CN103361510A - Cu-Zn-Sn-Ni-P-based alloy - Google Patents
Cu-Zn-Sn-Ni-P-based alloy Download PDFInfo
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- CN103361510A CN103361510A CN2013101041292A CN201310104129A CN103361510A CN 103361510 A CN103361510 A CN 103361510A CN 2013101041292 A CN2013101041292 A CN 2013101041292A CN 201310104129 A CN201310104129 A CN 201310104129A CN 103361510 A CN103361510 A CN 103361510A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Abstract
The invention provides a Cu-Zn-Sn-Ni-P-based alloy with excellent strength, bendability and stress relaxation-resistant characteristic at low cost, the Cu-Zn-Sn-Ni-P-based alloy contains, by mass, more than 3 % of Zn whose raw material cost is lower than that of Cu and Ni, and Sn mixed in copper scrap is allowed to be contained. The Cu-Zn-Sn-Ni-P-based alloy contains, by mass, 0.2 to 0.8% of Sn, 3 to 18% of Zn, 0.3 to 1.2% of Ni, 0.01 to 0.12% of P, the remainder contains Cu and inevitable impurities, the partical size of a crystal is greater than 1 [mu]m and smaller than 10 [mu]m, the diffraction strength of X-rays from a surface (220) is I (220), the diffraction strength of X-rays from a surface (311) is I (311), and when the diffraction strength of X-rays from the surfaces (220) and (311) of a pure copper powder standard sample is I0 (220) and I0(311), formulae I(220)/I0(220)<=3 and I(311)/I0(311)<=0.5 are satisfied.
Description
Technical field
The present invention relates to be associated gold for the applicable Cu-Zn-Sn-Ni-P such as the electroconductibility elasticity material such as junctor, terminal, rly., switch.
Background technology
In the past, as the material of terminal, junctor, used brass, phosphor bronze as solution strengthening type alloy.Yet, be accompanied by lightweight and the miniaturization of electronics, terminal, junctor thin-walled property, miniaturization, the material that is used for these is expected high strength and high bendability.And then, for waiting junctor that uses under the high temperature environment near the engine chamber of automobile, because stress relaxation phenomenon causes junctor to connect pressure drop low, therefore seek the good material of proof stress slackness.
Yet, because brass, the intensity of phosphor bronze, proof stress relaxation property are insufficient, thereby be widely used in recent years precipitation strength type alloy.Particularly, among precipitation strength type alloy, the Cu-Ni-Si alloy is known as the unfamiliar to the ear alloy of section (Corson alloy), because Ni
2Separating out of Si miniaturization compound, and have high strength, high bendability, good proof stress relaxation property, be used in recent years the people's livelihood with and vehicle mounted junctor (patent documentation 1～8).
The prior art document
Patent documentation
[patent documentation 1] TOHKEMY 2009-185341 communique
[patent documentation 2] TOHKEMY 2009-62610 communique
[patent documentation 3] Japanese kokai publication hei 11-293367 communique
[patent documentation 4] TOHKEMY 2003-306732 communique
[patent documentation 5] TOHKEMY 2005-163127 communique
[patent documentation 6] Japanese kokai publication hei 5-33087 communique
[patent documentation 7] TOHKEMY 2007-84923 communique
[patent documentation 8] TOHKEMY 2007-107087 communique.
Summary of the invention
The technical problem that invention will solve
Yet, separate out alloy and process separating out of causing and be reinforced owing to the solid solution of solute element and timeliness, compare with solid solution alloy, need the solution processing of high temperature and long ageing treatment, can't avoid the rising of manufacturing cost.In addition, because the rising sharply of in recent years copper price, nickel price, the expectation exploitation can replace with cheap raw material their cheaply copper alloy.
The present invention carries out in order to solve above-mentioned problem, its purpose be with low cost provide a kind of intensity, bendability and proof stress relaxation property all excellent Cu-Zn-Sn-Ni-P be associated gold, raw material cost is more cheap than Cu, Ni, contain the Zn that may be blended into more than the 3 quality % in the copper scale, simultaneously, allow to contain the Sn that is blended in the copper scale.
