CN103279178A - Server and integral computer cabinet with same - Google Patents
Server and integral computer cabinet with same Download PDFInfo
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- CN103279178A CN103279178A CN2013102195692A CN201310219569A CN103279178A CN 103279178 A CN103279178 A CN 103279178A CN 2013102195692 A CN2013102195692 A CN 2013102195692A CN 201310219569 A CN201310219569 A CN 201310219569A CN 103279178 A CN103279178 A CN 103279178A
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Abstract
The invention discloses a server and an integral computer cabinet with the same. The server comprises a casing, a mainboard, a CPU (central processing unit) and a radiating component, wherein the mainboard is arranged in the casing, the CPU is arranged on the mainboard, and the bottom of the radiating component is attached on the CPU while the top of the radiating component is attached on the top wall of the casing. According to the server, the radiating component comprises radiators and flexible heat-conducting materials. The lower surfaces of the radiators are attached on the CPU, for example, the radiators can be detachably arranged on the mainboard through screws, the lower surfaces of the radiators are closely attached to the upper surface of the CPU at the moment, and accordingly heat-conducting effect can be increased.
Description
Technical field
The present invention relates to data center's technical field, especially relate to a kind of server and have the complete machine cabinet of this server.
Background technology
In traditional server, the radiating mode of CPU is realized by heating radiator and fan, but this traditional radiating mode still can not satisfy the heat radiation requirement of CPU well.In order to improve the cooling effect of CPU, two kinds of solutions are arranged at present: 1) improve rotation speed of the fan merely, reduce cpu temperature; 2) adopt the wind scooper design, bring more cold wind to CPU.
But above-mentioned first kind of mode directly increased the energy consumption of fan, the cost height, and the above-mentioned second way has increased the complicacy of server architecture, has increased the layout difficulty of inner each parts of server.
Summary of the invention
The present invention is intended to solve at least one of technical matters that exists in the prior art.
For this reason, one object of the present invention is to propose a kind of server, the perfect heat-dissipating of this server, simple in structure, cost is low.
Another object of the present invention is to propose a kind of complete machine cabinet, and this complete machine cabinet adopts above-mentioned server, and the integral heat sink performance of this complete machine cabinet is good thus.
Server according to first aspect present invention embodiment comprises: housing; Mainboard, described mainboard are located in the described housing; CPU, described CPU are located on the described mainboard; And radiating subassembly, the bottom of described radiating subassembly is fitted on the described CPU, and the top of described radiating subassembly is fitted on the roof of described housing.
According to the server of the embodiment of the invention, radiating subassembly comprises heating radiator and flexible Heat Conduction Material.The lower surface of heating radiator is fitted on the CPU, and for example, heating radiator can removably be located on the mainboard by screw, and the lower surface of heating radiator and the upper surface of CPU fit tightly at this moment, can increase heat-transfer effect like this.
In addition, according to the server of the embodiment of the invention, can also have following additional technical feature:
According to one embodiment of present invention, described radiating subassembly comprises:
Heating radiator, the lower surface of described heating radiator are fitted on the described CPU; And
Flexible Heat Conduction Material, described Heat Conduction Material is located between the upper surface and described roof of described heating radiator.
Because Heat Conduction Material is flexible, therefore convenient when the cap of housing is installed, simultaneously roof and heating radiator have certain squeezing action to Heat Conduction Material, have increased the tightness degree that Heat Conduction Material and heating radiator contact with roof, thereby have improved heat transfer efficiency.
According to one embodiment of present invention, described heating radiator removably is located on the described mainboard.
According to one embodiment of present invention, described Heat Conduction Material is heat conductive silica gel.Because silicone grease has splendid thermal conductivity, electrical insulating property and stability in use and resistant of high or low temperature, therefore the radiating effect that heat conductive silica gel has not only increased CPU greatly is set, also avoid taking place simultaneously line short.
According to one embodiment of present invention, described radiating subassembly is a plurality of and is evenly distributed on the described CPU.Can further improve the cooling effect to CPU like this.
According to one embodiment of present invention, the outside wall surface of described roof is provided with upwardly extending heat radiator, described heat radiator be positioned at described radiating subassembly directly over.
Further increase area of dissipation thus, be convenient to heat in time, shed from roof efficiently, particularly remarkable to the lifting of CPU cooling effect.
According to one embodiment of present invention, described heat radiator is a plurality of and even distribution.
