CN103362248A - Composite thermal insulation external wall board - Google Patents
Composite thermal insulation external wall board Download PDFInfo
- Publication number
- CN103362248A CN103362248A CN2013103079294A CN201310307929A CN103362248A CN 103362248 A CN103362248 A CN 103362248A CN 2013103079294 A CN2013103079294 A CN 2013103079294A CN 201310307929 A CN201310307929 A CN 201310307929A CN 103362248 A CN103362248 A CN 103362248A
- Authority
- CN
- China
- Prior art keywords
- motherboard
- daughter board
- external wall
- hole
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Building Environments (AREA)
Abstract
The invention relates to a composite thermal insulation external wall board mainly comprising a motherboard, daughter boards and foam boards. The daughter boards and the foam boards are each pasted on one side panel of the motherboard by a bonding agent. The motherboard and the daughter boards are mainly made of three-dimensional hollow fabric composite rigid net racks; the daughter boards and the foam boards are mutually arranged at intervals; through holes are densely distributed on mutually bonded panels of the motherboard and the daughter boards; during bonding, the bonding agent passes through the through holes and is congealed into blocks at the back face of the panels, and the diameter of the blocks is larger than that of the through holes. The daughter boards are spaced apart from each other by the foam boards, so that air in each two daughter boards cannot easily circulate. Therefore, in a manner that hot air is obstructed to flow in hollow parts of the daughter boards, the thermal insulation performance of the external wall board is further improved, and the technical problem that heat loss caused by hot air circulation in a thermal insulation board cannot permanently be solved by the conventional thermal insulation board is solved.
Description
Technical field
The present invention relates to a kind of side fascia, be specifically related to a kind of composite thermal-insulation external wall panel.
Background technology
Be that the composite plate that the inorfil three dimensional fabric of representative is made after solidifying not only has the characteristics that quality is light, fire line is good by basalt fibre, also can bring good sound insulation and heat insulation effect because three dimensional fabric has unique hollow structure, make material so become the side fascia that has application prospect.
But three-dimensional composite plate also has its defective aspect insulation: as shown in Figure 1, the common structure of conventional three-dimensional composite plate (being the compound rigidity rack of three-dimensional hollow fabric among the application) is " top panel-connection warp-bottom panel " this sandwich style, rely on to connect hollow bulb that warp supports effectively trap heat from bottom panel to the transmission of top panel direction; But because its hollow bulb connects, therefore have inevitably hot air and flow and run off in the empty section therein, thereby weakened the heat-insulating property of three-dimensional composite plate.Therefore people are usually stacked to obtaining better heat-insulating property and better soundproof effect with the multi-layer three-dimension composite plate in order to strengthen its heat insulation effect, but the bonding surface of two composite plates of Chang Yinwei is very smooth, delamination resistance can be also bad (even it is also undesirable that the effect of bonding anti-layering is carried out carrying out after hacking is processed in its surface) is bonding easily to come off afterwards, has potential safety hazard.
And, the method that three-dimensional composite board is installed in construction is generally two kinds of dry-hanging method and wet combining methods, be provided with keel shoe between the warming plate that the employing dry-hanging method is installed and the body of wall, the hollow structure of keel shoe easily forms stack effect has combustion-supporting hidden danger also easily to have cold bridge, and the relative dry-hanging method of wet combining method has the cheap characteristics of construction cost, and it only is 1/3rd to 1/10th of dry-hanging method.But adopt the wet combining method that its shortcoming is also arranged, because traditional composite plate only has smooth surface.Therefore in wet combining, the smooth surface of composite plate is difficult for forming contacting of close and firm with floated coat, is unfavorable for this composite plate is installed in the concrete securely going.So, the general choice of three dimensional fabric hollow heat preservation board cladding form.
Summary of the invention
The primary technical problem that solves of the present invention is: propose a kind of effectively trap heat from warming plate internal drain and the side fascia that adopts the compound rigidity rack of three-dimensional hollow fabric to make.
