CN103290176B - A kind of multi irradiation laser-quenching method and device - Google Patents
A kind of multi irradiation laser-quenching method and device Download PDFInfo
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Abstract
The invention discloses a kind of laser-quenching method and device thereof.Single heating in existing laser-quenching technique is changed into repeatedly even high frequency time multi irradiation heating by the rapid scanning function that the inventive method adopts multi irradiation to add thermal bond tilting mirror, the heat transfer process that laser energy input causes is short heat-up time, multiple stacking mode is injected into workpiece surface, the laser energy cumulative rises that it makes metallic matrix absorb, the thermal conduction degree of depth also accumulates increase.Device comprises laser apparatus, Controlling System, light-conducting system, mechanical movement means and laser Machining head.Even if when processing parameter selects higher laser power, due to sweep velocity high and have irradiation interval exist, metallic surface temperature is controlled all the time below fusing point, make heat effectively, constantly can expand to inside workpiece from workpiece surface, thus under the prerequisite avoiding metallic surface to melt, improve the degree of depth in the austenitizing region of workpiece surface, and significantly improve laser quenching efficiency.
Description
Technical field
The invention belongs to laser surface strengthening treatment technology, relate to a kind of multi irradiation laser-quenching method and device.
Background technology
It is fast that laser quenching technology has speed of cooling, and do not need the feature of water or wet goods heat-eliminating medium, therefore this technique belongs to self-quench hardening technological process.
The relating to parameters such as thermal conduction characteristic, hardening capacity of the Cooling Velocity of Hardened Layer of Laser Quenching degree of depth and metal, also relevant with processing parameters such as adopted laser power, irradiation cycle, sweep velocity, spot sizes.For specific metallic substance, its austenitizing temperature T
awith melting temperature T
mbasicly stable, just change to some extent along with the fluctuation of overall homogeneity of ingredients and microstructure.Generally speaking, during laser quenching in metal works due to laser technical parameters and heat transfer process determine higher than austenitizing temperature T
athe conduction degree of depth just correspond to the degree of depth of Cooling Velocity of Hardened Layer of Laser Quenching.Usually, the LASER HEATING time is longer, or institute's input power density is higher, or the specific absorption of metallic substance to laser beam is higher, or the thermal diffusivity of metallic substance is larger, then metal inside temperature is higher, and darker between the surface region that can reach austenitizing temperature, the corresponding Cooling Velocity of Hardened Layer of Laser Quenching degree of depth is larger; After the material of required quenching is determined, laser hardening layer depth and laser power size, spot size, power density and action time length closely related.
In recent years, array laser quenching technology in constituency obtains applying more and more widely.To require to carry out hardening treatment to the whole surface of metal works different from general laser-quenching technique, precinct laser quenching technology is according to workpiece performance requriements, laser beam is adopted to carry out selective sclerosing process to material surface local, namely hardening region is not cover whole hardened layer, but form soft, firmly alternate composite hardening layer, or sclerosis array.This mode can make metal material surface have good wear resistance and obdurability concurrently.Current, the method realizing constituency array laser quench hardening technique is a lot, as adopt the mode of motion of multi-shaft interlocked control laser beam or workpiece progressively irradiation complete, or adopt pulse laser to export the mode combined with controlling machine bed motion track to realize.Wherein, pulse laser quenching mode can utilize the shutoff effect of switch power supply directly to export pulse laser, also can utilize chopper disk that continuous laser beam is changed into pulse mode, and rear a kind of mode requires higher to the Control system resolution of laser hardening machine.In addition, constituency array laser quenching strengthening can also adopt continuous laser to be scanned by mask, now only metal works can be made to be subject to hot quenching through the position of laser, the masked position sheltered from is then without quenching effect, be characterized in that technique is simple, do not need complicated Controlling System and programming process, but working (machining) efficiency is relatively low.Must be pointed out, no matter any mode, existing laser quenching mode all adopts laser beam single irradiation mode of quenching to carry out.
Because laser-quenching technique method requires that workpiece surface does not melt substantially, and the movement velocity of lathe is general lower, therefore existing laser beam single irradiated heat mode is adopted, no matter be the quenching of laser laser heating or pulsed laser heating quenching mode, the laser power used and power density all can not be too high, and laser quenching speed also must control in lower scope.Add the restriction of metallic substance thermal conduction characteristic and hardening capacity, therefore the Cooling Velocity of Hardened Layer of Laser Quenching degree of depth relatively shallow (generally lower than 1mm), laser quenching production efficiency cannot effectively improve.
Can therefore, develop novel laser surface hardening technology and method, increase substantially speed and the production efficiency of constituency array laser quenching method, can become this technology one of the gordian technique difficult problem expanding industrial application further.
Summary of the invention
In order to solve the difficult problem that existing laser quenching technology production efficiency is lower and case depth is more shallow, the invention provides a kind of multi irradiation laser-quenching method, the method can increase substantially production efficiency and the case depth of laser quenching; Present invention also offers the device realizing the method.
A kind of laser-quenching method provided by the invention, after laser beam is passed through laser Machining head by the method, irradiation is to workpiece surface, a machining cell on the corresponding workpiece of each laser beam that laser Machining head exports, each laser beam carries out intermittent type multi irradiation to corresponding machining cell, make the austenitizing temperature of laser quenching region higher than workpiece material of workpiece surface, but all the time lower than the fusing point of its workpiece material, and utilize the cumulative heating effect of laser repeatedly Repeat-heating to form Laser Hardened Layer, and reach required case depth; Described machining cell refers to when not moving laser Machining head position and the location of workpiece, by laser beam by irradiation after laser Machining head to workpiece surface and one-time continuous acts on the region of workpiece surface.
As the improvement of above-mentioned technological method, the method completes laser quenching by controlling laser-quenching technique parameter, laser-quenching technique parameter comprises laser power, spot size, irradiation cycle and umber of exposures etc., wherein, irradiation cycle refer to the laser beam of setting to the one-time continuous irradiated heat time of a machining cell and one time off time sum; Umber of exposures instigates a machining cell to reach the number of times that required case depth carries out multi irradiation.
As the further improvement of above-mentioned technological method, when needs quench unit fill continuously could cover whole region to be quenched time, described laser-quenching technique parameter also comprises relative moving speed, and it refers to light beam from a quench unit to the speed of another quench unit movement; When adopting the mode of the non-fixed point irradiation of laser beam to carry out laser quenching, described laser-quenching technique parameter also comprises sweep velocity, and sweep velocity refers to the movement velocity obtained at workpiece surface that laser beam causes because scanning mirror rotates.
