CN103298265B - A kind of circuit board outer layer circuit forming method - Google Patents
A kind of circuit board outer layer circuit forming method Download PDFInfo
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- CN103298265B CN103298265B CN201310121864.4A CN201310121864A CN103298265B CN 103298265 B CN103298265 B CN 103298265B CN 201310121864 A CN201310121864 A CN 201310121864A CN 103298265 B CN103298265 B CN 103298265B
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Abstract
The invention discloses a kind of circuit board outer layer circuit forming method, comprise step: with dip-coating ink layer even in the copper-clad plate of conductive hole, toast the described copper-clad plate being attached with described ink layer; Adopt the described ink layer that laser beam is unnecessary according to the line map gasification finish preset, make remaining described ink layer in described copper-clad plate, form described default line map; Adopt etching solution spray or soak described copper-clad plate, removing in described copper-clad plate not by Copper Foil that described ink layer adheres to; Adopt sodium hydroxide solution spray or soak described copper-clad plate, removing remaining described ink layer in described copper-clad plate.The present invention has effectively saved production cost; Can realize forming protective layer at the hole wall of conductive hole, avoid traditional complicated technology covering pressure photosensitive dry film; Adopt the ink that laser beam gasification finish is unnecessary, without the need to the process of exposure with development, save Production Time, improve production efficiency; Avoid the generation of developer solution waste water, be conducive to environmental protection.<!--1-->
Description
Technical field
The present invention relates to circuit board preparing technical field, be related specifically to circuit board outer layer circuit forming method.
Background technology
At present; in circuit board outer layer circuit manufacturing process; usual needs cover pressure photosensitive dry film in the copper-clad plate of existing conductive hole; after exposure, development; photosensitive dry film is formed required line pattern; then the copper-clad plate after development treatment is soaked or spray with etching solution, by etching solution, copper face copper-clad plate not having photosensitive dry film protect is etched away, and then in copper-clad plate, form the line pattern of needs.Because photosensitive dry film is in exposure, developing process, can produce a large amount of developer solution waste water, developer solution waste water can cause serious environmental pollution; And expose, developing process is very complicated, cause circuit board making duration to increase; In addition, the price of photosensitive dry film is very high, can increase the production cost of circuit board making undoubtedly.
Summary of the invention
Main purpose of the present invention for provide one be applied to circuit board outer layer circuit make time, avoid environmental pollution, enhance productivity, effectively cost-saving circuit board outer layer circuit forming method.
The present invention proposes a kind of circuit board outer layer circuit forming method, comprises step:
Steps A, with dip-coating ink layer even in the copper-clad plate of conductive hole, toasts the described copper-clad plate being attached with described ink layer;
Step B, adopts the described ink layer that laser beam is unnecessary according to the line map gasification finish preset, makes remaining described ink layer in described copper-clad plate, form described default line map;
Step C, adopts etching solution spray or soaks described copper-clad plate, to remove in described copper-clad plate not by Copper Foil that described ink layer adheres to;
Step D, adopts sodium hydroxide solution spray or soaks described copper-clad plate, removing remaining described ink layer in described copper-clad plate.
Preferably, when normal temperature, the ink layer viscosity in described steps A is less than or equal to 300 centipoises.
Preferably, the ink forming ink layer in described steps A comprises each component of following mass parts:
Containing the nitrogenous high polymer of carboxyl 30 ~ 80 parts;
Ketone or benzamide type solution 20 ~ 60 parts;
Wetting agent 0.01 ~ 0.2 part;
Described containing the nitrogenous high polymer of carboxyl for as shown in the formula shown in (I) or formula (II):
formula (I),
formula (II),
Wherein, in described formula (I) or formula (II):
R
1for
;
R
2for
or
;
R
3for carbon chain lengths is 8 ~ 30 carbon atoms;
N is the integer of 1 ~ 20.
Preferably, the time of immersion in described steps A is 10 ~ 30 seconds.
Preferably, the baking temperature in described steps A is 50 ~ 100 DEG C, and baking time is 5 ~ 30 minutes.
Preferably, the laser beam in described step B is carbon dioxide laser or Ultra-Violet Laser or optical-fiber laser.
Preferably, described step B also comprises:
Step B01, when needing non-conductive hole in the line map preset, adopting laser beam to hole in described copper-clad plate according to the line map preset, obtaining non-conductive hole.
Preferably, in the sodium hydroxide solution in described step D, the content of NaOH is 1% ~ 5%.
Preferably, the spray in described step D or soak time are 30 ~ 120 seconds.
Preferably, the spray in described step D or soak time are 40 ~ 60 seconds.