The technique means of dealing with problems
In order to reach above-mentioned purpose, Cu-Zn-Sn-Ni-P of the present invention is associated gold and contains Sn:0.2～0.8% in quality %, Zn:3～18%, Ni:0.3～1.2%, P:0.01～0.12%, remainder comprises Cu and inevitable impurity, crystal particle diameter is more than the 1 μ m and below the 10 μ m, to be made as from the X-ray diffraction intensity of (220) face I (220), to be made as from the X-ray diffraction intensity of (311) face I (311), and with fine copper powder standard test specimen from (220), (311) X-ray diffraction intensity of face is made as respectively I
0(220), I
0(311) time, be controlled to be I (220)/I
0And I (311)/I (220)≤3.0
0(311)≤0.5.In addition, above-mentioned copper alloy is more than the 540MPa according to the tensile strength that JIS-Z2241 measures, and the stress relaxation rate of rolling direction is below 25%.
The manufacture method of above-mentioned copper alloy is after with slab hot-rolling, thereby carries out successively the 1st cold rolling, 350～480 ℃ recrystallization annealing, final cold rolling manufacturing.
And then can also with total amount 0.02～0.25 quality % contain be selected among Mg, Mn, Ti, Cr and the Zr more than at least a kind.
The invention effect
According to the present invention, can obtain raw material cost with low cost more cheap than Cu, Ni, contain 3 quality % above may be blended into Zn in the copper scale, allow simultaneously to contain the Sn that is blended in the copper scale, intensity, bendability and proof stress relaxation property all excellent Cu-Zn-Sn-Ni-P are associated gold.
Embodiment
Below, the described Cu-Zn-Sn-Ni-P of embodiments of the present invention is associated gold describes.Need to prove, as long as no special note, % represents quality % among the present invention.
(composition)
［ Sn and Zn ］
The concentration that makes the Sn in the alloy is 0.2～0.8%, the concentration of Zn is 3～18%.Sn and Zn improve the intensity of alloy and thermotolerance, and then Sn improves the proof stress relaxation property, and Zn improves the thermotolerance of soldering.In addition, by containing the Zn more than the 3 quality %, tensile strength is brought up to more than the 540MPa, the copper scale of sneaking into Zn can be used for alloy manufacturing simultaneously, reduce manufacturing cost.Need to prove, as described later, even contain the above Zn of 3 quality %, be low temperature (below 480 ℃) if do not make recrystallization temperature, and remarkable thickization of crystal particle diameter then occurs, and strength decreased can't stably obtain the above tensile strength of 540MPa.
If the content of Sn and Zn is lower than above-mentioned scope, then can't obtain above-mentioned effect, if surpass above-mentioned scope, then electroconductibility reduces.And if the content of Sn surpasses above-mentioned scope, then hot workability reduces, if the content of Zn surpasses above-mentioned scope, then bendability reduces.
［ Ni and P ］
The concentration that makes the Ni in the alloy is 0.3～1.2%, the concentration of P is 0.01～0.12%.If contain simultaneously Ni and P, even then in the thermal treatment with short period of time of being recrystallised to purpose, owing to separating out Ni in the alloy
3The nano-precipitation of P, thereby intensity and the raising of proof stress relaxation property.
If the content of Ni and P is lower than above-mentioned scope, then Ni
3Separating out of P is insufficient, can't obtain desired intensity and stress relaxation and improve effect.If the content of Ni and P surpasses above-mentioned scope, then electroconductibility significantly reduces, and bendability and hot workability reduction.
［ other interpolation element ］
In the alloy, in order to improve intensity, can contain with total amount 0.02～0.25 quality % and be selected among Mg, Mn, Ti, Cr and the Zr more than one.And then Mg, Mn improve the proof stress relaxation property, and Cr, Mn improve hot workability.
