CN103292961A - Device and method for detecting encapsulation effect of organic light emitting diode - Google Patents
Device and method for detecting encapsulation effect of organic light emitting diode Download PDFInfo
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- CN103292961A CN103292961A CN2012105680125A CN201210568012A CN103292961A CN 103292961 A CN103292961 A CN 103292961A CN 2012105680125 A CN2012105680125 A CN 2012105680125A CN 201210568012 A CN201210568012 A CN 201210568012A CN 103292961 A CN103292961 A CN 103292961A
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- emitting diode
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Abstract
The invention provides a device and method for detecting the encapsulation effect of an organic light emitting diode. The device for detecting the encapsulation effect of the organic light emitting diode comprises a substrate, a cover plate, a metal mirror surface layer and adhesive materials, wherein the cover plate is opposite to the substrate, the cover plate and the substrate are separated from each other, the metal surface layer is formed on the inner surface of the substrate and/or the inner surface of the cover plate, and the adhesive materials are arranged on the periphery of the cover plate and the substrate plate so as to encapsulate the substrate plate and the cover plate to form a sealing structure. The device for detecting the encapsulation effect of the organic light emitting diode replaces an organic light emitting diode encapsulation structure to conduct sealing (namely, the encapsulation effect) detection, so that a detection result is made to be easily obtained visually, a detection period is shortened, and detection efficiency is improved.
Description
Technical field
The present invention relates to the Organic Light Emitting Diode encapsulation field, particularly relate to a kind of device for detection of the Organic Light Emitting Diode packaging effect and method.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode is called for short OLED) display, part country claims organic electro-luminescent display (Organic Electroluminesence Display is called for short OELD) again.The characteristic of OLED display is autoluminescence, therefore visibility and brightness are all higher, and there is not the visual angle problem, OLED display driving voltage is low in addition and province's electrical efficiency height, add fast, in light weight, the thin thickness of reaction, simple structure and low cost and other advantages, be regarded as one of demonstration product of tool future of 21 century.
Usually the basic structure of OLED display is that indium tin oxide (ITO) by a thin and transparent tool characteristic of semiconductor links to each other with the positive pole of electric power, adds another metallic cathode, is bundled into the structure as sandwich.Comprised in the total layer: electric hole transport layer (HTL), organic luminous layer (OEL) and electron transfer layer (ETL).When supplying power to appropriate voltage, anodal electric hole and cathode electronics just can combinations in luminescent layer, produce photon, thereby reach luminous function.
But, because metal electrode and organic luminous layer in the Organic Light Emitting Diode are very responsive to steam and oxygen, steam in the environment and the infiltration of oxygen can make the oxidation of metal electrode generating electrodes, metal electrode and organic luminous layer are peeled off and problem such as material cracking, and then make display produce dim spot, reduce luminous intensity and the luminous uniformity coefficient of Organic Light Emitting Diode significantly.Therefore, finish the evaporation process of metal electrode and organic luminorphor at the glass substrate of Organic Light Emitting Diode after, can be with the Organic Light Emitting Diode of top cover packaged glass substrate surface.
After the Organic Light Emitting Diode encapsulation, need detecting packaging effect.Traditional detection method is: select in microscopically observation and measure all good Organic Light Emitting Diode in brightness and put in the reliability testing stove (reliability testing stove refer to provide hot and humid etc. the stove and accessory of mal-condition so that the reliability of encapsulating structure is tested), do the test of some specific conditions, such as hot and humid, carry out microscopically observation and brightness afterwards again and measure, from the result of twice observation of front and back and measurement contrasts, judge whether packaging effect is good.But this detection method is difficult for observation, and sense cycle is long.
Summary of the invention
The technical problem to be solved in the present invention is: the difficult observation of existing Organic Light Emitting Diode method for testing packaging effect and cycle are long.