Further to solve and be: the technical problem that above-mentioned side fascia easily comes off from body of wall afterwards in installation.
The present invention for the technical scheme that solves the proposition of the first technical problem is: a kind of composite thermal-insulation external wall panel, mainly by motherboard, the interval sticks on daughter board and the cystosepiment formation on motherboard one side successively, described motherboard and daughter board all are to be cut into by the compound rigidity rack of three-dimensional hollow fabric, the compound rigidity rack of described three-dimensional hollow fabric is mainly made by solidifying behind the three dimension stereo fabric impregnating resin that adopts fibrous material to be woven into, the compound rigidity rack of described three-dimensional hollow fabric comprises panel, backboard and be connected to described panel and be connected warp with fiber between the backboard, described daughter board and cystosepiment all are at least two, all be densely covered with the first through hole on the described motherboard bonding side panel relative to daughter board, when bonding, described bonding agent passes described the first through hole and condenses into diameter greater than the coagula of described the first through-hole diameter at the back side of described panel.
The present invention for the technical scheme that solves the proposition of the second technical problem is: described daughter board is for being densely covered with the second through hole on the opposite side panel that is installed to body of wall; When being installed to body of wall on by bonding mortar described composite thermal-insulation external wall panel, described bonding mortar passes described the second through hole and condenses into diameter greater than the coagula of described the second through-hole diameter at the opposite side back side of panel of described daughter board.
Having improved of technique scheme:
In order further to improve the bonding force of side fascia and body of wall, the thickness of described cystosepiment is less than the thickness of described daughter board.So just form a rule or a piece sunk part of vertical parallax.When wet combining is installed, bonding mortar between side fascia and the body of wall, can partly be penetrated into the side that the compound rigidity rack of three-dimensional hollow fabric exceeds the cystosepiment part, this mode has further improved the bonding force of side fascia and body of wall, described daughter board and cystosepiment are strip, and described daughter board and the described cystosepiment interval that is parallel to each other is the zebra wire and arranges.
Further, described motherboard is bonded with the inorganic phase-changing material insulation layer away from being densely covered with third through-hole on the opposite side panel on the daughter board direction and covering, and described bonding agent passes behind the third through-hole at the back side of the opposite side panel of described motherboard and condenses into diameter greater than the coagula of described third through-hole diameter.
For the heat-insulating property that further improves warming plate among the present invention will be thickeied motherboard, described motherboard stacks gradually rear bonding forming by the compound rigidity rack of at least two three-dimensional hollow fabric, and the compound rigidity rack of described at least two three-dimensional hollow fabric also is densely covered with the through hole that passes for bonding agent on mutually bonding panel.Cementing agent between the compound rigidity rack of per two three-dimensional hollow fabric passes the through hole on the panel and forms one by one diameter in the through hole of back side of panel greater than the coagula of through-hole diameter under pressure.A plurality of such resin mass just can with two compound rigidity racks lockings of three-dimensional hollow fabric as one by one " rivet ", have been strengthened the anti-vertical resolution after two compound rigidity racks of three-dimensional hollow fabric are bonding greatly after cementing agent solidifies.In the stretch-draw of reality experiment, find: even the connection warp of the compound rigidity rack of aforementioned three-dimensional hollow fabric broken two compound rigidity racks of three-dimensional hollow fabric are separated along its bonding place.And " rivet " that bonding agent forms closely connect between enhancement Layer except being used for, and the heat insulating ability of layering sealing also is provided, and strengthened the heat-insulating property of side fascia.
In order to increase the aesthetic property of the side fascia among the present invention, also be provided with decorative layer on the external surface of described inorganic insulating layer or slurry.
Further improving of decorative layer had: described decorative layer is true mineral varnish layer.
To the perfect of fibrous material and resin be: described fibrous material is basalt fibre, and described resin is phenolic resins, unsaturated-resin, epoxy resin, inorganic silicon or extraordinary inorganic salts bonding agent.
