CN103338591A - A paster-type optical module - Google Patents

A paster-type optical module Download PDF

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Publication number
CN103338591A
CN103338591A CN2013102191013A CN201310219101A CN103338591A CN 103338591 A CN103338591 A CN 103338591A CN 2013102191013 A CN2013102191013 A CN 2013102191013A CN 201310219101 A CN201310219101 A CN 201310219101A CN 103338591 A CN103338591 A CN 103338591A
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Prior art keywords
optical module
circuit board
smd
pad
optical assembly
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CN2013102191013A
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CN103338591B (en
Inventor
程磊
张华�
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
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Abstract

The invention discloses a paster-type optical module. The paster-type optical module comprises a optical assembly and a circuit board, wherein the circuit board is provided with a circuit pin which realizes the function of the optical assembly; a front end of the circuit board is open to be provided with a first bonding pad; the pin on a rear end of the optical assembly is welded to the first bonding pad; the two sides of the circuit board are provided with a second bonding pad, and the circuit pin which realizes the function of the optical assembly and an external system plate are welded on the second bonding pad. The structure can be simplified and the cost can be reduced through the adoption of the paster-type optical module provided by the invention.

Description

SMD optical module
Technical field
The present invention relates to the optical module technology, relate in particular to a kind of SMD optical module.
Background technology
Present domestic market and international market have begun to use with the optical fiber communication business that multiple business is merged with a large bandwidth and at a high rate; In numerous solutions, the appearance that Fiber to the home (FTTH, Fiber To The Home) is considered to the ultimate solution of broadband access, and the domestic market is large-area applications.
At present, the optical device for the transmission of Access Networks such as high in the clouds data center, Ethernet, cordless communication network mostly is the Access Network optical module.For FTTH, adopt EPON (PON, Passive Optical Network) technology, its communication wavelengths is 1310nm and 1490nm; For client, just optical network unit (ONU, Optical Network Unit) BOX launches 1310nm and receives 1490nm.Increase along with the Access Network transmission capacity requirements, little encapsulation in the SMD optical module of client-side (SFF, Small Form Factor) optical module is because it is strong to be connected to network more flexible, can be independent of communication protocol, and can with the kilomegabit switch compatibility of each operator.Thereby, obtained application more and more widely.
Fig. 1 is existing SFF optical module structural representation.Referring to Fig. 1, this SFF optical module comprises: circuit board 11, contact pin 12, optical assembly 13, support 14 and shell 15, wherein,
Circuit board 11 is provided with the circuit of realizing optical assembly 13 functions, the function of circuit part comprises: control optical module operating state, for the laser in the optical assembly 13 provide biasing and modulated current, for the avalanche photodide in the optical assembly 13 provide high pressure and, the monitor message that shows the optical module operating state is provided.
Support 14 is used for cooperating with circuit board 11 and shell 15, thereby fixing and encapsulation optical module in support 14 both sides and rear end, is provided with the groove 141 for the location, simultaneously, in support 14 both sides, also is provided with a plurality of cramps 142 for the location; The front end of support 14 is provided with the half slot 143 that supports optical assembly 13; The bottom of support 14 is respectively arranged with the pin holes (not shown) of ccontaining contact pin 12 and the reference column 144 of riveted joint.
Circuit board 11 both sides and afterbody are respectively arranged with for the locating convex block 111 corresponding with groove 141, front end offers pad 112, welded at pad 112 by the pin 131 on optical assembly 13 rear ends, thereby realization optical assembly 13 is connected with circuit board 11, and the front end of optical assembly 13 is positioned on the half slot 143.Simultaneously, contact pin 12 also is welded on the circuit board 11 by the pad that arranges.
Like this, the locating convex block 111 that arranges on the circuit board 11 can position by button bit with corresponding groove on the support 14 141, and cramp 142 can position by button bit again with cramp hole 151 on the shell 15,
In when assembling, the circuit board 11 that is welded with optical assembly 13 and contact pin 12 is packed in the support 14, and the locating convex block 111 on the circuit board 11 is buckled on the support 14 in the corresponding groove 141, realize location and the assembling of circuit board 11 in support 14; Cover shell 15, and tip the cramp hole 151 on the shell 15 in cramp 142 corresponding on the support 14, realize the assembling of optical module, make it assembling and be shaped to the SFF optical module.
When needs are used optical module, contact pin 12 is inserted outside system board also weld, thereby realize and being connected of system board.
