CN103379945B - Flip edge shadow frame - Google Patents
Flip edge shadow frame Download PDFInfo
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- CN103379945B CN103379945B CN201380000449.1A CN201380000449A CN103379945B CN 103379945 B CN103379945 B CN 103379945B CN 201380000449 A CN201380000449 A CN 201380000449A CN 103379945 B CN103379945 B CN 103379945B
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- Prior art keywords
- lip
- shadow frame
- main body
- substrate
- detachable
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- 239000000758 substrate Substances 0.000 claims abstract description 118
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000008021 deposition Effects 0.000 claims abstract description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 16
- 239000007789 gas Substances 0.000 description 14
- 238000010891 electric arc Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 210000003141 lower extremity Anatomy 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A kind of device in order to process substrate is described at this.The device of a kind of deposition for controlling on substrate can include chamber, substrate support and shadow frame, chamber includes shadow frame support member, substrate support includes substrate, shadow frame has shadow frame main body and detachable lip, shadow frame main body includes the first supporting surface and the second supporting surface relative to first, and detachable lip is connected with shadow frame main body.Detachable lip can include supporting connector, the first lip surface, the second lip surface, the first edge and the second edge, first lip surface is in the face of substrate, second lip surface is relative to the first lip surface, first edge is arranged on above the first supporting surface, the second edge relative to the first edge to contact substrate.
Description
Background of invention
Technical field
Embodiments of the invention relate generally to a kind of shadow frame for processing chamber.
Prior art
Modern semiconductor device needs by from glass substrate deposition with remove conduction, partly
Multiple layers of conduction and dielectric material form feature, such as Organic Light Emitting Diode
(OLED), transistor and the dielectric film of low-k.Glass substrate processes
Technology includes plasma enhanced chemical vapor deposition (PECVD), physical vapour deposition (PVD)
(PVD), etching etc..Because the relatively low treatment temperature required for deposition thin film,
And can be by the good film quality using Cement Composite Treated by Plasma to bring, plasma
Body processes in the production being widely used in tablet device.
In general, Cement Composite Treated by Plasma includes substrate is arranged (position) in configuration
Supporting member (commonly referred to pedestal or heater) in vacuum chamber is upper, Yi Ji
It is adjacent at the upper surface that substrate exposes be formed plasma.Plasma is by by one
Plant or multiple place process gases introduces in chamber, and with electric field excited gas, so that gas
It is dissociated into charged and neutral particle to be formed.Plasma adjustable inductance formula and/or electric capacity
Formula ground or by use microwave energy produce, inductance type e.g. uses inductance
Radio-frequency coil, condenser type e.g. uses parallel plate electrode.
During processing, the edge of glass substrate and the back side and chamber interior assembly are necessary
It is protected, in order to avoid deposition.Typically, deposition mas equipment (deposition masking
Device) or shadow frame (shadow frame) is placed around substrate, regulate the flow of vital energy with the place of avoiding
Body or plasma arrive edge and the back side of substrate, and are protected by substrate during processing
Hold on supporting member.Shadow frame may be provided in the process chamber above supporting member,
So, when supporting member moves to a higher processing position, shadow frame is lifted
And contact substrate edge part.Therefore, shadow frame covers number milli around upper surface of base plate
Rice, thus avoid the deposition having edge and the back side on substrate.
In the case of the advantage considering use shadow frame, current shadow frame is designed with one
A little shortcomings.Shadow frame of the prior art typically comprises can have angular clamping machine
Structure.Substrate (such as, is being loaded from processing chamber by such wedge angle at contact substrate
And unloading) time may scratch substrate or make substrate breakage.Further, during processing,
Substrate and shadow frame experience expand and shrink, and cause mechanical stress to produce between,
And typically result in the damage of substrate.Therefore, the shadow frame of standard can have gap, with
Shadow frame is made to separate with substrate.
When shadow frame damaged substrate, electric arc it may happen that.Electric arc can cause pedestal, base
The damage of other assembly of plate or chamber.Therefore, one is needed in the art
Avoid the broken of substrate and/or rupture and avoid the dress of the electric arc during processing simultaneously
Put.
Summary of the invention
The present invention relates generally to a kind of for processing chamber (such as, PECVD chamber)
Shadow frame.In one embodiment, disclose a kind of heavy for control on substrate
Long-pending device.This device can include chamber, substrate support and shadow frame, chamber
Room includes shadow frame support member, and substrate support includes substrate, shadow frame
Including shadow frame main body, detachable lip (lip) and support connector.