The invention has the beneficial effects as follows:
Side fascia mentioned among the present invention is pasted daughter board, cystosepiment by interval on motherboard.On the one hand, daughter board is pasted up as the carrying basis take motherboard, can be obtained having the warming plate of the compound rigidity rack of two-layer at least three-dimensional hollow fabric by the method, improved the heat insulation effect of warming plate in vertical warming plate panel direction.On the other hand, with one of daughter board, one spaced apart, make the air in its per two daughter boards be difficult for circulation by cystosepiment.Thereby by intercepting the hot air mode that hollow bulb flows in daughter board, further improved the heat-insulating property of side fascia among the present invention, solved traditional warming plate and can not solve for a long time the technical problem that the circulation of air of warming plate internal heat brings thermal loss.
In addition, for also being densely covered with through hole on the base panel that is installed on the body of wall; Therefore in the time of on being installed to body of wall, the bonding mortar that plays bonding effect pass on the described base panel through hole and the back of described base panel condense into diameter greater than described base panel on the piece of through-hole diameter.The through hole of offering in the bottom surface of side fascia is that side fascia pastes metope, provides convenience.When wet combining was installed, bonding mortar passed densely covered aperture, formed the rivet effect, this rivet effect, bonding force and the anti-vertical resolution of excellence in the time of can forming installation.Form excellent bonding force, can remove other warming plates from and must settle and be fixed in metope rivet operation, a step pastes and puts in place.
Description of drawings
Below in conjunction with accompanying drawing a kind of composite thermal-insulation external wall panel of the present invention is described further.
Fig. 1 is the structural representation of the compound rigidity rack of existing three-dimensional hollow fabric.
Fig. 2 is the structural representation of composite thermal-insulation external wall panel among the embodiment one.
Fig. 3 is the polycrystalline substance schematic diagram of composite thermal-insulation external wall panel among the embodiment one.
Fig. 4 is the structural representation of the top panel of composite thermal-insulation external wall panel among the embodiment one.
Fig. 5 is the structural representation of composite thermal-insulation external wall panel among the embodiment two.
The specific embodiment
Embodiment one
According to shown in Figure 2, the composite thermal-insulation external wall panel among the present invention mainly is made of motherboard 1 and the daughter board 2, the cystosepiment 3 that stick on motherboard one side panel by resin respectively.Daughter board and cystosepiment are at least two, and daughter board 2 is four in an embodiment, and cystosepiment 3 is three.
Wherein, motherboard 1 and daughter board 2 are mainly cut by the compound rigidity rack of three-dimensional hollow fabric and make.
The compound rigidity rack of three-dimensional hollow fabric is mainly made (being preferably in the present embodiment basalt fibre) by solidifying behind the three dimension stereo fabric impregnating resin that adopts fibrous material to be woven into.The surface layer that three dimension stereo fabric mainly is woven into by the basalt fibre yarn, basalt fibre connection warp and the backing layer that is woven into by the basalt fibre yarn consist of.Three dimension stereo fabric once weaves out by rapier loom.During braiding, be main braided material by the basalt fibre yarn, at surface layer, continuously arranged several warps and independent another root warp and surface layer fabric parallel form the friendship volume; At the backing layer of fabric, continuously arranged warp and independent another root warp and backing layer fabric parallel form the friendship volume; Between the surface layer and backing layer of fabric, connect warp by basalt fibre and form the surface layer parallel is connected connection with the backing layer parallel.
When braiding, there is purpose to reduce the count of surface layer and backing layer, forms a plurality of loose meshes.Three dimension stereo fabric forms the compound rigidity rack of three-dimensional hollow fabric after impregnation, curing, the compound rigidity panel that rack has of three-dimensional hollow fabric, backboard and be connected to described panel and be connected warp with fiber between the backboard, the aforementioned mesh just densely covered through hole of formation after curing.