For addressing the above problem, the invention provides a kind of device for detection of the Organic Light Emitting Diode packaging effect, comprising:
Substrate;
Cover plate, described cover plate and described substrate are oppositely arranged and are spaced;
The speculum surface layer, described speculum surface layer is formed at the inside surface of described substrate and/or described cover plate;
The glue material, described glue material is arranged on described cover plate and described substrate periphery, forms hermetically-sealed construction to encapsulate described substrate and described cover plate.
Optionally, the thickness of described speculum surface layer is 40nm ~ 300nm.
Optionally, described speculum surface layer is silver mirror surface layer or magnesium specular layer.
Optionally, adopt evaporation coating method to form described speculum surface layer in the inside surface of described substrate and/or described cover plate.
Optionally, Organic Light Emitting Diode is active matrix organic light-emitting diode.
Optionally, the substrate manufacture material of described substrate and organic light-emitting diode packaging structure and measure-alike.
Optionally, the encapsulation cover plate of described cover plate and organic light-emitting diode packaging structure is made material and measure-alike.
Optionally, to make material identical with consumption for described glue material and the packaging adhesive material of organic light-emitting diode packaging structure.
Optionally, described encapsulation is identical with the method for packing of organic light-emitting diode packaging structure.
The present invention also provides a kind of method for detection of the Organic Light Emitting Diode packaging effect, utilize aforesaid device for detection of the Organic Light Emitting Diode packaging effect to substitute organic light-emitting diode packaging structure and detect, whether whether the destroyed organic light-emitting diode packaging structure that detects meets the requirements the mirror effect by described speculum surface layer.
Compared with prior art, the present invention has the following advantages:
Device for detection of the Organic Light Emitting Diode packaging effect provided by the present invention replaces organic light-emitting diode packaging structure to carry out the sealing effectiveness detection of (also claiming packaging effect), makes testing result intuitively draw easily on the one hand; Shorten sense cycle on the other hand, improved detection efficiency.
Description of drawings
Fig. 1 is that the embodiment of the invention is for detection of the synoptic diagram of the device of Organic Light Emitting Diode packaging effect;
Fig. 2 is that the embodiment of the invention is for detection of the synoptic diagram in the device forming process of Organic Light Emitting Diode packaging effect.
Embodiment
The invention provides a kind of device for detection of the Organic Light Emitting Diode packaging effect, and utilize this device to replace organic light-emitting diode packaging structure to carry out the sealing effectiveness detection of (also claiming packaging effect), thereby reach the purpose that detects the organic light-emitting diode packaging structure sealing effectiveness.The detection of adopting the device replacement organic light-emitting diode packaging structure for detection of the Organic Light Emitting Diode packaging effect provided by the present invention to carry out sealing effectiveness has the advantage of two aspects: make testing result intuitively draw easily on the one hand; Shorten sense cycle on the other hand, improved detection efficiency.
Please refer to Fig. 1, the device 100 for detection of the Organic Light Emitting Diode packaging effect that Fig. 1 provides for present embodiment, it includes substrate 110, cover plate 120 and glue material 130.Wherein, described cover plate 120 is oppositely arranged with described substrate 110 and is spaced, between them across glue material 130, between described glue material 130 is arranged on around described cover plate 120 and the described substrate 110, to encapsulate described substrate 110 and described cover plate 120 forms hermetically-sealed constructions.The sealing structure is similar with normal organic light-emitting diode packaging structure, and just the sealing structure has been lacked organic illuminating element (the organic illuminating element here comprises structures such as semiconductor positive pole, metallic cathode, electric hole transport layer, organic luminous layer and electron transfer layer).
In the present embodiment, described substrate 110 can be transparency carrier or translucent substrate.This substrate 110 can be made by glass material or resin material.Further preferred, described substrate 110 is identical with the baseplate material of organic light-emitting diode packaging structure, which kind of material the substrate that is organic light-emitting diode packaging structure has make, the substrate 110 of present embodiment is also made with this kind material, so that the formed device 100 for detection of the Organic Light Emitting Diode packaging effect of present embodiment is higher with the similarity degree of organic light-emitting diode packaging structure.
