CN103378261A - Light emitting diode encapsulating structure - Google Patents

Light emitting diode encapsulating structure Download PDF

Info

Publication number
CN103378261A
CN103378261A CN2012101257682A CN201210125768A CN103378261A CN 103378261 A CN103378261 A CN 103378261A CN 2012101257682 A CN2012101257682 A CN 2012101257682A CN 201210125768 A CN201210125768 A CN 201210125768A CN 103378261 A CN103378261 A CN 103378261A
Authority
CN
China
Prior art keywords
led
depression
base plate
package structure
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101257682A
Other languages
Chinese (zh)
Inventor
张耀祖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Original Assignee
Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rongchuang Energy Technology Co ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical Rongchuang Energy Technology Co ltd
Priority to CN2012101257682A priority Critical patent/CN103378261A/en
Priority to TW101115490A priority patent/TW201344983A/en
Publication of CN103378261A publication Critical patent/CN103378261A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

Landscapes

  • Led Device Packages (AREA)

Abstract

A light emitting diode encapsulating structure comprises an encapsulating substrate, a light emitting diode grain and a lens, wherein the encapsulating substrate is provided with a top face and a bottom face which are oppositely arranged, the light emitting diode grain is arranged on the top face of the encapsulating substrate, and the lens is arranged on the top face of the encapsulating substrate and covers the light emitting diode grain. A concave region is arranged on the top face of the encapsulating substrate, the depth of the concave region is smaller than the thickness between the top face and the bottom face of the encapsulating substrate, a convex column is formed at the position, corresponding to the concave region, of the lens, the convex column is embedded into the concave region of the encapsulating substrate, and the size of the tail end, located on the bottom portion of the concave region, of the convex column is larger than that of the opening of the concave region. The joint force between the lens and the substrate of the light emitting diode encapsulating structure is strong, and the light emitting diode encapsulating structure has the advantage of being high in reliability.