The size of motherboard 1 is much larger than daughter board 2, and in the present embodiment, it is that bar shaped, the cystosepiment 3 of 1m*20cm is bar shapeds of 1m*20cm that motherboard 1 is of a size of 1m*1m, daughter board 2, and the thickness of cystosepiment 3 is less than the thickness of described daughter board 2.As shown in Figure 3, when bonding, by resin 4(or other bonding agent) daughter board 2 and cystosepiment 3 compartment of terrain that is parallel to each other is the zebra wire and arranges (also cystosepiment 3 and daughter board 2 can be arranged to waffle grid) and be bonded on the side of motherboard 1, owing to all be densely covered with the first through hole on the relatively bonding side panel of motherboard 1, daughter board 2, so the resin between motherboard 1 and the daughter board 2 passing under pressure the first through hole and being frozen into diameter greater than the coagula of the first through-hole diameter at mutual bonding back side of panel.These coagulas with motherboard 1 and daughter board 2 lockings, have been strengthened motherboard 1 and the daughter board 2 anti-vertical resolution after bonding greatly as one by one " rivet ".
Composite thermal-insulation external wall panel bonds to daughter board 2 on the body of wall when mounted in the present embodiment, and daughter board 2 is for being densely covered with the second through hole on the opposite side panel that is installed to body of wall; With composite thermal-insulation external wall panel when the bonding mortar wet combining is to the body of wall, bonding mortar passes the second through hole and condenses into diameter greater than the coagula of the second through-hole diameter at the opposite side back side of panel that daughter board 2 is used for being installed to body of wall.
Embodiment two
As shown in Figure 5, on the basis of technical scheme described in the embodiment one, motherboard 1 is away from being densely covered with third through-hole on the opposite side panel on daughter board 2 directions, and by resin bonding inorganic phase-changing material insulation layer 5 is arranged, resin passes behind the third through-hole at the back side of the opposite side panel of motherboard 1 and is frozen into diameter greater than the coagula of third through-hole diameter, and these coagulas also play the effect that similar aforementioned " rivet " is used for anti-layering.Can certainly be directly be coated with polyphenyl particle heat-insulating mortar at the opposite side panel of motherboard 1, after thermal insulation mortar passes third through-hole, and be frozen into diameter greater than the coagula of third through-hole diameter at the opposite side back side of panel of motherboard 1.
Also be coated with true mineral varnish layer 6 on the surface of inorganic phase-changing material insulation layer 5 or polyphenyl particle heat-insulating mortar, to reach decoration function.The decorative layer that can certainly adopt other kind is such as sial, aluminium layer etc.This class decorative layer is fixed on by gluing form on the surface of inorganic phase-changing material insulation layer 5 or polyphenyl particle heat-insulating mortar, also can take alternate manner to fix.
Embodiment three
On the basis of above-described embodiment, do further perfect to motherboard 1: the compound rigidity rack of three-dimensional hollow fabric stacks gradually motherboard 1, bonding forming by two (also can by more polylith), and the compound rigidity rack of three-dimensional hollow fabric that consists of motherboard 1 also is densely covered with the through hole that passes for resin on mutually bonding panel.And by resin the compound rigidity rack of these two three-dimensional hollow fabric carrying out bondingly, resin is frozen into diameter greater than the coagula of described through-hole diameter at the back side of panel behind through hole under pressure.These coagulas with two compound rigidity racks lockings of three-dimensional hollow fabric, have been strengthened the anti-vertical resolution after two compound rigidity racks of three-dimensional hollow fabric are bonding greatly as one by one " rivet ".
For the described technical scheme of above-described embodiment, a kind of conversion that obviously can expect is: the fiber that has high fiber reinforcement effect with glass fiber or carbon fiber etc. replaces basalt fibre.
Resin among the application is phenolic resins, unsaturated-resin, epoxy resin, inorganic silicon or extraordinary inorganic salts bonding agent.
The above-described embodiment that is not limited to of the present invention, all employings be equal to the technical scheme that replace to form as: substitute resin among the application etc. with other bonding agent, all drop in the protection domain of requirement of the present invention.