In the present embodiment, described cover plate 120 can be transparent cover plate or translucent cover plate.This cover plate 120 can be made by glass material or resin material.Further preferred, described cover plate 120 is identical with the cover plate materials of organic light-emitting diode packaging structure, which kind of material the cover plate that is organic light-emitting diode packaging structure has make, the cover plate 120 of present embodiment is also made with this kind material, so that the formed device 100 for detection of the Organic Light Emitting Diode packaging effect of present embodiment is higher with the similarity degree of organic light-emitting diode packaging structure.
In the present embodiment, described glue material 130 can be frit glue material, also can be glue materials such as UV glue.Further preferred, described glue material 130 is identical with the glue material material of organic light-emitting diode packaging structure, which kind of material the glue material that is organic light-emitting diode packaging structure has make, the glue material 130 of present embodiment is also made with this kind material, so that the formed device 100 for detection of the Organic Light Emitting Diode packaging effect of present embodiment is higher with the similarity degree of organic light-emitting diode packaging structure.
In the present embodiment, described device 100 method for packing for detection of the Organic Light Emitting Diode packaging effect can be identical with the organic light-emitting diode packaging structure method for packing, be that organic light-emitting diode packaging structure is through what kind of technology encapsulation, the device 100 for detection of the Organic Light Emitting Diode packaging effect that present embodiment provides also encapsulates with identical technology, so that the formed device 100 for detection of the Organic Light Emitting Diode packaging effect of present embodiment is higher with the similarity degree of organic light-emitting diode packaging structure.
Need to prove, usually organic light-emitting diode packaging structure is by forming one by one little organic light-emitting diode packaging structure unit on whole the big substrate, another cuts down the single organic light-emitting diode packaging structure of formation, thereby the method for packing that the device 100 for detection of the Organic Light Emitting Diode packaging effect that provides of present embodiment also can not exclusively be similar to organic light-emitting diode packaging structure forms, but the single device 100 that is formed for detecting the Organic Light Emitting Diode packaging effect.
Concrete, in conjunction with reference to figure 1 and Fig. 2.At first please refer to Fig. 2, form the device 100 for detection of the Organic Light Emitting Diode packaging effect that present embodiment provides, substrate 110 can be provided earlier, described substrate 110 has above-mentioned various character.Form speculum surface layer 111 at substrate 110 then, the material of described speculum surface layer 111 can comprise silver, magnesium or other metal.120(please refer to Fig. 1 with cover plate) and substrate 110 pressings, and cover plate 120 has glue material 130 with the pressing all around of substrate 110 inside surfaces, and finally forms the device 100 for detection of the Organic Light Emitting Diode packaging effect shown in Fig. 1 by ultra-violet curing or laser clinkering.This mode has been avoided complicated whole surface glass manufacture craft, has saved the cost of manufacture for detection of the device 100 of Organic Light Emitting Diode packaging effect.But for guaranteeing that the device 100 for detection of the Organic Light Emitting Diode packaging effect that this method forms has higher similarity degree, when utilizing this method, guarantee each environmental baseline (for example as humidity and air pressure etc.), each technological parameter (institute's serviceability temperature when for example solidifying, set time, glue material 130 use amounts etc.) all identical, to reduce difference.
In the present embodiment, speculum surface layer 111 can be set at the inside surface of described substrate 110.By this speculum surface layer 111 is set, device 100 for detection of the Organic Light Emitting Diode packaging effect forms a kind of mirror case structure (the mirror case structure refers to transparent or translucent substrate 110 and the box like structure of cover plate 120 by 111 one-tenth of glue material 130 sealing metal specular layers), like this, just can directly see speculum surface layer 111(because substrate 110 and cover plate 120 all are transparent or translucent from device 100 outsides).