As the further improvement of above-mentioned technological method, it is characterized in that, the method comprises following concrete steps:
(1) quench unit on workpiece is established to add up to N, when the sequence number of quench unit on workpiece of pre-treatment is j, the laser beam quantity that present laser processing head exports is G, machining cell quantity in sequence number j quench unit is G, quench cycle is T, umber of exposures in a quench unit needed for each machining cell is Q, and the parameter of actual umber of exposures is q;
Quench cycle T refers to the product of umber of exposures and irradiation cycle needed for each machining cell in a quench unit; Quench unit refers in the set of a quench cycle T inner laser bundle at the machining cell of workpiece surface irradiation;
Make j=1, q=1; And the basic uniformity of Laser beam energy distribution in whole laser quenching process in a machining cell;
(2) G the laser beam exported after laser Machining head be the zero position of G machining cell accordingly in irradiation to a jth quench unit respectively, and to record this time point be t
0; Described laser beam correspondingly carries out an irradiation to each machining cell in quench unit, enters (3) after completing;
(3) judge whether q equals the umber of exposures Q set, if so, then a jth quench unit quenching is complete, all machining cell generation laser transformation hardenings namely comprised in a jth quench unit, and reach designed case depth, then proceed to step (4); If not, make q=q+1, if current time is t, irradiation cycle T
b, work as t-t
0=T
btime, proceed to step (2);
(4) judge whether j equals N.If so, then all quench unit generation laser transformation hardenings comprised are described, form laser quenching hardening region, and reach designed case depth, then proceed to step (5); If not, make j=j+1, proceed to step (2);
(5) terminate.
As the further improvement of technique scheme, if quench unit adds up to N on workpiece, when the sequence number of the quench unit of pre-treatment is j, the laser beam quantity that present laser processing head exports is G, machining cell quantity in sequence number j quench unit is G, if the umber of exposures needed for quench unit is Q, quench cycle is T, and the parameter of actual umber of exposures is q; Relative moving speed between setting workpiece and mechanical motion mechanism (comprising laser Machining head) is v, and the compensating motion speed of laser Machining head outgoing laser beam is-v; Wherein, quench cycle T refers to the product of umber of exposures in a quench unit and irradiation cycle, and quench unit refers in the set of a quench cycle T inner laser bundle at the machining cell of workpiece surface irradiation;
(1) j=1 is made, q=1;
(2) zero position of corresponding G machining cell in G the laser beam irradiation exported after laser Machining head to a jth quench unit, and to record this sart point in time be t
0; Described laser beam also carries out the motion of flight Contrary compensation with speed-v, enters (3) after completing while carrying out single irradiation according to the machining cell of design and the irradiation parameters of setting to each machining cell in a jth quench unit; The basic uniformity of Laser beam energy distribution in laser irradiation process in a machining cell;
(3) judge whether q equals the scanning times Q set, if so, then a jth quench unit quenching is complete, all machining cell generation laser transformation hardenings namely comprised in this quench unit, and reach designed case depth, then proceed to step (4); If not, make q=q+1, if current time is t, the setting scanning period is T
b, work as t-t
0=T
btime, proceed to step (2);
The time of the machining cell in quench unit being carried out to an irradiation just in time equals an irradiation cycle T
bif also do not arrive an irradiation cycle T
b, then need to wait for, when meeting t-t
0=T
btime just start the laser quenching process of multi irradiation formula flight next time;
(4) judge whether j equals N, if so, then all quench unit all quench complete, and namely all quench unit all laser transformation hardening occur, and form Cooling Velocity of Hardened Layer of Laser Quenching, and reach designed case depth; Then step (5) is entered, otherwise, make j=j+1, proceed to step (2);
(5) terminate.
Further improve as another of above-mentioned technological method, when laser power is 200-20000W, spot size is 0.4-50mm, and sweep velocity is 80-8000mm/s, and machining cell is of a size of 0.3-50000mm
2, umber of exposures is 2-8000, LASER HEATING time t
1for 1-8000ms, machining gap time t
2for 1-8000ms, quench cycle T is 2-150000ms.
When laser power is 1000-15000, spot size is 1.5-35mm, and sweep velocity is 150-5000mm/s, and machining cell is of a size of 1-10000mm
2, umber of exposures is 2-4000, LASER HEATING time t
1for 1-1000ms, machining gap time t
2for 1-1000ms, quench cycle T is 2-20000ms.
When laser power is 1500-10000W, spot size is 2-20mm, and sweep velocity is 200-5000mm/s, and machining cell is of a size of 10-5000mm
2, umber of exposures is 2-1000, LASER HEATING time t
1for 1-500ms, machining gap time t
2for 1-500ms, quench cycle T is 2-1000ms.
When laser power is 2000-8000W, spot size is 3-10mm, and sweep velocity is 230-5000mm/s, and machining cell is of a size of 15-3000mm
2, umber of exposures is 2-800, LASER HEATING time t
1for 1-400ms, machining gap time t
2for 1-400ms, quench cycle T is 2-800ms.
A kind of device realizing above-mentioned laser-quenching method provided by the invention, this device comprises laser apparatus, Controlling System, light-conducting system, mechanical movement means and laser Machining head;
Laser apparatus realizes light path by light-conducting system and laser Machining head and is connected; Controlling System and laser apparatus, mechanical movement means and laser Machining head are that electrical signal is connected, and control its work, and mechanical movement means drives laser Machining head or workpiece to move thereupon.
Described tilting mirror adopts preceding focus tilting mirror form or rearmounted f-θ type to focus on tilting mirror.Described laser apparatus is optical fiber laser, semiconductor laser, YAG laser, disc-type laser apparatus or CO
2laser apparatus.
Described laser Machining head is provided with optical splitter, and this optical splitter comprises the first support and the second support, is provided with the microscope base axle that can rotate between two stands, microscope base axle is installed with successively first step spectroscope to M level spectroscope, and whole level speculum; It is 1 that first step spectroscope and the reflection and transmission ratio of M level spectroscope to laser beam are the reflection and transmission ratio of 1: 1, the i-th grade of spectroscope to laser beam: (M+1-i), i=2,3 ..., M.
The inventive method adopts the heating of pulse multi irradiation or multi irradiation to fill the laser quenching mode of heating, even high frequency time multi irradiation heating is changed into repeatedly in single heating in existing laser-quenching technique, laser energy is injected into workpiece surface in the mode of short period of time heating, multiple stacking, the laser energy cumulative rises that metallic matrix is absorbed, be characterized in: can prevent workpiece surface from melting because of overheated on the one hand, the surface high-temp continued on the other hand makes the thermal conduction degree of depth increase considerably.Therefore, even if when selecting higher laser power, due to the existence of high sweep velocity, short heat-up time and time sweep hold-off, metallic surface temperature is controlled all the time below fusing point, guarantee that the energy that laser inputs constantly can be transmitted to inside workpiece from workpiece surface effectively with heat exchange pattern simultaneously, thus under the prerequisite avoiding metallic surface to melt, improve the degree of depth in workpiece surface austenitizing region, and significantly improve laser quenching production efficiency.Specifically, technical characteristics of the present invention is:
(1) the present invention can adopt a laser beam to carry out laser quenching to a machining cell, and two or more laser beam also can be adopted to carry out laser quenching to plural machining cell.
(2) laser Machining head of apparatus of the present invention can be the laser Machining head that normal optical focuses on, and also can be rotary mirror type laser Machining head, can also be the multiple beam output type laser Machining head being integrated with optical splitter.Apparatus of the present invention can adopt above-mentioned more than one laser Machining head.
(3) existing single laser irradiation quenching technology is changed into multi irradiation heating laser quenching technology, by selecting suitable laser-quenching technique parameter (comprising laser power, sweep velocity, spot size, irradiation cycle and umber of exposures etc.), the workpiece surface top temperature that the laser total energy of actual injection and heat accumulation is caused, lower than the melting temperature of metallic substance, avoids metallic surface, because of the energy of hyperabsorption in the short period of time, obvious melting phenomenon occurs.