Shadow frame main body can have the first supporting surface and the second supporting surface, the first supporting surface face
To substrate, the second supporting surface is relative to the first supporting surface.Detachable lip
Portion can be connected with shadow frame main body and be arranged on the second supporting surface in fixable mode
On.Detachable lip can have the first lip surface, the second lip surface, first
Edge and the second edge, the first lip surface is in the face of substrate support, the second lip
Surface, portion is relative to the first lip surface, and the first edge is arranged on above the first supporting surface,
Second edge is relative to the first edge.Support connector can shadow frame main body be coupled to
Detachable lip.
In another embodiment, the device of a kind of deposition for controlling on substrate can include
Chamber, substrate support and shadow frame, chamber includes shadow frame support member, base
Plate support includes that substrate, shadow frame include shadow frame main body and separable
Formula lip, shadow frame can be parked in substrate.
Shadow frame main body can include the first supporting surface, the second supporting surface, the first supporting surface face
To substrate, wherein the first face is parked on shadow frame support member, second
Support face is relative to first, and the second supporting surface includes that recess, recess have recess following table
Face and recess shoulder (recess ledge).Detachable lip can with shadow frame main body even
Connect and be arranged in the recess of the second supporting surface in fixable mode.Detachable lip
Portion can include the first lip surface, the second lip surface, the first edge and second
Edge, the first lip surface is in the face of substrate, and a portion is connected with recess lower surface,
Second lip surface is relative to the first lip surface, and the first edge is arranged to and recess platform
Shoulder connects, and the second edge is relative to the first edge.
Accompanying drawing explanation
In order to of the present invention features described above is understood in detail, can refer to embodiment, make
The more detailed narration of the present invention for summarizing briefly above, some embodiments are at accompanying drawing
Middle description.It should be noted, however, that typical case's enforcement of the present invention only depicted by accompanying drawing
Example, and be therefore not taken as a limitation on the scope of the invention, because the present invention
The embodiment of other equivalence can be allowed.
Fig. 1 is the generalized section processing chamber.
Fig. 2 A is the schematic diagram of shadow frame, and shadow frame has and is coupled to shadow frame body table
The detachable lip in face.
Fig. 2 B is the generalized section of the shadow frame that Fig. 2 A is described.
Fig. 3 A-3D is the generalized section of the various embodiments illustrating shadow frame.
Fig. 4 is the detachable lip illustrating the gap covered between adjacent shadow frame block
Schematic top plan view.
In order to help to understand, in the conceived case, identical reference is used to refer to
Show the similar elements shared in accompanying drawing.It can be anticipated that it is disclosed first in one embodiment
Part may be used advantageously in other embodiments, and quotes from the most especially.
Detailed description of the invention
Embodiments of the invention relate generally to a kind of shadow frame for processing chamber.?
In one or more embodiments described below, shadow frame is by integral type shadow frame main body
Or multi-block shadow frame main body is formed, integral type shadow frame main body or multi-block shadow frame
Main body lip detachable with integral type or the detachable lip of multi-block are connected.Cover
The design of frame can be by controlling between the shadow frame during high power operation and substrate
" gap " or distance, or control typically cause electric arc process (such as, based on
Silicon nitride or the deposition processes of silicon oxide) in shadow frame and substrate between " gap "
Or distance, allow electric arc control.In the case of lacking lip, electric arc on the contrary may be used
Can occur between adjacent shadow frame block.Additionally, in the case of lacking lip,
Electric arc is likely to occur between shadow frame and other chamber block on the contrary.
In the case of being not only restricted to theory, it is believed that electric arc is to cause substrate crushing or rupture
Partly cause.Contact it is essential that shadow frame does some with substrate, to avoid place
Deposition below shadow frame during reason.But, the weight of the shadow frame of prior art
The chip in substrate or slight crack can be caused.Chip or slight crack in substrate make pedestal
Some is exposed to plasma, thus results in the tendency that electric arc occurs.By this
In the embodiment of narration, weight that shadow frame is supported on surface reduces, and shadow frame
It is controlled with contacting of substrate, so that crushing or rupturing of substrate minimizes.So,
Embodiments set forth herein can control the deposition on substrate, avoid because rupturing simultaneously and
The electric arc caused.
Furthermore, due to narrow edge lip and related covering substrate is less,
Shadow frame improves the uniformity of non-crystalline silicon.The uniform arrangement of electrically insulating material also helps
Deposition uniformity in non-crystalline silicon.Below in conjunction with accompanying drawing to embodiments of the invention
Carry out clearer narration.
Fig. 1 is the generalized section of the exemplary process chamber 10 according to an embodiment,
Process chamber 10 and there is shadow frame.Can be adjusted and be indebted to the process chamber of the present invention
An example be that PECVD processes chamber, it is possible to from being positioned at holy gram of California
US business Ye Kai scientific & technical corporation of the subsidiary (AKT of the Applied Materials in La La city
America, Inc.) obtain.It is contemplated that other plasma process chamber (includes
Plasma process chamber from other manufacturer) it is equally applicable to implement the present invention.
