holding at least one respective substrate 6a, 6b, 9a, 9b. By the substrate holder 12 for two-sided and simultaneous Holding a plurality of substrates 6a, 6b, 9a, 9b is formed, this can be arranged in a space between two, provided about for coating or for heating, treatment units 115 of a treatment station 106, so that both the front 12 and at the Rear side 13 held substrates 6a, 9a and 6b, 9b are simultaneously treatable.

Also, according to an alternative embodiment, it is conceivable that the holding devices provided on opposite sides of the substrate holder 50 have common pairs of electrodes, so that one and the same electrode functions as a component of a front as well as a rear holding device. Such an electrode may act as a base plate and be coated on both sides insulating.

19, a cross-sectional view of a possible layer structure of such a double-sided substrate holder 50 is sketched. Thus, the substrate holder 50 has a base plate 21 and on both sides, in each case an electrically insulating layer 22a, 22b. On the insulating layer 22a, 22b, an electrically conductive layer 23a, 23b is respectively applied to the sides facing away from each other, in which two electrodes 25a, 26a and 25b, 26b are electrically embedded for each substrate 24a, 24b to be held.

Above the electrically conductive layer 23a, 23b, a further electrically insulating layer 27a, 27b is provided in each case. The double-sided layer structure, as shown in FIG. 19, essentially corresponds to that according to FIG. 2, so that with respect to the general mode of operation of the electrostatic support reference is made to the exemplary embodiments according to FIGS. 2 to 8.

Finally, FIG. 17 shows a plane of symmetry 16, with respect to which the substrate holding arrangement 1, the substrate holder 2 and / or the carrier 3 can be formed substantially symmetrically. It is also conceivable that the substrate holder 2 and / or the carrier 3 also point / or are formed rotationally symmetrical to an imaginary axis 17 which extends in the central or symmetry plane 16 and is substantially parallel to the connecting extension of the webs 4, 5, aligned. Thus, in particular it can also be provided that the substrate holding arrangement 1 or its substrate holder 2 and / or its carrier 3 can be converted by rotation with respect to the center axis 17 into a suitable orientation for the respective treatment station 104, 105.

Claims

Patent claims

Mobile, transportable electrostatic substrate support arrangement (1; 11) for thin, disk-shaped workpieces and for use at high temperatures, comprising a substrate holder (2; 20; 30; 40; 50) comprising at least one pair of electrodes (31.1, 31.2, 32.1 , 32.2, 33.1, 33.2, 34.1, 34.2, 41.1, 41.2, 42.1, 42.2, 43.1, 43.2, 44.1, 44.2) comprising holding means (31, 32, 33, 34, 41, 42, 43, 44), and with a support (3) for the substrate holder (2; 20; 30; 40; 50), the substrate holder (2; 20; 30; 40; 50) being at least substantially thermally over at least one side edge (2a, 2b, 2c, 2d) decoupled from the carrier (3) is mechanically connected.

2. substrate holder assembly according to any one of the preceding claims, wherein the substrate holder (2, 20, 30, 40, 50) by one or more, a thermally insulating material having webs (4, 5) is connected to the carrier (3).

3. substrate holder arrangement according to one of the preceding claims, wherein the carrier (3) has its own energy storage device with an electric charge storage and electrically connected to the at least one holding device (31, 32, 33, 34; 41, 42, 43, 44) is connectable.

4. substrate holder assembly according to claim 3, characterized in that the carrier (3) has a circuit to make a conversion of the voltage to at least one holding device (31-34, 41-44) and / or a controlled switching on and off.

5. substrate holder assembly according to claim 3 or 4, characterized in that the electrical connection between holding means (31, 32, 33, 34; 41, 42, 43, 44) and carrier (3) is at least partially surrounded by thermally insulating material.

6. substrate holder arrangement according to one of claims 3 to 5, characterized in that the charge storage device or an electrical circuit connected thereto for the asymmetrical potential supply of the electrodes (31.1, 31.2, 32.1, 32.2, 33.1, 33.2, 34.1, 34.2, 41.1, 41.2, 42.1 , 42.2, 43.1, 43.2, 44.1, 44.2) of at least one holding device (31, 32, 33, 34, 41, 42, 43, 44) is formed.

7. substrate holder assembly according to any one of the preceding claims, characterized in that the carrier (3) is formed like a frame.

