CN103324131A - Wafer copper film thickness on-line measuring module control system - Google Patents
Wafer copper film thickness on-line measuring module control system Download PDFInfo
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- CN103324131A CN103324131A CN2013102046912A CN201310204691A CN103324131A CN 103324131 A CN103324131 A CN 103324131A CN 2013102046912 A CN2013102046912 A CN 2013102046912A CN 201310204691 A CN201310204691 A CN 201310204691A CN 103324131 A CN103324131 A CN 103324131A
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Abstract
The invention discloses a wafer copper film thickness on-line measuring module control system. A two-stage control mode of an upper layer control system and a bottom layer control system is used, and the two layers of control system are in physical connection through an industrial Ethernet. A PLC and an on-line measuring module which is directly in charge of controlling a chemical mechanical polishing unit are used in the bottom layer control system, and a specially-used storage area for temporarily storing data collected by the measuring module in the technological process. An IPC is used in the upper layer control system, the bottom layer control system is used for monitoring the operation of the on-line measuring module, an OPC technology is used for actively reading the data in the bottom layer storage area, data processing is completed, and operating software is provided for technologists. Based on technological demands, a calibrating mode and a measuring mode are set in the wafer copper film thickness on-line measuring module control system, and a plurality of calibrating tables can be stored in a grouping mode to remove the influence of different technical formulas on measuring results. The wafer copper film thickness on-line measuring module control system has the advantages of being lossless in testing, simple in operation, convenient to maintain, good in expandability, safe and reliable.
Description
Technical field
The present invention relates to the chemical Mechanical Polishing Technique field, be specially a kind of wafer copper film thickness on-line measurement module controls system.
Background technology
Chemically mechanical polishing (Chemical Mechanical Planarization, CMP) technology is one of gordian technique of preparation multiple layer of copper interconnection structure during present integrated circuit is made.In ic manufacturing process, along with constantly dwindling of characteristic dimension, more and more higher to the requirement of overall planarization.As present the most effective overall flattening method, the CMP technology can effectively be taken into account part and global flatness, utilizes the cooperative effect of chemical corrosion and mechanical grinding to realize best polishing wafer effect.
The copper CMP process can be summarized as for three steps: the first step is removed a large amount of copper of crystal column surface with larger material removing rate, realizes preliminary planarization; Second step is removed remaining copper with the material removing rate of less, and by endpoint Detection stop process when barrier layer just all exposes; The 3rd step was removed barrier layer and a small amount of insulating layer material, reached the requirement of planarization.In polishing process, should control accurately in real time the copper film thickness of removing.If can not effectively measure the copper film thickness of crystal column surface, will cause wafer " to cross and throw " and situations such as " owing to throw ".Therefore, line Measurement Technique has important effect for copper CMP technique.
The CMP system designs for copper CMP technique, is used for removing the unnecessary copper of crystal column surface.Because in the CMP process, the polished surface of wafer is pressed on the polishing pad fully, so that on-line measurement is very difficult.In recent years, multiple On-line Measuring Method is proposed in succession in the copper CMP process, but mainly is for the CMP end point determination.From present Research both domestic and external, in all measuring techniques, optical means and based on the friction method be always research emphasis.For the copper CMP process, optical means generally judges when reach terminal point according to the variation of intensity of reflected light, but the precision that the diffraction that occurs owing to the existence of copper interconnecting line and scattering tend to affect optical measurement, so can affect the accuracy of measurement.It is generally acknowledged based on the endpoint Detection reliability of friction higher, and the endpoint Detection based on the drive motor curent change really applies in the industrial practice, but also can only in the residue of macroscopic scale reflection crystal column surface copper, can not detect in real time the variation of copper film thickness.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or provides at least a kind of useful commerce to select.For this reason, the object of the invention is to propose a kind of real-time, reliable wafer copper film thickness on-line measurement module controls system.
To achieve these goals, embodiments of the invention provide a kind of wafer copper film thickness on-line measurement module controls system, this system adopts the Two level control module of upper strata control system and bottom control system, realize physical connection by Industrial Ethernet between described upper strata control system and the bottom control system, wherein, in the described bottom control system, adopt programmable logic controller (PLC) PLC to be responsible for the directly on-line measurement module of control chemically mechanical polishing unit, in the control system of described upper strata, adopt industrial computer IPC to manage the operation of described on-line measurement module by the described PLC of bottom, and finish maintenance and the processing of data, for the technologist provides function software.
In one embodiment of the invention, described on-line measurement module is selected the electric eddy current measurement principle, sensor probe is installed in the chemically mechanical polishing dish, described sensor probe rotates with the chemically mechanical polishing deep bid during chemically mechanical polishing, cyclical movement to wafer below the time is measured, described on-line measurement module sends to described bottom control system with result of calculation by the DP bus, described technologist utilizes described upper strata control system to read in real time the one-tenth-value thickness 1/10 of the last copper film of crystal column surface, grasps copper film and removes situation.