Description

Package structure for LED
Technical field
The present invention relates to a kind of semiconductor package, relate in particular to a kind of encapsulating structure of light-emitting diode.
Background technology
Than traditional light emitting source, light-emitting diode (Light Emitting Diode, LED) have the advantages such as lightweight, that volume is little, it is low to pollute, the life-span is long, it is as a kind of novel light emitting source, be applied to more and more in the middle of each field, such as street lamp, traffic lights, signal lamp, shot-light and decorative lamp etc.
Existing package structure for LED generally includes substrate, be positioned at the LED crystal particle on the substrate and be arranged on the substrate and cover the lens of LED crystal particle.Yet, the common encapsulating structure of this kind just comes connection substrate and lens with bond usually, and lens are generally slim shell-like structure, and bond strength is not good enough so that the contact area between substrate and the lens is less for this kind structural design, and lens are easy to peel off from the substrate disengaging.
Summary of the invention
In view of this, be necessary to provide the package structure for LED of a kind of lens and substrate fluid-tight engagement.
A kind of package structure for LED, comprise base plate for packaging with the end face that is oppositely arranged and bottom surface, be arranged on the LED crystal particle on the base plate for packaging end face and be arranged on the base plate for packaging end face and cover the lens of this LED crystal particle, be provided with depression on the end face of this base plate for packaging, the degree of depth of this depression is less than the thickness between base plate for packaging end face and the bottom surface, the position of the corresponding depression of this lens is formed with projection, and this projection embeds in the depression of base plate for packaging and this projection is positioned at the tip dimensions of concave bottom greater than the size at described recessed openings place.
This kind package structure for LED embeds in the depression of base plate for packaging via the projection of lens, thereby strengthens the bond strength of lens and base plate for packaging, improves the reliability of package structure for LED, can prevent effectively that lens from peeling off from the base plate for packaging disengaging.
With reference to the accompanying drawings, the invention will be further described in conjunction with embodiment.
Description of drawings
The view sub-anatomy of the package structure for LED that Fig. 1 provides for first embodiment of the invention.
The whole cutaway view of the package structure for LED that Fig. 2 provides for first embodiment of the invention.
Fig. 3-Fig. 7 changes the embodiment schematic diagram for the depression distribution of the package structure for LED that first embodiment of the invention provides.
The view sub-anatomy of the package structure for LED that Fig. 8 provides for second embodiment of the invention.
Fig. 9-Figure 10 changes the embodiment schematic diagram for the depression distribution of the package structure for LED that second embodiment of the invention provides.
The main element symbol description
Package structure for LED 10，20
Base plate for packaging 11
Supporting part 110
Loading end 1100
The bottom surface 1102
The first electrode 112
The second electrode 114
Shoulder hole 115
The single order hole 1150
Depression 116
Recessed openings 1160
Concave bottom 1162
LED crystal particle 12
Lens 13
Projection 130
Projection is terminal 1300
Metal wire 14
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Referring to Fig. 1 and Fig. 2, the package structure for LED 10 that first embodiment of the invention provides comprises base plate for packaging 11, LED crystal particle 12 and lens 13.
Described base plate for packaging 11 comprises supporting part 110, the first electrode 112, the second electrode 114 and caves in 116.
This supporting part 110 comprises a loading end 1100 and the bottom surface 1102 relative with this loading end 1100.The described LED crystal particle 12 of these loading end 1100 carryings, this bottom surface 1102 is used for when assembling this package structure for LED 10 to the circuit board (not shown) and circuit board is affixed.
This first electrode 112 and the second electrode 114 are arranged at respectively on the loading end 1100 of supporting part 110, and extend to 1102 places, bottom surface, are electrically connected with circuit board formation during to circuit board at this package structure for LED 10 of assembling being used for.The upper surface of the loading end 1100 of described supporting part 110, the upper surface of the first electrode 112 and the second electrode 114 is jointly as the end face of base plate for packaging 11, and the lower surface of the bottom surface 1102 of described supporting part 110, the lower surface of the first electrode and the second electrode 114 is jointly as the bottom surface of base plate for packaging 11.
This depression 116 is formed on the loading end 1100 of base plate for packaging 11.This depression 116 communicates with loading end 1100, and 1,102 one sides are extended towards the bottom surface.This depression 116 forms a recessed openings 1160 at loading end 1100, and has a concave bottom 1162 in adjacent floor 1,102 one sides.The size of this concave bottom 1162 is greater than recessed openings 1160.The degree of depth of described depression 116 is less than the thickness of base plate for packaging 11, and also, this depression 116 is for being formed on the blind hole on the base plate for packaging 11, and this kind setting can guarantee that the bottom surface 1102 of base plate for packaging 11 is even curface, and makes things convenient for winding belt package and paster processing procedure.
Described LED crystal particle 12 is arranged on base plate for packaging 11 end faces, and is electrically connected to the first electrode 112 and second electrode 114 of this base plate for packaging 11.Concrete, this LED crystal particle 12 is arranged on the loading end 1100 of supporting part 110, and this LED crystal particle 12 is connected on the first electrode 112, the second electrode 114 by metal wire 14 routings.
Described lens 13 are arranged on base plate for packaging 11 end faces and cover this LED crystal particle 12.Concrete, these lens 13 cover the part surface of LED crystal particle 12, loading end 1100 parts that do not covered by LED crystal particle 12, the first electrode 112 and the second electrode 114.The position of these lens 13 corresponding depressions 116 has protruded out projection 130.
This projection 130 embeds in the depression 116, and this projection 130 is positioned at terminal 1300 sizes of projection at concave bottom 1162 places greater than the size of recessed openings 1160, thereby this projection end 1300 is trapped in concave bottom 1162 places, so that lens 13 are fixed on this base plate for packaging 11.Understandable, the size of described projection end 1300 can be with concave bottom 1162 measure-alike, perhaps be slightly less than the size of concave bottom 1162, can realize the function of fixed lens 13 greater than the size of recessed openings 1160 as long as guarantee terminal 1300 sizes of projection.
This kind package structure for LED 10 embeds in the depression 116 of base plate for packaging 11 via the projection 130 of lens 13, thereby strengthen the bond strength of lens 13 and base plate for packaging 11, improve the reliability of package structure for LED 10, can prevent effectively that lens 13 from peeling off from base plate for packaging 11 disengagings.
Need to prove, as shown in Figure 3, described depression 116 linearly shape is distributed in the both sides of LED crystal particle 12, as shown in Figure 4, described depression 116 also can be rounded around be distributed in LED crystal particle 12 around, certainly this depression 116 also can be other regular or irregular shapes, needs only corresponding adjustment projection 130 shape being set and does not affect base plate for packaging 11 and cooperate with holding of lens 13.In addition, the quantity of the depression 116 that described LED crystal particle 12 is one-sided can be two (as shown in Figure 5) or more, these a plurality of depressions 116 can be all linearly shape and adjacent distributions the both sides (as shown in Figure 6) of LED crystal particle 12 or be a plurality of concentric circless and around be distributed in LED crystal particle 12 around (as shown in Figure 7).
Referring to Fig. 8, second embodiment of the invention provides a kind of package structure for LED 20, package structure for LED 10 structures that provide with the first embodiment are substantially identical, this package structure for LED 20 comprises base plate for packaging 11, LED crystal particle 12 and lens 13 equally, and this base plate for packaging 11 comprises supporting part 110, the first electrode 112, the second electrode 114 and caves in 116; This LED crystal particle 12 is arranged on base plate for packaging 11 end faces, and is electrically connected to the first electrode 112 and second electrode 114 of this base plate for packaging 11; These lens 13 comprise the projection 130 that is embedded in the depression 116.Different from package structure for LED 10 is: be formed with shoulder hole 115 on the end face of this base plate for packaging 11, this shoulder hole 115 comprises the single order hole 1150 that is formed on the loading end 1100 and the described depression 116 that is formed on 1150 bottoms, single order hole, and this depression 116 forms recessed openings 1160 as the second order hole of shoulder hole 115 and the intersection that should cave in bottom the single order hole.Accordingly, the identical of the shape of the projection 130 of lens 13 and shoulder hole 115 is held in the shoulder hole 115 being fit to.This kind arranges structure can effectively increase bonding area between lens 13 and the base plate for packaging 11, further promote between the two in conjunction with dynamics.In the present embodiment, the size of described recessed openings 1160 is less than the size in single order hole 1150.
Certainly, described shoulder hole 115 can linearlyly be distributed in LED crystal particle 12 both sides (as shown in Figure 9), described shoulder hole 115 shoulder holes also can be rounded around being distributed in (as shown in figure 10) around the LED crystal particle 12.In addition, this shoulder hole 115 also can have other distressed structure, as long as guarantee that projection 130 can be held in the shoulder hole 115, does not repeat them here.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.