8. substrate holder arrangement according to one of the preceding claims, characterized in that the carrier (3) is designed as a base.

9. substrate holder arrangement according to one of the preceding claims, characterized in that the carrier (3) has electrical contact points and / or means for inductive energy transfer.

10. substrate holder assembly according to any one of the preceding claims, characterized in that the substrate holder (2, 20, 30, 40, 50) a plurality of holding means (31, 32, 33, 34, 41, 42, 43, 44).

11. substrate holder assembly according to claim 10, characterized in that a plurality of holding means (31, 32, 33, 34) are connected in parallel to the same charge storage or each holding device (41, 42, 43, 44) is connected to a separate charge storage.

12. substrate holder assembly according to any one of the preceding claims, characterized in that the terminals of the electrodes of the holding means (s) (31, 32, 33, 34; 41, 42, 43, 44) on the front side of the substrate holder (2, 20, 30 , 40, 50) are guided to the outside or through holes or around an edge of the substrate holder (2, 20, 30, 40, 50) around on the back of the substrate holder (2, 20, 30, 40, 50) are guided.

13. Substrate holding arrangement according to one of the preceding claims, characterized in that a plurality of holding devices (31, 32, 33, 34; 41, 42, 43, 44) are interconnected within or on the substrate holder (2; 20; 30; 40; 50) are.

14. The substrate holder assembly according to claim 1, wherein the at least one holding device (31, 32, 33, 34, 41, 42, 43, 44) is arranged lying in a planar plane of the substrate holder (2, 20, 30, 40, 50) is, which is bounded laterally by at least one side edge (2a, 2b, 2c, 2d).

15. The substrate holder arrangement according to claim 1, wherein the substrate holder (50) has at least one holding device (31, 32, 33, 34, 41, 42, 43, 44) on a front side (12) and on a rear side (13) facing away therefrom ) having.

16. The substrate holder arrangement as claimed in claim 15, wherein the holding devices (31, 32, 33, 34, 41, 42, 43, 44) provided on the front side (12) and rear side (13) and overlapping with one another have at least one common electrode.

A substrate holder assembly according to any one of the preceding claims, wherein the substrate holder (2; 20; 30; 40; 50) and / or the carrier (3) are oriented relative to a plane passing through the substrate holder (2; 20; 30; 40; 50). 16) are formed substantially mirror-symmetrical.

18. Substrate holder arrangement according to one of the preceding claims, wherein the substrate holder (2; 20; 30,40; 50) and / or the carrier (3) are rotationally symmetrical with respect to an axis (17) passing through the substrate holder and the carrier.

19. The substrate holder arrangement according to claim 1, wherein the connection between base and substrate holder has a thermal conductivity value less than 100 W / K, preferably <10 W / K, preferably <1 W /. K, preferably <0.1 W / K, more preferably <0.01 W / K.

20. Substrate holding arrangement according to one of the preceding claims 2 to 19, wherein a specific thermal conductivity of the at least one web (4, 5) is less than 100 W / m ^* K, preferably <30 W / m ^* K, more preferably <5 W / m ^* K is.

21. The substrate holder arrangement according to claim 2, wherein a size ratio of the area of a side edge (2a, 2b, 2c, 2d) to the cross-sectional area of a web (4, 5) adjacent thereto is at least 10: 1, preferably at least 100: 1 ,

22. The substrate holder assembly according to one of the preceding claims 2 to 21, wherein the at least one ridge (4, 5) has a length which is greater than a thickness of the substrate holder (2; 20; 30; 40; 50).

A substrate holder assembly according to any one of the preceding claims, wherein a thermal shield member (52) is disposed between the substrate (3) and the substrate holder (2; 20; 30; 40; 50).

24. Transport system (100) with a plurality of substrate holding arrangements (1) according to one of the preceding claims with a loading and / or unloading station (102), in which a substrate holding arrangement (1) is pivotable between a transport position and a loading / unloading position, as well as a Transport device (103) for transporting a substrate holding arrangement (1) from a loading and / or unloading station (102) to a substrate processing station (104, 105).

25. Transport system according to claim 24, characterized in that an electrical charging station (101) for the charge storage of a carrier (3) is provided.

Process for the treatment of at least one substrate brought into the region of at least one processing station (104, 105, 106) by means of a substrate holding arrangement according to one of the preceding claims 1 to 23 and detachably held on the substrate holding arrangement (1; 11).