But these elements are compared with Zn, and the free energy of formation of oxide compound is low, if the total amount of these elements surpasses above-mentioned scope, then oxidation in the dissolving of the atmosphere when ingot casting is cast causes the rising of unnecessary raw materials cost, the oxide compound that generates is involved in when casting, causes the reduction of ingot casting quality.
［ crystal particle diameter ］
The crystal particle diameter that makes alloy is more than the 1 μ m and below the 10 μ m.If crystal particle diameter surpasses 10 μ m, it is large that the chill mark when then W is crooked becomes, and processibility reduces, and in addition, because thickization of particle diameter, strength decreased can't stably obtain the above tensile strength of 540MPa.On the other hand, when crystal particle diameter was lower than 1 μ m, the proof stress relaxation property was significantly deteriorated.
Need to prove, crystal particle diameter is measured according to the method for section (process of chopping) of JIS-H0501.
［ X-ray diffraction intensity ］
To be made as from the X-ray diffraction intensity of (220) face I (220), to be made as from the X-ray diffraction intensity of (311) face I (311), and the X-ray diffraction intensity from (220), (311) face of fine copper powder standard test specimen will be made as respectively I
0(220), I
0(311) time, satisfy I (220)/I
0And I (311)/I (220)≤3.0
0(311)≤0.5.
If I (220)/I
0(220) surpass 3.0 or I (311)/I
0(311) surpass 0.5, then (220), (311) face are excessively flourishing, and bendability is significantly deteriorated.
［ tensile strength and stress relaxation rate ］
The tensile strength of preferably measuring according to JIS-Z2241 is more than the 540MPa, the stress relaxation rate of alloy is below 25%.Stress relaxation rate (proof stress relaxation property) is stretched the technological standard JCBAT309:2004 of copper association according to Japan and is measured.
Cu-Zn-Sn-Ni-P of the present invention is associated gold can carry out the 1st cold rolling and recrystallization annealing with behind slab hot-rolling and the building up by welding usually, thus final cold rolling manufacturing.Also can carry out stress relief annealing (the askew り Ware Blunt that gets) after cold rolling final.
Need to prove, the present invention is by containing Ni and P in alloy, thereby as described above, is the short period of time even make the recrystallization annealing time, Ni
3The nano-precipitation of P is separated out, and also can reduce production costs and improve intensity and proof stress relaxation property.
On the other hand, be below 25% in order to make stress relaxation rate, need to make the Ni of the moderate size that helps stress relaxation
3P is scattered in the parent phase as precipitate.Make and be cooled to Xu Lengshi, Ni after the hot rolling
3Though Ni is carried out in separating out of P
3The size of P is compared with the precipitation size that helps the stress relaxation level, becomes thick.Therefore, by separating out after suppressing hot rolling and finishing, and make Ni and P fully solid solution in parent phase, thus after the calendering material anneal (plain Tiao Ware Blunt) and during recrystallization annealing so that Ni
3The mode that P separates out is adjusted Ni in the material and the state of P.In order to make Ni and P solid solution, the temperature of finishing of hot rolling is preferably more than 600 ℃, in order to suppress to separate out, preferably carries out water-cooled.
Before hot rolling, with annealing furnace ingot casting was kept under 800～980 ℃ of temperature, 2～4 hours time, after the taking-up, implement immediately hot rolling.Temperature when finishing according to calendering reaches 600～800 ℃ mode, adjusts pass configuration (pass schedule), preferably cooling is made as water-cooled.
If the maintenance temperature before the hot rolling is lower than 800 ℃, then dynamic recrystallization does not occur when finishing in calendering, the engineering after the thick metal structure of cast structure of resulting from remains to, sometimes I (220)/I
0(220) can surpass 3.0 or I (311)/I
0(311) surpass 0.5.If the maintenance temperature before the hot rolling surpasses 980 ℃, then when hot rolling, generate the liquid phase of Sn-P system, in calender line, crack sometimes.
If the hold-time before the hot rolling is lower than 2 hours, then with hot rolling before the maintenance temperature be lower than 800 ℃ situation similarly, have the situation that thick metal structure is remaining, bendability is deteriorated.Even the hold-time surpasses 4 hours, effect is also saturated, and cost increases.
