CN103372826B - For the Universal test clamping apparatus that microwave power device infrared microscopy junction temperature detects - Google Patents
For the Universal test clamping apparatus that microwave power device infrared microscopy junction temperature detects Download PDFInfo
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- CN103372826B CN103372826B CN201310310947.8A CN201310310947A CN103372826B CN 103372826 B CN103372826 B CN 103372826B CN 201310310947 A CN201310310947 A CN 201310310947A CN 103372826 B CN103372826 B CN 103372826B
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Abstract
The invention discloses a kind of Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature, belong to infrared temperature-test technology field, its structure is split-type structural, primarily of base, intermediate carrier and two pieces of circuit carriers, three part compositions, base is arranged two pieces of circuit carriers and one piece of intermediate carrier, two pieces of circuit carriers be arranged in parallel, and be in same plane, intermediate carrier is provided with between two pieces of circuit carriers, all gap is left between circuit carrier and intermediate carrier, circuit carrier is provided with testing circuit board, testing circuit board on two circuit carriers is communicated with by the pipe leg of measured device, measured device is fixed on intermediate carrier.The present invention has higher versatility and ease for operation, substantially increases detection efficiency, reduces human and material resources cost, shortens the product development cycle.
Description
Technical field
The present invention relates to infrared temperature-test technology field, the Universal test clamping apparatus that under especially a kind of applicable various microwave power device DC condition, infrared microscopy junction temperature detects.
Background technology
Carrying out temperature detection to microwave power device is the requisite important step assessed the performance of device and life-span.In the various method and apparatus of existing microwave power device temperature detection, thermal microscope is accepted extensively by industry with advantages such as its higher spatial resolution, higher temperature control, higher sampling rates.Utilize the method can realize detecting for real-time, the accurate Temperature Distribution of DC operation condition microwave power device temperature.This all has great significance for fields such as microwave power device design, production, detection, failure analyses.
But, infrared microscopy temperature detection is carried out to microwave power device, needs device to be fixed on special test fixture.Current domestic general way is, adopt microwave test fixture to carry out infrared temperature detection, this has saved cost to a certain extent.But because microwave power device is of a great variety, different components size, different, cause the versatility of fixture poor, often need to change fixture in testing process, this wastes a large amount of time virtually, reduces detection efficiency; In addition, some microwave test fixture is due to frame for movement or circuit design and be not suitable for and carry out infrared microscopy temperature detection, and the temperature detection result utilizing these fixtures to obtain can exist larger error.
In order to strengthen versatility, the raising detection efficiency of test fixture, and get rid of impact testing result caused because clamp structure is unreasonable, ensure the accuracy of microwave power device infrared microscopy junction temperature testing result, design and be aly applicable to the fixture of infrared microscopy temperature detection under various microwave power device DC condition and be necessary.This fixture provides strong temperature detection guarantee by for improving microwave power device production cycle, test analysis ability and ability of designing and developing.
The microwave test fixture that what the existing test fixture for microwave power device infrared microscopy temperature detection adopted is device is special, its advantage has:
1) for device of the same race, all adopt same class fixture to carry out the test of various parameter, clamp structure is fixed, size is fixed, and can ensure the uniformity of devices function state to greatest extent.
2) fixture is through special design and process, can eliminate as uncertain factors such as device self-excitations.
Its shortcoming is mainly reflected in:
1) poor universality, complicated operation, for the device of different model, need to design different fixture, different fixture sizes, connect electric mode and be all not quite similar, during the change of measured device model, often need to change fixture, rewiring, this is very inconvenient for infrared microscopy temperature detection, can reduce the efficiency of mass detection to a great extent; In addition, the mode that existing test fixture generally all takes screw to fix ensures the thermo-contact of device, and changing a device often needs more than dismounting four screws, and this has had a strong impact on the speed detected especially.
