CN103378043A - Chip assembly structure and chip assembly method - Google Patents
Chip assembly structure and chip assembly method Download PDFInfo
- Publication number
- CN103378043A CN103378043A CN2012101229894A CN201210122989A CN103378043A CN 103378043 A CN103378043 A CN 103378043A CN 2012101229894 A CN2012101229894 A CN 2012101229894A CN 201210122989 A CN201210122989 A CN 201210122989A CN 103378043 A CN103378043 A CN 103378043A
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- China
- Prior art keywords
- soldered ball
- chip
- bonding wire
- circuit board
- weld pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
A chip assembly structure comprises a circuit board, a chip located on the circuit board and a plurality of bonding wires electrically connecting the chip to the circuit board. A plurality of first welding pads are formed on the circuit board, and a plurality of second welding pads corresponding to the first welding pads respectively are formed on the chip. A first welding ball is formed on each first welding pad, and a second welding ball is formed on each second welding pad. The bonding wires are pulled to the corresponding second welding balls from the first welding balls respectively. Each bonding wire comprises an arched part formed in a pulling mode, and the arched parts are close to the first welding balls. The invention further relates to a chip assembly method.
Description
Technical field
The present invention relates to a kind of chipset assembling structure and chip assemble method.
Background technology
Be the function that realizes being scheduled to, generally comprise circuit board and a plurality of chip that is arranged on the described circuit board in the electronic product, described chip may have different sizes and height.Between the described chip and described chip be electrically connected by the routing mode with described circuit board.
In the prior art, usually adopt the pressure welding mode to link to each other the weld pad on connecting line and chip or the circuit board, so, along with the development of technology, described chip size becomes more and more less, correspondingly, the structure of described chip is also more and more come fragile, if adopt the mode of pressure welding to link to each other with connecting line, then described chip damages easily under pressure, causes chip assembling yield to descend.
Summary of the invention
In view of this, be necessary to provide a kind of chipset assembling structure and chip assemble method that can guarantee chip assembling yield.
A kind of chipset assembling structure comprises that a circuit board, one are positioned at the chip on the described circuit board and a plurality of described chip are electrically connected to bonding wire on the described circuit board.Be formed with a plurality of the first weld pads on the described circuit board, form a plurality of the second weld pads that correspond respectively to described the first weld pad on the described chip.Be formed with first soldered ball on described each weld pad, be formed with second soldered ball on described each second weld pad.Described bonding wire is the second soldered ball to correspondence from described the first soldered ball tractive respectively.Described bonding wire comprises one because of the arch portion of tractive formation, and described arch portion is near described the first soldered ball.
A kind of chip assemble method comprises the steps:
A circuit board is provided, is formed with a plurality of the first weld pads on the described circuit board;
A chip is provided, is formed with the second corresponding weld pad of a plurality of and described the first weld pad on the described chip;
Described chip is fixedly installed on described circuit board surface;
On described second weld pad, form second soldered ball;
Form in correspondence on described first weld pad of the second weld pad of described the second soldered ball and form first soldered ball;
A bonding wire is provided, an end and described first soldered ball of described bonding wire welded mutually;
With described bonding wire by described the first soldered ball tractive to described the second soldered ball, the other end of described bonding wire is soldered to described the second soldered ball, described bonding wire forms an arch portion near described the first soldered ball because of tractive.
With respect to prior art, described chipset assembling structure and chip assemble method, by on the second weld pad of the second weld pad of described chip and described circuit board, forming respectively soldered ball, and described bonding wire at first linked to each other with soldered ball on the first weld pad, then with the soldered ball of described bonding wire tractive to described the second soldered ball, can avoid the pressure welding mode to cause described chip to damage, improve chip assembling yield.In addition, the connected mode of above-mentioned bonding wire can be so that because of close described the first soldered ball of the formed arch portion of tractive, compare prior art, the length of described bonding wire reduces to some extent, therefore help to reduce the inductance of bonding wire, promote the performance of described chip, and the height of bonding wire decreases, therefore can be so that described chipset assembling structure be more compact.
Description of drawings
Fig. 1 is the schematic diagram of chipset assembling structure of the present invention.
Fig. 2 is the flow chart of chip assemble method of the present invention.
The main element symbol description
| The |
100 |
| |
10 |
| Loading |
11 |
| The |
12 |
| The first soldered |
13 |
| |
20 |
| The |
21 |
| The second soldered |
22 |
| |
30 |
| Initiating |
31 |
| |
32 |
| |
33 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing the present invention being done one specifically introduces.