Claims (10)

1. package structure for LED, comprise and have the end face that is oppositely arranged and the base plate for packaging of bottom surface, be arranged on the LED crystal particle on the base plate for packaging end face, and be arranged on the base plate for packaging end face and cover the lens of this LED crystal particle, it is characterized in that: be provided with depression on the end face of this base plate for packaging, the degree of depth of this depression is less than the thickness between base plate for packaging end face and the bottom surface, the position of the corresponding depression of this lens is formed with projection, and this projection embeds in the depression of base plate for packaging and this projection is positioned at the tip dimensions of concave bottom greater than the size at described recessed openings place.
2. package structure for LED as claimed in claim 1 is characterized in that, described depression linearly shape is distributed in the both sides of LED crystal particle.
3. package structure for LED as claimed in claim 1 is characterized in that, described depression rounded around be distributed in LED crystal particle around.
4. package structure for LED as claimed in claim 1 is characterized in that, described depression is the grooves of a plurality of adjacent distributions on the base plate for packaging end face.
5. package structure for LED as claimed in claim 4 is characterized in that, described a plurality of grooves are rounded and with one heart around being distributed in around the LED crystal particle.
6. package structure for LED as claimed in claim 4 is characterized in that, described a plurality of grooves linearly shape are distributed in the both sides of LED crystal particle, and each side of LED crystal particle all has respectively the linear groove of at least two adjacent settings.
7. package structure for LED as claimed in claim 1, it is characterized in that, be formed with shoulder hole on the described base plate for packaging end face, the described depression that this shoulder hole comprises the single order hole that is formed on the base plate for packaging end face and is formed on single order hole bottom, the opening that this depression forms this depression as second order hole and the intersection bottom this depression and the single order hole of shoulder hole.
8. package structure for LED as claimed in claim 7 is characterized in that, described shoulder hole is around being distributed in around the LED crystal particle.
9. package structure for LED as claimed in claim 7 is characterized in that, described stepped pore distribution is in the both sides of LED crystal particle.
10. package structure for LED as claimed in claim 7 is characterized in that, the opening size of described depression is less than the size in single order hole.
CN2012101257682A 2012-04-26 2012-04-26 Light emitting diode encapsulating structure Pending CN103378261A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2012101257682A CN103378261A (en) 2012-04-26 2012-04-26 Light emitting diode encapsulating structure
TW101115490A TW201344983A (en) 2012-04-26 2012-05-02 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101257682A CN103378261A (en) 2012-04-26 2012-04-26 Light emitting diode encapsulating structure