If the temperature of finishing of hot rolling is lower than 600 ℃, then the solid solution of Ni-P is insufficient during hot rolling, has the deteriorated situation of proof stress relaxation property.
If carry out cooling after the hot rolling by Xu Leng (air cooling), although then in cooling separating out of Ni-P carry out, thickization of precipitation size, therefore the final thick precipitate that is helpless to stress relaxation that generates exists the deteriorated situation of proof stress relaxation property.
Preferably making the 1st cold rolling degree of finish is more than 95%.If the 1st cold rolling degree of finish is lower than 95%, then the separating out of Ni-P during recrystallization annealing becomes insufficient, has the deteriorated situation of proof stress relaxation property.
For bell-type annealing (バ ッ チ Ware Blunt), the temperature that preferably makes recrystallization annealing is that 350～480 ℃, annealing time are 15～90 minutes.If the recrystallization annealing temperature is lower than 350 ℃, then there is I (220)/I in non-recrystallization
0(220) surpass 3.0 or I (311)/I
0(311) surpass 0.5, the deteriorated situation of proof stress relaxation property simultaneously.If the recrystallization annealing temperature surpasses 480 ℃, remarkable thickization of crystal particle diameter then occurs, strength decreased, existence can't be stablized the situation that obtains the above tensile strength of 540MPa.If the annealing time of recrystallization annealing is lower than 15 minutes, although recrystallize then easily becomes mixed grain, there is I (220)/I
0(220) surpass 3.0 or I (311)/I
0(311) surpass 0.5 situation.If the annealing time of recrystallization annealing surpasses 90 minutes, the situation that then exists thickization of grain, strength decreased and production cost to rise.To need to prove, in order further reducing production costs, can to carry out recrystallization annealing by continuous annealing furnace.At this moment, annealing temperature is made as 550～700 ℃, reaches the mode of (10 μ m) below the target size with crystal particle diameter, adjusts the interior residence time (with the plate speed synonym) of stove of material.
Preferably final cold rolling degree of finish is made as 25～60%.If final cold rolling degree of finish is lower than 25%, then can't obtain sufficient intensity, if surpass 60%, then (220), (311) face are excessively flourishing, have I (220)/I
0(220) surpass 3.0 or I (311)/I
0(311) surpass 0.5 situation.
[embodiment]
＜experiment A(example 1～16, comparative example 1～8)
In the atmosphere melting furnace, dissolve electrolytic copper, the interpolation element shown in the table 1 of input specified amount, stirring molten metal.Afterwards, under 1100 ℃ of pouring temperatures, pour in the mold, obtain the copper alloy casting ingot that forms shown in the table 1 of thickness 30mm * width 60mm * length 120mm.After the average every face of ingot casting carried out building up by welding 2.5mm, carry out hot rolling, cold rolling, thermal treatment according to following order, obtain the sample of thickness of slab 0.2mm.
(1) with ingot casting after keeping carrying out 3 hours (hold-time) annealing under 800 ℃ of the temperature, be hot-rolled down to thickness of slab 11mm, the material temperature when finishing with hot rolling (hot rolling finish temperature) reaches the mode of 600 ℃ (error ± 10 ℃) and adjusts.
(2) in order to remove the oxide skin on the top layer after the hot rolling, implement the building up by welding of single face 0.5mm.
(3) implement the 1st cold rolling until thickness of slab and reach (degree of finish 97%) till the 0.3mm.
(4) 380 ℃ * 30 minutes recrystallization annealing of enforcement.
(5) grind the oxide skin of removing the surface after the recrystallization annealing by pickling polishing after, implement final cold rolling until thickness of slab and reach (degree of finish 33.3%) till the 0.2mm.
(6) final cold rolling after, further implement the stress relief annealing of 300 ℃ * 0.5h.