See also Fig. 1, the bonding wire 30 that chipset assembling structure 100 of the present invention comprises a circuit board 10, is arranged at the chip 20 on the described circuit board 10 and connects described circuit board 10 and described chip 20.
Described circuit board 10 comprises a loading end 11 that is used for carrying described chip 20.Be provided with a plurality of the first weld pads 12 on the described loading end 11, described the first weld pad 12 links to each other with circuit terminal (not shown) on the described circuit board 10, is formed with first soldered ball 13 on described each first weld pad 12.
Described chip 20 is fixedly installed on the loading end 11 of described circuit board 10.Described chip 20 surfaces are provided with a plurality of the second weld pads 21, and described the second weld pad 21 is corresponding with the first weld pad 12 on the described circuit board 10.Be formed with second soldered ball 22 on described each second weld pad 21.
Described bonding wire 30 is used for will described the first weld pad 12 and corresponding the second weld pad 21 electrical connections.Described bonding wire 30 comprises an initiating terminal 31 that links to each other with described the first soldered ball 13, clearing end 32 and an arch portion 33 that links to each other with described the second soldered ball 22.Described initiating terminal 31 is the end that described bonding wire 30 is at first fixed when welding, and described clearing end 32 is the end that described bonding wire 30 is fixed when welding at last.Described arch portion 33 be described bonding wire 30 by described the first soldered ball 13 to the formed transition portion of described the second soldered ball 22 tractives, described arch portion 33 is roughly concordant with the second soldered ball 22 on described the second weld pad 21 near described initiating terminals 31 and described arch portion 33 tops.
Described the first soldered ball 13, described the second soldered ball 22 and described bonding wire 30 are made of the metal material of high conductivity, and in the present embodiment, described the first soldered ball 13, described the second soldered ball 22 and described bonding wire 30 consist of by gold (Au).
In the present embodiment, the quantity of the described chip 20 on the described circuit board 10 is one.Should be understood that, the quantity of described chip 20 also can be for a plurality of, and the thickness of a plurality of chips 20 can be different, also can adopt the bonding wire 30 of aforesaid way to link to each other between the described chip 20, as long as the initiating terminal 31 of described bonding wire 30 is positioned on the lower chip 20, clearing end 32 is positioned on the higher chip 20, and described arch portion 33 is near described initiating terminal 31.
See also Fig. 2, chip assemble method of the present invention comprises the steps:
A circuit board is provided, is formed with a plurality of the first weld pads on the described circuit board;
A chip is provided, is formed with the second corresponding weld pad of a plurality of and described the first weld pad on the described chip;
Described chip is fixedly installed on described circuit board surface;
On described second weld pad, form second soldered ball;
Form in correspondence on described first weld pad of the second weld pad of described the second soldered ball and form first soldered ball;
A bonding wire is provided, an end and described first soldered ball of described bonding wire welded mutually;
With described bonding wire by described the first soldered ball tractive to described the second soldered ball, the other end of described bonding wire is soldered to described the second soldered ball, described bonding wire forms an arch portion near described the first soldered ball because of tractive.
The above only describes the method for attachment of one of them second weld pad of described chip and corresponding first weld pad of described circuit board in detail, be appreciated that, other second weld pad can adopt same procedure to realize connecting with corresponding the first weld pad, gives unnecessary details no longer one by one herein.
Described chipset assembling structure and chip assemble method, by on the second weld pad of the second weld pad of described chip and described circuit board, forming respectively soldered ball, and described bonding wire at first linked to each other with soldered ball on the first weld pad, then with the soldered ball of described bonding wire tractive to described the second soldered ball, can avoid the pressure welding mode to cause described chip to damage, improve chip assembling yield.In addition, the connected mode of above-mentioned bonding wire can be so that because of close described the first soldered ball of the formed arch portion of tractive, compare prior art, the length of described bonding wire reduces to some extent, therefore help to reduce the inductance of bonding wire, promote the performance of described chip, and the height of bonding wire decreases, therefore can be so that described chipset assembling structure be more compact.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (10)
1. chipset assembling structure, comprise a circuit board, one is positioned at the chip on the described circuit board and a plurality of described chip is electrically connected to bonding wire on the described circuit board, be formed with a plurality of the first weld pads on the described circuit board, form a plurality of the second weld pads that correspond respectively to described the first weld pad on the described chip, it is characterized in that: be formed with first soldered ball on described each weld pad, be formed with second soldered ball on described each second weld pad, described bonding wire is the second soldered ball to correspondence from described the first soldered ball tractive respectively, described bonding wire comprises one because of the arch portion of tractive formation, and described arch portion is near described the first soldered ball.