Process chamber 10 and include cavity 12 and the backboard 14 being arranged on cavity 12.
Cavity 12 has treatment region 16.The associated component of cavity 12 and process chamber 10
Size is not limited, and is typically proportionally greater than substrate 28 to be processed
Size.Any applicable substrate size can be processed.The example bag of the substrate size being suitable for
Include the substrate of the surface area with about 5500 square centimeters or bigger, e.g., from about 25000
Square centimeter or bigger, for example, about 50000 square centimeters or bigger.One
In individual embodiment, the surface area with about 90000 square centimeters or bigger can be processed
Substrate.
Gas distribution plate 18 can be mounted to backboard 14, and definition process district 16 is upper
Border.Multiple perforates 20 are formed in gas distribution plate 18, with process gases at permission
Deliver from these perforates.Gas source 40 can be by gas delivery to being formed at gas distribution
Plenum chamber (plenum) between plate 18 and backboard 14, regulates the flow of vital energy with the place of distribution fifty-fifty
Body, thus by gas distribution plate 18 delivery process gas equably.Power supply 42 can
It is electrically coupled to gas distribution plate 18, to be formed by the process gases flowing through perforate 20
Gas ions.Power supply 42 can be any kind of power supply for PECVD chamber, example
Such as radio-frequency power supply.Shadow frame 22 is depicted as being arranged on substrate support 32.Cover
Frame 22 includes that shadow frame main body 24, the most detachable lip 26 are attached to shadow frame
Main body 24.
Cavity 12 also includes shadow frame support member 44, and shadow frame support member 44 is annularly
Formed around substrate support 32.When substrate support 32 is positioned at relatively low position,
Shadow frame 22 is supported by shadow frame support member 44.
Substrate support 32, also referred to as pedestal or heater, be arranged in process chamber 10
In and activated by motor 33.In higher processing position so that substrate 28 is arranged in
Substrate support 32 in the substrate 34 of substrate support 32, supports and hides
Cover the shadow frame main body 24 of frame 22, and the lower boundary in definition process district 16, so make
Obtain substrate 28 to be arranged in treatment region 16.Prop up when shadow frame main body 24 is parked in substrate
Time on support surface 34, detachable lip 26 extends the upper of a part for substrate 28
This part contact of Fang Bingyu.
Substrate 28 is by the opening 36 into and out process chamber being formed in cavity 12
Room 10, opening 36 is optionally sealed by slit valve mechanism (not shown).Lift pin
38 can be slidably to configure through substrate support 32, and be applicable to by
Substrate is maintained at the upper end of substrate support 32.Lift pin 38 can be by using horse
Reach 33 reduction substrate supports 32 and activatable.
Fig. 2 A is the schematic diagram of the shadow frame 200 according to an embodiment, shadow frame 200
Detachable lip 202 is made to be coupled to shadow frame main body 204.Shadow frame main body 204
Can be made up of multiple shadow frame main body block 203A, 203B.Although being shown in the accompanying drawings
For multi-blocked structure, shadow frame main body 204 can be to have cooperation substrate (at plate glass base
Rectangle in the case of plate) the single block of shape.Additionally, shadow frame 200
Any size or shape can be required to be according to user, e.g. flat for one piece 5500
The substrate of square centimetre and the shadow frame that designs.
Shadow frame main body 204 can be with fixable mode and detachable lip 202
Connect.Detachable lip 202 can be by multiple detachable lip block 205A, 205B
Composition, however, it is to be understood that detachable lip 202 can include single block.
Shadow frame main body block 203A, 203B can be attached to detachable lip block respectively
205A、205B.Detachable lip block 205A, 205B can overlap shadow frame main body
Block 203A, 203B, thus allow detachable lip block 205A, 205B and be more than
One shadow frame main body block 203A, 203B connect.
It is formed between shadow frame main body block 203A, 203B and detachable lip block
Gap between 205A, 205B can by one or more gap cover 206A and
206B seals.Gap cover 206A and 206B can use one or more company of support
Fitting is connected to shadow frame main body 204, and support connector is depicted as the company here of support
Fitting 208A and 208B.Here the support connector described is preferred embodiment.
Further embodiment can use its that be connected to other assembly of shadow frame and shadow frame
The support connector that its assembly is connected or connected by other assembly of shadow frame.
Support connector in this embodiment can be door bolt or screw or other fastening
Mechanism.
It is important that, it is noted that depict the gap cover of the equipment of coverage gap here as
206A and 206B is an embodiment.Other gap cover can be integrated in
In shadow frame main body block 203A, 203B or detachable lip block 205A, 205B,
Such as being formed at the overhang in shadow frame main body block 203A, this overhang coordinates to be inserted
It is formed in the groove in the second shadow frame main body block 203B.It is also anticipated that above-mentioned enforcement
The combination of example.