Claims (8)
1. composite thermal-insulation external wall panel, it is characterized in that: mainly by motherboard, the interval sticks on daughter board and the cystosepiment formation on motherboard one side successively, described motherboard and daughter board all are to be cut into by the compound rigidity rack of three-dimensional hollow fabric, the compound rigidity rack of described three-dimensional hollow fabric is mainly made by solidifying behind the three dimension stereo fabric impregnating resin that adopts fibrous material to be woven into, the compound rigidity rack of described three-dimensional hollow fabric comprises panel, backboard and be connected to described panel and be connected warp with fiber between the backboard, described daughter board and cystosepiment all are at least two, all be densely covered with the first through hole on the described motherboard bonding side panel relative to daughter board, when bonding, described bonding agent passes described the first through hole and condenses into diameter greater than the coagula of described the first through-hole diameter at the back side of described panel.
2. described composite thermal-insulation external wall panel according to claim 1, it is characterized in that: described daughter board and cystosepiment are strip, and described daughter board and the described cystosepiment interval that is parallel to each other is the zebra wire and arranges, and the thickness of described cystosepiment is less than the thickness of described daughter board.
3. described composite thermal-insulation external wall panel according to claim 1 is characterized in that: described daughter board is used for being installed on the opposite side panel of body of wall and is densely covered with the second through hole; When being installed to body of wall on by bonding mortar described composite thermal-insulation external wall panel, described bonding mortar passes described the second through hole and condenses into diameter greater than the coagula of described the second through-hole diameter at the opposite side back side of panel of described daughter board.
4. arbitrary described composite thermal-insulation external wall panel according to claim 1-3, it is characterized in that: described motherboard is bonded with the inorganic phase-changing material insulation layer away from being densely covered with third through-hole on the opposite side panel on the daughter board direction and covering, and described bonding agent passes behind the third through-hole at the back side of the opposite side panel of described motherboard and condenses into diameter greater than the coagula of described third through-hole diameter.
5. described composite thermal-insulation external wall panel according to claim 1, it is characterized in that: described motherboard stacks gradually rear bonding forming by the compound rigidity rack of at least two three-dimensional hollow fabric, and the compound rigidity rack of described at least two three-dimensional hollow fabric also is densely covered with the through hole that passes for bonding agent on mutually bonding panel.
6. described composite thermal-insulation external wall panel according to claim 4 is characterized in that: be covered with decorative layer on the described inorganic phase-changing material insulation layer.
7. described composite thermal-insulation external wall panel according to claim 6, it is characterized in that: described decorative layer is true mineral varnish layer.
8. described composite thermal-insulation external wall panel according to claim 1, it is characterized in that: described fibrous material is basalt fibre, described resin is phenolic resins, unsaturated-resin, epoxy resin, inorganic silicon or extraordinary inorganic salts bonding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310307929.4A CN103362248B (en) | 2013-07-22 | 2013-07-22 | A kind of composite thermal-insulation external wall panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310307929.4A CN103362248B (en) | 2013-07-22 | 2013-07-22 | A kind of composite thermal-insulation external wall panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103362248A true CN103362248A (en) | 2013-10-23 |
| CN103362248B CN103362248B (en) | 2016-03-09 |
Family