＜experiment B(example 21～32, comparative example 11～22)
Except making the consisting of the Cu-0.4%Sn-15%Zn-0.4%Ni-0.05%P of ingot casting, similarly operate with experiment A and obtain ingot casting.But the cooling conditions after annealing conditions, the hot rolling of ingot casting finished, the 1st cold rolling degree of finish, recrystallization annealing condition and final cold rolling as shown in table 3 change of degree of finish obtain the sample of thickness of slab 0.2mm.Perhaps, final cold rolling after, further implement the stress relief annealing of 300 ℃ * 0.5h.
＜estimate＞
For the project below the evaluation of material after the stress relief annealing of experiment A, B.
［ average crystalline particle diameter ］
Behind the sample electrolytic polishing with width 20mm * length 20mm, utilize the FE-SEM processed of Philips company to observe backscattered electron image.Observe multiplying power and be made as 1000 times, for the image in 5 visuals field, obtain crystal particle diameter by the method for section of JISH0501 regulation, calculate mean value.
［ X-ray diffraction intensity ］
Utilize X-ray diffractometer (the リ ガ of Co., Ltd. Network RINT2500 processed) to carry out the standard test of each sample, calculate each from the X-ray diffraction intensity I (220) of (220) face, (311) face and the integrated intensity of I (311) by attached software.In addition, fine copper powder standard test specimen (325mesh uses after 1 hour 300 ℃ of lower heating) is also carried out same mensuration in hydrogen stream, measure each from the X-ray diffraction intensity I of (220) face, (311) face
0(220) and I
0(311).Need to prove, as the x-ray bombardment condition, use the Cu target, be set as tube voltage 25kV, tube current 20mA
［ tensile strength ］
For each sample, carry out tension test along the direction parallel with rolling direction, obtain tensile strength (TS) according to JISZ2241.
［ electric conductivity ］
For each sample, according to JISH0505, calculate electric conductivity (%IACS) by the volume specific resistance of obtaining by the quadripolar mesh procedure that has utilized the double bridge device.
［ W bendability ］
Make bending axis parallel with rolling direction, take the bar shaped test film of width 10mm * length 30mm.Carry out the W pliability test (JIS H3130) of this test film, the minimum bending radius that do not crack as MBR (Minimum Bend Radius), is estimated by the ratio MBR/t with thickness of slab t (mm).
［ proof stress relaxation property ］
Take the test film of the rectangular shape of width 10mm * length 100mm in the length direction of the test film mode parallel with rolling direction.One end of restraint test sheet take from the position (l=50mm) of fixed position 50mm as point of application, gives test film y
0Bending, load is equivalent to 80% stress (σ of 0.2% endurance
0).y
0Obtained by following formula.
y
0=(2/3)?l
2?σ
0?/?(E?t)
Here, E is Young's modulus, and t is the thickness of sample.Giving test film y
0The state of bending under remove load 150 ℃ of lower heating after 1000 hours, measure set deformation volume (highly) y, calculate stress relaxation rate { [y (mm)/y0 (mm)] * 100 (%) }.
With the resulting table 1～table 4 that the results are shown in.Need to prove, table 1, table 2 are for testing the result of A, and table 3, table 4 are for testing the result of B.
For experiment A
Content at Sn, Zn, Ni, P is in the specialized range, and crystal particle diameter is more than the 1 μ m and below the 10 μ m, satisfies I (220)/I
0And I (311)/I (220)≤3.0
0(311)≤0.5 in the situation of each embodiment, tensile strength is more than the 540MPa and stress relaxation rate is below 25%, and the W bendability is (MBR/t)≤0.5.
On the other hand, Zn be lower than 3% comparative example 1, and Sn be lower than in the situation of 0.2% comparative example 3, tensile strength all is low to moderate and is lower than 540MPa.
Zn surpasses in the situation of 18% comparative example 2, I (220)/I
0(220) surpass 3.0, and I (311)/I
0(311) surpassing 0.5, W bendability is (MBR/t)＞0.5, and stress relaxation rate also surpasses 25%, and is deteriorated.