Owing to more and more be subjected to the attention of each manufacturer at the register one's residence cost degradation of optical module product in market of optical fiber, and existing SFF optical module, include circuit board, contact pin, optical assembly, support and shell, and each parts need be positioned and assemble, be encapsulated as the SFF optical module at last.Because the parts of optical module are more, locate comparatively complexity of required structure, cost is higher; Further, in location and when assembling, need position respectively by a plurality of locating pieces that set in advance, locate comparatively loaded down with trivial detailsly, required time is longer.
Summary of the invention
Embodiments of the invention provide a kind of SMD optical module, simplified structure, reduce cost.
For achieving the above object, a kind of SMD optical module that the embodiment of the invention provides, this SMD optical module comprises: optical assembly and circuit board, wherein,
Described circuit board is provided with the circuit pin of realizing the optical assembly function, and described circuit board front end offers first pad, and the pin on the described optical assembly rear end is welded on first pad; Be provided with second pad in described circuit board both sides, realize that circuit pin and the external system plate of optical assembly function is welded to second pad.
Preferably, the quantity of second pad that arranges on the described circuit board equals to realize the circuit number of pins of optical assembly function.
Preferably, the quantity of described second pad is 20.
Preferably, the profile of described circuit board is regular shape.
Preferably, described regular shape comprises: rectangle, square and quadrangle.
Preferably, described optical assembly function comprises: control optical module operating state, for the laser in the optical assembly provide biasing and modulated current, for the avalanche photodide in the optical assembly provide high pressure and, the monitor message that shows SMD optical module operating state is provided.
Preferably, the bottom of the bottom of described optical assembly and circuit board is positioned at same horizontal plane.
Preferably, the pad size that arranges on the described external system plate is greater than the pad size of relative set on the SMD optical module.
Preferably, described SMD optical module be welded on the system board comprise:
Scaling powder is coated onto on second pad;
Circuit board is placed on the system board, and second pad aligns;
Pin on the welding diagonal position, fixing circuit board;
Determine the position alignment of circuit board, weld all the other pins.
Preferably, the described SMD optical module of dismounting welding comprises:
The temperature adjustment flatiron temperature is transferred to 260 ℃;
Utilize solder horn to cooperate solder sucker, circuit board pin scolding tin is all absorbed;
Instrument is inserted the circuit board bottom, and in the flatiron heating, tool using is mentioned the circuit board pin, so that circuit board pin and system board break away from.
As seen from the above technical solution, a kind of SMD optical module that the embodiment of the invention provides, owing to saved contact pin, support and shell, adopt circuit board and optical assembly to form SMD optical module, and the circuit board that arranges in the SMD optical module adopts the connected mode of the pad welding of paster integrated circuit to be connected with the external system plate, simple in structure, cost is low.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art.Apparently, the accompanying drawing in below describing only is some embodiments of the present invention, for those of ordinary skills, can also obtain other embodiment and accompanying drawing thereof according to these accompanying drawing illustrated embodiments.
Fig. 1 is existing SFF optical module structural representation.
Fig. 2 is the SMD optical module structural representation of the embodiment of the invention.
Embodiment
Below with reference to accompanying drawing the technical scheme of various embodiments of the present invention is carried out clear, complete description, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are resulting all other embodiment under the prerequisite of not making creative work, all belong to the scope that the present invention protects.
Existing direct insertion SFF optical module, parts are more, and structure is comparatively complicated, and cost is higher, when location and assembling, need position respectively by a plurality of locating pieces or the locating button that sets in advance, and locatees comparatively loaded down with trivial detailsly, and required time is longer.
Surface mount elements is applied on the circuit board more and more widely because volume is little, in light weight, with respect to the straight cutting element, is easy to welding and dismounting; And, because the surface mount elements volume is little, need not via hole, can effectively reduce stray electric field and stray magnetic field, especially in high frequency analog circuits and high-speed digital circuit, can improve stability and the reliability of circuit.
In the embodiment of the invention, consider direct insertion contact pin is replaced by surface mount elements, be connected to outside system board by the paster mode; Simultaneously, owing to adopt SMD welding manner, need not to arrange support and the shell that is welded with the circuit board of contact pin in order to location and support.
Fig. 2 is the SMD optical module structural representation of the embodiment of the invention.Referring to Fig. 2, this SMD optical module comprises: optical assembly 21 and circuit board 22, wherein,
Circuit board 22 is provided with the circuit pin of realizing optical assembly 21 functions, the optical assembly function comprises: control optical module operating state, for the laser in the optical assembly 21 provide biasing and modulated current, for the avalanche photodide in the optical assembly 21 provide high pressure and, the monitor message that shows SMD optical module operating state is provided.Be known technology about layout and cabling and the optical assembly function of circuit on circuit board, omit detailed description at this.
