CN103336622B - Touch display screen and optical filter box thereof and this optical filter box preparation method - Google Patents
Touch display screen and optical filter box thereof and this optical filter box preparation method Download PDFInfo
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Abstract
A kind of optical filter box, including substrate, the first conductive layer, light shield layer, filter layer, shape layer and the second conductive layer.Light shield layer is attached to the first surface of substrate, and the first conductive layer is located on light shield layer, and shape layer is attached on light shield layer and filter layer, and the second conductive layer is embedded in shape layer so that the second conductive layer and the first conductive layer form inductance capacitance structure.Therefore, optical filter box can realize touch control operation and filtering functions simultaneously.As the combination of two assemblies indispensable in display screen, when optical filter box is used for touching in display screen, display screen can be directly made to have touch controllable function, it is not necessary to assemble a touch-screen the most on a display screen, thus advantageously reduce the thickness of electronic product.During additionally, utilize optical filter box preparation to touch display screen, can reduce by an attaching process, thus also can save material and improve production efficiency.Additionally, the present invention also provides for a kind of touch display screen and optical filter box preparation method.
Description
Technical field
The present invention relates to touch screen technology, particularly relate to a kind of touch display screen and optical filter box thereof and
This optical filter box preparation method.
Background technology
Touch-screen is the inductive arrangement that can receive the input signals such as touch.It is the finest that touch-screen imparts information
New looks, are extremely attractive brand-new information interactive devices.The development of touch screen technology causes domestic
The common concern of external information medium circle, it has also become the Chaoyang new high-tech industry that photovoltaic industry is a dark horse.
At present, the electronic product with touch display function all includes display screen and the touch being positioned on display screen
Screen.But, touch-screen is as the assembly with display screen independence, at the electronics realizing man-machine interaction for some
During product, it is required to the size according to display screen and orders, assemble the most again, show to be formed to touch
Display screen, touch display screen can have touch control operation to be display function simultaneously.Existing touch-screen and display screen
Assembling mainly have a two ways, i.e. frame patch and entirely fitting.Frame patch is by the edge patch of touch-screen with display screen
Closing, full laminating is by whole of the upper surface laminating of the lower surface of touch-screen Yu display screen.
Display screen mainly includes polaroid, optical filter module, Liquid Crystal Module and thin film transistor (TFT) (TFT, Thin
Film Transistor), polaroid, optical filter module, Liquid Crystal Module and thin film transistor (TFT) it is combined into display
During screen, there is bigger thickness, and when continuing laminating touch-screen on display screen, will be further increased
Its thickness, thus run counter to the development trend that electronic product is lightening.
Summary of the invention
Based on this, it is necessary to provide a kind of touch display screen advantageously reducing electronic product thickness and optical filtering thereof
Chip module and this optical filter box preparation method.
A kind of optical filter box, including:
Substrate, including first surface and the second surface that is oppositely arranged with described first surface；
First conductive layer, is attached to described first surface, and described first conductive layer is that conductive thread intersects
The conductive grid formed, described first conductive layer includes multiple first grid cell；
Light shield layer, is positioned at the side of the described first the most described substrate of conductive layer, with by described first conductive layer
Be held between described light shield layer and described substrate, described light shield layer be gridline intersect formed grid
Shape structure, described light shield layer includes multiple grid cell, forms the conductive thread of described first conductive layer in institute
State the projection on light shield layer and be positioned at described gridline；
Filter layer, is attached to described first surface, and described filter layer includes multiple spaced filter unit,
Multiple described filter units lay respectively in the plurality of grid cell；
Shape layer, is attached on described light shield layer and described filter layer, and by described light shield layer and described optical filtering
Layer is held between described substrate and described shape layer；And
Second conductive layer, is located on described shape layer, and described second conductive layer is that conductive thread intersects shape
The conductive grid become, described second conductive layer includes multiple second grid cell.
Wherein in an embodiment, described second conductive layer is embedded in described shape layer.
Wherein in an embodiment, described shape layer offers the second grid away from the side of described light shield layer
Groove, described second conductive layer is formed by the conductive material being filled in described second grid groove.
Wherein in an embodiment, the degree of depth of described second grid groove is more than or equal to described second conduction
The thickness of layer.
Wherein in an embodiment, form the width of conductive thread of described first conductive layer less than described grid
The width of ruling.
Wherein in an embodiment, the thickness of described filter layer is more than the thickness of described light shield layer.
Wherein in an embodiment, form the width of conductive thread of described first conductive layer equal to described grid
The width of ruling.