Surpass at Sn in the situation of 0.8% comparative example 4, and P surpass in the situation of 0.12% comparative example 8, all under hot rolling, crack, can't alloying.
Ni is lower than in the situation of 0.3% comparative example 5, and stress relaxation rate surpasses 25%, and is deteriorated.
Ni surpasses in the situation of 1.2% comparative example 6, I (220)/I
0(220) surpass 3.0, and I (311)/I
0(311) surpass 0.5, W bendability (MBR/t)＞0.5, deteriorated.
P is lower than in the situation of 0.01% comparative example 7, and stress relaxation rate surpasses 25%, and is deteriorated.
About experiment B
Hot rolling, the 1st cold rolling, recrystallization annealing, and final cold rolling condition satisfy in the situation of each embodiment of specialized range, tensile strength is more than the 540MPa, and stress relaxation rate is below 25%, the W bendability is (MBR/t)≤0.5.
On the other hand, the maintenance temperature before the hot rolling be lower than 800 ℃ comparative example 11, comparative example 13 that the hold-time before the hot rolling is lower than 2 hours, and the annealing time of recrystallization annealing be lower than in 15 minutes the situation of comparative example 19 I (220)/I
0(220) all above 3.0, and I (311)/I
0(311) all be (MBR/t)＞0.5 above 0.5, W bendability, deteriorated.
In the situation of the comparative example 12 of the maintenance temperature before the hot rolling above 980 ℃, crack under the hot rolling, can't alloying.
Hot rolling finish situation that temperature is lower than 600 ℃ comparative example 14, the situation of the comparative example that is cooled to Xu Leng 15 after hot rolling is finished, and the 1st cold rolling degree of finish be lower than in the situation of 95% comparative example 16, stress relaxation rate is all above 25%, and is deteriorated.
The temperature of recrystallization annealing is lower than in 350 ℃ the situation of comparative example 17, does not generate recrystallize, becomes not crystallization, I (220)/I
0(220) surpass 3.0, and I (311)/I
0(311) surpass 0.5, W bendability (MBR/t)＞0.5, deteriorated, and also stress relaxation rate is deteriorated above 25%.
The temperature of recrystallization annealing surpass 480 ℃ comparative example 18, and the annealing time of recrystallization annealing surpass in 90 minutes the situation of comparative example 20, crystal particle diameter all above 10 μ m, becomes thick, tensile strength all is low to moderate and is lower than 540MPa.
Final cold rolling degree of finish is lower than in the situation of 25% comparative example 21, and tensile strength is low to moderate and is lower than 540MPa.
Final cold rolling degree of finish surpasses in the situation of 60% comparative example 22, I (220)/I
0(220) surpass 3.0, and I (311)/I
0(311) surpass 0.5, W bendability and be (MBR/t)＞0.5, deteriorated.
Claims (4)
1.Cu-Zn-Sn-Ni-P be associated gold, it contains Sn:0.2～0.8%, Zn:3～18%, Ni:0.3～1.2%, P:0.01～0.12% in quality %, remainder comprises Cu and inevitable impurity,
Crystal particle diameter is more than the 1 μ m and below the 10 μ m,
To be made as from the X-ray diffraction intensity of (220) face I (220), to be made as from the X-ray diffraction intensity of (311) face I (311), and the X-ray diffraction intensity from (220), (311) face of fine copper powder standard test specimen will be made as respectively I
0(220), I
0(311) time, satisfy I (220)/I
0And I (311)/I (220)≤3.0
0(311)≤0.5.
2. Cu-Zn-Sn-Ni-P according to claim 1 is associated gold, and wherein, the tensile strength of measuring according to JIS-Z2241 is more than the 540MPa, and the stress relaxation rate of rolling direction is below 25%.
3. Cu-Zn-Sn-Ni-P according to claim 1 and 2 is associated gold, its with slab hot-rolling after, thereby carry out successively the 1st cold rolling, 350～480 ℃ recrystallization annealing, final cold rolling manufacturing forms.