2) thermo-contact ensureing device and fixture is difficult to; The bad detected temperatures result that must cause of thermo-contact is higher, and the thermal resistance value calculated is higher, and the performance for device causes erroneous judgement.Because microwave test fixture carries out circuit and structural design mainly for its microwave property, in thermal design, the method for generally reinforcing and smearing thermal grease conduction by multiple screw ensures to possess good thermo-contact between device and fixture.But smearing thermal grease conduction when detecting for product class device likely can stained device; And only fix by screw, effectively can not ensure thermo-contact, fact proved, the degree of tightness of screw can cause very large impact to testing result.
3) some microwave power device test fixture is in order to ensure the special briquetting of the electrical contact design that device is good.Experiment finds, briquette structure can cause infrared microscopy temperature detection result on the low side.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature, this fixture can improve the efficiency that the infrared junction temperature of microwave power device detects, ensure testing result accurately and reliably, and this fixture has versatility.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature, it is characterized in that comprising square base, described base is arranged two pieces of circuit carriers and one piece of intermediate carrier, two pieces of circuit carriers be arranged in parallel, and be in same plane, intermediate carrier is provided with between two pieces of circuit carriers, all gap is left between circuit carrier and intermediate carrier, circuit carrier is provided with testing circuit board, testing circuit board on two circuit carriers is communicated with by the pipe leg of measured device, described measured device is fixed on intermediate carrier.
Do to supplement further to said structure, the adjacent side of described intermediate carrier upper surface and two circuit carriers surrounds the chamber, the end of placing measured device, and described measured device is fixed on intermediate carrier by staple.
Do to supplement further to said structure, described circuit carrier is provided with the slide opening of horizontal direction, and through screw in described slide opening, the end of screw coordinates with the screw on base.In the present invention, screw passes circuit carrier and is fixed on the screw on base, by tightening screw, circuit carrier can be made to be fixed on base.Circuit carrier regulates at horizontal level, by push-pull circuit carrier in horizontal direction, circuit carrier horizontal level is changed, reaches the object of the spacing of regulating circuit carrier and intermediate carrier.
Do to supplement further to said structure, described slide opening is set to two, and two slide openings be arranged in parallel, and are positioned at the diagonal angle of circuit carrier, is equipped with the screw be mated in two slide openings.Arrange two parallel slide openings in the present invention, and the width of slide opening coordinating with the screw diameter of axle, ensureing overall non rotating when moving horizontally, testing circuit board coordinates completely with the pipe leg of measured device, ensures test accuracy.
Do to supplement further to said structure, described screw is socketed with spring, and spring between circuit carrier and base, and is in compressive state.Carried out the height of control circuit carrier in the present invention by the elasticity of spring, when needs are heightened, loosen screw, otherwise, tighten screw.Spring on screw can holding circuit carrier height constant.
Do to supplement further to said structure, the upper surface of described intermediate carrier is coated with one deck indium sheet.The present invention, in order to get rid of the bad phenomenon of the thermo-contact that causes due to staple tightness, takes screw fastening to cover the method for indium sheet with pad, fully ensures thermo-contact good between measured device and intermediate carrier.
Do to supplement further to said structure, also comprise two symmetrically arranged briquettings, described briquetting is located at above 2 circuit carriers, and compresses the pipe leg of measured device.Briquetting in the present invention ensures that pipe leg and testing circuit board power up the good contact of microstrip line, the setting of two side pressing blocks avoids the appearance of cavity in tradition briquette structure with holes, improve the degree of accuracy of testing result, get rid of fixture cavity body structure for the impact detected.