Wherein in an embodiment, the thickness of described filter layer is more than described light shield layer and described first conduction
The thickness sum of layer.
Wherein in an embodiment, form the conductive thread throwing at described light shield layer of described second conductive layer
Shadow is positioned at described gridline.
Wherein in an embodiment, at least include a conductive thread forming described second conductive layer, its
Projection at described light shield layer is positioned at described grid cell.
Wherein in an embodiment, form the width of conductive thread of described second conductive layer between 0.2 to 5
Between Wei meter, the distance between the grid node of described second grid cell is between 50 to 500 microns.
Wherein in an embodiment, at least accommodate described in one in the range of each described first grid cell
Filter unit.
Wherein in an embodiment, described first conductive layer forms the first conductive unit of a plurality of mutually insulated,
Described second conductive layer forms the second conductive unit of a plurality of mutually insulated.
A kind of touch display screen, including the film crystal pipe electrode stacked gradually, liquid crystal module, as above-mentioned excellent
Select optical filter box according to any one of embodiment and upper polaroid.
Wherein in an embodiment, the first surface of described substrate is towards described liquid crystal module.
A kind of optical filter box preparation method, comprises the following steps:
A substrate, described substrate is provided to include first surface and the second table being oppositely arranged with described first surface
Face；
Form the first conductive layer at described first surface and be positioned at the one of the described first the most described substrate of conductive layer
The light shield layer of side, described light shield layer be gridline intersect formed lattice-shaped structure, including multiple grids
Unit；
It is respectively coated with photoresist, to form multiple spaced list that filters in the plurality of grid cell
Unit, the plurality of filter unit forms filter layer；
Imprint glue in the coating of described first surface and use impressing mould to imprint, making described impressing adhesive curing,
To form the shape layer offering the second grid groove, described second grid groove is positioned at described shape layer dorsad
The side of described light shield layer；
In described second grid groove, fill conductive material and make it solidify, to form the second conductive layer.
Wherein in an embodiment, described form the first conductive layer at described first surface and be positioned at described
The light shield layer of the side of the one the most described substrate of conductive layer, described light shield layer be gridline intersect formed
Lattice-shaped structure, including multiple grid cells step particularly as follows:
At described first surface plating conducting film or coating conductive ink, to form conductive film layer；
Black light photoresist precuring is coated in the side of the most described substrate of described conductive film layer, black to be formed
Look photoresist layer；
Utilize exposure-development that described black photoresist layer is etched into lattice-shaped, to obtain described light shield layer；
The conductive film layer being exposed to described light shield layer is etched, described conductive film layer is etched into described
Identical latticed, to obtain described first conductive layer of light shield layer shape.
Wherein in an embodiment, described form the first conductive layer at described first surface and be positioned at described
The light shield layer of the side of the one the most described substrate of conductive layer, described light shield layer be gridline intersect formed
Lattice-shaped structure, including multiple grid cells step particularly as follows:
At described first surface plating conducting film or coating conductive ink, to form conductive film layer；
Described conductive film layer coats photoresist, and precuring is to form photoresist layer, use exposure-development
Described photoresist layer is etched into latticed by technology；
The conductive film layer being exposed to described photoresist layer is etched, to obtain described first conductive layer, and
Remove the part that described photoresist layer is attached on described first conductive layer；
Described first conductive layer coats black light photoresist precuring, to form black photoresist layer, adopts
By exposure-development technology, described black photoresist layer is etched into lattice-shaped structure, to obtain described light shield layer.
Above-mentioned optical filter box and use the touch display screen of this optical filter box, optical filter box can be simultaneously
Realize touch control operation and filtering functions.As the combination of two assemblies indispensable in display screen, optical filter
When assembly is used for touching in display screen, display screen can be directly made to have touch controllable function, it is not necessary to the most on a display screen
Assemble a touch-screen, thus advantageously reduce the thickness of electronic product.Additionally, utilize above-mentioned optical filter box
When preparation touches display screen, can reduce by an attaching process, thus also can save material and improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation touching display screen in present pre-ferred embodiments；
Fig. 2 is to touch the layer structure schematic diagram of optical filter box in display screen shown in Fig. 1；
Fig. 3 is the stereogram of optical filter box shown in Fig. 2；
Fig. 4 to Fig. 6 is the partial enlarged drawing of optical filter box shown in Fig. 3；
Fig. 7 is the layer structure schematic diagram of optical filter box in another embodiment；
Fig. 8 is the layer structure schematic diagram of optical filter box in another embodiment；
Fig. 9 is the schematic flow sheet of optical filter box preparation method in an embodiment；
Figure 10 is to form light shield layer and the schematic flow sheet of the first conductive layer in an embodiment；
Figure 11 is to form light shield layer and the schematic flow sheet of the first conductive layer in another embodiment；
Figure 12 is the structural representation of the first conductive layer in an embodiment；
Figure 13 is the structural representation of the first conductive layer in another embodiment.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.