In one embodiment of the invention, also comprise: Hall switch, the signal when utilizing Hall switch accurately to provide described sensor probe to enter measurement range with auxiliary described on-line measurement module work, guarantees that measurement data is effective.Wherein, when described sensor probe entered and leaves wafer, described Hall switch provided respectively switching signal.
In one embodiment of the invention, also comprise: value to be calibrated and the actual measurement thickness process values that the described on-line measurement module of interim storage sends is responsible in described bottom control system made memory block, and the downward calibration scale that sends of described upper strata control system, described upper strata control system can read data in the bottom memory block by the access opc server, and current measurement value is presented in real time in the software interface of described upper strata control system, make things convenient for the technologist to read.
In one embodiment of the invention, the value to be calibrated that described on-line measurement module sends and actual measurement thickness process values, and the calibration scale that described upper strata control system sends downwards can be kept among the described IPC with filename and the storing path of described technologist's appointment.
In one embodiment of the invention, be provided with calibration mode and two kinds of patterns of measurement pattern for described on-line measurement module, in described calibration mode, the technologist utilizes described upper strata Control System Software that the value to be calibrated of described on-line measurement module is corresponding one by one with the known thickness value, generate a complete calibration scale, then, the calibration scale that generates is downloaded in the on-line measurement module, wherein, but a plurality of calibration scales of described on-line measurement module packet memory are to eliminate the different process prescription to the impact of measurement result, before downloading calibration scale, the technologist need select the demarcation group, in described measurement pattern, the calibration scale that described on-line measurement module is selected according to the technologist in the CMP (Chemical Mechanical Polishing) process process calculates film thickness value, the real-time end point values contrast with current film thickness value and technologist's setting in the CMP (Chemical Mechanical Polishing) process process of described bottom control system if current film thickness value is less than or equal to setting value, is ended CMP (Chemical Mechanical Polishing) process immediately.
In one embodiment of the invention, described upper strata Control System Software comprises graphic user interface and communication module, be used for to realize the transmission of steering order, the input of parameter, and the reading, show and processing etc. of data.
In one embodiment of the invention, adopt Qt to realize the exploitation of described software graphic user interface, and utilize the mechanism of Signal/Slot, the realization interface control is related one by one with the relevant treatment function, wherein said interface control comprises QPushButton, QSpinBox/QLineEdit, QLabel and QTableWidget, wherein, the groove function of described QPushButton is used for: access OPC Server, process data and management local file in the internal memory, wherein, described QSpinBox control provides the fine setting frame, QLineEdit provides input frame, described fine setting frame is used for selecting demarcation group and measurement group, described input frame is used for described technologist and inputs the terminal point setting value, value in described fine setting frame and the input frame all can be restrained, avoid artificial mistake, wherein, described QLabel control is used for providing label, described label comprises static labels and dynamic labels, described static labels is used for explaining other controls, make things convenient for the technologist to operate, described dynamic labels is used for showing the system time, module status and communication state etc., refresh cycle is 500 milliseconds, wherein, described QTableWidget control is used for providing the table view based on item, is used for showing and editing data to be calibrated and calibration scale.
In one embodiment of the invention, ripe OPC technology is adopted in the exploitation of described communication module, described communication module is responsible for connecting and disconnecting opc server, and the access method that realizes various types of data, assists and finishes the operations that graphic user interface provides for the technologist.Wherein, described opc server links to each other with described bottom control system.Described bottom control system defines a plurality of command variables and parametric variable according to process requirements, and in strict accordance with described upper strata control system the assignment of each variable is controlled described on-line measurement module, wherein, described communication module is realized the required basic operation of OPC client in the OPC standard, described upper strata Control System Software is by communication module access opc server and downward sending controling instruction and obtain data and feedback of status in the bottom control system, thereby keep the communication with the bottom control system, wherein, opc server is installed among the described IPC, adopt the OPC self defined interface to realize the access of opc server, wherein, adopt synchronous mode for the write operation of significant data, for the write operation of the download of calibration scale, select asynchronous system, wherein, read operation is unified is the subscription formula.
As from the foregoing, control method and system according to wafer copper film thickness on-line measurement module of the present invention have the following advantages:
(1) non-destructive testing, the current vortex detection method that adopted of the present invention need not to contact crystal column surface, avoided the scuffing to crystal column surface, while is the thickness of Real-time Obtaining crystal column surface copper film online, has larger superiority, can be advantageously applied to the CMP line Measurement Technique.
(2) simple to operate, the upper strata Control System Software has good effect of visualization, makes things convenient for the technologist to operate;
(3) be convenient to safeguard, need to safeguard or hardware device need to change the time when each controlled unit of bottom control system, if the address of each variable of bottom and original function remain unchanged, need not to adjust the upper strata control system.
(4) safe and reliable, the present invention adopts the OPC technology, for normal data communication provides good assurance.