Publications (1)

Publication Number Publication Date
CN103378261A true CN103378261A (en) 2013-10-30

Family

ID=49463093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101257682A Pending CN103378261A (en) 2012-04-26 2012-04-26 Light emitting diode encapsulating structure

Country Status (2)

Country Link
CN (1) CN103378261A (en)
TW (1) TW201344983A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110970539A (en) * 2018-09-28 2020-04-07 光宝光电(常州)有限公司 Light emitting unit

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080029775A1 (en) * 2006-08-02 2008-02-07 Lustrous Technology Ltd. Light emitting diode package with positioning groove
CN101452986A (en) * 2008-12-31 2009-06-10 广东昭信光电科技有限公司 Encapsulation structure and method for white light emitting diode device
CN201829528U (en) * 2010-07-23 2011-05-11 刘胜 Light emitting diode device encapsulating structure with fixing device
CN201893375U (en) * 2010-11-16 2011-07-06 宏齐科技股份有限公司 Light emitting diode packaging structure
CN102339939A (en) * 2010-07-23 2012-02-01 刘胜 Light-emitting diode (LED) device package structure with fixing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080029775A1 (en) * 2006-08-02 2008-02-07 Lustrous Technology Ltd. Light emitting diode package with positioning groove
CN101452986A (en) * 2008-12-31 2009-06-10 广东昭信光电科技有限公司 Encapsulation structure and method for white light emitting diode device
CN201829528U (en) * 2010-07-23 2011-05-11 刘胜 Light emitting diode device encapsulating structure with fixing device
CN102339939A (en) * 2010-07-23 2012-02-01 刘胜 Light-emitting diode (LED) device package structure with fixing device
CN201893375U (en) * 2010-11-16 2011-07-06 宏齐科技股份有限公司 Light emitting diode packaging structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110970539A (en) * 2018-09-28 2020-04-07 光宝光电(常州)有限公司 Light emitting unit

Also Published As

Publication number Publication date
TW201344983A (en) 2013-11-01

Similar Documents

Publication Publication Date Title
US10134967B2 (en) Light emitting device
US8616729B2 (en) Lens and light emitting apparatus having the same
CN102842667B (en) Light-emitting diode packaging structure and method for producing same
US8395183B2 (en) Light emitting apparatus
US8322885B2 (en) Lamp
CN103187504A (en) Package structure of light emitting diode
US8890192B2 (en) Light emitting diode with sidewise light output structure and method for manufacturing the same
EP2657968A1 (en) Package structure of high-power led light source module
CN102881812B (en) Manufacturing method for Light emitting diode packaging structure
CN103400927A (en) High-reliability LED (light emitting diode) bracket and LED device thereof
CN2935478Y (en) Support structure of LED equipped with transparent surface
CN103378261A (en) Light emitting diode encapsulating structure
US9257618B2 (en) LED package and method of manufacturing the same
CN102222665A (en) Integrated LED (light emitting diode) module with thin fly's-eye lens
CN202349676U (en) Light-emitting diode (LED) lamp and candlelight lamp made from LED lamp
CN201017897Y (en) Surface-mounted device diode crystal-fixing support structure
CN201582619U (en) Plug-in type luminescent diode lamp
WO2009096685A3 (en) Led package, and a production method therefor, and a device using the led package
CN206369147U (en) A kind of easy-to-mount split type vehicle turn signal
CN103515502A (en) Light emitting diode device
US8816385B2 (en) Light emitting diode package and method for manufacturing the same
CN202721175U (en) Radiating paster-type light-emitting diode support
CN210110829U (en) LED support
CN102916089A (en) Method for forming packaging structure of light emitting diode and method for forming base of packaging structure
KR100773451B1 (en) A high efficiency led lamp

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131030