Accompanying drawing gives presently preferred embodiments of the present invention.But, the present invention can come real in many different forms
Existing, however it is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiments is to make this
The understanding of disclosure of the invention content is more thorough comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, and it can be directly at another yuan
On part or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can
To be directly to another element or to may be simultaneously present centering elements.
Unless otherwise defined, all of technology used herein and scientific terminology and the technology belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.The art used the most in the description of the invention
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting the present invention.Used herein
Term " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
Referring to Fig. 1, the touch display screen 10 in present pre-ferred embodiments includes the lower polarisation stacked gradually
Sheet 101, film crystal pipe electrode 102, liquid crystal module 103, public electrode 104, optical filter box 100
And upper polaroid 105.
Touching display screen can be straight-down negative or the LCDs of side entering type light source.Thin film transistor (TFT) (TFT)
Electrode 102 includes glass-base 1021 and the show electrode 1023 being arranged on glass-base 1021.Liquid crystal
Module 103 includes liquid crystal bulk layer 1032 and is held on the alignment film 1034 of liquid crystal bulk layer 1032 both sides.
See also Fig. 2 and Fig. 3, in the present embodiment, optical filter box 100 include substrate 110,
One conductive layer 120, light shield layer 130, filter layer 140, shape layer 150 and the second conductive layer 160.Wherein:
Substrate 110 includes first surface (figure is not marked) and the second surface (figure being oppositely arranged with first surface
Do not mark).Substrate 110 carrying and protective effect, and substrate 110 light-permeable.Concrete, substrate 110
Material can be sillico aluminate glass or calcium soda-lime glass.The most in the present embodiment, substrate 110 common electrical dorsad
Pole 104 is arranged.
Seeing also Fig. 4, the first conductive layer 120 is attached to first surface.First conductive layer 120 is conduction
Silk thread intersects the conductive grid formed, and the first conductive layer 120 includes the first grid cell (figure do not mark).
Concrete the most in the present embodiment, the first conductive layer 120 forms the first conductive unit of a plurality of mutually insulated, and (figure is not
Mark).
In the present embodiment, the first conductive layer 120 is formed by the conductive material being attached to first surface.Specifically
, can by light shield layer 130 plated surface conducting film or coating conductive material, to form conductive film layer,
Again conductive film layer is etched, obtains patterned first conductive layer 120.Wherein, for the material of plated film
Can be metal or the ITO etc. with less resistive rate such as gold, silver, copper, and can for the conductive material of coating
For conductive ink etc..
Light shield layer 130 is positioned at the side of the first conductive layer 120 substrate 110 dorsad, with by the first conductive layer 120
It is held between light shield layer 130 and substrate 110.Light shield layer 130 can be by the photoresist of band black dyes, oil
The non-transparent material such as ink and shading resin solidify to form at first surface.Light shield layer 130 is gridline 131 phase
The lattice-shaped structure intersected to form mutually, light shield layer 130 includes multiple grid cell (figure is not marked).Form first
The projection on light shield layer 130 of the conductive thread of conductive layer 120 is positioned at gridline 131, so can keep away
Exempting from conductive thread, to stretch out light shield layer gridline outer and affect the light-out effect of filter layer, such that it is able to promote user
Experience..
In the present embodiment, the conductive thread forming the first conductive layer 120 can be straight line, curve or broken line.
Further, when the conductive thread forming the first conductive layer 120 is straight line, the center of conductive thread
Line aligns with the center line of gridline 131, thus can make the width of conductive thread as far as possible relatively greatly, to increase
Add the reliability of the first conductive layer 120.Formed the first conductive layer 120 conductive thread can also for curve or
Broken line.