According to one embodiment of present invention, the described heat radiator straight line that makes progress extends; Perhaps the described heat radiator curve that makes progress extends.
According to one embodiment of present invention, the top of described heating radiator has formed bearing frame, the open-top of described bearing frame, and wherein said Heat Conduction Material is located in the described bearing frame.Realize fixing to Heat Conduction Material thus, avoided Heat Conduction Material between heating radiator and roof, to remove, influenced the cooling effect of CPU.In this embodiment, the inner bottom surface of bearing frame is the upper surface of heating radiator.
Complete machine cabinet according to second aspect present invention embodiment comprises: cabinet; And at least one server, described server is located in the described cabinet, and described server is the server of the above-mentioned first aspect embodiment according to the present invention.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the synoptic diagram of server according to an embodiment of the invention.
Description of reference numerals:
Housing 1, the roof 11 of housing, the diapire 12 of housing;
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, be intended to for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center "; " vertically "; " laterally "; " length "; " width "; " thickness ", " on ", D score, " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", close the orientation of indications such as " counterclockwise " or position is based on orientation shown in the drawings or position relation, only be that the present invention for convenience of description and simplification are described, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used for describing purpose, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the invention, the implication of " a plurality of " is two or more, unless clear and definite concrete restriction is arranged in addition.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, broad understanding should be done in terms such as term " installation ", " linking to each other ", " connection ", " fixing ", for example, can be fixedly connected, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can link to each other indirectly by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand above-mentioned term concrete implication in the present invention as the case may be.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, first feature second feature it " on " or D score can comprise that first and second features directly contact, can comprise that also first and second features are not directly contacts but by the contact of the additional features between them.And, first feature second feature " on ", " top " and " above " comprise first feature directly over second feature and oblique upper, or only represent that the first characteristic level height is higher than second feature.First feature second feature " under ", " below " and " below " comprise first feature under second feature and tiltedly, or only represent that the first characteristic level height is less than second feature.
The application is based on the inventor to the cognitive of the following fact and finds: server 100 is important component parts of complete machine cabinet, server 100 comprises housing 1 and is arranged on mainboard 2 in the housing 1, CPU, hard disk, parts such as fan, the upper surface of CPU is provided with heating radiator 3 and is used for heat radiation, the inventor finds, there is a fixed difference difference between the roof 11 of server 100 housings 1 and the upper surface of heating radiator 3, the inventor finds by a large amount of experiments, the temperature difference between the roof 11 of server 100 housings 1 and the upper surface of heating radiator 3 is generally at 10 ℃-26 ℃, therefore the inventor is higher than the temperature of CPU(CPU the temperature of heating radiator 3) be connected to housing 1 roof 11 indirectly, thus find that CPU has obtained beyond thought cooling effect.
Below with reference to the server 100 of Fig. 1 description according to the embodiment of the invention.
Wherein, housing 1 can form cuboid, and housing 1 is metal shell.Mainboard 2 is located in the housing 1, and mainboard 2 can be fixed on the diapire 12 of housing 1 by screw, and CPU is located on the mainboard 2.Radiating subassembly is located in the housing 1, the bottom of radiating subassembly is fitted on the CPU, the top of radiating subassembly is fitted on the roof 11 of housing 1, CPU links to each other with the roof 11 of housing 1 indirectly like this, at least a portion in the heat that CPU work produces can be passed to the lower housing of temperature 1 roof 11 by radiating subassembly, and sheds from roof 11.
According to one embodiment of present invention, radiating subassembly comprises heating radiator 3 and flexible Heat Conduction Material 4.The lower surface of heating radiator 3 is fitted on the CPU, and for example, heating radiator 3 can removably be located on the mainboard 2 by screw, and the lower surface of heating radiator 3 and the upper surface of CPU fit tightly at this moment, can increase heat-transfer effect like this.
Flexible Heat Conduction Material 4 is located between the upper surface and housing 1 roof 11 of heating radiator 3.Because Heat Conduction Material 4 is flexible, therefore convenient when the cap of housing 1 is installed, simultaneously roof 11 has certain squeezing action with 3 pairs of Heat Conduction Materials 4 of heating radiator, has increased the tightness degree that Heat Conduction Material 4 and heating radiator 3 contact with roof 11, thereby has improved heat transfer efficiency.
Preferably, Heat Conduction Material 4 can be heat conductive silica gel.Because silica gel has splendid thermal conductivity, electrical insulating property and stability in use and resistant of high or low temperature, therefore the radiating effect that heat conductive silica gel has not only increased CPU greatly is set, also avoid taking place simultaneously line short.