The beneficial effect adopting technique scheme to produce is: the present invention devises special frame for movement and circuit structure, adopt the combination of base, circuit carrier and intermediate carrier, the adjustment in the horizontal direction and the vertical direction of realizing circuit carrier, the needs that various microwave power device infrared microscopy junction temperature detects can be met, there is higher versatility; Intermediate carrier carrying measured device in the present invention, the good thermo-contact of device and carrier is one of key factor ensureing the testing result degree of accuracy, and take in structure intermediate carrier covers indium sheet, the mode adding screw in compression ensures thermo-contact; Briquette form in the present invention avoids the formation of cavity, and can meet the testing requirement of different size device, ensures the degree of accuracy of testing result; Structure of the present invention is simple, and operating aspect, eliminates in test the clamp-replacing time, improve detection efficiency.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is general structure front view of the present invention;
Fig. 2 is horizontal level adjusting device schematic diagram of the present invention;
Fig. 3 is the schematic diagram after removing screw in Fig. 2;
Fig. 4 is measured device thermo-contact structural representation;
Fig. 5 is the present invention's top view in testing;
Fig. 6 is the infrared detection figure of the present invention in test process;
Fig. 7 is the result adopting traditional microwave test fixture to detect a certain model device, and maximum temperature is 133;
Fig. 8 is the result adopting the present invention same device to be carried out under identical consumption conditions to temperature detection, and maximum temperature is 154 DEG C;
Wherein: 1, circuit carrier, 2, base, 3, pipe leg, 4, intermediate carrier, 5, chamber, the end, 6, slide opening, 7, screw, 8, testing circuit board, 9, screw, 10, measured device, 11, indium sheet, 12, staple, 13, briquetting.
Detailed description of the invention
The present invention is specifically related to a kind of Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature, for the high accuracy infrared microscopy temperature detection under various microwave power device DC condition.
1 is known with reference to the accompanying drawings, the present invention is split-type structural, primarily of base 2, intermediate carrier 4 and two pieces of circuit carriers, 1 three part compositions, base 2 is arranged two pieces of circuit carriers 1 and one piece of intermediate carrier 4, two pieces of circuit carriers 1 be arranged in parallel, and be in same plane, intermediate carrier 4 is provided with between two pieces of circuit carriers 1, all gap is left between circuit carrier 1 and intermediate carrier 4, circuit carrier 1 is provided with testing circuit board 8, testing circuit board 8 on two circuit carriers 1 is communicated with by the pipe leg 3 of measured device 10, measured device 10 is fixed on intermediate carrier 4.Surround the chamber, the end 5 of placing measured device 10 by the adjacent side of intermediate carrier 1 upper surface and two circuit carriers 1, measured device 10 is fixed on intermediate carrier 4 by staple 12.Testing circuit board 8 is fixed by welding on both sides circuit carrier 1, forms test module.Intermediate carrier 4 is placed measured device 10, measured device 10 is fixed on intermediate carrier 4 by screw, measured device 10 is connected with test module circuit by left and right sides pipe leg 3, and chamber, the end 5 and the both sides circuit carrier 1 of measured device 10 are adjacent to, for measured device 10 liang of side pipe legs 3 provide support.
The present invention be directed to different measured devices 10, end chamber 5 size corresponding due to different components is different, only have and could meet different size requirement on devices by regulating circuit carrier 1 and the distance of intermediate carrier 4, therefore the spacing of both sides circuit carrier 1 and height are can be freely regulated according to the size of measured device 10, but both sides carrier directly should not contact with intermediate carrier 4.In an initial condition, the height of intermediate carrier 4, higher than the circuit carrier 1 of both sides, when deployed, needs the circuit carrier 1 of both sides to heighten, and ensures that pipe leg 3 contacts with testing circuit board 8.Because the thickness of measured device 10 is different, also according to the thickness of measured device 10, intermediate carrier 4 can be changed, to adapt to different test case.
In accompanying drawing 2 and accompanying drawing 3, can find out that circuit carrier 1 is provided with the slide opening 6 of horizontal direction, through screw 7 in slide opening 6, the end of screw 7 coordinates with the screw 9 on base 2.Slide opening 6 is set to two, and two slide openings 6 be arranged in parallel, and are positioned at the diagonal angle of circuit carrier 1, is equipped with the screw 7 be mated in two slide openings 6.