In the present embodiment, the width of conductive thread of the first conductive layer 120 is formed less than gridline 131
Width.For reaching visually-clear effect, the conductive thread forming the first conductive layer 120 must be by gridline 131
Block.Therefore, for preventing what conductive thread from exposing gridline 131 to block scope, the first conductive layer 120 is formed
The width of conductive thread less than the width of gridline 131.Owing to the width of gridline 131 is led more than first
The width of the conductive thread of electric layer 120, therefore the first conductive layer 120 is blocked layer 130 is coated with, both are formed
Integrally-built thickness equal to the thickness of light shield layer.
Further, in the present embodiment, the thickness of filter layer 140 is more than the thickness of light shield layer 130.Cause
This, can prevent being blocked layer 130 from the light of filter unit 141 side outgoing or the first conductive layer 120 hides
Gear, thus increase light emission rate.
Refer to Fig. 7, in another embodiment, form the width etc. of the conductive thread of the first conductive layer 120
Width in gridline 131.Therefore, when forming the first conductive layer 120 and light shield layer 130, can first depend on
Secondary form the conductive film layer in front and black photoresist layer at first surface, more successively to black photoresist layer and
Conductive film layer is etched, and just can get light shield layer 130 and first conductive layer 120 of preset shape.Shape
During, it is not necessary to introduce new mask plate, thus preparation flow can be simplified.
Further, the thickness of filter layer 140 more than light shield layer 130 and the first conductive layer 120 thickness it
With.Therefore, filter layer 140 can be made to protrude from light shield layer 130 and the surface of the first conductive layer 120, thus
Prevent being blocked layer 130 from the light of filter unit 141 side outgoing and the first conductive layer 120 blocks, enter
And increase light emission rate.
Referring to Fig. 1 to Fig. 4, filter layer 140 is attached to first surface.Filter layer 140 includes multiple
Spaced filter unit 141.Multiple filter units 141 lay respectively in multiple grid cell, thus logical
Cross gridline 131 to separate single for multiple filter units 141.Filter unit 141 can be respectively by being coated on
The RGB(red green blue tricolor on one surface) chromatic photoresist formation, there is filtering functions.Send from backlight
Light filter through filter unit 141, the light of corresponding color can be respectively obtained.Control the light of backlight
Line throughput in different colours filter unit 141, can be mixed to get shades of colour mixed light, Jin Ershi
Existing multicoloured display.In the present embodiment, grid cell is square, thus by filter unit 141
Shape is also defined to square, and then makes the colour developing of multiple filter unit 141 evenly.It is appreciated that
Grid cell is alternatively triangle, circle or other are irregularly shaped.
In the present embodiment, a filter unit 141 is at least accommodated in the range of each first grid cell.Tool
Body, the first grid cell can with filter unit 141 one to one or one-to-many.As shown in Figure 4, one
A filter unit 141 is only included in the range of one grid cell；As it is shown in figure 5, first grid cell
In the range of comprise same axially on multiple filter units 141；As shown in Figure 6, first grid cell
In the range of comprise multiple orthogonal axially on multiple filter units 141.Therefore, on every gridline
The most only a conductive thread need to be set, so that the density of conductive grid reduces, it is simple to processing.
Shape layer 150 is attached on light shield layer 130 and filter layer 140, and by light shield layer 130 and filter layer
140 are held between substrate 110 and shape layer 150.Concrete, shape layer 150 is by being coated on first surface
Impressing adhesive curing formed.Impressing glue is transparence, does not affect the transmitance of entirety.In the present embodiment,
The material of impressing glue is solvent-free ultra-violet curing acryl resin, and its thickness is 2～10 microns.It may be noted that
It is that in other embodiments, impressing glue material can also be On Visible Light Cured Resin, heat reactive resin etc..
Second conductive layer 160 is located on shape layer 150.The most in the present embodiment, the second conductive layer 160
It is embedded in shape layer 150.Wherein, the second conductive layer 160 and the first conductive layer 120 are respectively positioned on substrate 110
Side, both be oppositely arranged and between be spaced shape layer 150.Therefore, the second conductive layer 160 is led with first
Between electric layer 120 formed inductance capacitance structure so that optical filter box 110 can realize simultaneously touch-control and
Filtering functions.Second conductive layer 160 for conductive thread intersect formed conductive grid, the second conductive layer
160 include multiple second grid cell (figure is not marked).The most in the present embodiment, the second conductive layer 160 shape
Become the second conductive unit 163 of a plurality of mutually insulated.
Wherein, the conductive grid of the second conductive layer 160 can be regular polygon, it is possible to for random grid.When
When the conductive grid of two conductive layers 160 is random grid, can effectively avoid interference with, thus avoid touching
Form Moire fringe on display screen 10, promote display effect.