Additional aspect of the present invention and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the hardware configuration of the wafer copper film thickness on-line measurement module controls system of the embodiment of the invention;
Fig. 2 is sensor probe movement locus example in the CMP (Chemical Mechanical Polishing) process;
Fig. 3 is demarcation and the measurement procedure of the wafer copper film thickness on-line measurement module of the embodiment of the invention;
Fig. 4 is the examples of interfaces of the upper strata Control System Software of the embodiment of the invention;
Fig. 5 is that the interface function of the upper strata Control System Software of the embodiment of the invention forms;
Fig. 6 is OPC client and opc server software interactive flow process.
Embodiment
The below describes embodiments of the invention in detail, and the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, be intended to for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center "; " vertically "; " laterally "; " length "; " width "; " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of indications such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only be for convenience of description the present invention and simplified characterization, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used for describing purpose, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the invention, the implication of " a plurality of " is two or more, unless clear and definite concrete restriction is arranged in addition.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, broad understanding should be done in the terms such as term " installation ", " linking to each other ", " connection ", " fixing ", for example, can be to be fixedly connected with, and also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can indirectly link to each other by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be above-mentioned term concrete meaning in the present invention.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, can comprise that also the first and second features are not directly contacts but by the other feature contact between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that the First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic under the Second Characteristic and tiltedly, or only represent that the First Characteristic level height is less than Second Characteristic.
The present invention has aimed to provide a kind of wafer copper film thickness on-line measurement module controls system, guarantees the normal operation of measurement module, and preferably with the existing CMP system integration.
Embodiments of the invention provide a kind of wafer copper film thickness on-line measurement module controls system, adopt the Two level control module of upper strata control system and bottom control system, realize physical connection by Industrial Ethernet between upper strata control system and the bottom control system, wherein, in the bottom control system, adopt programmable logic controller (PLC) PLC to be responsible for the directly on-line measurement module of control chemically mechanical polishing unit, in the control system of upper strata, adopt industrial computer IPC by the normal operation of the PLC management on-line measurement module of bottom, and finish the processing of data, for the technologist provides function software.
Particularly, on-line measurement module controls system hardware structure of the present invention adopts " IPC (industrial computer)+PLC (programmable logic controller (PLC)) " Two level control module, referring to Fig. 1.PLC consists of bottom control system main hardware, is responsible for the directly on-line measurement module of control CMP unit.Host computer IPC consists of upper strata control system main hardware, by bottom PLC Real Time Monitoring on-line measurement module, and the normal operation of administration module, and finish the processing of data, for the technologist provides function software.Realize physical connection by Industrial Ethernet between upper strata control system and the lower floor's control system.
In one embodiment of the invention, the on-line measurement module is selected the electric eddy current measurement principle, sensor probe is installed in the chemically mechanical polishing dish, sensor probe rotates with the chemically mechanical polishing deep bid during chemically mechanical polishing, cyclical movement to wafer below the time is measured, the on-line measurement module sends to the bottom control system with result of calculation by the DP bus, and the technologist utilizes the upper strata control system to read in real time the one-tenth-value thickness 1/10 of the last copper film of crystal column surface, grasps copper film and removes situation.
In one embodiment of the invention, also comprise: the signal when utilizing Hall switch accurately to provide sensor probe to enter measurement range, with auxiliary on-line measurement module work, the assurance measurement data is effective, wherein, when sensor probe entered and leave wafer, Hall switch provided respectively switching signal.
Particularly, the used on-line measurement device of the present invention utilizes the electric eddy current measurement principle, mainly comprises the parts such as current vortex sensor, signal generator, front end circuit and calculation control unit.Sensor probe is installed in the polishing disk.During polishing, probe rotates with the polishing deep bid, and (referring to Fig. 2) measured in cyclical movement during to the wafer below.Signal generator provides working signal through front end circuit for current vortex sensor.The copper film variation in thickness signal that sensor detects is input to calculation control unit by data line through front end circuit, conducting slip ring and conduction fixed ring.Calculation control unit is according to the calculated signals that collects, and result of calculation is sent to the bottom control system by the DP bus.Guarantee simultaneously effective measurement data in order to reduce as far as possible measuring error, the present invention utilizes Hall switch accurately to provide the signal of popping one's head in when entering measurement range.When probe entered and leave wafer (position of a and b among Fig. 2), Hall switch provided respectively switching signal, and namely the angular regions between a and the b is effective measured zone.
In one embodiment of the invention, also comprise: value to be calibrated and the actual measurement thickness process values that the online measurement module of interim storage sends is responsible in bottom control system made memory block, and the downward calibration scale that sends of upper strata control system, the upper strata control system reads data in the bottom memory block by the access opc server, and current measurement value is presented in the Control System Software interface, upper strata in real time, make things convenient for the technologist to read.
In one embodiment of the invention, also comprise: after CMP (Chemical Mechanical Polishing) process finishes, the technologist is by the corresponding control in the software interface of clicking the upper strata control system, the upper strata control system is presented at data form in accordance with regulations the position of interface appointment, browses all processes data for the technologist.