(4) multi irradiation laser-quenching technique provided by the invention, its spot size need not be defined as minimum focal beam spot, but according to the actual requirement of workpiece, can adjust in wider scope, be so also conducive to improving laser quenching efficiency and case depth.
(5) when adopting flight quenching technology, the motion delay that mechanical movement means frequent start-stop causes can be avoided, can effectively improve laser quenching efficiency.
(6) compared to prior art, the inventive method, under the condition of same laser power, can significantly improve the degree of depth of laser quenching; Or adopt higher laser power, with under identical case depth condition within the identical cool time, significantly improve laser quenching efficiency.Therefore, the present invention can break through the restriction of laser power, sweep velocity and laser power density under existing laser-quenching technique (single laser irradiation quenching technology) condition, the technical problem such as the case depth solving existing laser quenching is limited, production efficiency is on the low side.
Tilting mirror can realize the high-speed sweep of light beam, the inventive method is made to ensure under the infusible prerequisite of surface of workpiece, adopt high-power laser beam to carry out high-speed sweep to metal material surface and be heated as possibility, thus laser quenching production efficiency can be significantly improved.
Beam of laser can be divided into the multiple laser of energy even by optical splitter, is conducive to carrying out laser quenching to multiple machining cell simultaneously, thus improves the efficiency of laser quenching.
In sum, multi irradiation laser-quenching method provided by the invention, existing single laser irradiated heat mode is changed over laser irradiation type of heating repeatedly, change the heat transfer process of existing laser-quenching technique, avoid and easily cause the phenomenons such as metal material surface melts, case depth is shallow because adopt during high power density laser quenching, the degree of depth and the efficiency of laser quenching can be significantly improved, effectively solve the technical barrier that existing laser-quenching technique production efficiency is low.The present invention can adopt multiple beam to carry out laser quenching to multiple machining cell simultaneously, can improve efficiency and the quenching quality of laser quenching further.
Accompanying drawing explanation
The structural representation of the optical splitter that Fig. 1 uses for example of the present invention.
The structural representation of the tilting mirror of the type of focusing after the f-θ type that Fig. 2 uses for example of the present invention.
The structural representation of the tilting mirror of the preceding focus mirror form that Fig. 3 uses for example of the present invention.
Fig. 4 is laser irradiation period definition schematic diagram of the present invention.
Fig. 5 is multi irradiation laser-quenching apparatus principle schematic of the present invention.
The structural representation of the reflect focalization laser Machining head that Fig. 6 uses for example of the present invention.
Fig. 7 is embodiment 2 machine tool guideway multi irradiation formula flight laser-quenching technique application principle schematic diagram.
Fig. 8 is the relation curve principle schematic of umber of exposures and laser power in the laser quenching of example 4 multi irradiation.
Fig. 9 is the relation curve principle schematic of umber of exposures and case depth in the laser quenching of example 4 multi irradiation.
Embodiment
The inventive method adopts the heating of pulse multi irradiation or multi irradiation to fill the laser quenching mode of heating, change existing single laser irradiation quenching method into intermittent type multi irradiation quenching method, by controlling laser multi irradiation to the heat-up time of machining cell, intermittent time and umber of exposures, increase the laser total energy of injection and workpiece surface is rapidly heated, but temperature controls all the time under fusing point, interstitial laser is relied on to add thermogenetic cumulative heating effect and obtain darker hardened layer by heat conducting mode, make superpower, high sweep velocity laser quenching mode is achieved, and darker hardened layer can be obtained.In addition, the inventive method, in conjunction with the high-speed sweep function of tilting mirror, can carry out the laser quenching of scanning filling formula to larger sized machining cell.
Described laser-quenching method comprises multi irradiation laser-quenching method and multi irradiation formula flight laser-quenching method.
In order to more clearly embodiments of the present invention are described, when this, relational language of the present invention is defined as follows: machining cell: when not moving laser Machining head position and the location of workpiece, by laser beam by irradiation after laser Machining head to workpiece surface and the region that one-time continuous acts on workpiece surface is referred to as machining cell.Laser beam energy distribution in a machining cell should uniformity substantially.Described laser Machining head position is not moved and is referred to that laser Machining head integral position does not move, and when the structure of laser Machining head is rotary mirror type structure, in laser Machining head, the deflection behavior of tilting mirror is not included.Described machining cell directly can be obtained by laser beam irradiation of fixing a point, and its size equals the size of workpiece surface laser facula; Described machining cell also can be filled by laser beam flying and be obtained, and now the size of machining cell is greater than the size of workpiece surface laser facula.
Irradiation cycle: refer to that the laser beam of setting carries out one-time continuous irradiated heat time (t to the workpiece surface in a machining cell inner laser spot size
1) with one time off time (t
2) sum, be designated as T
b.Quench unit: in an irradiation cycle, the set of the machining cell of the laser beam institute irradiation of setting.A quench unit can comprise one or more machining cell.
Umber of exposures: be the number of times of instigating a quench unit to reach required case depth to need repetitive irradiation, be designated as Q.Quench cycle: refer to the umber of exposures of each machining cell and the product of irradiation cycle in a quench unit, be designated as T.
Sweep velocity: refer to the movement velocity obtained at workpiece surface that laser beam causes because scanning mirror rotates.Sweep velocity is a kinematic parameter of laser beam when adopting scanning mirror to carry out multi irradiation laser quenching to the mode that machining cell carries out scanning filling, when adopting the mode of laser beam fixed point irradiation processing unit to carry out multi irradiation laser quenching, do not comprise this kinematic parameter of sweep velocity.(adding segmentation carriage return herein)
Relative moving speed: when workpiece comprises multiple quench unit, laser beam needs to move from a quench unit to another quench unit, distance between the irradiation zero position that the value of relative moving speed equals adjacent two quench unit is divided by the required time, and this required time refers to the time that the irradiation zero position moving to next quench unit from the irradiation zero position of a quench unit spends.Relative moving speed both can drive laser Machining head to move by mechanical motion mechanism, also can be that mechanical motion mechanism drives workpiece motion s, can also be that the mode of the arbitrary combination motion between said two devices realizes.When relative movement is for moving continuously, relative moving speed refers to the real time kinematics speed of workpiece or laser Machining head entirety in quenching process; When relative movement is non-continuous movement, relative moving speed refers to the average translational speed of workpiece or laser Machining head entirety in quenching process.
In the present invention, the basic uniformity of Laser beam energy distribution in a machining cell, laser beam carries out intermittent type multi irradiation to each machining cell, make the laser total energy injected in each machining cell can not cause workpiece surface rapid melting because of heat accumulation, but utilize the cumulative heating effect of heating for multiple times to form Laser Hardened Layer, and reach desired depth.
Multi irradiation laser-quenching method of the present invention can adopt following detailed process to realize:
(1) quench unit on workpiece is established to add up to N, when the sequence number of quench unit on workpiece of pre-treatment is j, the laser beam quantity that present laser processing head exports is G, G be more than or equal to 1 positive integer, machining cell quantity in sequence number j quench unit is G, quench cycle is T, and umber of exposures required in a quench unit is Q, and the parameter of actual umber of exposures is q;
Make j=1, q=1; And the basic uniformity of Laser beam energy distribution in whole laser quenching process in a machining cell;
(2) zero position of corresponding G machining cell in G the laser beam irradiation exported after laser Machining head to a jth quench unit, and to record this time point be t
0; Described laser beam carries out an irradiation to each machining cell in quench unit, enters (3) after completing;
(3) judge whether q equals the umber of exposures Q set, if so, then a jth quench unit quenching is complete, namely comprised all machining cell generation laser transformation hardenings, and reaches designed case depth, then proceeds to step (4); If not, make q=q+1, if current time is t, irradiation cycle T
b, work as t-t
0during=Tb, proceed to step (2);
The time of quench unit being carried out to an irradiation just in time equals an irradiation cycle T
b, then start immediately to carry out irradiation next time to quench unit, if also do not arrive an irradiation cycle T
b, then need to wait for, when meeting t-t
0=T
btime just start irradiation quenching process next time.