In the present embodiment, the side of shape layer 150 light shield layer 130 dorsad offers the second grid groove 151,
Second conductive layer 160 is solidify to form by the conductive material being filled in the second grid groove 151.Concrete,
Conductive material can be metal (such as Nano Silver), CNT, Graphene, organic conductive macromolecule and ITO.
Therefore, when forming the second conductive layer 160, mould one-shot forming can be imprinted with, obtain the pattern preset,
And patterned etch need not be passed through, thus simple flow cost-effective.
Further, the degree of depth of the second grid groove 151 is more than or equal to the thickness of the second conductive layer 160.
Therefore, the second conductive layer 160 can be coated in the second grid groove 151 completely, thus can be to the second conduction
Layer 160 is formed and is effectively protected, and prevents scratch the second conductive layer 160 during follow-up laminating, and then impact
The quality of product.
In the present embodiment, the conductive thread forming the second conductive layer 160 is positioned in the projection of light shield layer 130
In gridline 131.Further, center line and the gridline of the conductive thread of the second conductive layer 160 are formed
The center line alignment of 131.Therefore, light shield layer 130 can effectively block the conductive thread of the second conductive layer 160,
Thus avoid user can see conductive thread in use and experience lf being influenced.Additionally, due to conductive thread is hidden
Gear, the width requirement hence for conductive thread is the highest, the most no more than the width of gridline 131.Cause
This, can make (the thinnest without doing) easy to make, and wider conductive thread not easy fracture, and then can promote
The reliability of two conductive layers 160.
Refer to Fig. 8, in another embodiment, at least include a conduction forming the second conductive layer 160
Silk thread, it is positioned at grid cell in the projection of light shield layer 130.Owing to the projection of conductive thread is positioned at grid
In unit, so that the conductive thread forming the second conductive layer 160 can not be formed effectively by gridline 131
Block.And in touching display screen 10, user must be made again cannot to observe conductive thread.In order to reach vision
Transparent, further, form the width of conductive thread of the second conductive layer 160 between 0.2 to 5 micron,
Distance between the grid node of the second grid cell is between 50 to 500 microns.
In the touch display screen 10 of optical filter box 100 and use optical filter box 100, optical filter box 100
Touch control operation and filtering functions can be realized simultaneously.As the combination of two assemblies indispensable in display screen,
When optical filter box 100 is used for touching in display screen 10, display screen can be directly made to have touch controllable function, it is not necessary to
Assemble a touch-screen the most on a display screen, thus advantageously reduce the thickness of electronic product.Additionally, utilize filter
When light chip module 100 preparation touches display screen, can reduce by an attaching process, thus also can save material also
Improve production efficiency.
Additionally, the present invention also provides for a kind of optical filter box preparation method.
Referring to Fig. 9, Figure 12 and Figure 13, in one embodiment, optical filter box preparation method includes step
Rapid S110～S150:
Step S110 a, it is provided that substrate, substrate include first surface and with first surface be oppositely arranged second
Surface.
Substrate plays carrying and protective effect, and light-permeable.The material of substrate and functioning as described above, therefore at this
Repeat no more.Before carrying out subsequent step, also substrate can be pre-processed, the surface of substrate is carried out
Cleaning, and make first surface ionize, thus strengthen the adhesive ability of first surface.
Step S120, forms the first conductive layer at first surface and is positioned at the side of the first conductive layer substrate dorsad
Light shield layer, light shield layer be gridline 131 intersect formed lattice-shaped structure, including multiple grid lists
Unit.
Concrete, light shield layer can be by non-transparent material such as the photoresist of band black dyes, ink and shading resins
It solidify to form at first surface.Light shield layer is intersected by a plurality of gridline 131 and is formed, including multiple
Grid cell.The region that first surface is corresponding with grid cell is not covered by non-transparent material, therefore light-permeable.
Step S130, is respectively coated with photoresist in multiple grid cells, multiple spaced to be formed
Filter unit, multiple filter units form filter layer.
The region that grid cell correspondence first surface is not covered by non-transparent material, coats photoresistance material to this region
Material so that it is just can get multiple filter unit after solidification.Photoresist is that rgb light hinders material, former according to three
Chromogen is managed, after the light mixing of different filter units, and the light of other multiple colors available.Due to
Filter unit is positioned at grid cell, therefore multiple filter units are individually separated by gridline 131.
Step S140, imprints glue in first surface coating and uses impressing mould to imprint, and makes impressing glue solid
Changing, to form the shape layer offering the second grid groove, the second grid groove is positioned at shape layer shading dorsad
The side of layer.