The realization that horizontal level regulates: circuit carrier 1 is adjustable with the spacing of intermediate carrier 4, and slide opening 6 is positioned on circuit carrier 1, and its screwing 7 is corresponding with screw 9 on intermediate carrier 4.Screw 7 is fixed on screw 9, by tightening screw 7, circuit carrier 1 can be made to be fixed on intermediate carrier 4.By unscrewing screw 7, circuit carrier 1 can be made to move around in the horizontal direction on intermediate carrier 4, reaching the object of the spacing of regulating circuit carrier 1 and intermediate carrier 4.
The realization that upright position regulates: screw 7 is by passing a spring after testing circuit board 8, access the screw 9 of two wing bases 2 again, spring between circuit carrier and base, and is in compressive state, so just can the adjustment of realizing circuit plate upright position by slack adjuster.
It is thermo-contact and electrical contact that microwave power device infrared microscopy junction temperature detects two crucial aspects, in order to ensure good thermo-contact and electrical contact, devises device fixed structure.
Base in the present invention and carrier all adopt the brass material that thermal conductivity is good, intensity is high.In addition, in order to ensure the realization of good thermo-contact, can find out in figure 4, the upper surface of intermediate carrier 4 is coated with one deck indium sheet 11.Indium is the very good and metal material of quality softness of a kind of thermal conductivity, and this material fully can fill up the air gap between device and carrier after device pressing, thus the thermal resistance greatly reduced between device and carrier is to ensure thermo-contact characteristic.In order to get rid of the bad phenomenon of the thermo-contact that causes due to screw tightening degree, taking screw fastening to cover the method for indium sheet 11 with pad, fully ensureing thermo-contact good between measured device 10 and intermediate carrier 4.
In order to ensure the realization of good electrical contact, the briquette structure guarantee pipe leg that traditional many employings of microwave test fixture are with holes and circuit board power up the good contact of microstrip line.But briquette structure here can form a cavity, the size of cavity can cause larger impact to infrared microscopy junction temperature testing result.Two briquettings 13 that are symmetrical, that be made up of polytetrafluoroethylmaterial material are set here on circuit carrier 1, with the pipe leg 3 of fixing measured device 10, as shown in Figure 5, avoid the formation of cavity and the testing requirement of different size device can be met.Two topmost effects of side pressing block are the degrees of accuracy improving testing result, get rid of fixture cavity body structure for the impact detected.
In order to advantage place of the present invention is described, the test process for two each 20 devices of model is that example is described.Adopt the situation of conventional microwave test fixture as follows:
Standby 2 kinds of microwave test fixtures and correspondence add electrical lead, concrete testing procedure is as follows:
1, according to the intermediate carrier 4 that measured device 10 size Selection is suitable, ensure that measured device 10 nail 12 that can be fixed is fixed on intermediate carrier 4;
2, according to the power-up condition of measured device 10, power supply output line is connected on circuit carrier 1 and intermediate carrier 4;
3, adjustment screw 7, makes the pipe leg 3 of measured device and feed line good contact in the testing circuit board 8 of circuit carrier 1;
4, the present invention is placed on thermal infrared imager heating platform;
5, pressing two side pressing block 13;
6, power up and test;
7, open two side pressing blocks 13, unscrew the staple 12 of intermediate carrier 4, change measured device;
8, pressing two side pressing block 13, adds electrical testing;
If the model change of 9 measured devices, only needs to change intermediate carrier 4, and micrometer adjusting screw 7 can repeat to measure by above-mentioned steps.
In test process, the temperature value gathered is the temperature on horizontal line in the middle part of the measured device shown in Fig. 6, wherein Fig. 7 and Fig. 8 can be had to find out along horizontal line temperature value from left to right.
Test result is as follows:
Overall test time is 4 hours, and wherein the clamp-replacing time is 10 minutes, and the device lay day has accounted for 2 and a half hours, and maximum temperature is 133 DEG C, as shown in Figure 7.
Adopt the situation of this patent Universal test clamping apparatus as follows:
Standby Universal test clamping apparatus and to add electrical lead a set of;
Overall test time is 3 hours, eliminates the clamp-replacing time, and device total lay day is 1 hour, and maximum temperature is 154 DEG C, as shown in Figure 8.