4. each described Cu-Zn-Sn-Ni-P is associated gold according to claim 1～3, its further with total amount 0.02～0.25 quality % contain be selected among Mg, Mn, Ti, Cr and the Zr more than at least a kind.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012082973A JP6077755B2 (en) | 2012-03-30 | 2012-03-30 | Cu-Zn-Sn-Ni-P-based alloy and manufacturing method thereof |
| JP2012-082973 | 2012-03-30 |
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|---|---|
| CN103361510A true CN103361510A (en) | 2013-10-23 |
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| CN2013101041292A Pending CN103361510A (en) | 2012-03-30 | 2013-03-28 | Cu-Zn-Sn-Ni-P-based alloy |
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| Country | Link |
|---|---|
| JP (1) | JP6077755B2 (en) |
| KR (1) | KR20130111349A (en) |
| CN (1) | CN103361510A (en) |
| TW (1) | TWI510654B (en) |
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| MX2016000027A (en) * | 2013-07-10 | 2016-10-31 | Mitsubishi Materials Corp | Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal. |
| JP6270417B2 (en) * | 2013-11-01 | 2018-01-31 | Ｊｘ金属株式会社 | Copper alloy sheet with excellent conductivity and stress relaxation properties |
| CN108796296B (en) | 2018-06-12 | 2019-08-06 | 宁波博威合金材料股份有限公司 | One Albatra metal and its application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05311295A (en) * | 1992-05-07 | 1993-11-22 | Dowa Mining Co Ltd | Copper base alloy for heat exchanger and its manufacture |
| JP2002294368A (en) * | 2001-03-30 | 2002-10-09 | Kobe Steel Ltd | Copper alloy for terminal and connector and production method therefor |
| US6471792B1 (en) * | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| CN101522927A (en) * | 2006-10-03 | 2009-09-02 | 日矿金属株式会社 | Method for production of copper alloy for electronic material |
| CN102317483A (en) * | 2009-04-01 | 2012-01-11 | Jx日矿日石金属株式会社 | Cu-Zn-Sn alloy plate and tin-plated Cu-Zn-Sn alloy strip |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3243479B2 (en) * | 1991-05-31 | 2002-01-07 | 同和鉱業株式会社 | Copper base alloy for heat exchanger |
| JP3807475B2 (en) * | 1998-07-08 | 2006-08-09 | 株式会社神戸製鋼所 | Copper alloy plate for terminal and connector and manufacturing method thereof |
| JP5050226B2 (en) * | 2005-03-31 | 2012-10-17 | Ｄｏｗａメタルテック株式会社 | Manufacturing method of copper alloy material |
| JP5466879B2 (en) * | 2009-05-19 | 2014-04-09 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet and manufacturing method thereof |
-
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- 2012-03-30 JP JP2012082973A patent/JP6077755B2/en not_active Expired - Fee Related
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- 2013-03-04 TW TW102107463A patent/TWI510654B/en not_active IP Right Cessation
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- 2013-03-28 CN CN2013101041292A patent/CN103361510A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05311295A (en) * | 1992-05-07 | 1993-11-22 | Dowa Mining Co Ltd | Copper base alloy for heat exchanger and its manufacture |
| US6471792B1 (en) * | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| JP2002294368A (en) * | 2001-03-30 | 2002-10-09 | Kobe Steel Ltd | Copper alloy for terminal and connector and production method therefor |
| CN101522927A (en) * | 2006-10-03 | 2009-09-02 | 日矿金属株式会社 | Method for production of copper alloy for electronic material |
| CN102317483A (en) * | 2009-04-01 | 2012-01-11 | Jx日矿日石金属株式会社 | Cu-Zn-Sn alloy plate and tin-plated Cu-Zn-Sn alloy strip |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201348469A (en) | 2013-12-01 |
| KR20130111349A (en) | 2013-10-10 |
| TWI510654B (en) | 2015-12-01 |
| JP2013213236A (en) | 2013-10-17 |
| JP6077755B2 (en) | 2017-02-08 |
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Application publication date: 20131023 |