Summary of the invention
In order to achieve the above object, the invention provides a kind of ceramic heating flake that is applicable to the liquid heating, it is adjusted by the concrete component to ceramic substrate, makes substrate be fit to heating plate more and uses, thereby make heating plate have the advantage that the efficiency of heating surface is higher, working life is longer.
The technical scheme that the present invention adopts for its technical problem of solution is:
A kind of ceramic heating flake that is applicable to the liquid heating, comprise ceramic substrate and the silk-screen heating circuit on ceramic substrate, described ceramic substrate adopts mixed powder to form by the step of pulverizing, oven dry, spreading, stirring and curtain coating, the weight proportion of described mixed powder is: aluminium oxide 84-89%, silica 1 .8-2.8%, talcum powder 4.5-6.5%, clay 5.5-7.5%, total amount satisfies 100%.
Wherein, adopt ball-milling method in the step of pulverizing, the weight proportion of mixed powder, ball, water is (1-1.8): (1.5-2.): 1.
The step of spreading is divided into thick rolling and smart step of rolling over, and in thick step of rolling over, the component weight proportion of the adhesive that adopts is: polydiene alcohol 15-18%, and ethylene glycol 1.5-1.8%, glycerine 7-11%, water 64-74%, alcohol 5.5-6.5%, total amount satisfies 100%.
The material that the heating circuit adopts is the refractory metal resistance slurry.
Described refractory metal resistance slurry is, but is not limited to: tungsten manganese, molybdenum manganese, nickel, silver-colored palladium wherein a kind of.
Ceramic heating flake has the ceramic substrate of heating circuit and a ceramic substrate that does not print the heating circuit to be overrided to form by a single face silk-screen, and the heating circuit sealing is between two ceramic substrates.
Ceramic heating flake by two or above single face silk-screen have the ceramic substrate of heating circuit and one the ceramic substrate of printing heating circuit be overrided to form successively, the heating circuit sealing is between two adjacent ceramic substrates.
The diameter of section size of described heating circuit is the 3-5 micron.
The heating circuit with rule close around mode on ceramic substrate, form intensive hot zone, ceramic substrate is provided with the lead solder-joint that connects external power source for the heating circuit, lead solder-joint is provided with the insulation-encapsulated material, be provided with interval region between lead solder-joint and the intensive hot zone, the insulation-encapsulated material concentrates on lead solder-joint and the interval region.
The invention has the beneficial effects as follows: the present invention is based on the environment for use of this heating plate and characteristics the proportioning of ceramic substrate is designed, make the ceramic substrate that generates all make moderate progress at aspects such as intensity, anti-solidity, also can keep reliability of structure even be immersed in the medium-term and long-term work of liquid, experiment showed, that can reach more than 10000 hours its useful life.
When further on ceramic substrate, interval region being set, the heat that produces on the intensive hot zone can be avoided being directly delivered on the insulated enclosure material, the stability of insulated enclosure material is better, thereby makes that the overall sealing performance of heating plate is more perfect, and working life is longer.
Embodiment
Ceramic heating flake of the present invention can be applied on the various liquid heating apparatus, as pot-type boiler, add hot water tap etc.During concrete the application, the heating plate of some quantity is plugged on the erector, then this erector is installed on the equipment of required heating to use.Because the employed material of this heating plate is nonmetal, so in heating process not can with water in material produce reaction, thereby solve the problem of heater surfaces fouling, so just can not surrounded by the dirt layer because of the surface, cause conduction of velocity and the efficient of the heat of electric heating piece, heat utilization ratio, energy savings that heater produces can be improved greatly, the useful life of heater can also be prolonged.
Ceramic heating flake comprises ceramic substrate and the silk-screen heating circuit on ceramic substrate, and the material that the circuit that wherein generates heat adopts is the refractory metal resistance slurry, and the high-temperature metal resistance slurry is, but is not limited to: tungsten manganese, molybdenum manganese, nickel, silver-colored palladium wherein a kind of.
Ceramic substrate adopts mixed powder to form by the step of pulverizing, oven dry, spreading, stirring and curtain coating, the weight proportion of described mixed powder is: aluminium oxide 84-89%, silica 1 .8-2.8%, talcum powder 4.5-6.5%, clay 5.5-7.5%, total amount satisfies 100%.Adopt ball-milling method in the step of pulverizing, the weight proportion of mixed powder, ball, water is (1-1.8): (1.5-2.): 1.The step of spreading is divided into thick rolling and smart step of rolling over, and in thick step of rolling over, the component weight proportion of the adhesive that adopts is: polydiene alcohol 15-18%, and ethylene glycol 1.5-1.8%, glycerine 7-11%, water 64-74%, alcohol 5.5-6.5%, total amount satisfies 100%.