(4) judge whether j equals N, if so, then all quench unit generation laser transformation hardenings comprised are described, form laser quenching hardening region, and reach designed case depth, then proceed to step (5); If not, make j=j+1, proceed to step (2);
(5) terminate.
Above-mentioned steps (1), the laser beam the present invention inciding laser Machining head is referred to as incoming laser beam, the beam sizes of incoming laser beam must be less than or equal to the light inlet size of laser Machining head, and when the actual laser power size adopted depends on the power density that the highest of adopted laser apparatus, optical mirror slip, tilting mirror can bear and laser quenching, the power density that fusing can be born does not occur workpiece substantially; The energy distribution pattern of incoming laser beam can be gaussian model or flat-top pattern, and the laser beam of flat-top pattern is conducive to the homogeneity ensureing hardening depth and hardness, improves the quality of laser quenching.After laser Machining head, irradiation is referred to as outgoing laser beam to laser beam the present invention of workpiece surface, and the machining cell quantity of primary quenching of the present invention is identical with the quantity of described outgoing laser beam.When the quantity of described outgoing laser beam is for the moment, a corresponding incoming laser beam (laser apparatus).When the quantity of described outgoing laser beam is more than two or two, both can corresponding two or more incoming laser beam; Also can a corresponding incoming laser beam, now need to adopt optical splitter a branch of incident laser to be divided into the multiple laser of energy even.
Adopt optical splitter to carry out even light splitting to laser beam, laser quenching can be carried out to multiple machining cell simultaneously.Figure 1 shows that a kind of Pyatyi optical splitter formation schematic diagram of the present invention, described optical splitter comprises the first support 6.20 and the second support 6.30, rotary microscope base axle 6.26 is installed between two stands, microscope base axle 6.26 has fixedly mounted one-level spectroscope 6.28, secondary light-splitting mirror 6.25, three grades of spectroscopes 6.24, level Four spectroscope 6.23, Pyatyi spectroscope 6.22 and whole level speculum 6.21.The reflection and transmission ratio of one-level spectroscope 6.28 and Pyatyi spectroscope 6.22 pairs of laser beams is 1
:1, the reflection and transmission ratio of secondary light-splitting mirror 6.25 pairs of laser beams is the reflection and transmission ratio of 1: 4, three grades of spectroscopes, 6.24 pairs of laser beams is 1: 3, and the reflection and transmission ratio of level Four spectroscope 6.23 pairs of laser beams is 1: 2.
Incoming laser beam 6.4 is divided into reflected beam 6.27 and transmitted light beam 6.29 through one-level spectroscope 6.28, and the laser beam that reflected beam 6.27 obtains five beam energy equalizations successively altogether after secondary light-splitting mirror 6.25, three grades of spectroscopes 6.24, level Four spectroscope 6.23, Pyatyi spectroscope 6.22 and whole level speculum 6.21 is acted on workpiece by each light-emitting window.Transmitted light beam 6.29 is divided into five road laser beams of energy equalization to be acted on workpiece by each light-emitting window in the same fashion.The microscope base axle 6.26 of described optical splitter can rotate under driven by motor, realizes the swing of multi-laser beam.
Step (2) described laser beam carries out irradiation according to the processing parameter of setting, and described processing parameter comprises: the lasing time t in laser power, spot size, sweep velocity, machining cell size, a machining cell
1with the processing intermittent time t in a machining cell
2deng.The size of described machining cell can be identical with the laser spot size of workpiece surface, also can obtain larger sized machining cell by rotating mirror scanning.
Tilting mirror structure of the present invention can be that rearmounted f-θ type focuses on tilting mirror, also can be preceding focus tilting mirror structure formation.As shown in Figure 2, rearmounted f-θ type focusing scanning tilting mirror comprises Z axis motor 6.16, Z axis tilting mirror 6.17, Y-axis tilting mirror 6.13, y-axis motor 6.18 and rearmounted f-θ condenser lens 6.11; Incoming laser beam 6.4 is after the beat of Z axis tilting mirror 6.17 and Y-axis tilting mirror 6.13, scanning area 6.19 is obtained at focussing plane 6.10 place after being focused on by f-θ lens 6.11 again, wherein, Z axis motor 6.16 drives Z axis tilting mirror 6.17, y-axis motor 6.18 drives Y-axis tilting mirror 6.13, under the quick deflection driven of tilting mirror, laser beam is driven to carry out large-scale scanning machining.Wherein, the f-θ lens 6.11 of rear focus version are through the optical mirror slip of optimizing structure design, it can effective compensation process zone central part and edge because the difference of the spot size brought of path difference or energy density, improve the consistence of tilting mirror field sweep scope inner laser power density.
As shown in Figure 3, preceding focus scanning mirror comprises preceding focus mirror 6.14, Z axis motor 6.16, Z axis tilting mirror 6.17, Y-axis tilting mirror 6.13, y-axis motor 6.18 and protective glass 6.12; Z axis tilting mirror 6.17 is arranged on Z axis motor 6.16, and Y-axis tilting mirror 6.13 is arranged on y-axis motor 6.18, and preceding focus mirror 6.14 is arranged in the light path of incoming laser beam 6.4, and protective glass 6.12 is arranged on the emitting light path of Y-axis tilting mirror 6.13.
The difference of two kinds of structure formations is; preceding focus scanning mirror structure (Fig. 3) is control incoming laser beam 6.4 being realized after preceding focus mirror 6.14 focuses on beam scanning motion again by rotating mirror scanning; bright dipping place of tilting mirror is provided with protective glass 6.12, and there is no f-θ type condensing lens.Described preceding focus mirror 6.14 can be normal optical condensing lens, also can be that light beam focuses on shaping mirror.Light beam focus on the effect of shaping mirror be to laser beam carry out focusings process while, be also the laser beam of energy even by the laser beam reshaping of gaussian model or other non-uniform pattern, to obtain the laser quenching hot spot of required flat-top pattern.
The described laser spot size obtained at workpiece surface after laser Machining head generally required for workpiece the area size of laser quenching select, can be the small light spot at focused spot place, also can adopt the comparatively large spot of out of focus.For circular light spot, spot size refers to its diameter, the hot spot of rectangle or other shape, then can represent by the length of side.
The corresponding laser processing figure of machining cell, laser processing figure can be point, line, surface figure, also can be the camber line of other arbitrary shapes, line segment, circle, rectangle, square or trilateral etc.