In one embodiment of the invention, the value to be calibrated that the on-line measurement module sends and actual measurement thickness process values, and the control system calibration scale that sends downwards in upper strata is kept among the IPC with filename and the storing path of appointment.
Particularly, the special memory block of bottom control system made of the present invention is responsible for the data (comprising value to be calibrated and actual measurement thickness process values) of the online measurement module transmission of interim storage and the calibration scale that the upper strata control system sends downwards.In the CMP technological process, the on-line measurement module initiatively sends to the bottom control system in real time with the data that collect.The upper strata control system can initiatively read data in the bottom memory block by the access opc server, and current measurement value in time is reflected on the Control System Software interface, upper strata, makes things convenient for the technologist to read.After the CMP process finished, technologist such as need were browsed all processes data, only needed to click the corresponding control in the control interface, and system can be presented at data form in accordance with regulations the position of interface appointment automatically.All data (comprising value to be calibrated, actual measurement thickness process values and calibration scale) all can be kept in the host computer by the upper strata Control System Software, and in this process, the technologist is specified file name and storing path artificially, need not to be concerned about concrete preservation form.
In one embodiment of the invention, for the on-line measurement module calibration mode and two kinds of patterns of measurement pattern are set.In calibration mode, the technologist utilizes the software of upper strata control system can the value to be calibrated of on-line measurement module is corresponding one by one with the known thickness value, generates a complete calibration scale, then, the calibration scale that generates is downloaded in the on-line measurement module.Wherein, but a plurality of calibration scales of on-line measurement module packet memory to eliminate the different process prescription to the impact of measurement result, download calibration scale before, the technologist need select the demarcation group.In measurement pattern, the calibration scale that the on-line measurement module is selected according to the technologist in the CMP (Chemical Mechanical Polishing) process process calculates film thickness value, the bottom control system contrasts the end point values of current film thickness value and technologist's setting in the CMP (Chemical Mechanical Polishing) process process in real time, if current film thickness value is less than or equal to setting value, end immediately CMP (Chemical Mechanical Polishing) process.
Particularly, on-line measurement module controls of the present invention system is provided with and demarcates and measure two kinds of patterns.Usually, before actual measurement, need in real working condition the on-line measurement module to be demarcated, the flow process of two kinds of patterns is referring to Fig. 3.Timing signal, the technologist utilizes the Control System Software can the output valve of on-line measurement module is corresponding one by one with the known thickness value, generates a complete calibration scale.Then, the calibration scale that generates is downloaded in the on-line measurement module.But a plurality of calibration scales of on-line measurement module packet memory are to eliminate the different process prescription to the impact of measurement result.So, before downloading calibration scale, need selected demarcation group.Before the measurement, the technologist need select calibration scale (the measurement group among Fig. 4), and sets the CMP end point values.In the technological process, film thickness value can calculate according to the calibration scale that the technologist selects in system, and real-time Output rusults.Because the current vortex detection method is Real-time Obtaining crystal column surface copper film thickness online, so can according to arts demand, artificially set end point values.In the CMP process, the bottom control system contrasts current film thickness value and setting value in real time, if current film thickness value is less than or equal to setting value, ends immediately technique.
In one embodiment of the invention, the upper strata Control System Software comprises graphic user interface and communication module, be used for to realize the transmission of steering order, the input of parameter, and the reading, show and processing etc. of data.
Particularly, upper strata of the present invention Control System Software operates among the host computer IPC, mainly comprises graphic user interface and communication module.Based on process requirements, the basic function of software comprises the transmission of steering order, and the input of parameter, and the reading, show and processing etc. of data can be the technologist every routinely operation is provided.Graphic user interface is responsible for realizing control and the corresponding groove function of every basic operation.Communication module is responsible for connecting and disconnecting opc server, realizes the access method of various types of data, the auxiliary operations that graphic user interface provides for the user, such as the transmission of steering order and the input of parameter etc. finished.Lower floor's control system defines a plurality of command variables and parametric variable according to process requirements, and in strict accordance with the upper strata control system assignment of each variable is controlled online measurement module.
Fig. 4 is the simple examples at on-line measurement module controls system software interface.Such as the need expansion, this interface can utilize paging mode to manage simultaneously the on-line measurement module of a plurality of CMP unit.Major function for convenience of explanation is only take the CMP1 unit as example.Below in conjunction with examples of interfaces, specifically introduce each functional areas (referring to Fig. 5).
(1) title block: title block is used for sign dbase and system time.
(2) model selection: the pattern district is used for selecting the mode of operation of online measurement module.Click and demarcate button, select calibration mode; Click button, the State selective measurements pattern measured.
(3) status surveillance: state area is used for showing duty and the communication state of online measurement module.Wherein, the duty of module can be divided into demarcation, measures and download three states.If module and system communication are normal, communication state is shown as normally; If communication abnormality is shown as unusual.
(4) operational zone: in conjunction with normal operating process, the operational zone is used for realizing all operations weres of module, comprises the demonstration of data/open, edit, preserve and download, and the parameter of module arranges etc.
