CN103311137A - Automatic supply equipment for solder ball positioning in high-density chip packaging - Google Patents
Automatic supply equipment for solder ball positioning in high-density chip packaging Download PDFInfo
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- CN103311137A CN103311137A CN2012100576178A CN201210057617A CN103311137A CN 103311137 A CN103311137 A CN 103311137A CN 2012100576178 A CN2012100576178 A CN 2012100576178A CN 201210057617 A CN201210057617 A CN 201210057617A CN 103311137 A CN103311137 A CN 103311137A
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- upset
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Abstract
The invention relates to a piece of automatic supply equipment for solder ball positioning in high-density chip packaging. The equipment comprises a large bottom plate, two support plates, two turning shafts, two turning support plates, a turning power transmission device, a working platform, a solder ball fixture and a ball box device, wherein the large bottom plate is arranged at the bottom of the equipment, the two support plates are respectively fixed at left and right sides of the large bottom plate, the two turning shafts are respectively connected with the two support plates, the two turning support plates are respectively fixed on the two turning shafts, the turning power transmission device is connected with one of the turning shafts, the working platform is fixed on the two turning support plates, the solder ball fixture is fixed on the upper surface of the working platform, and the ball box device is arranged above the solder ball fixture. Compared with the prior art, the automatic supply equipment has the advantages of large solder ball supply quantity, high solder ball supply accuracy, little damage to solder balls, high supply speed and the like.
Description
Technical field
The present invention relates to a kind of supply arrangement, especially relate to a kind of superchip packaging solder ball location auto supply equipment.
Background technology
Soldered ball is located supply mode automatically and mainly contained two kinds at present: vibrating disc supplies with soldered ball and traditional soldered ball ball box is supplied with soldered ball, wherein vibrating disc supply soldered ball quantity delivered is little, and it is longer to supply with the soldered ball time, and traditional soldered ball ball box is supplied with the situation that can occur damaging soldered ball in the soldered ball supply process.
Summary of the invention
Purpose of the present invention is exactly to provide a kind of quantity delivered big for the defective that overcomes above-mentioned prior art existence, supplies with soldered ball accuracy rate height, fireballing superchip packaging solder ball location auto supply equipment.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of superchip packaging solder ball location auto supply equipment, comprise the big plate in bottom, supporting bracket, trip shaft, the upset supporting bracket, the upset actuating unit, workbench, soldered ball tool and ball box device, the big plate in described bottom is arranged on the bottom of this equipment, described supporting bracket is provided with two, be separately fixed at the left and right sides of the big plate in bottom, described trip shaft is provided with two, be connected with two supporting brackets respectively, described upset supporting bracket is provided with two, be separately fixed on two trip shafts, described upset actuating unit links to each other with one of them trip shaft, described workbench is fixed on two upset supporting brackets, described soldered ball tool is fixed on the workbench upper surface, and described ball box device is arranged on soldered ball tool top.
Described upset actuating unit comprises upset motor, first belt, upset driving pulley, upset driven pulley and tension pulley, described upset motor is fixed therein in the supporting bracket and surveys, described upset driving pulley, upset driven pulley and tension pulley are arranged on the outside of same supporting bracket, the upset driving pulley is connected by first belt with the upset driven pulley, tension pulley is arranged on first belt outside, and described upset motor drives the trip shaft upset by upset driving pulley and upset driven pulley.
Be provided with vacuum chamber in the described workbench, vacuum chamber is connected with external vacuum equipment by vacuum interface.
Described soldered ball tool is provided with the soldered ball inlet hole, and this soldered ball inlet hole penetrates the soldered ball tool and is connected with the vacuum chamber of workbench.
Described ball box device comprises ball box body, line slideway, soldered ball detecting sensor and power drive system, described line slideway is provided with two, be separately fixed on the workbench, described ball box body is fixed on two line slideways, and a side of ball box body is provided with three assembly welding ball detecting sensors.
In the described three assembly welding ball detecting sensors, the first soldered ball detecting sensor and the 3rd soldered ball detecting sensor are to detect the transducer whether outstanding soldered ball tool upper surface of soldered ball is arranged, and the second soldered ball detecting sensor is to detect the transducer of soldered ball storage in the ball box body.
Described power drive system comprises ball box driving motor, second belt, the ball box moves driving pulley, the ball box moves driven pulley, the ball box moves the back limit sensor and the ball box moves preceding limit sensor, described ball box driving motor is fixed on the workbench, be arranged on the outside of ball box body, described ball box moves driving pulley and is arranged on the ball box driving motor, the ball box moves driving pulley and moves driven pulley with the ball box and be connected by second belt, ball box driving motor moves driving pulley by the ball box and the ball box moves moving forward and backward of driven pulley control ball box body, limit sensor and ball box moved the back limit sensor and are separately positioned on the ball box and move the below that driving pulley and ball box move driven pulley before described ball box moved, and limit sensor and ball box moved the scope that moves back and forth of back limit sensor restriction ball box body before the ball box moved.
Gap between described ball box body base plane and the soldered ball tool upper surface is 1/4 of soldered ball diameter.
When superchip packaging solder ball location auto supply equipment carries out the soldered ball supply, workbench and soldered ball tool are in level, the ball box body rests on the oblique upper position of soldered ball tool, in the ball box body, feed a large amount of soldered balls, when triggering the second soldered ball detecting sensor, namely stop in the ball box body, supplying with soldered ball.Open start button, upset driven by motor workbench and the soldered ball tool angle of setting of overturning clockwise is 15 °-30 °, make workbench keep heeling condition, ball box driving motor drives the ball box body by drive system and moves to the direction of overturning, the interior soldered ball of ball box body is followed the ball box body and is moved together, in the time of above through the soldered ball tool, external vacuum equipment is inhaled vacuum, produce gravitation, by soldered ball gravity and sorptive force double action the soldered ball through soldered ball tool top is sucked in the corresponding soldered ball inlet hole.The ball box body is in mobile process, the first soldered ball detecting sensor detects the soldered ball whether outstanding soldered ball tool upper surface is arranged, if there is soldered ball to protrude from the upper surface of soldered ball tool, will trigger the first soldered ball detecting sensor, the ball box body is with regard to stop motion, and operating personnel check and the eliminating problem; If there is not soldered ball to give prominence to soldered ball tool upper surface, then continue operation, so just avoid cut effectively, hindered the ball phenomenon, promote yields.When the trigger ball box moves the back during limit sensor, the ball box body stops mobile, and the upset motor drives overturn counterclockwise 2 times of angles of set angle of workbench and soldered ball tool by drive system, makes workbench keep heeling condition.The ball box body is mobile round about under the drive of ball box driving motor, the interior soldered ball of ball box is also followed the ball box body and is moved together, in the time of above through the soldered ball tool, if also have the soldered ball inlet hole not suck soldered ball, then external vacuum equipment is inhaled vacuum, produce gravitation, under gravity and sorptive force double action, suck soldered ball in the soldered ball inlet hole position of vacancy.The ball box body is in mobile process, the 3rd soldered ball detecting sensor detects the soldered ball whether outstanding soldered ball tool upper surface is arranged simultaneously, if the upper surface of the outstanding soldered ball tool of soldered ball is arranged, will trigger the 3rd soldered ball detecting sensor, the ball box body is with regard to stop motion, and operating personnel check queueing problem; If there is not soldered ball to give prominence to soldered ball tool upper surface, then continue operation, so also avoid cut effectively, hindered the ball phenomenon, promote yields.During limit sensor, the ball box body stops mobile before the trigger ball box moves, and the upset motor drives the angle that workbench and soldered ball tool overturn clockwise and set by drive system, makes workbench keep level, carries out ensuing absorption soldered ball action.
Compared with prior art, the superchip packaging solder ball location auto supply equipment of the present invention's design has the following advantages:
1. the present invention utilizes the reciprocal upset of soldered ball tool and the reciprocating motion of soldered ball ball box, can shorten for the ball activity duration, promotes operating efficiency.
2. because this equipment is provided with the soldered ball detecting sensor, to detect soldered ball tool upper surface whether remaining soldered ball is arranged, and inform that accordingly the staff is handled, effectively avoid the cut or cut part of bad soldered ball to resupply, improve the acceptance rate of product.
3. because this equipment is provided with the soldered ball detecting sensor, with detection soldered ball tool upper surface whether remaining soldered ball is arranged, and inform that accordingly the staff is handled, thereby can guarantee that avoiding adsorbing mould presses down the situation generation of damage tool accidentally when adsorbing soldered ball.
4. superchip packaging solder ball location auto supply equipment supply soldered ball quantity is the highest can once provide 50,000 balls, supplies with soldered ball accuracy rate height, and speed is fast.
Description of drawings
Fig. 1 is perspective view of the present invention;
Fig. 2 is backsight structural representation of the present invention;
Fig. 3 is plan structure schematic diagram of the present invention;
Fig. 4 is right TV structure schematic diagram of the present invention;
Fig. 5 is left TV structure schematic diagram of the present invention;
Fig. 6 is horizontal balance plan structure schematic diagram of the present invention;
Fig. 7 is clockwise rotary movement schematic diagram of the present invention;
Fig. 8 is counterclockwise rotary movement schematic diagram of the present invention;
Fig. 9 is horizontal balance schematic diagram of the present invention.
1 is the big plate in bottom among the figure, 2 are the upset motor, 3 is supporting bracket, 4 is trip shaft, 5 are the upset supporting bracket, 6 is workbench, 7 is the ball box body, 8 is ball box driving motor, 9 is the first soldered ball detecting sensor, 10 is the second soldered ball detecting sensor, 11 is the 3rd soldered ball detecting sensor, 12 is line slideway, 13 is the soldered ball tool, 14 is the soldered ball inlet hole, 15 is first belt, 16 are the upset driving pulley, 17 are the upset driven pulley, 18 is tension pulley, 19 is second belt, 20 move driving pulley for the ball box, 21 move driven pulley for the ball box, 22 move preceding limit sensor for the ball box, 23 for the ball box move the back limit sensor, 24 is soldered ball, 25 is vacuum interface.
Embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
Embodiment
A kind of superchip packaging solder ball location auto supply equipment, its perspective view as shown in Figure 1.Comprise the big plate 1 in bottom, supporting bracket 3, trip shaft 4, upset supporting bracket 5, upset actuating unit, workbench 6, soldered ball tool 13 and ball box device.
As shown in Figure 2, the big plate 1 in bottom is arranged on the bottom of this equipment, supporting bracket 3 is provided with two, be separately fixed at the left and right sides of the big plate 1 in bottom, trip shaft 4 is provided with two, is connected with two supporting brackets 3 respectively, upset supporting bracket 5 is provided with two, be separately fixed on two trip shafts 4, the upset actuating unit links to each other with one of them trip shaft 4, and workbench 6 is fixed on two upset supporting brackets 5.
Soldered ball tool 13 is fixed on workbench 6 upper surfaces, and the ball box body is arranged on soldered ball tool 13 tops.Soldered ball tool 13 is provided with soldered ball inlet hole 14, and this soldered ball inlet hole 14 penetrates soldered ball tool 13 and is connected with the vacuum chamber of workbench 6, as shown in Figure 3.
The upset actuating unit comprises upset motor 2, first belt 15, upset driving pulley 16, upset driven pulley 17 and tension pulley 18, its structural representation as shown in Figure 4, upset motor 2 is fixed therein in the supporting bracket 3 to be surveyed, upset driving pulley 16, upset driven pulley 17 and tension pulley 18 are arranged on the outside of same supporting bracket 3, upset driving pulley 16 is connected by first belt with upset driven pulley 17, tension pulley 18 is arranged on first belt, 15 outsides, and upset motor 2 drives trip shaft 4 upsets by upset driving pulley 16 and upset driven pulley 17.
Be provided with vacuum chamber in the workbench 6, vacuum chamber is connected with external vacuum equipment by vacuum interface 25.
The ball box device comprises ball box body 7, line slideway 12, soldered ball detecting sensor and power drive system, described line slideway 12 is provided with two, be separately fixed on the workbench 6, described ball box body 7 is fixed on two line slideways 12, one side of ball box body 7 is provided with three assembly welding ball detecting sensors, as shown in Figure 3.
In the three assembly welding ball detecting sensors, the first soldered ball detecting sensor 9 and the 3rd soldered ball detecting sensor 11 are to detect the transducer whether soldered ball 24 outstanding soldered ball tool 13 upper surfaces are arranged, and the second soldered ball detecting sensor 10 is to detect the transducer of soldered ball 24 storages in the ball box body 7.
Power drive system comprises ball box driving motor 8, second belt 19, the ball box moves driving pulley 20, the ball box moves driven pulley 21, the ball box moves back limit sensor 23 and the ball box moves preceding limit sensor 22, its structural representation as shown in Figure 5, ball box driving motor 8 is fixed on the workbench 6, be arranged on the outside of ball box body 7, the ball box moves driving pulley 20 and is arranged on the ball box driving motor 8, the ball box moves driving pulley 20 and moves driven pulley 21 with the ball box and be connected by second belt 19, ball box driving motor 8 moves driving pulley 20 by the ball box and moves moving forward and backward of driven pulley 21 control ball box bodies 7 with the ball box, limit sensor 22 and ball box moved back limit sensor 23 and are separately positioned on the ball box and move the below that driving pulley 20 and ball box move driven pulley 21 before the ball box moved, and limit sensor 22 and ball box moved the scope that moves back and forth that back limit sensor 23 limits ball box bodies 7 before the ball box moved.
Gap between ball box body 7 base plane and soldered ball tool 13 upper surfaces is 1/4 of soldered ball diameter, in general, gap between ball box body 7 base plane and soldered ball tool 13 upper surfaces is 0.1mm at soldered ball 24 diameters during less than 0.3mm, during greater than 0.3mm, this gap is between 0.1mm～0.3mm at the soldered ball diameter.
When superchip packaging solder ball location auto supply equipment carries out the soldered ball supply, workbench 6 and soldered ball tool 13 are in level, ball box body 7 rests on the oblique upper position of soldered ball tool 13, in ball box body 7, feed a large amount of soldered balls 24, when triggering the second soldered ball detecting sensor 10, namely stop in ball box body 7, supplying with soldered ball 24, as shown in Figure 6.
Open start button, 15 °-30 ° of the angles that upset motor 2 drive workbenches 6 and the 13 clockwise upsets of soldered ball tool are set, make workbench 6 keep heeling condition, ball box driving motor 8 drives ball box body 7 by drive system and moves to the direction of overturning, ball box body 7 interior soldered balls 24 are followed ball box body 7 and are moved together, in the time of above through soldered ball tool 13, external vacuum equipment is inhaled vacuum, produce gravitation, by soldered ball gravity and sorptive force double action the soldered ball 24 through soldered ball tool 13 tops is sucked in the corresponding soldered ball inlet hole 14.Ball box body 7 is in mobile process, the first soldered ball detecting sensor 9 detects the soldered ball 24 whether outstanding soldered ball tool 13 upper surfaces are arranged, if there is soldered ball 24 to protrude from the upper surface of soldered ball tool 13, will trigger the first soldered ball detecting sensor 9, ball box body 7 is with regard to stop motion, and operating personnel check and the eliminating problem; If there are not soldered ball 24 outstanding soldered ball tool 13 upper surfaces, then continue operation, so just avoid cut effectively, hindered the ball phenomenon, promote yields.When the trigger ball box moved back limit sensor 23, ball box body 7 stopped mobile, and upset motor 2 makes workbench 6 keep heeling condition by 2 times of angles of drive system drive workbench 6 and soldered ball tool 13 counterclockwise upset set angles.Ball box body 7 is mobile round about under the drive of ball box driving motor 8, ball box body 7 interior soldered balls 24 are also followed ball box body 7 and are moved together, in the time of above through soldered ball tool 13, if also have soldered ball inlet hole 14 not suck soldered ball 24, then external vacuum equipment is inhaled vacuum, produce gravitation, under gravity and sorptive force double action, suck soldered ball 24 in soldered ball inlet hole 13 positions of vacancy.Ball box body 7 is in mobile process, the 3rd soldered ball detecting sensor 11 detects the soldered ball 24 whether outstanding soldered ball tool 13 upper surfaces are arranged simultaneously, if the upper surface of soldered ball 24 outstanding soldered ball tools 13 is arranged, will trigger the 3rd soldered ball detecting sensor 11, ball box body 7 is with regard to stop motion, and operating personnel check queueing problem; If there are not soldered ball 24 outstanding soldered ball tool 13 upper surfaces, then continue operation, so also avoid cut effectively, hindered the ball phenomenon, promote yields.Before the trigger ball box moves during limit sensor 22, ball box body 7 stops mobile, upset motor 2 drives workbench 6 and the soldered ball tool 13 clockwise angles of overturning and setting by drive system, makes workbench 6 keep level, carries out ensuing absorption soldered ball action.
In the above-mentioned superchip encapsulation location soldered ball auto supply equipment course of work, the schematic diagram that superchip encapsulation location soldered ball auto supply equipment is done clockwise rotary movement as shown in Figure 7, the schematic diagram that superchip encapsulation location soldered ball auto supply equipment is done counterclockwise rotary movement as shown in Figure 8, the action schematic diagram when superchip encapsulation location soldered ball auto supply equipment horizontal direction moves is as shown in Figure 9.
Claims (8)
1. a superchip packaging solder ball is located auto supply equipment, it is characterized in that, this equipment comprises the big plate in bottom, supporting bracket, trip shaft, the upset supporting bracket, the upset actuating unit, workbench, soldered ball tool and ball box device, the big plate in described bottom is arranged on the bottom of this equipment, described supporting bracket is provided with two, be separately fixed at the left and right sides of the big plate in bottom, described trip shaft is provided with two, be connected with two supporting brackets respectively, described upset supporting bracket is provided with two, be separately fixed on two trip shafts, described upset actuating unit links to each other with one of them trip shaft, described workbench is fixed on two upset supporting brackets, and described soldered ball tool is fixed on the workbench upper surface, and described ball box device is arranged on soldered ball tool top.
2. a kind of superchip packaging solder ball according to claim 1 is located auto supply equipment, it is characterized in that, described upset actuating unit comprises the upset motor, first belt, the upset driving pulley, upset driven pulley and tension pulley, described upset motor is fixed therein in the supporting bracket and surveys, described upset driving pulley, upset driven pulley and tension pulley are arranged on the outside of same supporting bracket, the upset driving pulley is connected by first belt with the upset driven pulley, tension pulley is arranged on first belt outside, and described upset motor drives the trip shaft upset by upset driving pulley and upset driven pulley.
3. a kind of superchip packaging solder ball according to claim 1 is located auto supply equipment, it is characterized in that be provided with vacuum chamber in the described workbench, vacuum chamber is connected with external vacuum equipment by vacuum interface.
4. a kind of superchip packaging solder ball according to claim 1 is located auto supply equipment, it is characterized in that described soldered ball tool is provided with the soldered ball inlet hole, and this soldered ball inlet hole penetrates the soldered ball tool and is connected with the vacuum chamber of workbench.
5. a kind of superchip packaging solder ball according to claim 1 is located auto supply equipment, it is characterized in that, described ball box device comprises ball box body, line slideway, soldered ball detecting sensor and power drive system, described line slideway is provided with two, be separately fixed on the workbench, described ball box body is fixed on two line slideways, and a side of ball box body is provided with three assembly welding ball detecting sensors.
6. a kind of superchip packaging solder ball according to claim 5 is located auto supply equipment, it is characterized in that, in the described three assembly welding ball detecting sensors, the first soldered ball detecting sensor and the 3rd soldered ball detecting sensor are to detect the transducer whether outstanding soldered ball tool upper surface of soldered ball is arranged, and the second soldered ball detecting sensor is to detect the transducer of soldered ball storage in the ball box body.
7. a kind of superchip packaging solder ball according to claim 5 is located auto supply equipment, it is characterized in that, described power drive system comprises ball box driving motor, second belt, the ball box moves driving pulley, the ball box moves driven pulley, the ball box moves the back limit sensor and the ball box moves preceding limit sensor, described ball box driving motor is fixed on the workbench, be arranged on the outside of ball box body, described ball box moves driving pulley and is arranged on the ball box driving motor, the ball box moves driving pulley and moves driven pulley with the ball box and be connected by second belt, ball box driving motor moves driving pulley by the ball box and the ball box moves moving forward and backward of driven pulley control ball box body, limit sensor and ball box moved the back limit sensor and are separately positioned on the ball box and move the below that driving pulley and ball box move driven pulley before described ball box moved, and limit sensor and ball box moved the scope that moves back and forth of back limit sensor restriction ball box body before the ball box moved.
8. a kind of superchip packaging solder ball according to claim 1 is located auto supply equipment, it is characterized in that the gap between described ball box body base plane and the soldered ball tool upper surface is 1/4 of soldered ball diameter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210057617.8A CN103311137B (en) | 2012-03-06 | 2012-03-06 | A kind of superchip packaging solder ball location auto supply equipment |
| HK13113265.6A HK1186002A1 (en) | 2012-03-06 | 2013-11-27 | A high density package solder ball location automatic supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210057617.8A CN103311137B (en) | 2012-03-06 | 2012-03-06 | A kind of superchip packaging solder ball location auto supply equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103311137A true CN103311137A (en) | 2013-09-18 |
| CN103311137B CN103311137B (en) | 2015-10-28 |
Family
ID=49136212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210057617.8A Active CN103311137B (en) | 2012-03-06 | 2012-03-06 | A kind of superchip packaging solder ball location auto supply equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103311137B (en) |
| HK (1) | HK1186002A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
| CN111640842A (en) * | 2020-07-02 | 2020-09-08 | 江文涛 | Packaging structure for packaging LED flip chip and packaging method thereof |
| CN114724980A (en) * | 2022-03-02 | 2022-07-08 | 上海微松工业自动化有限公司 | Ball paving device based on BGA ball planting technology |
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| JP2000040709A (en) * | 1998-07-23 | 2000-02-08 | Matsushita Electric Ind Co Ltd | Shifting device and method of conductive ball |
| US6099681A (en) * | 1997-08-08 | 2000-08-08 | Matsushita Electric Industrial Co., Ltd. | Mounting apparatus for mounting small balls and mounting method thereof |
| CN2832404Y (en) * | 2005-10-13 | 2006-11-01 | 河南科技大学 | Cutting wire type soldering ball apparatus for highly sealed package |
| CN101743480A (en) * | 2006-11-22 | 2010-06-16 | 洛科企业有限公司 | An improved ball mounting apparatus and method |
| CN101604618B (en) * | 2009-06-09 | 2011-02-09 | 上海微松工业自动化有限公司 | Ball-planting device of semiconductor packaging equipment |
| CN102122606A (en) * | 2010-11-16 | 2011-07-13 | 上海微松工业自动化有限公司 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
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2012
- 2012-03-06 CN CN201210057617.8A patent/CN103311137B/en active Active
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2013
- 2013-11-27 HK HK13113265.6A patent/HK1186002A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099681A (en) * | 1997-08-08 | 2000-08-08 | Matsushita Electric Industrial Co., Ltd. | Mounting apparatus for mounting small balls and mounting method thereof |
| JP2000040709A (en) * | 1998-07-23 | 2000-02-08 | Matsushita Electric Ind Co Ltd | Shifting device and method of conductive ball |
| CN2832404Y (en) * | 2005-10-13 | 2006-11-01 | 河南科技大学 | Cutting wire type soldering ball apparatus for highly sealed package |
| CN101743480A (en) * | 2006-11-22 | 2010-06-16 | 洛科企业有限公司 | An improved ball mounting apparatus and method |
| CN101604618B (en) * | 2009-06-09 | 2011-02-09 | 上海微松工业自动化有限公司 | Ball-planting device of semiconductor packaging equipment |
| CN102122606A (en) * | 2010-11-16 | 2011-07-13 | 上海微松工业自动化有限公司 | Wafer-level package micro-ball automatic collection, supply and circulation equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103871915A (en) * | 2014-03-24 | 2014-06-18 | 上海微松工业自动化有限公司 | Manual BGA ball mounting machine |
| CN103871915B (en) * | 2014-03-24 | 2016-08-17 | 上海微松工业自动化有限公司 | Manually BGA ball attachment machine |
| CN111640842A (en) * | 2020-07-02 | 2020-09-08 | 江文涛 | Packaging structure for packaging LED flip chip and packaging method thereof |
| CN114724980A (en) * | 2022-03-02 | 2022-07-08 | 上海微松工业自动化有限公司 | Ball paving device based on BGA ball planting technology |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1186002A1 (en) | 2014-02-28 |
| CN103311137B (en) | 2015-10-28 |
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Inventor after: Guo Jian Inventor after: Zhang Jinzhi Inventor after: Zhao Kai Inventor after: Shi Yang Inventor after: Wang Yanqing Inventor before: Guo Jian Inventor before: Lin Haitao Inventor before: Wang Yanqing |