Concrete, first impressing glue is coated on first surface and uses impressing mould to imprint, after it solidifies,
Just can obtain offering the shape layer of the second grid groove, the second grid groove is positioned at shape layer light shield layer dorsad
Side.Wherein, light shield layer and filter layer are held between substrate and shape layer by shape layer.Impressing glue is
Transparence, does not affect the transmitance of entirety.In the present embodiment, the material of impressing glue is that solvent-free ultraviolet is solid
Changing acryl resin, its thickness is 2～10 microns.It is pointed out that in other embodiments, imprint glue
Material can also be On Visible Light Cured Resin, heat reactive resin etc..
Step S150, fills conductive material in the second grid groove and makes it solidify, to form the second conduction
Layer.
Concrete, conductive material can be metal (such as Nano Silver), CNT, Graphene, organic conductive height
Molecule and ITO.Therefore, when forming the second conductive layer, mould one-shot forming can be imprinted with, obtain pre-
If pattern, and patterned etch need not be passed through, thus simple flow.Especially when using ITO as conduction
During material, owing to without etching, therefore decreasing waste of material and then cost-effective.Additionally, use second
Grid groove forms the second conductive layer, makes conductive material be not limited to traditional ITO, thus adds conduction material
The selection face of material.
Refer to Figure 10, in one embodiment, above-mentioned steps 120 particularly as follows:
Step S121, at first surface plating conducting film or coating conductive ink, to form conductive film layer.
Step S123, in the side of conductive film layer substrate dorsad coating black light photoresist precuring, to be formed
Black photoresist layer；
Step S125, utilizes exposure-development that black photoresist layer is etched into lattice-shaped.
Concrete, the lattice-shaped i.e. shape of light shield layer.Owing to photoresist is photosensitive material, pass through exposure-development
Black photoresist layer just can be etched into lattice-shaped by technology, thus obtains light shield layer.
Step S127, is etched the conductive film layer being exposed to light shield layer, is etched into by conductive film layer and hides
Identical latticed, to obtain the first conductive layer of photosphere shape.
Use conductive material etching solution that conductive film layer is etched due to general, therefore will not produce with photoresist layer
Raw reaction.Therefore, conductive film layer, as mask layer, is etched by the gridline 131 of available light shield layer,
Conductive film layer is etched into latticed, thus obtains the first conductive layer.
In the present embodiment, during owing to conductive film layer is etched being formed the first conductive layer, use shading
Layer is as mask layer, therefore the width forming the conductive thread of the first conductive layer only have to be equal to and can not be less than shading
The width of the gridline 131 of layer.
In the present embodiment, also can be when forming the first conductive layer, to the conductive thread forming the first conductive layer
Carry out break line treatment, to obtain the first conductive unit 121 of a plurality of mutually insulated.Concrete, utilizing exposure
-development is when being etched black photoresist layer, by black photoresist layer with the first conductive layer broken string at 20
The black light photoresist of corresponding region also removes.Therefore, when with the gridline 131 of light shield layer for mask layer to leading
When electrolemma layer is etched, the first conductive layer can be divided into multiple mutually insulated, and (interval is preset each other
Distance) the first conductive unit 121.
Owing to having at identical broken string 20 on the light shield layer in the present embodiment and the first conductive layer.Therefore, hide
Photosphere is also partitioned into a plurality of spaced lattice-shaped band.In order to not affect visual effect, need to make screening
At the broken string of photosphere, 20 visions are invisible.As shown in figure 12, in the present embodiment, the first conductive layer is disconnected
Line is the breach that a width is 0.5 to 50 micron offered on conductive thread.Therefore, the grid of light shield layer
Spacing between the breakpoint of line 131 is less, is in outside visual range, thus does not interferes with visual effect.
Refer to Figure 11, in another embodiment, above-mentioned steps 120 particularly as follows:
Step S221, at first surface plating conducting film or coating conductive ink, to form conductive film layer.
Step S223, coats photoresist on conductive film layer, and precuring is to form photoresist layer, use and expose
Photoresist layer is etched into latticed by light-developing technique.
Concrete, photoresist layer is etched into identical with the conductive grid of the first conductive layer latticed.Owing to exposing
Light-development is accurately controlled, therefore is first formed by photoresist layer latticed, then using latticed photoresist layer as
Mask plate, and then be etched conductive film layer obtaining the first conductive layer.