The present invention adopts ink to substitute expensive photosensitive dry film, has effectively saved production cost; And can realize forming protective layer at the hole wall of conductive hole, solve traditional complicated technology covering pressure photosensitive dry film; Additionally use the ink that laser beam gasification finish is unnecessary, without the need to the process of exposure with development, save Production Time, improve production efficiency; Avoid the generation of developer solution waste water, be conducive to environmental protection.
Accompanying drawing explanation
Fig. 1 is the flow chart of circuit board outer layer circuit forming method first embodiment of the present invention;
Fig. 2 is the flow chart of circuit board outer layer circuit forming method second embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Figure 1, Fig. 1 is the flow chart of circuit board outer layer circuit forming method first embodiment of the present invention.The circuit board outer layer circuit forming method that the present embodiment is mentioned, comprises step:
Steps A, with dip-coating ink layer even in the copper-clad plate of conductive hole, toasts the copper-clad plate being attached with ink layer;
Ink layer in this step adopts viscosity to be less than or equal to the ink of 300 centipoises (during normal temperature); the dry ink layer of thickness 5um ~ 15um can be formed on the hole wall of the copper facing conductive hole of 0.01m ~ 2mm in diameter 0.05mm ~ 6mm, length; protective layer can be formed at the hole wall of conductive hole, and avoid traditional complicated technology covering pressure photosensitive dry film.Dip coater is put in copper-clad plate with conductive hole, and dip-coating 10 ~ 30 seconds, copper-clad plate obtains uniform ink layer.Oven cooking cycle is put in the copper-clad plate of coating ink layer, and baking temperature can be set in 50 ~ 100 DEG C, and baking time is 5 ~ 30 minutes.
Step B, adopts the ink layer that laser beam is unnecessary according to the line map gasification finish preset, makes remaining ink layer in copper-clad plate, form default line map;
Laser engraving machine is put in copper-clad plate after baking; under the protection of inert gas; adopt laser beam according to the line map direct gasification preset; ink layer is removed the part not needing laying-out in line map; part Copper Foil in copper-clad plate protects by remaining ink layer, and the circuit that the part Copper Foil be protected is formed is consistent with the line map preset.
Step C, adopts etching solution spray or soaks copper-clad plate, to remove in copper-clad plate not by Copper Foil that ink layer adheres to;
Ink in this step is not soluble in acidic etching liquid or alkaline etching liquid, can adopt common acidic etching liquid or alkaline etching liquid spray or soak copper-clad plate, will do not etched away by the Copper Foil that ink layer is protected.
Step D, adopts sodium hydroxide solution spray or soaks copper-clad plate, removing remaining ink layer in copper-clad plate.
Ink in this step dissolves in sodium hydroxide solution, and in sodium hydroxide solution, the content of NaOH is 1% ~ 5%, and spray or soak time are between 30 ~ 120 seconds.Spray or after soaking, in copper-clad plate, remaining ink layer is washed away, the circuit that the Copper Foil exposed is formed is consistent with default line map.
Owing to adopting ink to substitute expensive photosensitive dry film in the present embodiment, effectively save production cost; And can realize forming protective layer at the hole wall of conductive hole, avoid traditional complicated technology covering pressure photosensitive dry film; Additionally use the ink that laser beam gasification finish is unnecessary, without the need to the process of exposure with development, save Production Time, improve production efficiency; Avoid the generation of developer solution waste water, be conducive to environmental protection.
As shown in Figure 2, Fig. 2 is the flow chart of circuit board outer layer circuit forming method second embodiment of the present invention, comprises step:
Steps A 01, with dip-coating ink layer even in the copper-clad plate of conductive hole, time of immersion is 30 seconds, at 100 DEG C, the copper-clad plate being attached with ink layer is toasted 30 minutes;
The ink forming ink layer in steps A comprises each component of following mass parts:
Described containing the nitrogenous high polymer of carboxyl for as shown in the formula shown in (I) or formula (II):
formula (I),
formula (II),
Wherein, in described formula (I) or formula (II):
R
1for
;
R
2for
or
;
R
3for carbon chain lengths is 8 ~ 30 carbon atoms;
N is the integer of 1 ~ 20.
Wherein, ketones solvent is at least one in acetone or butanone, and benzamide type solvent is dimethyl formamide, and wetting agent can select silicone polymer, and dyestuff can select the gorgeous indigo plant of alcohol insoluble basic.This ink viscosity is less than or equal to 300 centipoises (during normal temperature); the dry ink layer of thickness 5um ~ 15um can be formed on the hole wall of the copper facing conductive hole of 0.01m ~ 2mm in diameter 0.05mm ~ 6mm, length; protective layer can be formed at the hole wall of conductive hole, and avoid traditional complicated technology covering pressure photosensitive dry film.
Step B00, under inert gas shielding, adopts carbon dioxide laser beam or UV laser beam or fiber laser beam, and the ink layer unnecessary according to the line map gasification finish preset, makes remaining ink layer in copper-clad plate, form default line map;
Step B01, when needing non-conductive hole in the line map preset, adopting laser beam to hole in copper-clad plate according to the line map preset, obtaining non-conductive hole.