In one embodiment of the invention, adopt Qt to realize the exploitation of software graphic user interface, and utilize the mechanism of Signal/Slot, the realization interface control is related one by one with the relevant treatment function, wherein interface control comprises QPushButton, QSpinBox/QLineEdit, QLabel, and QTableWidget, wherein, the groove function of QPushButton is used for: access OPC Server, process data and management local file in the internal memory, wherein, the QSpinBox control provides the fine setting frame, QLineEdit provides input frame, the fine setting frame is used for selecting demarcation group and measurement group, input frame is used for the technologist and inputs the terminal point setting value, value in fine setting frame and the input frame all can be restrained, avoids artificial mistake, wherein, the QLabel control is used for providing label, label comprises static labels and dynamic labels, and static labels is used for explaining other controls, make things convenient for the technologist to operate, dynamic labels is used for showing the system time, module status and communication state etc., refresh cycle is 500 milliseconds, wherein, the QTableWidget control is used for providing the table view based on item, is used for showing and editing data to be calibrated and calibration scale.
Particularly, the graphic user interface of software is that technologist and on-line measurement module controls system carry out mutual sole mode.By software interface, the technologist can in time assign operations to control system, and the measurement data of simultaneously control system being obtained and module status in time feed back to the technologist, so that subsequent treatment.Qt by the exploitation of Norway TrollTech company is a C++ kit be used to developing cross-platform graphical user interface program, offers application developer and sets up the required all functions of graphic user interface.The mode that Qt uses source code level " once to write, everywhere compiling " makes up multi-platform program.Its complete object-oriented and easy the expansion, and the mechanism of Signal/Slot is provided, make the transmission of inter-module signal more safe and simple.Based on the good interface function of Qt, the present invention utilizes Qt Designer to realize the exploitation of software interface.As the central feature of Qt, the mechanism of Signal/Slot is used for the communication between object, utilizes this mechanism, can be some mutual uncomprehending object bindings together, and the realization interface control is related one by one with the relevant treatment function.The present invention has mainly used following a few class controls, and the below will introduce respectively its function and implementation method.
(1) the QPushButton:QPushButton control is used for providing order button.Order button in this interface comprises demarcation in the diagram, measures, opens, edits, preserves, download and measured value etc.By the mechanism of Signal/Slot, order button is connected the clicked signal of oneself with corresponding groove function.The technologist realizes corresponding operating by button click.Among the present invention, the groove function of QPushButton is mainly used in: 1) access OPC Server, and namely the mode by synchronous (or asynchronous) visits opc server, finishes the assignment to the bottom relevant variable; 2) process data in the internal memory, be about to data and accurately be presented at the position that the position of appointment or form in accordance with regulations are saved in appointment, so that the technologist consults at any time; 3) management local file.
(2) QSpinBox and QLineEdit:QSpinBox control provide the fine setting frame, and QLineEdit provides input frame.Fine setting frame in this interface is used for selecting demarcation group and measurement group.Input frame is used for the technologist and inputs the terminal point setting value.Value in fine setting frame and the input frame all can be restrained, avoids artificial mistake.When the value in the frame changed, control can send corresponding signal, by the mechanism of Signal/Slot, called corresponding groove function, and input value is assigned to variable corresponding to bottom.
(3) the QLabel:QLabel control is used for providing label, can be divided into static labels and dynamic labels.Static labels in this interface is used for explaining other controls, makes things convenient for the technologist to operate.Dynamic labels in this interface comprises the system time among Fig. 4, module status and communication state etc.Because system time and state need real-time update, so all operations content of this type of QLabel control all is placed in the timer of master routine.Timer constantly refreshes content in the label according to the cycle of setting.When bottom changes to dependent variable, program can be reflected in the content that is resolved on the corresponding label immediately.
QTimer*timer=new?QTimer;
connect(timer,SIGNAL(timeout()),this,SLOT(timerupdate()));
timer->start(500);
It more than is the example code about timer.Timer is a QTimer object.Every 500ms (sending the timeout signal) that crosses, program meeting Automatically invoked timerupdate function needs the content that shows in the renewal interface.
(4) the QTableWidget:QTableWidget control is used for providing the table view based on item, but the sparse array of effective expression two dimension.It can show any cell that the technologist is rolled in the dimension of regulation.When the technologist in cell during input text, QTableWidget can create a QTableWidgetItem who is used for storing text automatically.Form in this interface is used for showing and editing data to be calibrated and calibration scale.
In one embodiment of the invention, ripe OPC technology is adopted in the exploitation of communication module, has realized the required basic operation of OPC client in the OPC standard.The upper strata control system is by communication module access opc server and downward sending controling instruction and obtain data and feedback of status in the bottom control system, thereby keep the communication with the bottom control system, wherein, opc server is installed among the IPC, adopts the OPC self defined interface to realize the access of opc server, wherein, adopt synchronous mode for the write operation of significant data, for the write operation of the download of calibration scale, select asynchronous system, wherein, read operation is unified is the subscription formula.