Step S225, is etched the conductive film layer being exposed to photoresist layer, to obtain the first conductive layer,
And remove the part that photoresist layer is attached on the first conductive layer.
Ibid, general employing conductive material etching solution is etched, therefore photoresist layer will not be etched.Due to
There is the most patterned photoresist layer to do mask, thus can quickly conductive film layer be etched into latticed first
Conductive layer.After obtaining the first conductive layer, again it is exposed development, just remaining photoresist can be removed.
In the present embodiment, the first conductive layer also can be divided into the first conductive unit of a plurality of mutually insulated
121.Concrete, when photoresist layer is etched, by photoresist layer with the first conductive layer broken string at 20
The photoresist of corresponding region also removes.Therefore, when patterned photoresist layer as mask plate to conductive film layer
When being etched, the first conductive layer can be divided into multiple mutually insulated (being spaced predeterminable range each other)
The first conductive unit 121.
Step S227, coats black light photoresist precuring, to form black light photoresist on the first conductive layer
Layer, uses exposure-development technology black photoresist layer to be etched into lattice-shaped structure, to obtain light shield layer.
In the present embodiment, the width of the conductive thread forming the first conductive layer depends on the grid of photoresist layer
Width.Therefore, by controlling the precision of exposure imaging, the conductive thread etc. of formation the first conductive layer can be made
In gridline 131 width, it is possible to make the conductive thread of formation the first conductive layer less than gridline 131 width.
Additionally, due to after light shield layer is formed at the first conductive layer, the etching of the first conductive layer is not with light shield layer
Gridline 131 as mask layer.Therefore, at the gridline 131 of light shield layer and the broken string of the first conductive layer
The region of 20 correspondences can retain, so that light shield layer forms complete lattice-shaped structure.As shown in figure 13, exist
In the present embodiment, the broken string of the first conductive layer can be permutation or the disappearance of full line conductive thread, so that two
Being spaced relatively big between individual the first adjacent conductive unit 121, insulation effect is preferable.
By above-mentioned color filter preparation method, available a kind of optical filter box, this optical filter box can be simultaneously
Realize touch control operation and filtering functions.As the combination of two assemblies indispensable in display screen, this optical filtering
When chip module is used for touching in display screen, display screen can be directly made to have touch controllable function, it is not necessary to again at display screen
Upper assembling one touch-screen, thus advantageously reduce the thickness of electronic product.Additionally, the optical filter box system of utilization
During standby touch display screen, can reduce by an attaching process, thus also can save material and improve production efficiency.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (15)
1. an optical filter box, it is characterised in that including:
Substrate, including first surface and the second surface that is oppositely arranged with described first surface；
First conductive layer, is attached to described first surface, and described first conductive layer is that conductive thread intersects
The conductive grid formed, described first conductive layer includes multiple first grid cell；
Light shield layer, is positioned at the side of the described first the most described substrate of conductive layer, with by described first conductive layer
Be held between described light shield layer and described substrate, described light shield layer be gridline intersect formed grid
Shape structure, described light shield layer includes multiple grid cell, forms the conductive thread of described first conductive layer in institute
State the projection on light shield layer and be positioned at described gridline；
Filter layer, is attached to described first surface, and described filter layer includes multiple spaced filter unit,
Multiple described filter units lay respectively in the plurality of grid cell；
Shape layer, is attached on described light shield layer and described filter layer, and by described light shield layer and described optical filtering
Layer is held between described substrate and described shape layer；And
Second conductive layer, is located on described shape layer, and described second conductive layer is that conductive thread intersects shape
The conductive grid become, described second conductive layer includes multiple second grid cell；
At least including a conductive thread forming described second conductive layer, it is in the projection position of described light shield layer
In described grid cell；
Form the width of conductive thread of described second conductive layer between 0.2 to 5 micron, described second net
Distance between the grid node of lattice unit is between 50 to 500 microns.
Optical filter box the most according to claim 1, it is characterised in that described second conductive layer is embedded
In described shape layer.
Optical filter box the most according to claim 2, it is characterised in that described shape layer is away from described
The side of light shield layer offers the second grid groove, and described second conductive layer is recessed by being filled in described second grid
Conductive material in groove is formed.
Optical filter box the most according to claim 3, it is characterised in that described second grid groove
The degree of depth is more than or equal to the thickness of described second conductive layer.
Optical filter box the most according to claim 1, it is characterised in that form described first conductive layer
The width of conductive thread less than the width of described gridline.