Step C01, adopts etching solution spray or soaks copper-clad plate, to remove in copper-clad plate not by Copper Foil that ink layer adheres to;
Step D01, adopts sodium hydrate content to be the sodium hydroxide solution of 5%, copper-clad plate is sprayed or soaks 60 seconds, removing remaining ink layer in copper-clad plate.
The ink that the present embodiment have employed said components substitutes photosensitive dry film expensive in traditional handicraft, has effectively saved production cost; Can realize forming protective layer at the hole wall of conductive hole, avoid traditional complicated technology covering pressure photosensitive dry film; Have employed the ink that laser beam gasification finish is unnecessary, without the need to the process of exposure with development, save Production Time, improve production efficiency; Avoid the generation of developer solution waste water, be conducive to environmental protection.
The foregoing is only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. a circuit board outer layer circuit forming method, is characterized in that, comprises step:
Steps A, with dip-coating ink layer even in the copper-clad plate of conductive hole, toasts the described copper-clad plate being attached with described ink layer;
Step B, adopts the described ink layer that laser beam is unnecessary according to the line map gasification finish preset, makes remaining described ink layer in described copper-clad plate, form described default line map;
Step C, adopts etching solution spray or soaks described copper-clad plate, to remove in described copper-clad plate not by Copper Foil that described ink layer adheres to;
Step D, adopts sodium hydroxide solution spray or soaks described copper-clad plate, removing remaining described ink layer in described copper-clad plate;
When normal temperature, the ink layer viscosity in described steps A is less than or equal to 300 centipoises.
2. circuit board outer layer circuit forming method according to claim 1, is characterized in that, the time of immersion in described steps A is 10 ~ 30 seconds.
3. circuit board outer layer circuit forming method according to claim 1, is characterized in that, the baking temperature in described steps A is 50 ~ 100 DEG C, and baking time is 5 ~ 30 minutes.
4. circuit board outer layer circuit forming method according to claim 1, is characterized in that, the laser beam in described step B is carbon dioxide laser or Ultra-Violet Laser or optical-fiber laser.
5. circuit board outer layer circuit forming method according to claim 4, is characterized in that, described step B also comprises:
Step B01, when needing non-conductive hole in the line map preset, adopting laser beam to hole in described copper-clad plate according to the line map preset, obtaining non-conductive hole.
6. circuit board outer layer circuit forming method according to claim 1, is characterized in that, in the sodium hydroxide solution in described step D, the content of NaOH is 1% ~ 5%.
7. circuit board outer layer circuit forming method according to claim 6, is characterized in that, the spray in described step D or soak time are 30 ~ 120 seconds.
8. circuit board outer layer circuit forming method according to claim 7, is characterized in that, the spray in described step D or soak time are 40 ~ 60 seconds.
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| CN103298265B true CN103298265B (en) | 2016-04-06 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883824A (en) * | 2015-05-15 | 2015-09-02 | 胜宏科技（惠州）股份有限公司 | Treatment method for circuit board whose PAD gets inked during solder mask producing process |
| CN106550545A (en) * | 2016-12-08 | 2017-03-29 | 湖北第二师范学院 | A kind of full-automatic PCB Sheetmaking systems and method based on Internet of Things |
| CN107309148B (en) * | 2017-08-14 | 2023-06-27 | 广东东讯新材料有限公司 | Vertical continuous coating VCC method and device for circuit board |
| CN107635353A (en) * | 2017-10-12 | 2018-01-26 | 安捷利（番禺）电子实业有限公司 | A kind of double-faced flexible wiring board and its laser preparation method |
| CN111787707A (en) * | 2020-07-27 | 2020-10-16 | 深圳市卓创通电子有限公司 | Laser engraving and processing technology for inner layer circuit of copper-clad plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004015497A1 (en) * | 2002-08-07 | 2004-02-19 | Mitsubishi Chemical Corporation | Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor |
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
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|---|---|---|---|---|
| US6504111B2 (en) * | 2001-05-29 | 2003-01-07 | International Business Machines Corporation | Solid via layer to layer interconnect |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004015497A1 (en) * | 2002-08-07 | 2004-02-19 | Mitsubishi Chemical Corporation | Image forming material having bluish-violet laser-photosensitive resist material layer and resist image forming method therefor |
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
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Effective date of registration: 20160920 Address after: 516100, Guangdong, Huizhou province Boluo County Town Po Village Patentee after: Huizhou Red Forest Industrial Co., Ltd. Address before: 518172, No. 1820-1823, building two, dragon garden, Longcheng street, Longcheng District, Shenzhen City, Guangdong Province, Longgang Patentee before: Wang Junsheng |