2. chipset assembling structure as claimed in claim 1, it is characterized in that: each described bonding wire comprises an initiating terminal that links to each other with described the first soldered ball and a clearing end that links to each other with described the second soldered ball, and described arch portion is between described initiating terminal and described clearing end and near described initiating terminal.
3. as claimed in claim 1 chipset assembling structure, it is characterized in that: the top of described arch portion is concordant with the second soldered ball on described the second weld pad.
4. chipset assembling structure as claimed in claim 1, it is characterized in that: described the first soldered ball, described the second soldered ball and described bonding wire are made of the metal material of high conductivity.
5. chipset assembling structure as claimed in claim 4 is characterized in that: the material of described the first soldered ball, described the second soldered ball and described bonding wire is gold.
6. a chip assemble method comprises the steps:
A circuit board is provided, is formed with a plurality of the first weld pads on the described circuit board;
A chip is provided, is formed with the second corresponding weld pad of a plurality of and described the first weld pad on the described chip;
Described chip is fixedly installed on described circuit board surface;
On described second weld pad, form second soldered ball;
Form in correspondence on described first weld pad of the second weld pad of described the second soldered ball and form first soldered ball;
A bonding wire is provided, an end and described first soldered ball of described bonding wire welded mutually;
With described bonding wire by described the first soldered ball tractive to described the second soldered ball, the other end of described bonding wire is soldered to described the second soldered ball, described bonding wire forms an arch portion near described the first soldered ball because of tractive.
7. chip assemble method as claimed in claim 6 is characterized in that: described chip is fixed in described circuit board surface by mode bonding or welding.
8. chip assemble method as claimed in claim 6, it is characterized in that: the top of described arch portion is concordant with the second soldered ball on described the second weld pad.
9. chip assemble method as claimed in claim 6, it is characterized in that: described the first soldered ball, described the second soldered ball and described bonding wire are made of the metal material of high conductivity.
10. chip assemble method as claimed in claim 9 is characterized in that: the material of described the first soldered ball, described the second soldered ball and described bonding wire is gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101229894A CN103378043A (en) | 2012-04-25 | 2012-04-25 | Chip assembly structure and chip assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101229894A CN103378043A (en) | 2012-04-25 | 2012-04-25 | Chip assembly structure and chip assembly method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103378043A true CN103378043A (en) | 2013-10-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101229894A Pending CN103378043A (en) | 2012-04-25 | 2012-04-25 | Chip assembly structure and chip assembly method |
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| CN (1) | CN103378043A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550684A (en) * | 2018-06-16 | 2018-09-18 | 江门市中阳光电科技有限公司 | A kind of LED light source |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038374A1 (en) * | 2001-08-27 | 2003-02-27 | Shim Jong Bo | Multi-chip package (MCP) with spacer |
| CN1561545A (en) * | 2001-09-28 | 2005-01-05 | 摩托罗拉公司 | Semiconductor with multiple rows of bond pads |
| US6977439B2 (en) * | 2002-03-21 | 2005-12-20 | Samsung Electronics Co., Ltd. | Semiconductor chip stack structure |
| CN1966272A (en) * | 2005-11-15 | 2007-05-23 | 富士施乐株式会社 | LED array head and image recording device |
| CN101106120A (en) * | 2006-07-10 | 2008-01-16 | 力成科技股份有限公司 | Spherical grid array encapsulation structure of base plate bottom glue encapsulation |
| CN101490832A (en) * | 2006-07-18 | 2009-07-22 | 埃普科斯股份有限公司 | Module having a flat structure, and equipment method |
-
2012
- 2012-04-25 CN CN2012101229894A patent/CN103378043A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030038374A1 (en) * | 2001-08-27 | 2003-02-27 | Shim Jong Bo | Multi-chip package (MCP) with spacer |
| CN1561545A (en) * | 2001-09-28 | 2005-01-05 | 摩托罗拉公司 | Semiconductor with multiple rows of bond pads |
| US6977439B2 (en) * | 2002-03-21 | 2005-12-20 | Samsung Electronics Co., Ltd. | Semiconductor chip stack structure |
| CN1966272A (en) * | 2005-11-15 | 2007-05-23 | 富士施乐株式会社 | LED array head and image recording device |
| CN101106120A (en) * | 2006-07-10 | 2008-01-16 | 力成科技股份有限公司 | Spherical grid array encapsulation structure of base plate bottom glue encapsulation |
| CN101490832A (en) * | 2006-07-18 | 2009-07-22 | 埃普科斯股份有限公司 | Module having a flat structure, and equipment method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550684A (en) * | 2018-06-16 | 2018-09-18 | 江门市中阳光电科技有限公司 | A kind of LED light source |
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Application publication date: 20131030 |
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