Quench unit can be single machining cell, also can be the combination of multiple machining cell, and the figure that quench unit is formed can be complex combination figure or other arbitrary graphic of the graphics processing composition that above-mentioned machining cell is corresponding.It can be discrete, continuous print or staggered between them.Laser processing figure corresponding to machining cell can be formed by scanning filling, also can be formed by the direct irradiation of focal beam spot.When the unit figure that laser processing figure is discrete, if this unit figure is the figure fitted like a glove with laser facula, then do not need to fill to laser processing figure, only need laser facula overlapping irradiation just can make this machining cell generation laser transformation hardening for Q time, and reach designed case depth.For other laser processing figure, comprise constituency array, line style or face type, all need to carry out scanning filling and just can realize.
As previously mentioned, irradiation cycle T
bbe the single machining cell of laser beam irradiation a heat-up time and one time off time sum, the laser irradiation cycle as shown in Figure 4, irradiation cycle T
bin LASER HEATING time t
1, processing intermittent time t
2be defined as follows: t
1be the lasing time in a machining cell, t
2for the processing intermittent time before laser next time this machining cell of irradiation.In other words, for certain machining cell, irradiation cycle T
bequal t
1+ t
2.
Irradiation process in quench unit can be mode that is continuous or pulse.Utilize the high sweep velocity feature of tilting mirror, rapid scanning can be carried out to the machining cell of large-size, be conducive to adopting higher laser power and relative moving speed, to improve the efficiency of laser quenching.
The key of the inventive method is by multi irradiation process, can adopt higher laser power, higher sweep velocity carries out laser quenching, and is guaranteeing the hardened layer obtaining the larger degree of depth under the prerequisite of obviously fusing does not occur workpiece surface.Or under the prerequisite that case depth is identical, obtain higher laser quenching working (machining) efficiency.Technician can according to the material category of required quenching workpiece, and kind and the power of purposes and institute's use laser apparatus select suitable processing parameter.
The laser apparatus that the inventive method adopts can be optical fiber laser, semiconductor laser, YAG laser, disc-type laser apparatus or CO
2laser apparatus.
As employing CO
2when laser apparatus carries out laser quenching, need at the special CO of workpiece surface spraying
2laser quenching light absorption paint is (as SiO
2coating, graphite paint or other is to 10.6 μm of CO
2the coating etc. that laser absorption rate is high), after the light absorption paint drying of workpiece surface, then carry out laser quenching.When adopting optical fiber laser, semiconductor laser, video disc laser apparatus or YAG laser to carry out laser quenching, both the pretreatment process of spraying dedicated suction optical coating can have been adopted to carry out laser quenching, also can any light absorption paint, directly laser quenching is carried out to workpiece.
When the workpiece quenched to needing big area carries out multi irradiation laser quenching, in order to avoid the motion delay that mechanical movement means frequent start-stop causes, multi irradiation formula flight laser-quenching method can be adopted, can effectively improve laser processing efficiency.
So-called multi irradiation formula flight laser-quenching technique requires to meet two conditions simultaneously: first is keep continuous print relative movement form with relative moving speed v between workpiece and laser Machining head entirety, and second is that laser beam keeps the quenching mode of multi irradiation to quench unit.For meeting above-mentioned requirements simultaneously, the laser beam needing laser Machining head to export compensates motion when multi irradiation, detailed process is described as follows: when the laser beam that laser Machining head exports carries out multi irradiation quenching to certain quench unit in quench cycle T, move continuously with relative moving speed v between workpiece and laser Machining head entirety, the laser beam that now laser Machining head exports also needs to carry out Contrary compensation motion with the speed of-v in quench cycle T, and repeat said process again jumped to next quench unit before next quench cycle T starts after.Like this, just can guarantee that the effect that laser Machining head obtains time static with laser Machining head to the actual effect of workpiece surface enforcement multi irradiation quenching in flight course is identical, and turn avoid the frequent start-stop of lathe, thus the production efficiency of laser quenching can be improved further.Relative movement during multi irradiation formula flight laser quenching both can be workpiece motion s, also can be laser Machining head motion under other running gear (the present invention is referred to as mechanical motion mechanism) drives, also comprise the two to move simultaneously, as long as the position relationship between workpiece and laser Machining head there occurs relative displacement, just need to carry out real-Time Compensation to moving coordinate, and calculate flight compensation jump distance.The compensating motion speed of laser Machining head outgoing laser beam is numerically equal to relative moving speed, contrary on direction.
If wherein the coordinate at workpiece or mechanical motion mechanism place is reference frame, be designated as (X, Y), the coordinate at another place is moving coordinate system, is set to (U, V), if t workpiece and mechanical motion mechanism are respectively v at x, y direction relative moving speed
xt, v
yt, for any one machining cell, first point acted on by the central point of laser facula on machining cell is called reference point A, the t of machining cell
0the reference point in moment is A
0, the reference point of t is A
t.Known, t
0the initial point of moment fixed coordinate system (X, Y) and moving coordinate system (U, V) overlaps, therefore, and t
0moment machining cell mid point A
0the coordinates of motion (U
a0, V
a0) with fixed coordinate system in coordinate (X
t0, Y
t0) overlap, formula I can be expressed as:
T (t > t
0) after the moment, the reference point A in moving coordinate system and fixed coordinate system
toverlap again, the reference point A of t machining cell
tcompensation coordinate (X
t, T
t) be formula II:
In practical application, workpiece and mechanical motion mechanism can be made only in x-axis or y-axis generation relative movement, then formula II can be reduced to formula III:
Formula III is the irradiation coordinate calculation formula of multi irradiation formula flight laser quenching, t (t > t
0) moment flight compensate jump distance be:
Specifically, when adopting multi irradiation formula flight laser quenching technology, the inventive method specifically comprises the steps:
(1) establish quench unit on workpiece to add up to N, when the sequence number of quench unit on workpiece of pre-treatment is j, the laser beam quantity that present laser processing head exports is the machining cell quantity in G, sequence number j quench unit is G, and irradiation cycle is T
bquench cycle is T, and umber of exposures required in a quench unit is Q, and the parameter of actual umber of exposures is q, carry out relative movement with relative moving speed v between setting workpiece and laser Machining head entirety, the compensating motion speed of setting laser processing head outgoing laser beam is-v;
Make j=1, q=1; And the basic uniformity of Laser beam energy distribution in whole laser quenching process in a machining cell;
(2) zero position of G laser beam irradiation corresponding G machining cell in a jth quench unit of the output after laser Machining head, and to record this time point be t
0; While described laser beam carries out an irradiation to each machining cell in quench unit, also carry out the motion of flight Contrary compensation with speed-v, enter after completing (3);
(3) set current time as t, judge whether q equals the umber of exposures Q set;
If, then a jth quench unit quenching is complete, namely comprised all machining cell generation laser transformation hardenings, and reach designed case depth, now a quench cycle T is just in time equaled to the time that quench unit j carries out irradiation, laser beam jumps to next quench unit immediately, and jump distance equals formula IV and compensates jump distance in the flight that the T moment calculates, and then proceeds to step (4);
If not, make q=q+1, now t-t
0=T
b, the time of the machining cell in quench unit being carried out to an irradiation just in time equals an irradiation cycle T
b, laser beam jumps to first machining cell from last machining cell immediately, and jump distance equals formula IV at T
bthe flight that moment calculates compensates jump distance, and starts to carry out the laser quenching of multi irradiation flight next time to quench unit.If also do not arrive an irradiation cycle T
b, then need to wait for, when meeting t-t
0=T
btime just start the laser quenching process of multi irradiation formula flight next time, then proceed to step (2);
(4) judge whether j equals N, if so, then illustrate that all quench unit comprised all have realized laser quenching sclerosis, form laser quenching hardening region, and reach designed case depth, then proceed to step (5); If not, make j=j+1, proceed to step (2);
(5) terminate.