Circuit board 22 front ends offer first pad 221, and the pin 211 on optical assembly 21 rear ends is welded to first pad 221, thereby realize being connected of optical assembly 21 and circuit board 22; Be provided with second pad 222 in circuit board 22 both sides, realize that circuit pin and the external system plate of optical assembly 21 functions is welded to second pad 222, thus being connected of realization circuit board 22 and system board.
In the embodiment of the invention, optical assembly 21 and circuit board 22 are formed SMD optical module, and circuit board 21 pastes by module with system board, adopt the pad welding of paster integrated circuit to connect.Be welded as known technology about paster, omit detailed description at this.
Preferably, the quantity of second pad 222 that arranges on the circuit board 22 equals to realize the circuit number of pins of optical assembly 21 functions.
In the embodiment of the invention, the quantity of second pad 222 can be set to 20.
In the practical application, because circuit board 22 need not to be placed in the support and position, thereby the profile of circuit board 22 can be regular shape, and for example, rectangle, square, quadrangle and polygon etc. are effectively to reduce production costs.
Preferably, the bottom of the bottom of optical assembly 21 and circuit board 22 is positioned at same horizontal plane, like this, can effectively increase supporting surface, is convenient to the fixing of SMD optical module.
In the practical application, because the SMD optical module of the embodiment of the invention adopts pad to link to each other with the external system plate, the structure of external system plate also can be carried out corresponding modify, need not to be provided for the contact pin groove of ccontaining contact pin again, only need in the relevant position, reserve the pad that welds with SMD optical module and get final product.
Preferably, the pad size that arranges on the external system plate is greater than the pad size of relative set on the SMD optical module.
By as seen above-mentioned, the SMD optical module of the embodiment of the invention, with respect to existing SFF optical module, can save contact pin, support and shell, adopt circuit board and optical assembly to form SMD optical module, and the connected mode that the circuit board in the SMD optical module adopts the pad of similar paster integrated circuit to weld is set, be connected with the external system plate, simple in structure, cost is low; Further, because property of there are differences all between the optical assembly in the different optical modules, thereby in the debug process of optical module, it is all different that each optical module correspondence imposes on bias current, modulated current, high pressure and the calibration factor of optical assembly.In the embodiment of the invention, because circuit board and optical assembly are formed SMD optical module, be convenient to maintenance and replace, in maintenance with when replacing, the SMD optical module that only needing to break down maybe needs to replace disassembles from system board and get final product, maintenance and replacing conveniently; And, also be convenient to the upgrading of optical assembly and related circuit plate.For example, upgrading if desired only needs to change SMD optical module.With respect to adopting optical assembly directly is welded on mode on the system board, when optical assembly breaks down or upgrades when needing to change, needs to change system board and optical assembly, and need debug again system board, make that replacement cost and debugging required time are long.In other words, the SMD optical module of the embodiment of the invention adopts the paster welding manner, can keep the flexibility of optical module, is convenient to safeguard; By saving support, shell and contact pin, adopt the form of pad welding to be connected with system board, can effectively reduce production costs.
Below the flow process that the SMD optical module of the embodiment of the invention is welded on the system board is described.
A11 is coated onto scaling powder on second pad, to optimize the second pad quality;
In this step, before welding, coat scaling powder at second pad, handle with flatiron, zinc-plated bad or oxidized to avoid second pad, cause follow-up welding quality not good.
A12 is placed into circuit board on the system board, and second pad aligns;
In this step, according to second number of pads and the arrangement mode that arrange on circuit board and the system board, second pad of relative set on circuit board and the system board is alignd.
A13, the pin on the welding diagonal position, fixing circuit board;
In this step, by the pin on the welding diagonal position, in order to circuit board tentatively is fixed on the system board.
A14, whether the position of check circuit plate is aimed at, and determines to aim at, and welds all the other pins.
When the SMD optical module of the dismounting embodiment of the invention, the temperature adjustment flatiron temperature can be transferred to about 260 ℃, after cooperating solder sucker that circuit board pin scolding tin is all absorbed with solder horn, insert the circuit board bottom with instrument, in with the flatiron heating, tool using is mentioned the circuit board pin, and the circuit board pin is broken away from system board gradually.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also comprises these changes and modification interior.