Fig. 2 B describes the generalized section of the shadow frame 200 according to an embodiment, hides
Covering frame 200 makes detachable lip 202 be coupled to shadow frame main body 204.Cover
Frame main body 204 can have first supporting surface the 210, second supporting surface 212, inward flange
214A and 214B, outward flange 216 and lower limb 218.
First supporting surface 210 can be in the face of substrate, and in fact during processing
It is parked in substrate.When shadow frame 200 is not supported by substrate support,
Lower limb 218 is parked on shadow frame support member.One example of shadow frame support member
It it is the shoulder (ledge) extending from chamber wall.
Second supporting surface 212 can be arranged relative to the first supporting surface 210.In Fig. 2 B institute
In the embodiment shown, surface 210 and 212 is substantial parallel.However, it is to be understood that
Surface 210,212 can be arranged to coordinate shadow frame demand.Second supporting surface 212 can
Having the structure being formed in surface, such as perforate 213, perforate 213 can be used for holding
Receive the retention mechanism in order to detachable lip 202 to be connected to shadow frame main body 204.
The thickness of shadow frame main body 204 guarantees between detachable lip 202 and substrate
It is contacted without being applied to too many stress substrate or shadow frame main body 204.Consider
The detachable lip 202 position when being attached at shadow frame main body 204, is covering
In frame main body 204, the distance between the first supporting surface 210 and the second supporting surface 212 is (i.e.,
The length of inward flange 214A) should be not blocked up and detachable lip is arranged to not
Contact substrate, in one embodiment, this distance substrate the most to be processed
Thickness.In certain embodiments, the first supporting surface 210 and the second supporting surface 212
Between distance between about 6 millimeters and about 15 millimeters, e.g., from about 10 millimeters
Distance.In the embodiment shown in Fig. 2 B, shadow frame main body 204 is depicted as having " L "
Shape, to make shadow frame main body 204 be parked in substrate, simultaneously all
Side ring is around both substrate and substrate support.
Inward flange 214A and 214B can be configured to provide shadow frame main body 204 respectively
From substrate and the appropriate intervals between substrate support.It is being not intended to be limited to theory
In the case of, it is believed that the damage caused substrate by shadow frame main body 204 can improve base
Seat and shadow frame main body 204 between compared to and other assembly between for electric arc occur
Probability.But, if shadow frame main body 204 is from substrate too far, then deposition can
Can betide on substrate below shadow frame.
Outward flange 216 and lower limb 218.Outward flange 216 and lower limb can be substantially
Smooth surface, the flat surfaces intersected with an angle of 90 degrees such as Fig. 2 B be depicted as.Separately
Outer embodiment can include different shapes or angle, to meet technical staff for hiding
Cover the needs of frame support member.Shadow frame main body 204 more can by metal (such as, aluminum),
Anodised aluminium or pottery are constituted.
Detachable lip 202 would generally include pottery.Detachable lip uses
Aluminium strip carrys out the probability of warpage.In one embodiment, detachable lip 202 is relatively
Shadow frame main body 204 is thin.In certain embodiments, detachable lip can be between
About 2 millimeters are arrived about 10 millimeters thick, and e.g., from about 3 millimeters are arrived about 5 millimeters thick.At one
In embodiment, detachable lip 202 is made up of and about 3 millimeters thick pottery.
In the embodiment shown in Fig. 2 B, detachable lip 202 extends beyond and covers
Frame main body 204, and a part for substrate edges can be covered.Detachable lip 202
Extensible beyond shadow frame main body 204 about 25 millimeters and about 40 millimeters between.
Detachable lip 202 can include one piece of single block.Detachable lip
202 can have first lip surface the 222, second lip surface the 224, first edge 226,
And second edge 228.Support connector 229 to may be used to detachable lip 202
It is coupled to shadow frame main body 204.
First lip surface 222 is arranged to during processing in the face of substrate, and with second
Support face 212 contacts.Additionally, when shadow frame 200 is arranged on substrate support,
Can contacting with substrate at least partially of first lip surface 222.First lip surface
222 can be substantially planar surface.Further embodiment can include superficial makings or
Further feature, contacts the part of substrate reducing by the first lip surface 222.
Second lip surface 224 is relative to the first lip surface 222.Second lip surface
224 can be substantially parallel to the first lip surface 222.Further embodiment include with
The second lip surface 224 of an angle formation is had relative to the first lip surface 222,
To produce an angle.In one embodiment, the first lip surface 222 and second
Lip surface 224 can form the angle from about 3 degree to about 7 degree, e.g., from about 5 degree
Angle.