No matter whether the inventive method utilize flight compensation technique, its essence is and utilize single beam laser or multiple laser, correspondingly the quenching of intermittent type multi irradiation is carried out to single machining cell or multiple machining cell, make the laser total energy injected in each machining cell can not cause workpiece surface rapid melting, but utilize the cumulative heating effect of heating for multiple times to form Laser Hardened Layer, and reach desired depth.As long as the laser-quenching technique parameter that can realize the program may be used to realize the inventive method.Generally speaking, when laser power is 200-20000W, spot size is 0.4-50mm, and sweep velocity is 80-8000mm/s, and machining cell is of a size of 0.3-50000mm
2, umber of exposures is 2-8000, LASER HEATING time t
1for 1-8000ms, machining gap time t
2for 1-8000ms, quench cycle T is 2-150000ms.When laser power is 1000-15000, spot size is 1.5-35mm, and sweep velocity is 150-5000mm/s, and machining cell is of a size of 1-10000mm
2, umber of exposures is 2-4000, LASER HEATING time t
1for 1-1000ms, machining gap time t
2for 1-1000ms, quench cycle T is 2-20000ms.When laser power is 1500-10000W, spot size is 2-20mm, and sweep velocity is 200-5000mm/s, and machining cell is of a size of 10-5000mm
2, umber of exposures is 2-1000, LASER HEATING time t
1for 1-500ms, machining gap time t
2for 1-500ms, quench cycle T is 2-1000ms.When laser power is 2000-8000W, spot size is 3-10mm, and sweep velocity is 230-5000mm/s, and machining cell is of a size of 15-3000mm
2, umber of exposures is 2-800, LASER HEATING time t
1for 1-400ms, machining gap time t
2for 1-400ms, quench cycle T is 2-800ms.
As shown in Figure 5, apparatus of the present invention comprise laser apparatus 1, Controlling System 3, light-conducting system 4, mechanical movement means 5 and laser Machining head 6.Wherein, laser apparatus 1 realizes light path by light-conducting system 4 with laser Machining head 6 and is connected; Controlling System 3 is connected for electrical signal with laser apparatus 1, mechanical movement means 5 and laser Machining head 6, controls its work.Mechanical movement means 5 drives laser Machining head 6 or workpiece 8 to move thereupon.
Described laser Machining head can be typical reflection focusing structure form, and also can adopt the reflect focalization laser Machining head of example of the present invention as shown in Figure 6, it comprises casing 6.0,45 ° of speculums 6.1, rotating mechanism 6.2, reflect focalization mirror 6.5, motor 6.6 and light-emitting window 6.7.45 ° of speculums 6.1 and reflect focalization mirror 6.5 staggered relatively in casing 6.0, and reflect focalization mirror 6.5 is connected with the rotation axis of motor 6.6, casing 6.0 also has light-emitting window 6.7, make incoming laser beam 6.4 after 45 ° of speculums 6.1 and reflect focalization mirror 6.5 from light-emitting window 6.7 out after irradiation to workpiece surface.Reflect focalization mirror 6.5 can rotate around horizontal optical axis under the drive of motor 6.6, thus outgoing laser beam is deflected.Casing 6.0 is arranged on rotating mechanism 6.2, makes it can horizontally rotate with rotating mechanism 6.2.Laser Machining head shown in Fig. 6 is connected with the moving parts of lathe by connection mechanism 6.3.
Described laser Machining head also can be tilting mirror structure as shown in Figures 2 and 3.
Described laser Machining head also can using the part of the optical splitter shown in Fig. 1 as structure.
Mechanical movement means 5 can be the running gears such as machine tool, numerically-controlled machine or articulated robot (mechanical arm), and the requirement lathe according to reality processing can adopt single shaft or multi-shaft interlocked form.
Light-conducting system 4 can be ferry optical transmission system, the hard light path light-conducting system that also can be made up of optical mirror slip group.Light-conducting system 4 by the beam transmission of laser apparatus 1 to the light inlet of laser Machining head 6.
Described laser apparatus is optical fiber laser, semiconductor laser, YAG laser, disc-type laser apparatus or CO
2laser apparatus.
The use procedure of apparatus of the present invention is:
Step one, adjusts to the top of workpiece 8 by laser Machining head 6, by light-conducting system, the laser beam that laser apparatus 1 exports is conducted to the light inlet of laser Machining head 6.
Step 2, under the prerequisite of not outgoing laser beam, confirms that the laser through laser Machining head (comprises machining cell size, umber of exposures, t according to the parameter of Programming
1, t
2, irradiation cycle) whether the machining cell that obtains or quench unit be consistent with design.
Step 3, opens laser apparatus 1, according to the laser-quenching technique parameter of setting, carries out the laser quenching of multi irradiation formula, obtains a laser quenching unit at workpiece surface.
Step 4, mechanical movement means 5 drives laser Machining head 6 to move under control of the control system, makes the laser beam irradiation of its outgoing to the next quench unit of workpiece surface;
Step 5, repeating step three to step 4, until all quench unit of traversal workpiece surface, obtains laser phase-change quenching layer at workpiece surface.
The present invention can carry out laser quenching strengthening to workpiece such as large mould, machine tool guideway, large size bearing seat ring and rail, and significantly improves the degree of depth of laser quenching, or increases substantially the efficiency of laser quenching.Or while increasing substantially the laser quenching degree of depth, significantly enhance productivity.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.It should be noted that at this, the explanation for these embodiments understands the present invention for helping, but does not form limitation of the invention.In addition, if below in described each embodiment of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
Embodiment 1: the application of constituency multi irradiation laser-quenching technique in vehicle mould laser quenching.
The present embodiment adopts semiconductor laser to carry out constituency array laser quenching to the vehicle mould of 50CrMnMo material, four bundle laser are exported from four laser apparatus, the power of every Shu Jiguang is 1500W, the spot size of described four bundle laser on workpiece is Φ 7mm, and being arranged as 1 × 4 array of spacing 3.5mm, the size of machining cell is identical with the array of input laser beam hot spot with array.T
1for 0.008s, t
2for 0.004s, umber of exposures is 131, and quench cycle is 1.57s, and relative moving speed is 960mm/min.Depth of hardening 1.0mm.
Conventional laser quenching method adopts single beam to carry out the quenching of single continuous laser to single machining cell, laser power 1200W, spot diameter Φ 7mm, and the cool time is 1.0s, the depth of hardening 0.8mm obtained.
For this workpiece, the laser quenching time needed for the quenching of the present embodiment hot spot is about 1.6 times of existing technique, and depth of hardening is about 1.25 times of existing technique.
Embodiment 2: the application of multi irradiation formula flight laser-quenching technique in constituency in machine tool guideway laser quenching.
In order to solve the low problem of discrete sclerosis figure laser quenching efficiency, the present invention proposes a kind of constituency multi irradiation formula flight laser-quenching method, specifically comprise three kinds of forms, that is: workpiece fix, laser processing cephalomotor flight formula multi irradiation laser-quenching method; Laser Machining head is fixed, the flight formula multi irradiation laser-quenching method of workpiece motion s; The flight formula multi irradiation laser-quenching method that workpiece and laser Machining head move all mutually.