Particularly, ripe OPC technology is adopted in the exploitation of communication module, has realized the basic operation that the OPC client possesses in the OPC standard.The upper strata control system is by the communication module access downward sending controling instruction of opc server and obtain data and feedback of status in the bottom control system, thereby keeps the communication with the bottom control system.Wherein, opc server is installed in the host computer, and system links to each other with bottom control.The present invention adopts the realization of OPC self defined interface to the access of opc server.OPC client and opc server comprise two aspects alternately: one be client from the server reading out data, one is that user end to server is write data.In the OPC standard, the data access of opc server and OPC client has three kinds of modes: synchronous, asynchronous and subscription.Three kinds of modes can realize the client read data.And user end to server is write data and is only had dual mode: synchronous write and asynchronous write.For the present invention, the write operation of significant data adopts synchronous mode, correctly arranges to guarantee each parameter, can not omit, for example the terminal point setting value.For the write operations such as download of calibration scale, select asynchronous system, to reduce the consumption of CPU and Internet resources, guarantee the real-time of system.Than the method for synchronization and asynchronous system, subscription formula data acquisition modes can reduce the number of times of client-access server effectively, simultaneously can process mass data, and farthest avoid the situation of network congestion, very large advantage is being arranged aspect the data monitoring of big data quantity.So read operation of the present invention is unified to be the subscription formula.
The software of OPC client and opc server reciprocal process realizes mainly being divided into following step (referring to Fig. 6):
(1) create also connection server object: initialization COM storehouse, create an OPC Server object, obtain pointing to the pointer variable IOPCServer of server object.
(2) interpolation group and item: utilize the IOPCServer interface to create OPC Group.By the OPCGroup object reference IOPCItemMgt interface that creates, add the OPCItem object of appointment.
(3) read-write operation of data: the value of coming each Item object among synchronous or the asynchronous write OPCGroup by the member function Write that calls IOPCSyncIO or IOPCAsyncIO2.For reading of data, the unified subscribing manner that adopts of communication module.
(4) disconnect and being connected of server: the OPC client discharges all interface pointer and also deletes successively OPCItem, OPCGroup and OPCServer object when withdrawing from.
As from the foregoing, control method and system according to wafer copper film thickness on-line measurement module of the present invention have the following advantages:
(1) non-destructive testing, the current vortex detection method that adopted of the present invention need not to contact crystal column surface, avoided the scuffing to crystal column surface, while is the thickness of Real-time Obtaining crystal column surface copper film online, has larger superiority, can be advantageously applied to the CMP line Measurement Technique.
(2) simple to operate, the user interface of the IPC of upper strata supervisory system has good effect of visualization, makes things convenient for the technologist to operate;
(3) be convenient to safeguard, need to safeguard or hardware device need to change the time when each controlled unit of bottom control system, if the address of each variable of bottom and original function remain unchanged, need not to adjust the upper strata control system.
(4) safe and reliable, the present invention adopts the OPC technology, for normal data communication provides good assurance.
Describe and to be understood in the process flow diagram or in this any process of otherwise describing or method, expression comprises module, fragment or the part of code of the executable instruction of the step that one or more is used to realize specific logical function or process, and the scope of preferred implementation of the present invention comprises other realization, wherein can be not according to order shown or that discuss, comprise according to related function by the mode of basic while or by opposite order, carry out function, this should be understood by the embodiments of the invention person of ordinary skill in the field.
In the description of this instructions, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or the example in conjunction with specific features, structure, material or the characteristics of this embodiment or example description.In this manual, the schematic statement of above-mentioned term not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or characteristics can be with suitable mode combinations in any one or more embodiment or example.
Although the above has illustrated and has described embodiments of the invention, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art is not in the situation that break away from principle of the present invention and aim can change above-described embodiment within the scope of the invention, modification, replacement and modification.
Claims (9)
1. wafer copper film thickness on-line measurement module controls system, it is characterized in that, adopt the Two level control module of upper strata control system and bottom control system, realize physical connection by Industrial Ethernet between described upper strata control system and the bottom control system, wherein
In the described bottom control system, adopt programmable logic controller (PLC) PLC to be responsible for directly controlling the on-line measurement module of chemically mechanical polishing unit,
In the control system of described upper strata, adopt industrial computer IPC to manage the operation of described on-line measurement module by the described PLC of bottom, and finish maintenance and the processing of data, for the technologist provides function software.
2. wafer copper film thickness on-line measurement module controls as claimed in claim 1 system, it is characterized in that, described on-line measurement module is selected the electric eddy current measurement principle, sensor probe is installed in the chemically mechanical polishing dish, described sensor probe rotates with the chemically mechanical polishing deep bid during chemically mechanical polishing, cyclical movement to wafer below the time is measured, described on-line measurement module sends to described bottom control system with result of calculation by the DP bus, described technologist utilizes described upper strata control system to read in real time the one-tenth-value thickness 1/10 of the last copper film of crystal column surface, grasps copper film and removes situation.