First edge 226 connects first and second lip surface 222,224.Although
Fig. 2 B depicts as flat, but the first edge 226 can be to allow the first edge 226
Coordinate securely and in a groove variously-shaped is installed, coordinate the most securely and be arranged on
Bending in the recess shoulder (not shown) of bending or V-arrangement or the first edge of V-arrangement.
Second edge 228 is relative to the first edge 226.Second edge 228 connects first
And second lip surface 222,224.Although depicting flat surfaces in fig. 2b as,
But the second edge 228 can be to provide contact with safer between substrate or reduce contact
That puts is variously-shaped, (rounded) or tapered asymptotic (tapered) of such as arc-shaped
Second edge.
Support connector 229 and detachable lip 202 can be securely connected to shadow frame
Main body 204.Supporting connector 229 can be detachable lip 202 and shadow frame master
Connect on the point that body 204 is met, e.g. close at the first edge 226.This
Outward, supporting connector 229 can be fixing connector, e.g. door bolt, groove or spiral shell
Silk.In the embodiment shown in Fig. 2 B, support connector 229 and depict screw as.
Support connector 229 and can include such as aluminum, anodised aluminium, pottery or other material
The material of material.The support connector 229 being used in an embodiment can include and hide
Cover frame main body 204 or the identical material of detachable lip 202.Support additionally is even
The embodiment of fitting 229 can include that slidably groove, door bolt, clasp maybe can will be able to divide
Other being securely held together from formula lip 202 and shadow frame main body 204 is fixed
Adnexa.
It is important that, it is noted that the shadow frame described here need not by multiple shadow frame masters
Body block and detachable lip block composition.Detachable lip and shadow frame main body can be divided
All-in-one-piece structure that Wei be not single.The combination of any of above content may be used to form root
Embodiment according to the shadow frame of the present invention.For example, an all-in-one-piece shadow frame
The main multiple detachable lip block being connectable to include a shadow frame part.
In the case of being not only restricted to theory, it is believed that by the design described here
The use of the detachable lip of kind or multiple design, has permission preferably at edge
Deposition profile.Due to disorderly air-flow, the design of prior art has been found that in shadow frame
The gradually inclination in direction, thus causes the uneven thickness of sedimentary above substrate surface
Degree.Embodiments set forth herein forms deposition profile evenly.Along with evenly
Deposition profile, equipment can be formed closer to substrate edges, so brings on substrate
More equipment, and the less waste of substrate space during processing.
Fig. 3 A-3D is the various realities illustrating the shadow frame using detachable lip designs
Execute the generalized section of example.The part of embodiment described below can make alone or in combination
With, to reach and the contacting of substrate surface, and not damaged substrate during processing.
Fig. 3 A describes shadow frame 300, and shadow frame 300 has tapered asymptotic dividing
From formula lip 302.Shadow frame 300 can have detachable lip 302, detachable
Lip 302 has tapered asymptotic edge 304A and 304B.Tapered asymptotic
Edge 304A and 304B can form the profile that deposition thin film is relatively low.Although this embodiment
In detachable lip 302 be depicted as that there are two tapered asymptotic edges, but
It is to be not required to two tapered asymptotic expressions in edge.Detachable lip 302 can be firm
Admittedly be connected to the upper surface of shadow frame main body 306.Detachable lip 302 can make
Connect with supporting connector, depict support connector as screw 308 here.Optional
Select support connector so that this support connector can be removed easily.
The part that the shadow frame of prior art extends surface in shadow frame (is referred to as
Lip) there is of a relatively high critical thickness.If this is because lip is during processing
Damage, then must replace whole shadow frame, thus bring undesired downtime
And the high cost replaced.Removable connector can allow for detachable lip 302
The setting reliable on substrate when being connected to shadow frame main body 306.Additionally, damaging
In the case of Huai, detachable lip 302 can be removed and replaced easily.
Fig. 3 B describes shadow frame 310, and shadow frame 310 has the detachable lip of support
The recess 316 of 312.In this embodiment, along with detachable lip 312 is from covering
Frame main body 314 stretches out, and detachable lip 312 maintains the most similar width
Degree.As discussed previously, detachable lip 312 can be the thinnest, such as
Between about 1 millimeter and about 3 millimeters, to produce gratifying film profile.
Detachable lip 312 can be securely connected the upper surface to shadow frame main body 314.
Detachable lip 312 can use removable means to connect, such as screw or folder
Son.Some embodiments can use permanent or semi-permanent connector, such as, weld.