The laser quenching of discrete constituency array multi irradiation flight formula is carried out to 40Cr machine tool guideway elongated metal parts surface, fibre laser power 6000W, by optical splitter, the beam of laser that laser apparatus exports is divided into five bundle laser of energy even, the power of every Shu Jiguang is 1200W, the spot size of described five bundle laser is 6mm × 6mm, and being arranged as 1 × 5 array of spacing 3mm, the size of machining cell is identical with the array of input laser beam with array.T
1for 0.009s, t
2for 0.003s, laser irradiation number of times is 58 times, and the time of quench cycle T is 0.7s, and relative moving speed during flight quenching is 2570mm/min, the compensation speed of laser Machining head outgoing laser beam is-2570mm/min, and the maximum case depth obtained is 0.8mm.The optimizing technology parameters that existing single exposure spots configuration laser-quenching technique adopts such as five bundle laser powers are 900W (total laser power 4500W), spot size is 6mm × 6mm, spacing between 1 × 5 array is 3mm, the single hot spot cool time is 1.25s, the relative moving speed (V-bar) of five hot spot dot matrix quenchings is simultaneously 1250mm/min, the case depth 0.8mm obtained.
Total process period needed for the present embodiment is about 1/2 of existing technique.
As shown in Figure 7, numerical control laser processing system comprises industrial robot (mechanical arm) 51, external movement X-axis parts 50, ferry optical transmission system 52, beam-expanding system 54 and laser Machining head 6 in the application of multi irradiation formula flight laser-quenching technique in machine tool guideway.Industrial robot (mechanical arm) 51 is fixed on external movement X-axis parts 50, and laser Machining head 6 is fixed on the forearm 53 of industrial robot (mechanical arm) 51.Laser beam enters laser Machining head 6 through ferry optical transmission system 52 and beam-expanding system 54.During laser quenching, each kinematic axis of industrial robot (mechanical arm) 51 is set in a fixed position, external movement X-axis parts 50 drive industrial robot (mechanical arm) 51 and laser Machining head 6 to move, and the laser that laser Machining head 6 exports carries out multi irradiation formula flight laser quenching to machine tool guideway 55.
Embodiment 3: the application of multi irradiation laser-quenching technique in large mould
The present embodiment adopts the CO of 10.6 μm
2laser apparatus carries out laser quenching to the large mould that 50CrNiMo material is made, and spot size is Φ 7mm, laser power 6000W, the machining cell obtained by tilting mirror is of a size of 7mm × 35mm, the sweep velocity of machining cell inner laser is 500mm/s, and umber of exposures is 17 times, t
1for 0.07s, t
2for 0.09s, the time of quench cycle T is 2.72s, relative moving speed 350mm/min, and the direction vector of relative moving speed is vertical with the length direction of machining cell, and single track quenching can obtain the wide hardened area of 35mm, amount of lap 2mm.Before laser quenching, first at the special SiO of workpiece surface spraying
2light absorption paint, carries out follow-up laser quenching again after the light absorption paint drying of workpiece surface.By rotating mirror scanning fill method, the case depth obtained is 0.8mm.
Amount of lap refers to that adjacent two quench unit produce the width of drawing effect.Amount of lap can be 0 to 3mm.
Under this power and hot spot condition, according to existing technology, the running gear of conventional machine tool generally cannot reach so high sweep velocity, therefore cannot realize the high power laser light quenching of 6000W.In order to ensure that workpiece surface melting phenomenon does not occur, lower laser power must be adopted to quench.The optimizing technology parameters that existing technique adopts is: spot size is Φ 7mm, and laser power is 1200W, relative moving speed 350mm/min, and single track quenching can only obtain the wide hardened area of 7mm, and amount of lap is 1mm.First at the special SiO of workpiece surface spraying
2light absorption paint, carries out follow-up laser quenching again after the light absorption paint drying of workpiece surface, and an irradiation quenches the case depth 0.8mm obtained.
The total working (machining) efficiency of the present embodiment is about 5 times of existing technique.
Embodiment 4:
The present embodiment adopts optical fiber laser to carry out multi irradiation laser quenching to 42CrMo gear, and spot size is Φ 6mm, and the machining cell obtained by tilting mirror is of a size of 12mm × 22mm, and the sweep velocity of machining cell inner laser is 4000mm/s, t
1=0.011s, t
2=0.016s, the processing parameter that rotating mirror scanning adopts when filling multi irradiation laser quenching is as follows: laser power scope 2000W ~ 6000W, umber of exposures scope 50 ~ 1200, quench cycle scope 1.35s ~ 32.4s, relative mobility speed ranges 22mm/min ~ 533mm/min.Corresponding depth of hardening scope is 0.64mm ~ 2.1mm.
The impact of processing parameter on case depth is as shown in table 1.Laser power has material impact to umber of exposures, and as shown in Figure 8, laser power is elevated to 6000W from 2000W, and the umber of exposures of multi irradiation laser quenching is reduced to 50 from 1200, and relative moving speed brings up to 533mm/min from 22mm/min.When identical with above-mentioned parameter, to the affecting laws of case depth as shown in Figure 9, umber of exposures is reduced to 50 from 1200 to umber of exposures, and corresponding laser hardening layer depth is reduced to 0.64mm by 2.1mm.The direction vector of relative moving speed is vertical with the length direction of machining cell, and single track quenching can obtain the wide hardened area of 22mm,
Typically, when the first workpiece to certain material carries out quench treatment, sample can be utilized or after laser quenching is carried out to quench unit some on workpiece, check whether roughness and the case depth on workpiece quenching hardened layer surface reach technical requirements, if it is confirm that the processing parameter adopted is reasonable, otherwise can parameter adjustment be carried out, until meet the demands, to obtain processing parameter accurately.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the content disclosed in this embodiment and accompanying drawing.The equivalence completed under not departing from spirit disclosed in this invention so every or amendment, all fall into the scope of protection of the invention.
The processing parameter of table 1. embodiment 4 on the impact of case depth as rule
Claims (7)
1. a multi irradiation laser-quenching method, the method carries out laser quenching by controlling laser-quenching technique parameter, after laser beam is passed through laser Machining head, irradiation is to workpiece surface, laser beam carries out intermittent type multi irradiation to each machining cell, make the austenitizing temperature of laser quenching region higher than workpiece material of workpiece surface, but all the time lower than the fusing point of its workpiece material, and utilize the cumulative heating effect of laser repeatedly Repeat-heating to form Laser Hardened Layer, and reach required case depth;
Described machining cell refers to when not moving laser Machining head position and the location of workpiece, by laser beam by irradiation after laser Machining head to workpiece surface and one-time continuous acts on the region of workpiece surface; Irradiation cycle refer to the laser beam of setting to the one-time continuous irradiated heat time of a machining cell and one time off time sum; Umber of exposures instigates a quench unit to reach the number of times that required case depth carries out multi irradiation;
Described laser-quenching technique parameter refers to: laser power is 200-20000W, and spot size is 0.4-50mm; Sweep velocity is 80-8000mm/s, and machining cell is of a size of 0.3-50000mm
2, umber of exposures is 2-8000, LASER HEATING time t
1for 1-8000ms, machining gap time t
2for 1-8000ms, quench cycle T is 2-150000ms;
In whole quench treatment process, the heating of pulse multi irradiation or multi irradiation is adopted to fill the laser quenching mode of heating, multi irradiation heating is changed in single heating in existing laser-quenching technique, by controlling laser multi irradiation to the laser power of machining cell, sweep velocity, spot size, irradiation cycle and umber of exposures and LASER HEATING time, the form that laser energy is able to short period of time heating and multiple stacking is constantly injected into surface of workpiece by thermal conduction, increase the laser total energy of injection and surface of workpiece is rapidly heated, make the austenitizing temperature of laser quenching region higher than metal work piece materials of surface of workpiece, but temperature controls all the time under fusing point, interstitial laser is relied on to add thermogenetic cumulative heating effect and obtain darker hardened layer by heat conducting mode, complete overall laser transformation hardening technique thus, and improve the production efficiency of laser quenching.