Claims (10)

1. a SMD optical module is characterized in that, this SMD optical module comprises: optical assembly and circuit board, wherein,
Described circuit board is provided with the circuit pin of realizing the optical assembly function, and described circuit board front end offers first pad, and the pin on the described optical assembly rear end is welded on first pad; Be provided with second pad in described circuit board both sides, realize that circuit pin and the external system plate of optical assembly function is welded to second pad.
2. SMD optical module according to claim 1 is characterized in that, the quantity of second pad that arranges on the described circuit board equals to realize the circuit number of pins of optical assembly function.
3. SMD optical module according to claim 2 is characterized in that, the quantity of described second pad is 20.
4. SMD optical module according to claim 1 is characterized in that, the profile of described circuit board is regular shape.
5. SMD optical module according to claim 4 is characterized in that, described regular shape comprises: rectangle, square and quadrangle.
6. according to each described SMD optical module of claim 1 to 5, it is characterized in that, described optical assembly function comprises: control optical module operating state, for the laser in the optical assembly provide biasing and modulated current, for the avalanche photodide in the optical assembly provide high pressure and, the monitor message that shows SMD optical module operating state is provided.
7. SMD optical module according to claim 6 is characterized in that, the bottom of described optical assembly and the bottom of circuit board are positioned at same horizontal plane.
8. SMD optical module according to claim 6 is characterized in that, the pad size that arranges on the described external system plate is greater than the pad size of relative set on the SMD optical module.
9. SMD optical module according to claim 6 is characterized in that, described SMD optical module is welded on the system board comprise:
Scaling powder is coated onto on second pad;
Circuit board is placed on the system board, and second pad aligns;
Pin on the welding diagonal position, fixing circuit board;
Determine the position alignment of circuit board, weld all the other pins.
10. SMD optical module according to claim 9 is characterized in that, the described SMD optical module of dismounting welding comprises:
The temperature adjustment flatiron temperature is transferred to 260 ℃;
Utilize solder horn to cooperate solder sucker, circuit board pin scolding tin is all absorbed;
Instrument is inserted the circuit board bottom, and in the flatiron heating, tool using is mentioned the circuit board pin, so that circuit board pin and system board break away from.
CN201310219101.3A 2013-06-04 2013-06-04 SMD optical module Active CN103338591B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106501906A (en) * 2016-10-26 2017-03-15 博为科技有限公司 A kind of 10G PON BOSA patches
WO2022261988A1 (en) * 2021-06-18 2022-12-22 深圳汝原科技有限公司 Radiation source assembly, and drying apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003098304A1 (en) * 2002-05-17 2003-11-27 Iljin Corporation Plug-in type optical module
CN101416426A (en) * 2006-03-02 2009-04-22 菲尼萨公司 Directly modulated laser with integrated optical filter
CN201897649U (en) * 2010-08-28 2011-07-13 绍兴飞泰光电技术有限公司 Single-fiber bidirectional SFF (Small Form Factor) light transceiving integrated module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003098304A1 (en) * 2002-05-17 2003-11-27 Iljin Corporation Plug-in type optical module
CN101416426A (en) * 2006-03-02 2009-04-22 菲尼萨公司 Directly modulated laser with integrated optical filter
CN201897649U (en) * 2010-08-28 2011-07-13 绍兴飞泰光电技术有限公司 Single-fiber bidirectional SFF (Small Form Factor) light transceiving integrated module

Non-Patent Citations (1)

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Title
李胜铭: "贴片电子元器件焊接技巧", 《电子制作》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106501906A (en) * 2016-10-26 2017-03-15 博为科技有限公司 A kind of 10G PON BOSA patches
WO2022261988A1 (en) * 2021-06-18 2022-12-22 深圳汝原科技有限公司 Radiation source assembly, and drying apparatus

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