Owing to should all be structure, the character and measure-alike with the organic light-emitting diode packaging structure corresponding component for detection of substrate 110, cover plate 120 and glue material 130 of the device 100 of Organic Light Emitting Diode packaging effect, and should be for detection of the method for packing of the method for packing of the device 100 of Organic Light Emitting Diode packaging effect and organic light-emitting diode packaging structure also identical (or similar), thereby this sealing effectiveness for detection of the device 100 of Organic Light Emitting Diode packaging effect can embody the sealing effectiveness of organic light-emitting diode packaging structure.Thereby the available device 100 that is somebody's turn to do for detection of the Organic Light Emitting Diode packaging effect replaces organic light-emitting diode packaging structures carry out the sealing effectiveness detection of (also claiming packaging effect).
If should be good for detection of device 100 sealing states of Organic Light Emitting Diode packaging effect, then speculum surface layer 111 can keep good mirror status always, if and steam or oxygen enter into this for detection of device 100 inside of Organic Light Emitting Diode packaging effect, steam or oxygen will with speculum surface layer 111 in metal generation oxidation reaction, make that the mirror effect of speculum surface layer 111 is destroyed, cause speculum surface layer 111 to become transparent or translucent from mirror status.Thereby, when utilizing this device 100 for detection of the Organic Light Emitting Diode packaging effect to replace organic light-emitting diode packaging structure to carry out the sealing effectiveness detection, whether testing result intuitively draws easily, namely as long as with the naked eye observe the mirror status of speculum surface layer 111 destroyed.Simultaneously, utilizing this device 100 for detection of the Organic Light Emitting Diode packaging effect to replace organic light-emitting diode packaging structure to carry out sealing effectiveness detects, can produce organic light-emitting diode packaging structure, shorten sense cycle, improve detection efficiency.
That utilizes that present embodiment provides examines sheet (be first for detection of product) for detection of the device 100 of Organic Light Emitting Diode packaging effect as the head in the production run, whether can draw the organic light-emitting diode packaging structure sealing effectiveness that corresponding packaging technology made obtains very soon desirable, if undesirable then can in time adjust technology, avoid taking place large batch of product problem.
Detect more accurately sensitivity in order to make, present embodiment is preferred, described speculum surface layer 111 thickness of described device 100 for detection of the Organic Light Emitting Diode packaging effect are between 40nm ~ 300nm, in this thickness range, this speculum surface layer 111 can reach needed minute surface thickness, can reflect steam and the oxygen situation of described device 100 inside for detection of the Organic Light Emitting Diode packaging effect again more delicately.
In the present embodiment, preferred, described speculum surface layer is silver mirror surface layer or magnesium specular layer, selects these two kinds of metals that the advantage of two aspects is arranged, these two kinds of bright and clean lights of the formed minute surface of metal of aspect, and whether the very easy minute surface of observing out changes; These two kinds of metals itself cathodic metal material that is exactly organic LED display device on the other hand, thereby can utilize existing device and technology to form this speculum surface layer 111, provide cost savings.Further preferred, present embodiment can adopt the evaporation coating method of using in the OLED production run to form described speculum surface layer 111 in the inside surface of described substrate 110.
Need to prove, except the inside surface at substrate 110 forms the speculum surface layer 111, in other embodiments of the invention, speculum surface layer 111 also can be formed on cover plate 120 inside surfaces, perhaps also can form described speculum surface layer 111 at the inside surface of substrate 110 and cover plate 120 simultaneously.
Need to prove, in the present embodiment, described Organic Light Emitting Diode is active matrix organic light-emitting diode preferably, be that described organic light-emitting diode packaging structure is the active matrix organic light-emitting diode encapsulating structure, and described device 100 for detection of the Organic Light Emitting Diode packaging effect is for detecting the device 100 of active matrix organic light-emitting diode packaging effect.
The present invention also provides a kind of method for detection of the Organic Light Emitting Diode packaging effect, this method is utilized aforesaid device for detection of the Organic Light Emitting Diode packaging effect to substitute organic light-emitting diode packaging structure and is detected, and whether whether the destroyed organic light-emitting diode packaging structure that detects meets the requirements the mirror effect by described speculum surface layer.