In different embodiment, the structure of ceramic heating flake can be different.In the structure of double-layer ceramic heating plate, ceramic heating flake has the ceramic substrate of heating circuit and a ceramic substrate that does not print the heating circuit to be overrided to form by a single face silk-screen, and the heating circuit sealing is between two ceramic substrates.In the structure of multi-layer ceramics heating plate, ceramic heating flake by two or above single face silk-screen have the ceramic substrate of heating circuit and one the ceramic substrate of printing heating circuit be overrided to form successively, the heating circuit sealing is between two adjacent ceramic substrates.Laminate and need carry out under certain pressure and temperature, under hydrogen shield, the percent by volume of hydrogen is 30%-100%, the percent by volume of nitrogen is 70%--0%, according to the binder removal sintering curve of setting, the highlyest forms at common sintering more than 1600 ℃.Said structure all makes the heating circuit seal fully, the oxidation of having no chance forever, thereby stable work in work, and the life-span is long; And the thickness of whole heating sheet has only the thickness of 1.3-4mm, makes its two-sided heating in the course of the work, and its heat can be brought into play rapidly, behind the disconnected power down source, also can cool off rapidly, just can not cause the hysteresis heat excessive when equipment uses like this.
As shown in Figure 1, heating circuit of the present invention adopts the mode winding of rule distribution on ceramic substrate.Consider the safety of use, the diameter of section of heating circuit of the present invention is generally controlled between the 3-5 micron, the value when this diameter of section is converted into circular that periphery equates for the size of mean value of the periphery of the major part of heating circuit-line.Even the heating plate fracture, the short circuit current that the heating circuit produces in liquid also can be restricted, and institute's electric current of letting out is fully within the human body safe range; Can not produce human body is damaged.
In order further to guarantee the reliability of heating plate, as shown in Figure 1, the heating circuit with rule close around mode on ceramic substrate, form intensive hot zone 1, ceramic substrate is provided with the lead solder-joint 2 that connects external power source for the heating circuit, lead solder-joint 2 is provided with the insulation-encapsulated material, be provided with interval region 3 between lead solder-joint 2 and the intensive hot zone 1, the insulation-encapsulated material concentrates on lead solder-joint 2 and the interval region 3.This set makes the heat that produces on the intensive hot zone 1 can avoid being directly delivered on the insulated enclosure material, and the stability of insulated enclosure material is better, thereby makes that the overall sealing performance of heating plate is more perfect, and working life is longer.
Below specifically making of ceramic substrate being enumerated embodiment describes.
Embodiment 1
Aluminium oxide, silicon dioxide, talcum powder, clay mixing are obtained mixed powder, and the weight proportion of mixed powder is: aluminium oxide 84%, silicon dioxide 2.8%, talcum powder 6.5%, clay 6.7%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.5:1; To the powder oven dry after pulverizing; Powder is slightly rolled over, and the component weight proportion of the adhesive that adopts is: polydiene alcohol 15%, ethylene glycol 1.8%, glycerine 11%, water 66.7%, alcohol 5.5%; Powder is carried out essence rolles over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 2
Aluminium oxide, silicon dioxide, talcum powder, clay mixing are obtained mixed powder, and the weight proportion of mixed powder is: aluminium oxide 89%, silica 1 .8%, talcum powder 4.5%, clay 4.7%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1.8:2:1; To the powder oven dry after pulverizing; Powder is slightly rolled over, and the component weight proportion of the adhesive that adopts is: polydiene alcohol 18%, ethylene glycol 1.5%, glycerine 7%, water 67%, alcohol 6.5%; Powder is carried out essence rolles over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 3
Aluminium oxide, silicon dioxide, talcum powder, clay mixing are obtained mixed powder, and the weight proportion of mixed powder is: aluminium oxide 86%, silicon dioxide 2%, talcum powder 6.5%, clay 5.5%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1.3:1.8:1; To the powder oven dry after pulverizing; Powder is slightly rolled over, and the component weight proportion of the adhesive that adopts is: polydiene alcohol 17%, ethylene glycol 2%, glycerine 9%, water 66%, alcohol 6%; Powder is carried out essence rolles over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 4
Aluminium oxide, silicon dioxide, talcum powder, clay mixing are obtained mixed powder, and the weight proportion of mixed powder is: aluminium oxide 85%, silicon dioxide 2%, talcum powder 5.5%, clay 7.5%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.7:1; To the powder oven dry after pulverizing; Powder is slightly rolled over, and the component weight proportion of the adhesive that adopts is: polydiene alcohol 18%, ethylene glycol 1.8%, glycerine 10.7%, water 64%, alcohol 5.5%; Powder is carried out essence rolles over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 5
Aluminium oxide, silicon dioxide, talcum powder, clay mixing are obtained mixed powder, and the weight proportion of mixed powder is: aluminium oxide 87.5%, silicon dioxide 2%, talcum powder 4.5%, clay 6%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.5:1; To the powder oven dry after pulverizing; Powder is slightly rolled over, and the component weight proportion of the adhesive that adopts is: polydiene alcohol 15%, ethylene glycol 1.5%, glycerine 7%, water 71%, alcohol 5.5%; Powder is carried out essence rolles over; Stir, enter curtain coating and make ceramic substrate.