Detachable lip 312 can have smooth edge 318A and 318B.Smooth
Edge 318A can be substantially similar to the recess shoulder 319 of recess 316.Smooth
Edge 318B can be extended out above substrate (not shown).It is formed at shadow frame main body
The recess 316 on 314 surfaces, disclosed by such embodiment, it is possible to provide detachable lip
Support that portion 312 is extra and avoid the volume of flowing below detachable lip 312
Outer both measures.Further, by reducing the detachable lip that plasma can contact
The surface area of 312, can reduce the damage of the most detachable lip 312
Bad.In the embodiment shown in figure 3b, the upper surface essence of detachable lip 312
The surface of upper alignment shadow frame main body 314 the top.
Fig. 3 C describes the shadow frame 320 according to another embodiment, and shadow frame 320 has
Support the recess 323 of detachable lip 322.In this embodiment, along with dividing
Stretch out from shadow frame main body 324 from formula lip 322, detachable lip 322
Maintain the most similar width.As discussed previously, detachable lip 322
Can be the thinnest, to produce gratifying film profile.Detachable lip 322
The upper surface to shadow frame main body 324 can be securely connected.Detachable lip 322
Removable means can be used to connect, such as screw or clip.
Detachable lip 322 can have detachable hp body 329 and smooth limit
Edge 326.Smooth edge 326 can be substantially similar to the recess shoulder of recess 323
327.Further, smooth edge 326 can be parked securely against recess shoulder 327,
The part that shadow frame main body 324 parks to avoid detachable lip 322 to abut against
Rotary motion (pivoting movement).Detachable lip 322 also can have circle
The edge 328 of arcuation.The edge 328 of arc-shaped can be circular shape can completely
It is configured to share a bisector with detachable hp body 329.Reality additionally
Execute example and include only for the circular arc rim 328 of partial arc, such as only in the face of substrate
The circular arc rim that surface is arc-shaped 328.In one embodiment, arc-shaped
Edge is partially or completely arc-shaped, and wherein bisector offsets towards substrate (not shown).
Fig. 3 D describes the shadow frame 330 according to another embodiment, and shadow frame 330 has
Support the recess 336 of detachable lip 332.In this embodiment, along with dividing
Angled edge is extended outwardly to form from shadow frame main body 324 from formula lip 332
335, the width of detachable lip 332 reduces.Angularly edge 335 can be base
In the various angles of user demand, such as from the substrate-side of detachable lip 332
Measure, the angle of 2 degree formed between the first lip surface and the second lip surface.
Detachable lip 332 can be securely connected the upper surface to shadow frame main body 334.
Further embodiment can have the angled edge 335 of the angle of 1 degree or less,
To allow detachable lip 332 to extend farther in surface, the most detachable
Lip 332 maintains the upper table of the recess 336 being same as or less than shadow frame main body 334
The height in face.
Detachable lip 332 can have smooth edge 333.Smooth edge 333
The recess shoulder 337 of recess 336 can be substantially similar to.Further, smooth edge
333 can park securely against recess shoulder 337, to avoid detachable lip
332 rotary motions abutting against the part that shadow frame main body 334 is parked.Detachable
Lip 332 also can have multiple support connector, depicts two screw 338A here as
And 338B.
Although it is substantially straight that embodiments set forth herein describes detachable lip one
Main body, but further embodiment can have the main body bent by two-dimensional silhouette
Or formed variously-shaped.For example, detachable lip can from shadow frame main body with
One curvature extends, to contact substrate.Further embodiment can in detachable lip
There is one or more bending section, to allow the first edge of detachable lip to start from
Higher than substrate surface.Detachable lip then will have one in detachable lip
Individual or multiple bending sections, with by the second boundary zone to the contacting of substrate.
Fig. 4 is the detachable lip illustrating the gap covered between adjacent shadow frame block
Schematic top plan view.Shadow frame 400 can have shadow frame main body 402, shadow frame master
Body 402 has one or more shadow frame main body block 403A, 403B, shadow frame main body
Block 403A, 403B can be different length and shape so that shadow frame main body 402 accords with
Close the size and dimension of the substrate being made boundary line by shadow frame main body 402.
Detachable lip 404 can include multiple detachable lip block 405A and
405B, detachable lip block 405A, 405B can have and extend beyond shadow frame master
The size of body block 403A, 403B.Consequently, it is possible to detachable lip block 405A,
Shadow frame main body block 403A, 403B, when being attached securely, can be kept by 405B
Together, and reduce the gap width between block and block.
Detachable lip 404 can coordinate inserts in recess 406.Recess 406 can be by many
Individual recess forms, and e.g. those are formed at shadow frame main body block 403A to these multiple recesses
With the recess in 403B.When shadow frame main body block 403A, 403B and detachable lip
When portion block 405A, 405B are combined, the gap of some sizes may have an independent existence
In detachable between lip block 405A, 405B and have an independent existence in shadow frame
Between main body block 403A, 403B.One or more gap cover 410 may be used to
Cover the gap between these block parts.Although the most only illustrating a gap
Covering 410, but a gap cover can be infered and may correspond to by detachable
Lip block 405A, 405B and shadow frame main body block 403A, 403B are formed at shadow frame
Each gap in 400.