2. multi irradiation laser-quenching method according to claim 1, it is characterized in that, when needs quench unit fill continuously could cover whole region to be quenched time, described laser-quenching technique parameter also comprises relative moving speed, and it refers to light beam from a quench unit to the speed of another quench unit movement; When adopting the mode of the non-fixed point irradiation of laser beam to carry out laser quenching, described laser-quenching technique parameter also comprises sweep velocity, and sweep velocity refers to the movement velocity obtained at workpiece surface that laser beam causes because scanning mirror rotates.
3. multi irradiation laser-quenching method according to claim 1, is characterized in that, the method comprises following concrete steps:
(1) establish quench unit on workpiece to add up to N, when the sequence number of quench unit on workpiece of pre-treatment is j, quench cycle is T, and umber of exposures required in a quench unit is Q, and the parameter of actual umber of exposures is q;
Quench cycle T refers to the product of umber of exposures in a quench unit and irradiation cycle; Quench unit refers in the set of a quench cycle T inner laser bundle at the machining cell of workpiece surface irradiation;
Make j=1, q=1; And the basic uniformity of Laser beam energy distribution in whole laser quenching process in a machining cell;
(2) laser beam irradiation after laser Machining head is to the zero position of a jth quench unit, and to record this time point be t
0; Described laser beam carries out an irradiation to each machining cell in quench unit, enters (3) after completing;
(3) judge whether q equals the umber of exposures Q set, if so, then a jth quench unit quenching is complete, all machining cell generation laser transformation hardenings namely comprised in a jth quench unit, and reach designed case depth, then proceed to step (4); If not, make q=q+1, if current time is t, irradiation cycle T
b, work as t-t
0=T
btime, proceed to step (2);
(4) judge whether j equals N, if so, then all quench unit generation laser transformation hardenings comprised are described, form laser quenching hardening region, and reach designed case depth, then proceed to step (5); If not, make j=j+1, proceed to step (2);
(5) terminate.
4. multi irradiation laser-quenching method according to claim 1, if quench unit adds up to N on workpiece, when the sequence number of the quench unit of pre-treatment is j, if the umber of exposures needed for quench unit is Q, quench cycle is T, and the parameter of actual umber of exposures is q; Relative moving speed between setting workpiece and the mechanical motion mechanism comprising laser processing is v, and the compensating motion speed of laser Machining head outgoing laser beam is-v; Wherein, quench cycle T refers to the product of umber of exposures in a quench unit and irradiation cycle, and quench unit refers in the set of a quench cycle T inner laser bundle at the machining cell of workpiece surface irradiation;
(1) j=1 is made, q=1;
(2) irradiation is to the zero position of a jth quench unit after laser Machining head for laser beam, and to record this sart point in time be t
0; Described laser beam also carries out the motion of flight Contrary compensation with speed-v, enters (3) after completing while carrying out single irradiation according to the machining cell of design and the irradiation speed of setting to each machining cell in a jth quench unit; The basic uniformity of Laser beam energy distribution in laser irradiation process in a machining cell;
(3) judge whether q equals the umber of exposures Q set, if so, then a jth quench unit quenching is complete, all machining cell generation laser transformation hardenings namely comprised in this quench unit, and reach designed case depth, then proceed to step (4); If not, make q=q+1, if current time is t, setting irradiation cycle is T
b, work as t-t
0=T
btime, proceed to step (2);
The time of quench unit being carried out to an irradiation just in time equals an irradiation cycle T
b, then laser beam jumps to first machining cell from last machining cell immediately, and jump distance equals formula IV at T
bthe flight that moment calculates compensates jump distance, and starts to carry out the laser quenching of multi irradiation flight next time, if also do not arrive an irradiation cycle T to quench unit
b, then need to wait for, when meeting t-t
0=T
btime just start the laser quenching process of multi irradiation formula flight next time;
(4) judge whether j equals N, if so, then all quench unit all quench complete, and namely all quench unit all laser transformation hardening occur, and form Cooling Velocity of Hardened Layer of Laser Quenching, and reach designed case depth; Then step (5) is entered, otherwise, make j=j+1, proceed to step (2);
(5) terminate.
5., according to described multi irradiation laser-quenching method arbitrary in Claims 1-4, it is characterized in that,
Described laser power is 1000-15000, and spot size is 1.5-35mm, and sweep velocity is 150-5000mm/s, and machining cell is of a size of 1-10000mm
2, umber of exposures is 2-4000, LASER HEATING time t
1for 1-1000ms, machining gap time t
2for 1-1000ms, quench cycle T is 2-20000ms.
6., according to described multi irradiation laser-quenching method arbitrary in Claims 1-4, it is characterized in that,
Described laser power is 1500-10000W, and spot size is 2-20mm, and sweep velocity is 200-5000mm/s, and machining cell is of a size of 10-5000mm
2, umber of exposures is 2-1000, LASER HEATING time t
1for 1-500ms, machining gap time t
2for 1-500ms, quench cycle T is 2-1000ms.
7., according to described multi irradiation laser-quenching method arbitrary in Claims 1-4, it is characterized in that,
Described laser power is 2000-8000W, and spot size is 3-10mm, and sweep velocity is 230-5000mm/s, and machining cell is of a size of 15-3000mm
2, umber of exposures is 2-800, LASER HEATING time t
1for 1-400ms, machining gap time t
2for 1-400ms, quench cycle T is 2-800ms.
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| CN109593919B (en) * | 2018-12-18 | 2020-04-17 | 中国船舶重工集团公司第七二五研究所 | Bearing surface laser quenching device and method based on distributed three-dimensional light beam scanning |
| CN113720841B (en) * | 2021-08-25 | 2024-02-09 | 武汉飞能达激光技术有限公司 | Laser quenching quality monitoring method and application thereof |
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| JPS5798620A (en) * | 1980-12-08 | 1982-06-18 | Agency Of Ind Science & Technol | Laser working device |
| JPS5891117A (en) * | 1981-11-26 | 1983-05-31 | Toshiba Corp | Heat treating method |
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2013
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101403030A (en) * | 2008-03-10 | 2009-04-08 | 华中科技大学 | On-line laser machining apparatus for strengthening and toughening treatment of steel rail surface |
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Effective date of registration: 20180402 Address after: 436070 Ezhou city Gedian Development Zone No. 1 Industrial Zone entrepreneurship service center in Hubei Patentee after: Wuhan Hanhai Intelligent Laser Engineering Co. Ltd. Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: Huazhong University of Science and Technology |