CN103386335A - 一种柔性圆环形微流控芯片 - Google Patents
一种柔性圆环形微流控芯片 Download PDFInfo
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- CN103386335A CN103386335A CN201310341664XA CN201310341664A CN103386335A CN 103386335 A CN103386335 A CN 103386335A CN 201310341664X A CN201310341664X A CN 201310341664XA CN 201310341664 A CN201310341664 A CN 201310341664A CN 103386335 A CN103386335 A CN 103386335A
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CN201310341664XA CN103386335A (zh) | 2013-08-07 | 2013-08-07 | 一种柔性圆环形微流控芯片 |
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CN201310341664XA CN103386335A (zh) | 2013-08-07 | 2013-08-07 | 一种柔性圆环形微流控芯片 |
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CN103386335A true CN103386335A (zh) | 2013-11-13 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109014552A (zh) * | 2017-06-09 | 2018-12-18 | 通用电气公司 | 制造环形部件的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1576372A (zh) * | 2003-07-29 | 2005-02-09 | 中国科学院电子学研究所 | 聚二甲基硅氧烷夹心式微流体生物芯片 |
CN103055981A (zh) * | 2012-12-31 | 2013-04-24 | 苏州汶颢芯片科技有限公司 | 一种聚二甲基硅氧烷微流控芯片及其制备方法 |
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2013
- 2013-08-07 CN CN201310341664XA patent/CN103386335A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1576372A (zh) * | 2003-07-29 | 2005-02-09 | 中国科学院电子学研究所 | 聚二甲基硅氧烷夹心式微流体生物芯片 |
CN103055981A (zh) * | 2012-12-31 | 2013-04-24 | 苏州汶颢芯片科技有限公司 | 一种聚二甲基硅氧烷微流控芯片及其制备方法 |
Non-Patent Citations (1)
Title |
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刘长春等: "聚二甲基硅氧烷微流体芯片的制作技术", 《传感器技术》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109014552A (zh) * | 2017-06-09 | 2018-12-18 | 通用电气公司 | 制造环形部件的方法 |
US10919106B2 (en) | 2017-06-09 | 2021-02-16 | General Electric Company | Ultrasonic welding of annular components |
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Legal Events
Date | Code | Title | Description |
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DD01 | Delivery of document by public notice |
Addressee: Suzhou YoungChip Chip Technology Co., Ltd. Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: Ye Jiaming Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
|
DD01 | Delivery of document by public notice |
Addressee: Suzhou YoungChip Chip Technology Co., Ltd. Document name: the First Notification of an Office Action |
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DD01 | Delivery of document by public notice |
Addressee: Suzhou YoungChip Chip Technology Co., Ltd. Document name: Review of business letter |
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DD01 | Delivery of document by public notice |
Addressee: Suzhou YoungChip Chip Technology Co., Ltd. Document name: Notification that Application Deemed to be Withdrawn |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131113 |