Gap cover 410 can be fixed to have corresponding junction point 408A and 408C
Shadow frame main body block 403A, 403B, here junction point 408A and 408C is retouched
Plot perforate.Junction point 408A and 408C can be formed through shadow frame main body block 403B
With gap cover 410, to allow the support connector of such as screw or door bolt therefrom to lead to
Cross.Junction point 408B and 408D can be formed through detachable lip block 405A,
405B and shadow frame main body block 403A, 403B, to connect detachable lip block
405A, 405B and shadow frame main body block 403A, 403B.The component of the top is (at this
In embodiment in be illustrated as shadow frame main body block 403A, 403B, detachable lip
Block 405A, 405B or gap cover 410) junction point 408A-408D, can
There is shape edge in the slope, to allow support connector to be recessed into the block of the top
In part.
Embodiments set forth herein relates generally to a kind of shadow frame for processing chamber.
This shadow frame is by the single structure of the detachable lip supporting solid memder or multiple component
The shadow frame main body composition of part or multiple component.Detachable lip can include various shape
Shape, and lightweight material can be used.The detachable lip of multi-block or multi-block hide
The embodiment covering frame main body includes gap cover, to seal the gap between block and block.
Detachable lip can contact substrate and not make substrate produce slight crack or rupture, thus
Allow shadow frame to occur without electric arc for high energy plasma operation, provide simultaneously
The good profile of the deposition thin film on substrate.Additionally, the detachable lip of shadow frame
Portion can replace easily, allowing the detachable lip damaged with relatively low cost and
Higher frequency exchange.
Although foregoing relate to embodiments of the invention, but basic without departing substantially from the present invention
In the case of scope, other and the further embodiment of the available present invention, and
And the scope of the present invention is defined by appended claims.
Claims (15)
1., for controlling a device for the deposition on substrate, described device includes:
Shadow frame, described shadow frame includes:
Shadow frame main body, described shadow frame main body have the first supporting surface, second
Support face and inward flange, wherein said first supporting surface is being positioned at covering of process chamber
In the face of the substrate of substrate support time in frame support member, described second
Support face is relative to described first supporting surface, and described inward flange has described first and supports
Length between face and described second supporting surface, described length substantially equal to be located
The thickness of the substrate of reason；And
Detachable lip, described detachable lip is with described shadow frame main body even
Connect and be arranged on described second supporting surface in fixable mode, described separable
Formula lip have the first lip surface, the second lip surface, the first edge and
Second edge, described first lip surface in the face of described substrate support, described the
Two lip surface are arranged on relative to described first lip surface, described first edge
Above described first supporting surface, described second edge is relative to described first edge；
And
Supporting connector, described shadow frame main body is coupled to described by described support connector
Detachable lip.
2. device as claimed in claim 1, wherein said detachable lip includes
Material selected from the combination of pottery, aluminum or described ceramic and described aluminum.
3. device as claimed in claim 1, wherein said shadow frame main body includes coupling
Two or more the shadow frame main body block being connected together.
4. device as claimed in claim 3, wherein said detachable lip includes
The detachable lip block of a two or more being coupled together.
5. device as claimed in claim 4, farther includes one or more gap
Covering, wherein said one or more gap cover seal described two or more
Gap between individual detachable lip block and described two or more shadow frame master
Gap between body block.
6. device as claimed in claim 1, wherein said detachable lip has
Thickness between 2 millimeters and 5 millimeters.
7. device as claimed in claim 1, farther includes one or more gap and covers
Cover piece, wherein said one or more gap cover seal described two or more
Gap between detachable lip block and described two or more shadow frame main body
Gap between block.
8., for controlling a device for the deposition on substrate, described device includes:
Shadow frame, described shadow frame includes:
Shadow frame main body, described shadow frame main body has:
First supporting surface, wherein said first supporting surface is being positioned at process chamber
Shadow frame support member in time in the face of the substrate of substrate support；
Second supporting surface, described second supporting surface supports relative to described first
Face, described second supporting surface has recess, and described recess has:
Recess lower surface；And
Recess shoulder；
Inward flange, described inward flange has described first supporting surface and described recessed
Length between lower surface, described length is substantially equal to base to be processed
The thickness of plate；And
Detachable lip, described detachable lip is with described shadow frame main body even
Connect and be arranged in the described recess of described second supporting surface in fixable mode,
Described detachable lip has:
First lip surface, described first lip surface in the face of described substrate,
A part for wherein said first lip surface is with described recess lower surface even
Connect；
Second lip surface, described second lip surface is relative to described first
Lip surface；
First edge, described first edge is arranged to described recess shoulder even
Connect；And
Second edge, described second edge is relative to described first edge.