ID=49364442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310307929.4A Expired - Fee Related CN103362248B (en) | 2013-07-22 | 2013-07-22 | A kind of composite thermal-insulation external wall panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103362248B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103640267A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Three-dimensional fiber composite material |
| CN105907036A (en) * | 2016-05-16 | 2016-08-31 | 安徽德全新型建材科技有限公司 | Fireproof high-temperature-resistant building outer wall board |
| CN105968704A (en) * | 2016-05-16 | 2016-09-28 | 安徽德全新型建材科技有限公司 | Fireproof building external wall panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2280132C1 (en) * | 2004-11-15 | 2006-07-20 | Иван Николаевич Калинин | Structural sandwich panel |
| CN200985610Y (en) * | 2006-12-21 | 2007-12-05 | 郑瑞源 | Fixing structure of building board |
| KR20090049678A (en) * | 2007-11-14 | 2009-05-19 | 김철용 | Panel to use of waste styrofoam for building |
| CN102852273A (en) * | 2012-09-14 | 2013-01-02 | 江苏鑫石器玄武岩纤维有限公司 | Three-dimensional hollow fabric reinforced composite plate |
| CN203373900U (en) * | 2013-07-22 | 2014-01-01 | 新疆拓新节能新材料有限公司 | Compound thermal insulation external wall panel |
-
2013
- 2013-07-22 CN CN201310307929.4A patent/CN103362248B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2280132C1 (en) * | 2004-11-15 | 2006-07-20 | Иван Николаевич Калинин | Structural sandwich panel |
| CN200985610Y (en) * | 2006-12-21 | 2007-12-05 | 郑瑞源 | Fixing structure of building board |
| KR20090049678A (en) * | 2007-11-14 | 2009-05-19 | 김철용 | Panel to use of waste styrofoam for building |
| CN102852273A (en) * | 2012-09-14 | 2013-01-02 | 江苏鑫石器玄武岩纤维有限公司 | Three-dimensional hollow fabric reinforced composite plate |
| CN203373900U (en) * | 2013-07-22 | 2014-01-01 | 新疆拓新节能新材料有限公司 | Compound thermal insulation external wall panel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103640267A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Three-dimensional fiber composite material |
| CN103640267B (en) * | 2013-11-21 | 2016-03-02 | 苏州市莱赛电车技术有限公司 | A kind of Three-dimensional fiber composite material |
| CN105907036A (en) * | 2016-05-16 | 2016-08-31 | 安徽德全新型建材科技有限公司 | Fireproof high-temperature-resistant building outer wall board |
| CN105968704A (en) * | 2016-05-16 | 2016-09-28 | 安徽德全新型建材科技有限公司 | Fireproof building external wall panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103362248B (en) | 2016-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103568379B (en) | Aeroge composite plate and preparation method thereof | |
| CN103362248B (en) | A kind of composite thermal-insulation external wall panel | |
| CN105604312A (en) | Fiber-reinforced building formwork and preparation method thereof | |
| CN203373900U (en) | Compound thermal insulation external wall panel | |
| CN106738111B (en) | Bending-resistant plywood and manufacturing method thereof | |
| CN203373930U (en) | External wall board | |
| CN209907116U (en) | Bamboo-based fiber composite sleeper | |
| JP2020525329A (en) | Artificial plate core and manufacturing method thereof | |
| CN103362268B (en) | A kind of Side fascia | |
| CN210211615U (en) | Glass fiber composite board | |
| CN103953158A (en) | Fire-resistant gypsum board | |
| CN203899110U (en) | Carbon fiber snowboard | |
| CN207538373U (en) | A kind of enhanced heat preservation decoration integrative composite plate | |
| CN108138488A (en) | Multilayer laminate | |
| CN205767779U (en) | A kind of composite fireproof plate | |
| CN104626666A (en) | Extra-fine glass wool of superlayer structure | |
| CN205875582U (en) | Integrated configuration anchor assembly and composite insulation board | |
| CN102152525B (en) | Method for preparing three-dimensional orthogonal woven foam sandwich composite material | |
| CN209509376U (en) | A kind of heat-preserving stone composite board | |
| CN206374291U (en) | A kind of fire-proof plate with fire-proof and thermal-insulation function | |
| CN203808424U (en) | Aluminum-base composite ceiling plate | |
| CN201152017Y (en) | Bamboo-plastic combined template | |
| CN102587615A (en) | Anti-deformation environment-friendly floorboard and manufacturing method thereof | |
| CN208841978U (en) | A kind of composite combustion-proof plate | |
| CN205857436U (en) | A kind of polyurethane thermal insulation board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 Termination date: 20160722 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |