CN103309394B - For improving the method and apparatus of power compensation precision - Google Patents

For improving the method and apparatus of power compensation precision Download PDF

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CN103309394B
CN103309394B CN201310071409.8A CN201310071409A CN103309394B CN 103309394 B CN103309394 B CN 103309394B CN 201310071409 A CN201310071409 A CN 201310071409A CN 103309394 B CN103309394 B CN 103309394B
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value
power
electronic devices
components
parameter
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CN103309394A (en
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杨俊波
张晓波
杨哲
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Kaiwei International Co
Marvell Asia Pte Ltd
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Marvell International Ltd
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Abstract

The embodiments of the present invention relate to a kind of method and apparatus for improving power compensation precision.Particularly, the method that the embodiments of the present invention provide comprises the following steps: the current parameter value receiving a parameter of electronic devices and components to be measured; And generate the second power back-off table based on described current parameter value and predetermined first power back-off table.In addition, the embodiments of the present invention additionally provide the equipment corresponding with described method.The method and apparatus that each embodiment of the application of the invention provides can make electronic devices and components obtain more accurate power back-off.

Description

For improving the method and apparatus of power compensation precision
the cross reference of related application
This application claims in the March 6 in 2012, order was submitted the 61/607th, the right of priority of No. 122 U. S. applications, its disclosure is all incorporated into this by way of reference.
Technical field
The embodiments of the present invention relate generally to electronic devices and components field, and relate more specifically to the method and apparatus for improving power compensation precision.
Background technology
Along with the develop rapidly of semiconductor technology, increasing electronic devices and components are dissolved in the middle of our daily life.Such as, in daily life, people communicate each other frequently by the subscriber equipment of such as mobile communication equipment (such as, mobile phone) and so on.But, in order to make subscriber equipment can carry out work better, strictly must control its transmitter (that is, electronic devices and components example) power, this is because usually can not more than 1dB according to the deviate of different agreement power.Because temperature and/or voltage have relatively large impact to its transmitter power, therefore in order to eliminate this impact, must consider when carrying out APC (automated power control) to its transmitter the impact that temperature and/or voltage produce its power.
At present, the common way of industry obtains temperature and/or voltage power offset by look-up table.But, so likely can reduce power compensation precision, thus subscriber equipment cannot normally be worked.Therefore, need to provide a kind of method and apparatus that can improve power compensation precision, subscriber equipment can both normally be worked at different temperature and/or voltage.
Summary of the invention
In order to solve the problem, in the present context, one of the object of each illustrative embodiments of the present invention is to provide a kind of method and apparatus for improving power compensation precision.Electronic devices and components can be made to obtain more accurate power back-off by described method and apparatus.
Embodiment there is provided a kind of method for improving power compensation precision according to some of one aspect of the invention, such as, can comprise: the current parameter value receiving a parameter of electronic devices and components to be measured; And generate the second power back-off table based on described current parameter value and predetermined first power back-off table.
According to a further aspect of the present invention some embodiment there is provided a kind of equipment for improving power compensation precision, such as, can comprise: receiving trap, is configured to the current parameter value of the parameter receiving electronic devices and components to be measured; And generating apparatus, be configured to generate the second power back-off table based on described current parameter value and predetermined first power back-off table.
The exemplary solution that exemplary embodiment of the invention provides at least can bring following significant technique effect: carry out actual value of testing when APC calibrates by the temperature/voltage of electronic devices and components and adjust predetermined first temperature power compensation meter/voltage power compensation meter, thus the generation of above-mentioned situation can be avoided preferably, and temperature and/or voltage can be eliminated better on the impact of power.
Accompanying drawing explanation
By reference to accompanying drawing reading detailed description hereafter, above-mentioned and other objects of embodiment of the present invention, feature and advantage will become easy to understand.In the accompanying drawings, show some embodiments of the present invention by way of example, and not by way of limitation, wherein:
Fig. 1 show according to each illustrative embodiments of the present invention, for improving the process flow diagram of the method 100 of power compensation precision;
Fig. 2 show according to each illustrative embodiments of the present invention, for improving the schematic block diagram of the equipment 200 of power compensation precision;
Fig. 3 diagrammatically illustrates linear interpolation coordinates computed system and represents; And
Fig. 4 diagrammatically illustrates and will be benefited from each illustrative embodiments of the present invention and can be the block diagram of the computing equipment 400 of each illustrative embodiments exemplary device of the present invention.
Embodiment
Below with reference to some illustrative embodiments, principle of the present invention and spirit are described.Should be appreciated that providing these embodiments is only used to enable those skilled in the art understand better and then realize the present invention, and not limit the scope of the invention by any way.
Below with reference to Fig. 1 describe according to each illustrative embodiments of the present invention, for improving the method for power compensation precision.
As shown in Figure 1, according to each illustrative embodiments of the present invention, method 100 such as can comprise the current parameter value (S101) of the parameter receiving electronic devices and components to be measured.
In an illustrative embodiments, the described parameter that the current parameter value of described electronic devices and components to be measured typically refers to described electronic devices and components is tested by current reality the value arrived.Wherein, described parameter can be such as following at least one: temperature, voltage.Due to the spirit that temperature power compensation and/or voltage power compensate being identical, therefore hereafter for temperature, each illustrative embodiments of the present invention is set forth.
As everyone knows, some electronic devices and components (such as, transmitter) in subscriber equipment may be thermally sensitive, and therefore for the transmitter of subscriber equipment, temperature can impact its emissive power, as shown in table 1.
Table 1
As shown in table 1, when transmitter is at different temperature, the actual emission power of the transmitter of subscriber equipment is not identical, therefore to electronic devices and components (such as, transmitter) when carrying out APC, need to obtain described parameter (such as, temperature) and tested by current reality the value arrived.
As shown in Figure 1, according to each illustrative embodiments of the present invention, method 100 such as can comprise and generates the second power back-off table (S102) based on described current parameter value and predetermined first power back-off table.
In an illustrative embodiments, described predetermined first power back-off table is generated in advance by following steps: test described electronic devices and components or the performance number corresponding under multiple different parameters values of described parameter with its other electronic devices and components of same batch; Select the performance number of a parameter value in described multiple different parameters value and correspondence thereof as the first reference power value of the first reference parameter value and correspondence thereof; And be used as multiple first power compensating value by described electronic devices and components multiple performance numbers of correspondence under described multiple different parameters value are deducted described first reference power value respectively, thus form described first power back-off table.
Usually, each subscriber equipment can have a first temperature power compensation meter under specified temp (being generally 25 °) (namely when dispatching from the factory, table 2), and subscriber equipment can launch certain power (power etc. that power, base station that such as, communication protocol specifies are specified) exactly at a certain temperature.Further, 5 DEG C, the usual interval of each probe temperature, and scope can comprise the scope of daily use, such as, from-40 DEG C to 50 DEG C.Due to when subscriber equipment is in real work, temperature may not be specified temp, and its transmitter emissive power just has deviation like this.In order to the power emission deviation that compensation temperature is brought, the power deviation that the relative specified temp of subscriber equipment working temperature brings must be obtained, then in the emissive power of subscriber equipment, deduct this power deviation.Therefore, an importance of the problems referred to above is to obtain the correct power deviation that subscriber equipment actual work temperature is brought relative to specified temp.Suppose that the reference temperature selected is Tbase (Tbase is a value in table 1 in multiple different probe temperature), the emissive power of its correspondence is Pbase.Therefore, the power compensating value under each probe temperature is that the transmission power level of its correspondence deducts reference power value Pbase.Table 2 is the first temperature power compensation meter, as follows:
Table 2
In an illustrative embodiments, wherein said reference temperature can be 25 DEG C.Due to the custom of industry, usually choosing reference temperature is 25 DEG C, and different temperature can certainly be selected as reference temperature.
In an illustrative embodiments, generate the second power back-off table based on described current parameter value and predetermined first power back-off table and comprise: in described first power back-off table, determine the first power compensating value for described current parameter value; And be used as multiple second power compensating value by multiple first power compensating values of described electronic devices and components in described first power back-off table being deducted respectively described the first power compensating value for described current parameter value, thus form described second power back-off table.
For the subscriber equipment of certain model, only need to test limited electronic devices and components to obtain above-mentioned first temperature power compensation meter in laboratory.Later all electronic devices and components can use this first temperature power compensation meter, and do not need each subscriber equipment to be tested one time to obtain the first temperature power compensation meter, because expend time in very much and resource like this, thus cannot meet the requirement of production line.
But, with generation first temperature power compensation meter unlike, each electronic devices and components need actual Self-adaptive APC correction card on a production line, this APC correction card have recorded temperature when doing APC calibration for the user device configuration of different capacity and electronic devices and components, wherein power bracket from-25dB to-90dB and each other interval 1dB usually.An importance of described method is to record the temperature (such as, the temperature sensor by subscriber equipment) that when carrying out APC, actual test is arrived, and then reports this temperature to subscriber equipment.When subscriber equipment carries out the compensation of APC temperature power, it can use reported temperature to improve precision.Suppose that the temperature that subscriber equipment is when APC calibrates is Ts, and in practical operation, it is identical for being difficult to ensure that each subscriber equipment is Ts when APC calibrates.And the Ts of each subscriber equipment and Tbase mentioned above also may be different.Therefore, subscriber equipment just accurately cannot calculate the power excursion that the relative Ts of actual work temperature brings.Because the first temperature power compensation meter of above-mentioned generation, its reference temperature is Tbase, the Δ Pr (working temperature is Tr) therefore obtained relative to Tbase, instead of relative to Ts's.The power back-off table that the first temperature power compensation meter obtains relative to Ts must be adjusted for this reason.That is, the linear interpolation formula utilizing above-mentioned table 2 and Fig. 3 to describe, obtains the power compensating value Δ Ps of Ts, and compensated by all UE temperature power in table 2 and deduct Δ Ps, table 3 is the second temperature power compensation meter, as follows:
Table 3
By above-mentioned steps, each electronic devices and components can both obtain a second temperature power compensation meter matched with oneself Ts, thus improve the precision of power back-off.
Below with reference to Fig. 2, it illustrates according to each illustrative embodiments of the present invention, for improving the schematic block diagram of the equipment 200 of power compensation precision.Equipment 200 such as can comprise: receiving trap 201, is configured to the current parameter value of the parameter receiving electronic devices and components to be measured; And generating apparatus 202, be configured to generate the second power back-off table based on described current parameter value and predetermined first power back-off table.
For clarity, in fig. 2 and the sub-device that comprises of each device not shown.But, should be appreciated that the device recorded in equipment 200 is corresponding with the step in the method 100 described with reference to figure 1 respectively.Thus, the operation described for the method 100 of Fig. 1 above and feature are equally applicable to equipment 200 and the device wherein comprised and sub-device, do not repeat them here.
Should be appreciated that equipment 200 can profit realize in various manners.Such as, in some embodiments, equipment 200 can utilize software and/or firmware module to realize.In addition, equipment 200 also can utilize hardware module to realize.Such as, equipment 200 can be implemented as integrated circuit (IC) chip or special IC (ASIC).Equipment 200 also can be implemented as SOC (system on a chip) (SOC).In addition, equipment 200 also can utilize the combination of hardware module and software and/or firmware module to realize.Other modes that are known or exploitation in the future are also feasible now, and scope of the present invention is unrestricted in this regard.
Fig. 3 diagrammatically illustrates linear interpolation coordinates computed system and represents.Above power back-off table only have recorded the power compensating value at limited temperature, obtain the offset of certain non-said temperature, then need to utilize linear interpolation method to calculate.Particularly, suppose that arbitrary temp is Tr, the temperature range of Tr is found to be Tc1 < Tr < Tc2 (Tc1 and Tc2 is the probe temperature value in table 2), then Δ Pr=Δ Pc1+ (Tr-Tc1) * (Δ Pc2-Δ Pc1)/(Tc2-Tc1) as shown in Figure 3.
As shown in Figure 4, computing equipment 400 can comprise: CPU (CPU (central processing unit)) 401, RAM (random access memory) 402, ROM (ROM (read-only memory)) 403, system bus 404, hard disk controller 405, keyboard controller 406, serial interface controller 407, parallel interface controller 408, display controller 409, hard disk 410, keyboard 411, serial peripheral equipment 412, concurrent peripheral equipment 413 and display 414.In such devices, what be coupled with system bus 404 has CPU401, RAM402, ROM403, hard disk controller 405, keyboard controller 406, serialization controller 407, parallel controller 408 and display controller 409.Hard disk 410 is coupled with hard disk controller 405, keyboard 411 is coupled with keyboard controller 406, serial peripheral equipment 412 is coupled with serial interface controller 407, and concurrent peripheral equipment 413 is coupled with parallel interface controller 408, and display 414 is coupled with display controller 409.Should be appreciated that the structured flowchart described in Fig. 4 illustrates just to the object of example, instead of limitation of the scope of the invention.In some cases, can increase or reduce certain module as the case may be.
It should be noted that embodiments of the present invention can be realized by the combination of hardware, software or software and hardware.Hardware components can utilize special logic to realize; Software section can store in memory, and by suitable instruction execution system, such as microprocessor or special designs hardware perform.Those having ordinary skill in the art will appreciate that above-mentioned equipment and method can use computer executable instructions and/or be included in processor control routine to realize, such as, on the programmable memory of mounting medium, such as ROM (read-only memory) (firmware) or the data carrier of such as optics or electrical signal carrier of such as disk, CD or DVD-ROM, provide such code.Equipment of the present invention and module thereof can be realized by the hardware circuit of the programmable hardware device of the semiconductor of such as VLSI (very large scale integrated circuit) or gate array, such as logic chip, transistor etc. or such as field programmable gate array, programmable logic device etc., also with the software simulating performed by various types of processor, also can be realized by the combination such as firmware of above-mentioned hardware circuit and software.
Although it should be noted that the some devices or sub-device that are referred to equipment in above-detailed, this division is only not enforceable.In fact, according to the embodiment of the present invention, the Characteristic and function of two or more devices above-described can be specialized in one apparatus.Otherwise, the Characteristic and function of an above-described device can Further Division for be specialized by multiple device.
In addition, although describe the operation of the inventive method in the accompanying drawings with particular order, this is not that requirement or hint must perform these operations according to this particular order, or must perform the result that all shown operation could realize expectation.On the contrary, the step described in process flow diagram can change execution sequence.Additionally or alternatively, some step can be omitted, multiple step be merged into a step and perform, and/or a step is decomposed into multiple step and perform.
Although describe the present invention with reference to some embodiments, should be appreciated that, the present invention is not limited to disclosed embodiment.The present invention is intended to contain the interior included various amendment of spirit and scope and the equivalent arrangements of claims.The scope of claims meets the most wide in range explanation, thus comprises all such amendments and equivalent structure and function.

Claims (8)

1., for improving a method for power compensation precision, described method comprises:
Receive the current parameter value of a parameter of electronic devices and components to be measured;
The first power compensating value for described current parameter value is determined in predetermined first power back-off table; And
Be used as multiple second power compensating value by multiple first power compensating values of described electronic devices and components in described first power back-off table being deducted respectively described the first power compensating value for described current parameter value, thus form described second power back-off table.
2. method according to claim 1, the current parameter value of wherein said electronic devices and components to be measured refers to that the described parameter of described electronic devices and components is tested by current reality the value arrived.
3. method according to claim 1, wherein said predetermined first power back-off table is generated in advance by following steps:
Test described electronic devices and components or the performance number corresponding under multiple different parameters values of described parameter with its other electronic devices and components of same batch;
Select the performance number of a parameter value in described multiple different parameters value and correspondence thereof as the first reference power value of the first reference parameter value and correspondence thereof; And
Deduct described first reference power value respectively by multiple performance numbers that described electronic devices and components are corresponding under described multiple different parameters value and be used as multiple first power compensating value, thus form described first power back-off table.
4. method as claimed in any of claims 1 to 3, wherein said parameter is following at least one: temperature, voltage.
5., for improving an equipment for power compensation precision, described equipment comprises:
Receiving trap, is configured to the current parameter value of the parameter receiving electronic devices and components to be measured; And
Generating apparatus, is configured to
The first power compensating value for described current parameter value is determined in predetermined first power back-off table; And
By by described electronic devices and components in described first power back-off table multiple
One power compensating value deducts described the first power compensating value for described current parameter value respectively and is used as multiple second power compensating value, thus forms described second power back-off table.
6. equipment according to claim 5, the current parameter value of wherein said electronic devices and components to be measured refers to that the described parameter of described electronic devices and components is tested by current reality the value arrived.
7. equipment according to claim 5, wherein said predetermined first power back-off table is generated in advance by following steps:
Test described electronic devices and components or the performance number corresponding under multiple different parameters values of described parameter with its other electronic devices and components of same batch;
Select the performance number of a parameter value in described multiple different parameters value and correspondence thereof as the first reference power value of the first reference parameter value and correspondence thereof; And
Deduct described first reference power value respectively by multiple performance numbers that described electronic devices and components are corresponding under described multiple different parameters value and be used as multiple first power compensating value, thus form described first power back-off table.
8., according to the equipment in claim 5 to 7 described in any one, wherein said parameter is following at least one: temperature, voltage.
CN201310071409.8A 2012-03-06 2013-03-05 For improving the method and apparatus of power compensation precision Expired - Fee Related CN103309394B (en)

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CN106925997B (en) * 2015-12-29 2024-01-23 上海发那科机器人有限公司 Automatic drilling and milling system and method and drilling and milling production line
CN113452390B (en) * 2021-06-25 2022-10-21 展讯通信(上海)有限公司 Power compensation method, device, storage medium and electronic equipment

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JPH10107653A (en) * 1996-09-30 1998-04-24 Toshiba Corp Transmission power control method and its device for radio communication equipment
KR20050060505A (en) * 2003-12-16 2005-06-22 주식회사 팬택 Method of controling a power in the mobile communication terminal
CN101436887A (en) * 2007-11-14 2009-05-20 大唐移动通信设备有限公司 Power control method, apparatus and mobile terminal
CN101494477A (en) * 2008-01-23 2009-07-29 联芯科技有限公司 Terminal power control method and device
CN101938258A (en) * 2010-08-27 2011-01-05 华为终端有限公司 Method and device for controlling radio frequency power amplifier to transmit signal
CN102149178A (en) * 2010-02-08 2011-08-10 联芯科技有限公司 Method and device for compensating temperature of mobile terminal power

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JP5510122B2 (en) * 2010-06-30 2014-06-04 アイコム株式会社 High frequency circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10107653A (en) * 1996-09-30 1998-04-24 Toshiba Corp Transmission power control method and its device for radio communication equipment
KR20050060505A (en) * 2003-12-16 2005-06-22 주식회사 팬택 Method of controling a power in the mobile communication terminal
CN101436887A (en) * 2007-11-14 2009-05-20 大唐移动通信设备有限公司 Power control method, apparatus and mobile terminal
CN101494477A (en) * 2008-01-23 2009-07-29 联芯科技有限公司 Terminal power control method and device
CN102149178A (en) * 2010-02-08 2011-08-10 联芯科技有限公司 Method and device for compensating temperature of mobile terminal power
CN101938258A (en) * 2010-08-27 2011-01-05 华为终端有限公司 Method and device for controlling radio frequency power amplifier to transmit signal

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