9. device as claimed in claim 8, wherein said first edge and described the
Two edges are that taper is asymptotic.
10. device as claimed in claim 8, wherein said second edge has and is less than
The width at described first edge.
11. devices as claimed in claim 8, wherein said shadow frame main body includes choosing
Freely pottery, aluminum, anodised aluminium and described aluminum ceramic, described and described sun
The material of the group of the combination composition of pole aluminium oxide.
12. devices as claimed in claim 8, wherein said shadow frame main body includes two
Individual or more shadow frame main body block.
13. devices as claimed in claim 12, wherein said detachable lip bag
Include the detachable lip block of two or more.
14. devices as claimed in claim 13, farther include one or more
Gap covering, wherein said one or more gap cover seal described detachable
The gap between gap and described shadow frame body surfaces between lip surface.
15. devices as claimed in claim 8, wherein said detachable lip has
Thickness between 2 millimeters and 5 millimeters.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261620955P | 2012-04-05 | 2012-04-05 | |
| US61/620,955 | 2012-04-05 | ||
| US13/569,064 US10676817B2 (en) | 2012-04-05 | 2012-08-07 | Flip edge shadow frame |
| US13/569,064 | 2012-08-07 | ||
| US13/789,188 | 2013-03-07 | ||
| US13/789,188 US20140251216A1 (en) | 2013-03-07 | 2013-03-07 | Flip edge shadow frame |
| PCT/US2013/032990 WO2013151786A1 (en) | 2012-04-05 | 2013-03-19 | Flip edge shadow frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103379945A CN103379945A (en) | 2013-10-30 |
| CN103379945B true CN103379945B (en) | 2016-10-12 |
Family
ID=49300945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380000449.1A Active CN103379945B (en) | 2012-04-05 | 2013-03-19 | Flip edge shadow frame |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5956564B2 (en) |
| KR (1) | KR101547483B1 (en) |
| CN (1) | CN103379945B (en) |
| TW (1) | TWI576458B (en) |
| WO (1) | WO2013151786A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101942011B1 (en) * | 2014-06-13 | 2019-01-25 | 어플라이드 머티어리얼스, 인코포레이티드 | Flat edge design for better uniformity and increased edge life |
| KR101628813B1 (en) * | 2015-01-05 | 2016-06-09 | 주식회사 엠에스티엔지니어링 | Shadow frame |
| KR102632725B1 (en) * | 2016-03-17 | 2024-02-05 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support plate, thin film deposition apparatus including the same, and thin film deposition method |
| US10468221B2 (en) * | 2017-09-27 | 2019-11-05 | Applied Materials, Inc. | Shadow frame with sides having a varied profile for improved deposition uniformity |
| WO2019156837A1 (en) * | 2018-02-09 | 2019-08-15 | Applied Materials, Inc. | Apparatus and methods for reducing cross-contamination in cvd systems |
| CN108374161B (en) * | 2018-03-07 | 2020-05-01 | 昆山龙腾光电股份有限公司 | Shielding frame and chemical vapor deposition device |
| CN108728814B (en) * | 2018-06-04 | 2020-06-30 | 深圳市华星光电半导体显示技术有限公司 | Shadow frame |
| KR102191388B1 (en) * | 2018-06-12 | 2020-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | Mask Frame and Mask Assembly |
| CN109338335B (en) * | 2018-10-16 | 2020-09-08 | 深圳市华星光电技术有限公司 | Shadow frame structure for chemical vapor deposition |
| JP7385023B2 (en) * | 2019-09-26 | 2023-11-21 | アプライド マテリアルズ インコーポレイテッド | Support bracket device and method for substrate processing |
| KR20240093834A (en) * | 2021-11-01 | 2024-06-24 | 어플라이드 머티어리얼스, 인코포레이티드 | Notched susceptor design for stable shadow frame |
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- 2013-03-19 KR KR1020137018289A patent/KR101547483B1/en active IP Right Grant
- 2013-03-19 CN CN201380000449.1A patent/CN103379945B/en active Active
- 2013-03-19 JP JP2014509524A patent/JP5956564B2/en active Active
- 2013-03-19 TW TW102109741A patent/TWI576458B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013151786A1 (en) | 2013-10-10 |
| KR101547483B1 (en) | 2015-08-26 |
| TW201348491A (en) | 2013-12-01 |
| TWI576458B (en) | 2017-04-01 |
| CN103379945A (en) | 2013-10-30 |
| KR20140034126A (en) | 2014-03-19 |
| JP2014528155A (en) | 2014-10-23 |
| JP5956564B2 (en) | 2016-07-27 |
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