Concrete, can put in the RA stove with the alternative organic light-emitting diode packaging structure of this device for detection of the Organic Light Emitting Diode packaging effect and (omit originally and will organic light-emitting diode packaging structure not put into the step of RA stove detection before, whether the speculum surface layer has problem to get final product only to need intuitively to observe before putting into), after placing a period of time under the hot and humid condition, take out, and whether destroy to detect this sealing effectiveness for detection of the device of Organic Light Emitting Diode packaging effect (or packaging effect) by detecting this speculum surface layer for detection of the device of Organic Light Emitting Diode packaging effect, from this sealing effectiveness for detection of the device of Organic Light Emitting Diode packaging effect, reflect the sealing effectiveness (or packaging effect) of organic light-emitting diode packaging structure.
The above only is specific embodiments of the invention; purpose is in order to make those skilled in the art better understand spirit of the present invention; yet protection scope of the present invention is not limited range with the specific descriptions of this specific embodiment; any those skilled in the art is in the scope that does not break away from spirit of the present invention; can make an amendment specific embodiments of the invention, and not break away from protection scope of the present invention.
Claims (10)
1. the device for detection of the Organic Light Emitting Diode packaging effect is characterized in that, comprising:
Substrate;
Cover plate, described cover plate and described substrate are oppositely arranged and are spaced;
The speculum surface layer, described speculum surface layer is formed at the inside surface of described substrate and/or described cover plate;
The glue material, described glue material is arranged on described cover plate and described substrate periphery, forms hermetically-sealed construction to encapsulate described substrate and described cover plate.
2. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, the thickness of described speculum surface layer is 40nm ~ 300nm.
3. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, described speculum surface layer is silver mirror surface layer or magnesium specular layer.
4. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, adopts evaporation coating method to form described speculum surface layer in the inside surface of described substrate and/or described cover plate.
5. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, Organic Light Emitting Diode is active matrix organic light-emitting diode.
6. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, the substrate manufacture material of described substrate and organic light-emitting diode packaging structure and measure-alike.
7. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, the encapsulation cover plate of described cover plate and organic light-emitting diode packaging structure is made material and measure-alike.
8. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, described glue material is identical with consumption with the packaging adhesive material making material of organic light-emitting diode packaging structure.
9. the device for detection of the Organic Light Emitting Diode packaging effect as claimed in claim 1 is characterized in that, described encapsulation is identical with the method for packing of organic light-emitting diode packaging structure.
10. method for detection of the Organic Light Emitting Diode packaging effect, it is characterized in that, utilize as the alternative organic light-emitting diode packaging structure of the described device for detection of the Organic Light Emitting Diode packaging effect of claim 1 to 9 detects, whether whether the destroyed organic light-emitting diode packaging structure that detects meets the requirements the mirror effect by described speculum surface layer.
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| CN2012105680125A CN103292961A (en) | 2012-12-24 | 2012-12-24 | Device and method for detecting encapsulation effect of organic light emitting diode |
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| CN2012105680125A CN103292961A (en) | 2012-12-24 | 2012-12-24 | Device and method for detecting encapsulation effect of organic light emitting diode |
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| CN103292961A true CN103292961A (en) | 2013-09-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137221A (en) * | 2019-04-26 | 2019-08-16 | 武汉华星光电半导体显示技术有限公司 | Verify structure and preparation method thereof |
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2012
- 2012-12-24 CN CN2012105680125A patent/CN103292961A/en active Pending
Non-Patent Citations (2)
| Title |
|---|
| R.S.KUMAR ET AL.: "Low moisture permeation measurement through polymer substrates for organic light emitting devices", 《THIN SOLID FILMS》, vol. 417, 31 December 2002 (2002-12-31), pages 120 - 126, XP004387719, DOI: doi:10.1016/S0040-6090(02)00584-9 * |
| STEFFEN HERGERT ET AL.: "Process development and accurate low-cost characterization for OLED sealants by using a calcium test", 《JOURNAL OF THE SID》, 15 June 2007 (2007-06-15), pages 421 - 429 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137221A (en) * | 2019-04-26 | 2019-08-16 | 武汉华星光电半导体显示技术有限公司 | Verify structure and preparation method thereof |
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Application publication date: 20130911 |