3. wafer copper film thickness on-line measurement module controls as claimed in claim 2 system, it is characterized in that, also comprise: Hall switch, signal when utilizing Hall switch accurately to provide described sensor probe to enter measurement range, with auxiliary described on-line measurement module work, guarantee that measurement data is effective.Wherein, when described sensor probe entered and leaves wafer, described Hall switch provided respectively switching signal.
4. wafer copper film thickness on-line measurement module controls as claimed in claim 1 system, it is characterized in that, also comprise: value to be calibrated and the actual measurement thickness process values that the described on-line measurement module of interim storage sends is responsible in described bottom control system made memory block, and the downward calibration scale that sends of described upper strata control system, described upper strata control system can read data in the bottom memory block by the access opc server, and current measurement value is presented in real time in the software interface of described upper strata control system, make things convenient for the technologist to read.
5. wafer copper film thickness on-line measurement module controls as claimed in claim 4 system, it is characterized in that, the value to be calibrated that described on-line measurement module sends and actual measurement thickness process values, and the calibration scale that described upper strata control system sends downwards can be kept among the described IPC with filename and the storing path of described technologist's appointment.
6. wafer copper film thickness on-line measurement module controls as claimed in claim 1 system is characterized in that, is provided with calibration mode and two kinds of patterns of measurement pattern for described on-line measurement module,
In described calibration mode, the technologist utilizes described upper strata Control System Software that the value to be calibrated of described on-line measurement module is corresponding one by one with the known thickness value, generate a complete calibration scale, then, the calibration scale that generates is downloaded in the on-line measurement module, wherein, but a plurality of calibration scales of described on-line measurement module packet memory are to eliminate the different process prescription to the impact of measurement result, before downloading calibration scale, the technologist need select the demarcation group
In described measurement pattern, the calibration scale that described on-line measurement module is selected according to the technologist in the CMP (Chemical Mechanical Polishing) process process calculates film thickness value, the real-time end point values contrast with current film thickness value and technologist's setting in the CMP (Chemical Mechanical Polishing) process process of described bottom control system, if current film thickness value is less than or equal to setting value, end immediately CMP (Chemical Mechanical Polishing) process.
7. wafer copper film thickness on-line measurement module controls as claimed in claim 1 system, it is characterized in that, described upper strata Control System Software comprises graphic user interface and communication module, is used for realizing the transmission of steering order, the input of parameter, and the reading, show and processing etc. of data.
8. wafer copper film thickness on-line measurement module controls as claimed in claim 7 system, it is characterized in that, adopt Qt to realize the exploitation of described software graphic user interface, and utilize the mechanism of Signal/Slot, the realization interface control is related one by one with the relevant treatment function
Wherein said interface control comprises QPushButton, QSpinBox/QLineEdit, and QLabel and QTableWidget,
Wherein, the groove function of described QPushButton is used for: access OPC Server, the data of processing internal memory and management local file,
Wherein, described QSpinBox control provides the fine setting frame, and QLineEdit provides input frame, described fine setting frame is used for selecting demarcation group and measurement group, and described input frame is used for described technologist and inputs the terminal point setting value, and the value in described fine setting frame and the input frame all can be restrained, avoid artificial mistake
Wherein, described QLabel control is used for providing label, described label comprises static labels and dynamic labels, described static labels be used for explaining other controls, make things convenient for the technologist to operate, described dynamic labels is used for showing the system time, module status and communication state etc., refresh cycle is 500 milliseconds
Wherein, described QTableWidget control is used for providing the table view based on item, is used for showing and editing data to be calibrated and calibration scale.
