CN103331693A - Grinding device for realizing dynamic magnetic field processing and grinding method of grinding device - Google Patents
Grinding device for realizing dynamic magnetic field processing and grinding method of grinding device Download PDFInfo
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- CN103331693A CN103331693A CN2013102398644A CN201310239864A CN103331693A CN 103331693 A CN103331693 A CN 103331693A CN 2013102398644 A CN2013102398644 A CN 2013102398644A CN 201310239864 A CN201310239864 A CN 201310239864A CN 103331693 A CN103331693 A CN 103331693A
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Abstract
The invention discloses a grinding device for realizing dynamic magnetic field processing and a grinding method of the grinding device. According to the grinding method, dynamic magnetic field grinding is realized together by the design of the grinding device and a control strategy of a grinding path; the grinding device adopts an eccentric design, can realize dynamic variation of a magnetic field by adjusting the eccentricity of a permanent magnet and meanwhile can realize adjustment of magnetic field intensity by changing the specification of the clamped permanent magnet; the control strategy of the grinding path is based on the idea of Peano curve to achieve a uniform grinding effect, meanwhile can realize dynamic variation of the magnetic field in the grinding finish process and effectively improves the grinding finish efficiency and the uniform grinding effect.
Description
Technical field
The present invention relates to a kind of for lapping device and the Ginding process thereof of realizing dynamic magnetic field processing.
Background technology
In present magnetic grinding manufacture field, what adopt mostly is that static magnetic field carries out attrition process to surface of the work, the magnetic field of machining area is provided by a series of permanent magnets of alternately arranging, but permanent magnet is not have eccentric throw with respect to pivot, and namely the magnetic field for the surface of the work somewhere does not change in the process.And can realize magnetic particle and abrasive particle in the rambling motion of surface of the work if adopt dynamic magnetic field to grind, and then can effectively avoid the appearance of repetition track, improve the working (machining) efficiency of grinding and the uniformity of grinding effect.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of lapping device and the Ginding process thereof that can realize dynamic magnetic field processing.
In order to solve the problems of the technologies described above, the invention provides a kind of lapping device for dynamic magnetic field processing, comprise workbench and grinding head, described grinding head is made up of grinding clamp and clamping plate, be provided with permanent magnet in the described clamping plate, described grinding clamp is provided with chute, and described clamping plate are located in the chute and the state that is movably connected.
Based on the design of above-mentioned lapping device, take corresponding Ginding process as follows:
1), the design of lapping device: grinding head adopts the design of centering type, can realize the dynamic change in magnetic field by the eccentric throw of adjusting permanent magnet, and the specification of permanent magnet that simultaneously can be by changing clamping realizes the adjustment of magnetic field intensity;
2), the design of grinding track: according to the thought of Peano curve, realize the variation of the movement locus of workbench by PLC control, to reach the uniformity of grinding effect.
Adopt said structure and method, its beneficial effect is: utilize the design of lapping device and the control of grinding track to realize that jointly dynamic magnetic field grinds, grinding clamp adopts the design of centering type, can realize the dynamic change in magnetic field by the eccentric throw of adjusting clamping plate, the specification that can pass through the permanent magnet of change clamping simultaneously realizes the adjustment of magnetic field intensity, the control strategy of grinding track adopts the thought of Peano curve, to reach the uniformity of grinding effect, can realize the dynamic change in magnetic field in the attrition process process simultaneously.
Description of drawings
Fig. 1 is lapping device structural representation of the present invention;
Fig. 2 is the stereogram of the grinding head of lapping device of the present invention;
Fig. 3 is the grinding track schematic diagram of Ginding process of the present invention.
Among the figure: 1-workbench, 2-grinding head, 3-grinding clamp, 4-clamping plate, 5-permanent magnet, 6-chute.
The specific embodiment
The present invention will be further described in detail below in conjunction with accompanying drawing.