Optical filter box the most according to claim 5, it is characterised in that the thickness of described filter layer is big
Thickness in described light shield layer.
Optical filter box the most according to claim 1, it is characterised in that form described first conductive layer
The width of conductive thread equal to the width of described gridline.
Optical filter box the most according to claim 7, it is characterised in that the thickness of described filter layer is big
Thickness sum in described light shield layer Yu described first conductive layer.
Optical filter box the most according to claim 1, it is characterised in that each described first grid list
A described filter unit is at least accommodated in the scope of unit.
Optical filter box the most according to claim 1, it is characterised in that described first conductive layer shape
The first conductive unit of a plurality of mutually insulated, described second conductive layer form a plurality of mutually insulated second is become to lead
Electric unit.
11. 1 kinds touch display screen, it is characterised in that include film crystal pipe electrode, the liquid stacked gradually
Brilliant module, as described in any one of the claims 1～10 optical filter box and upper polaroid.
12. touch display screens according to claim 11, it is characterised in that the first table of described substrate
Facing to described liquid crystal module.
13. 1 kinds of optical filter box preparation methods, it is characterised in that comprise the following steps:
A substrate, described substrate is provided to include first surface and the second table being oppositely arranged with described first surface
Face；
Form the first conductive layer at described first surface and be positioned at the one of the described first the most described substrate of conductive layer
The light shield layer of side, described light shield layer be gridline intersect formed lattice-shaped structure, including multiple grids
Unit, the region that described first surface is corresponding with the plurality of grid cell is uncovered；
It is respectively coated with photoresistance material in the region that the corresponding described first surface of the plurality of grid cell is uncovered
Material, to form multiple spaced filter unit, the plurality of filter unit forms filter layer；
Imprint glue in the coating of described first surface and use impressing mould to imprint, making described impressing adhesive curing,
To form the shape layer offering the second grid groove, described second grid groove is positioned at described shape layer dorsad
The side of described light shield layer；
In described second grid groove, fill conductive material and make it solidify, to form the second conductive layer；
Wherein, described conductive material is solidified in described second grid groove being formed conductive thread, and described second
Conductive layer be conductive thread intersect formed conductive grid, described second conductive layer includes multiple second net
Lattice unit, at least includes a conductive thread forming described second conductive layer, and it is in the throwing of described light shield layer
Shadow is positioned at described grid cell；The width of the conductive thread forming described second conductive layer is micro-between 0.2 to 5
Between meter, the distance between the grid node of described second grid cell is between 50 to 500 microns.
14. optical filter box preparation methods according to claim 13, it is characterised in that described in institute
State first surface form the first conductive layer and be positioned at the shading of side of the described first the most described substrate of conductive layer
Layer, described light shield layer be gridline intersect formed lattice-shaped structure, including the step of multiple grid cells
Rapid particularly as follows:
At described first surface plating conducting film or coating conductive ink, to form conductive film layer；
Black light photoresist precuring is coated in the side of the most described substrate of described conductive film layer, black to be formed
Look photoresist layer；
Utilize exposure-development that described black photoresist layer is etched into lattice-shaped, to obtain described light shield layer；
The conductive film layer being exposed to described light shield layer is etched, described conductive film layer is etched into described
Identical latticed, to obtain described first conductive layer of light shield layer shape.
15. optical filter box preparation methods according to claim 13, it is characterised in that described in institute
State first surface form the first conductive layer and be positioned at the shading of side of the described first the most described substrate of conductive layer
Layer, described light shield layer be gridline intersect formed lattice-shaped structure, including the step of multiple grid cells
Rapid particularly as follows:
At described first surface plating conducting film or coating conductive ink, to form conductive film layer；
Described conductive film layer coats photoresist, and precuring is to form photoresist layer, use exposure-development
Described photoresist layer is etched into latticed by technology；
The conductive film layer being exposed to described photoresist layer is etched, to obtain described first conductive layer, and
Remove the part that described photoresist layer is attached on described first conductive layer；
Described first conductive layer coats black light photoresist precuring, to form black photoresist layer, uses and expose
Described black photoresist layer is etched into lattice-shaped structure by light-developing technique, to obtain described light shield layer.
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| CN201310282575.2A CN103336622B (en) | 2013-07-05 | 2013-07-05 | Touch display screen and optical filter box thereof and this optical filter box preparation method |
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| CN103336622B true CN103336622B (en) | 2016-08-17 |
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|---|---|
| CN103336622A (en) | 2013-10-02 |
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