9. wafer copper film thickness on-line measurement module controls as claimed in claim 7 system, it is characterized in that, ripe OPC technology is adopted in the exploitation of described communication module, described communication module is responsible for connecting and disconnecting opc server, and the access method that realizes various types of data, assist and finish the operations that graphic user interface provides for the technologist.Wherein, described opc server links to each other with described bottom control system.Described bottom control system defines a plurality of command variables and parametric variable according to process requirements, and in strict accordance with described upper strata control system the assignment of each variable is controlled described on-line measurement module,
Wherein, described communication module is realized the required basic operation of OPC client in the OPC standard, described upper strata Control System Software is by communication module access opc server and downward sending controling instruction and obtain data and feedback of status in the bottom control system, thereby keep the communication with the bottom control system
Wherein, opc server is installed among the described IPC, adopts the OPC self defined interface to realize the access of opc server,
Wherein, adopt synchronous mode for the write operation of significant data, for the write operation of the download of calibration scale, select asynchronous system,
Wherein, read operation is unified is the subscription formula.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104678289A (en) * | 2015-02-13 | 2015-06-03 | 上海华岭集成电路技术股份有限公司 | Method for calibrating setting values and measurement values in shmoo test |
| CN106197249A (en) * | 2016-09-30 | 2016-12-07 | 天津华海清科机电科技有限公司 | Copper layer thickness on-line measurement system and control method thereof during CMP |
| CN106289040A (en) * | 2016-09-30 | 2017-01-04 | 天津华海清科机电科技有限公司 | Calibration system for wafer copper layer thickness multimetering |
| CN106323152A (en) * | 2016-09-05 | 2017-01-11 | 天津华海清科机电科技有限公司 | Off-line segmentation processing method and system for CMP (Chemical Mechanical Planarization) metal film thickness measurement data |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) * | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5647952A (en) * | 1996-04-01 | 1997-07-15 | Industrial Technology Research Institute | Chemical/mechanical polish (CMP) endpoint method |
| CN1447396A (en) * | 2002-03-21 | 2003-10-08 | 三星电子株式会社 | Chemical mechanical polishing appts. and its control method |
| CN2747793Y (en) * | 2004-10-27 | 2005-12-21 | 蔡仲伦 | Industrial controlled network appts. based on tandem server |
| CN201490163U (en) * | 2009-05-27 | 2010-05-26 | 中国电子科技集团公司第四十八研究所 | On-line end-point detection system for chemical and mechanical polishing device |
| CN102049733A (en) * | 2010-07-26 | 2011-05-11 | 清华大学 | Eddy current metal film thickness end point detection device |
| CN102278967A (en) * | 2011-03-10 | 2011-12-14 | 清华大学 | Thickness measuring device and method of polishing solution and chemically mechanical polishing equipment |
| CN102445144A (en) * | 2011-09-22 | 2012-05-09 | 清华大学 | Calibrating method and device for online membrane thickness measuring system |
-
2013
- 2013-05-28 CN CN201310204691.2A patent/CN103324131B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) * | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5647952A (en) * | 1996-04-01 | 1997-07-15 | Industrial Technology Research Institute | Chemical/mechanical polish (CMP) endpoint method |
| CN1447396A (en) * | 2002-03-21 | 2003-10-08 | 三星电子株式会社 | Chemical mechanical polishing appts. and its control method |
| CN2747793Y (en) * | 2004-10-27 | 2005-12-21 | 蔡仲伦 | Industrial controlled network appts. based on tandem server |
| CN201490163U (en) * | 2009-05-27 | 2010-05-26 | 中国电子科技集团公司第四十八研究所 | On-line end-point detection system for chemical and mechanical polishing device |
| CN102049733A (en) * | 2010-07-26 | 2011-05-11 | 清华大学 | Eddy current metal film thickness end point detection device |
| CN102278967A (en) * | 2011-03-10 | 2011-12-14 | 清华大学 | Thickness measuring device and method of polishing solution and chemically mechanical polishing equipment |
| CN102445144A (en) * | 2011-09-22 | 2012-05-09 | 清华大学 | Calibrating method and device for online membrane thickness measuring system |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104678289A (en) * | 2015-02-13 | 2015-06-03 | 上海华岭集成电路技术股份有限公司 | Method for calibrating setting values and measurement values in shmoo test |
| CN106323152A (en) * | 2016-09-05 | 2017-01-11 | 天津华海清科机电科技有限公司 | Off-line segmentation processing method and system for CMP (Chemical Mechanical Planarization) metal film thickness measurement data |
| CN106323152B (en) * | 2016-09-05 | 2018-10-02 | 清华大学 | The offline segment processing method and processing system of CMP metal film thickness measurement data |
| CN106289040B (en) * | 2016-09-30 | 2019-11-22 | 清华大学 | Calibration system for wafer copper layer thickness multimetering |
| CN106197249A (en) * | 2016-09-30 | 2016-12-07 | 天津华海清科机电科技有限公司 | Copper layer thickness on-line measurement system and control method thereof during CMP |
| CN106289040A (en) * | 2016-09-30 | 2017-01-04 | 天津华海清科机电科技有限公司 | Calibration system for wafer copper layer thickness multimetering |
| CN106737122A (en) * | 2016-12-28 | 2017-05-31 | 武汉新芯集成电路制造有限公司 | A kind of grinding control method and grinding wafer system |
| CN110044249A (en) * | 2019-04-30 | 2019-07-23 | 清华大学 | A kind of film thickness measuring method, system and chemical mechanical polishing apparatus |
| CN110207584A (en) * | 2019-04-30 | 2019-09-06 | 清华大学 | A kind of film thickness measuring method, system and chemical mechanical polishing apparatus |
| CN110044249B (en) * | 2019-04-30 | 2020-09-15 | 清华大学 | Film thickness measuring method and system and chemical mechanical polishing device |
| CN110207584B (en) * | 2019-04-30 | 2020-12-04 | 清华大学 | Film thickness measuring method and system and chemical mechanical polishing device |
| CN110823165A (en) * | 2019-11-19 | 2020-02-21 | 文登恒润锻造有限公司 | Platform, method and device for measuring straightness of forged crankshaft blank and electronic equipment |
| CN110823165B (en) * | 2019-11-19 | 2022-03-25 | 文登恒润锻造有限公司 | Platform, method and device for measuring straightness of forged crankshaft blank and electronic equipment |
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