As illustrated in fig. 1 and 2, a kind of lapping device for dynamic magnetic field processing, comprise workbench 1 and grinding head 2, described grinding head 2 is made up of grinding clamp 3 and clamping plate 4, be provided with permanent magnet 5 in the described clamping plate 4, described grinding clamp 3 is provided with chute 6, described clamping plate 4 are located in the chute 6 and the state that is movably connected, the grinding head 2 of this lapping device adopts the design of centering type, can realize the dynamic change in magnetic field by the eccentric throw of adjusting permanent magnet 5, the specification of permanent magnet 5 that simultaneously can be by changing clamping realizes the adjustment of magnetic field intensity; As shown in Figure 3, the control strategy of grinding track adopts the thought of Peano curve, to reach the uniformity of grinding effect, can realize the dynamic change in magnetic field in the attrition process process simultaneously.
Claims (2)
1. one kind is used for the lapping device that dynamic magnetic field is processed, comprise workbench (1) and grinding head (2), described grinding head (2) is made up of grinding clamp (3) and clamping plate (4), be provided with permanent magnet (5) in the described clamping plate (4), it is characterized in that: described grinding clamp (3) is provided with chute (6), and described clamping plate (4) are located in the chute (6) and the state that is movably connected.
2. Ginding process of be used for realizing the lapping device of dynamic magnetic field processing is characterized in that:
1), the design of lapping device: grinding head (2) adopts the design of centering type, can realize the dynamic change in magnetic field by the eccentric throw of adjusting permanent magnet (5), and the specification of permanent magnet (5) that simultaneously can be by changing clamping realizes the adjustment of magnetic field intensity;
2), the design of grinding track: according to the thought of Peano curve, realize the variation of the movement locus of workbench (1) by PLC control, to reach the uniformity of grinding effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102398644A CN103331693A (en) | 2013-06-18 | 2013-06-18 | Grinding device for realizing dynamic magnetic field processing and grinding method of grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013102398644A CN103331693A (en) | 2013-06-18 | 2013-06-18 | Grinding device for realizing dynamic magnetic field processing and grinding method of grinding device |
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| CN103331693A true CN103331693A (en) | 2013-10-02 |
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| CN2013102398644A Pending CN103331693A (en) | 2013-06-18 | 2013-06-18 | Grinding device for realizing dynamic magnetic field processing and grinding method of grinding device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU848318A1 (en) * | 1978-06-20 | 1981-07-23 | Ленинградский Политехнический Инсти-Тут Им.M.И.Калинина | Apparatus for magnetic-abrasive working |
| JP2001150309A (en) * | 1999-11-19 | 2001-06-05 | Systemseiko Co Ltd | Grinding method and grinding device |
| CN2865999Y (en) * | 2006-01-25 | 2007-02-07 | 薛玉田 | Magnetic lapping machine |
| CN201120585Y (en) * | 2007-11-27 | 2008-09-24 | 赵殿甲 | Magnetic grinding machine |
| CN202804889U (en) * | 2012-07-20 | 2013-03-20 | 武汉理工大学 | Magnetically-adjustable magnetofluid grinding tester |
| CN202878031U (en) * | 2012-09-17 | 2013-04-17 | 辽宁科技大学 | Magnetic abrasive finishing device suitable for large plane finishing |
-
2013
- 2013-06-18 CN CN2013102398644A patent/CN103331693A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU848318A1 (en) * | 1978-06-20 | 1981-07-23 | Ленинградский Политехнический Инсти-Тут Им.M.И.Калинина | Apparatus for magnetic-abrasive working |
| JP2001150309A (en) * | 1999-11-19 | 2001-06-05 | Systemseiko Co Ltd | Grinding method and grinding device |
| CN2865999Y (en) * | 2006-01-25 | 2007-02-07 | 薛玉田 | Magnetic lapping machine |
| CN201120585Y (en) * | 2007-11-27 | 2008-09-24 | 赵殿甲 | Magnetic grinding machine |
| CN202804889U (en) * | 2012-07-20 | 2013-03-20 | 武汉理工大学 | Magnetically-adjustable magnetofluid grinding tester |
| CN202878031U (en) * | 2012-09-17 | 2013-04-17 | 辽宁科技大学 | Magnetic abrasive finishing device suitable for large plane finishing |
Non-Patent Citations (1)
| Title |
|---|
| 杜月: "机器人辅助抛光系统末端抛光工具的优化设计与轨迹规划", 《中国优秀硕士学位论文全文数据库(电子期刊)信息科技辑》, no. 5, 15 May 2011 (2011-05-15) * |
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Application publication date: 20131002 |