Therefore the present invention can meet the needs that various microwave power device infrared microscopy junction temperature detects, and improves detection efficiency, and ensure that the degree of accuracy of testing result.
Claims (7)
1. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature, it is characterized in that comprising square base (2), described base (2) is arranged two pieces of circuit carriers (1) and one piece of intermediate carrier (4), two pieces of circuit carriers (1) be arranged in parallel, and be in same plane, intermediate carrier (4) is provided with between two pieces of circuit carriers (1), all gap is left between circuit carrier (1) and intermediate carrier (4), circuit carrier (1) is provided with testing circuit board (8), testing circuit board (8) on two circuit carriers (1) is communicated with by the pipe leg (3) of measured device (10), described measured device (10) is fixed on intermediate carrier (4).
2. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 1, it is characterized in that the adjacent side of described intermediate carrier (4) upper surface and two circuit carriers (1) surrounds the chamber, the end (5) of placing measured device (10), described measured device (10) is fixed on intermediate carrier (4) by staple (12).
3. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 1, it is characterized in that described circuit carrier (1) is provided with the slide opening (6) of horizontal direction, through screw (7) in described slide opening (6), the end of screw (7) coordinates with the screw (9) on base (2).
4. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 3, it is characterized in that described slide opening (6) is set to two, article two, slide opening (6) be arranged in parallel, and be positioned at the diagonal angle of circuit carrier (1), be equipped with the screw (7) be mated in two slide openings (6).
5. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 3 or 4, it is characterized in that described screw (7) is socketed with spring, spring is positioned between circuit carrier (1) and base (2), and is in compressive state.
6. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 2, is characterized in that the upper surface of described intermediate carrier (4) is coated with one deck indium sheet (11).
7. the Universal test clamping apparatus detected for microwave power device infrared microscopy junction temperature according to claim 1, characterized by further comprising two symmetrically arranged briquettings (13), described briquetting (13) is located at above 2 circuit carriers (1), and compresses the pipe leg (3) of measured device (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310310947.8A CN103372826B (en) | 2013-07-23 | 2013-07-23 | For the Universal test clamping apparatus that microwave power device infrared microscopy junction temperature detects |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310310947.8A CN103372826B (en) | 2013-07-23 | 2013-07-23 | For the Universal test clamping apparatus that microwave power device infrared microscopy junction temperature detects |
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| CN103372826A CN103372826A (en) | 2013-10-30 |
| CN103372826B true CN103372826B (en) | 2015-09-09 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106053889B (en) * | 2016-06-22 | 2018-07-31 | 珠海纳睿达科技有限公司 | A kind of multifunction microwave test fixture |
| CN110794221B (en) * | 2019-11-05 | 2021-07-09 | 中国电子科技集团公司第四十一研究所 | MEMS attenuator testing arrangement |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3583694A (en) * | 1970-03-20 | 1971-06-08 | John R Davies | Circuit board clamp |
| GB2143081B (en) * | 1983-07-06 | 1987-01-14 | Philips Electronic Associated | Infra-red detector with differentially connected pyroelecric elements |
| US6209859B1 (en) * | 1999-10-10 | 2001-04-03 | Henry Chung | Universal reflow fixture |
| CN201166758Y (en) * | 2008-03-21 | 2008-12-17 | 北京京东方光电科技有限公司 | Detecting clamp |
| CN201500900U (en) * | 2009-09-16 | 2010-06-09 | 沈阳晨讯希姆通科技有限公司 | fixture |
| CN101806815A (en) * | 2010-04-08 | 2010-08-18 | 中国电子科技集团公司第十三研究所 | Fixture for SiC MESFET DC tests |
| CN203438103U (en) * | 2013-07-23 | 2014-02-19 | 中国电子科技集团公司第十三研究所 | Universal testing clamp for detecting microscopic infrared junction temperature of microwave power device |
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