According to one embodiment of present invention, radiating subassembly is a plurality of and is evenly distributed on the CPU.Can further improve the cooling effect to CPU like this.
According to one embodiment of present invention, the outside wall surface of roof 11 (upper wall surface among Fig. 1) is provided with upwardly extending heat radiator 5, heat radiator 5 be positioned at radiating subassembly directly over.Further increase area of dissipation thus, be convenient to heat in time, shed from roof 11 efficiently, particularly remarkable to the lifting of CPU cooling effect.
Further, heat radiator 5 is a plurality of and even distribution.Heat radiator 5 can be integrally welded with housing 1, certainly also can be fastening by screw.Heat radiator 5 can be aluminium flake.According to one embodiment of present invention, upwards straight line extension of heat radiator 5.According to another embodiment of the invention, upwards curve extension of heat radiator 5.
According to one embodiment of present invention, the top of heating radiator 3 has formed bearing frame (scheming not shown), the open-top of bearing frame, and wherein Heat Conduction Material 4 is located in the bearing frame.Realize fixing to Heat Conduction Material 4 thus, avoided Heat Conduction Material 4 between heating radiator 3 and roof 11, to remove, influenced the cooling effect of CPU.In this embodiment, the inner bottom surface of bearing frame is the upper surface of heating radiator 3.
Below the simple complete machine cabinet of describing according to the embodiment of the invention.
The complete machine cabinet comprises cabinet and at least one server 100 according to an embodiment of the invention, and server 100 is located in the cabinet, and server 100 is according to the server of describing in the above embodiment of the present invention 100.
Need to prove, all be prior art according to other structure of the complete machine cabinet of the embodiment of the invention etc., and known by those of ordinary skill in the art, therefore describe in detail no longer one by one here.
In the description of this instructions, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. a server is characterized in that, comprising:
Housing;
Mainboard, described mainboard are located in the described housing;
CPU, described CPU are located on the described mainboard; And
Radiating subassembly, the bottom of described radiating subassembly are fitted on the described CPU, and the top of described radiating subassembly is fitted on the roof of described housing.
2. server according to claim 1 is characterized in that, described radiating subassembly comprises:
Heating radiator, the lower surface of described heating radiator are fitted on the described CPU; And
Flexible Heat Conduction Material, described Heat Conduction Material is located between the upper surface and described roof of described heating radiator.
3. server according to claim 2 is characterized in that, described heating radiator removably is located on the described mainboard.
4. server according to claim 2 is characterized in that, described Heat Conduction Material is heat conductive silica gel.
5. server according to claim 1 is characterized in that, described radiating subassembly is a plurality of and is evenly distributed on the described CPU.
6. server according to claim 1 is characterized in that, the outside wall surface of described roof is provided with upwardly extending heat radiator, described heat radiator be positioned at described radiating subassembly directly over.
7. server according to claim 6 is characterized in that, described heat radiator is a plurality of and even distribution.
8. server according to claim 6 is characterized in that, the described heat radiator straight line that makes progress extends; Perhaps the described heat radiator curve that makes progress extends.
9. server according to claim 2 is characterized in that, the top of described heating radiator has formed bearing frame, the open-top of described bearing frame, and wherein said Heat Conduction Material is located in the described bearing frame.
10. a complete machine cabinet is characterized in that, comprising:
Cabinet; And
At least one server, described server are located in the described cabinet, and described server is according to each described server among the claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102195692A CN103279178A (en) | 2013-06-04 | 2013-06-04 | Server and integral computer cabinet with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102195692A CN103279178A (en) | 2013-06-04 | 2013-06-04 | Server and integral computer cabinet with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103279178A true CN103279178A (en) | 2013-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102195692A Pending CN103279178A (en) | 2013-06-04 | 2013-06-04 | Server and integral computer cabinet with same |
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| Country | Link |
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| CN (1) | CN103279178A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104484023A (en) * | 2014-12-15 | 2015-04-01 | 浪潮电子信息产业股份有限公司 | CPU VR heat radiation device based on multi-path server |
| CN104503557A (en) * | 2015-01-16 | 2015-04-08 | 浪潮(北京)电子信息产业有限公司 | Heat dissipation management method and system based on multipath processor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201255863Y (en) * | 2008-09-16 | 2009-06-10 | 华为技术有限公司 | Server heat radiating construction and server |
| CN201821591U (en) * | 2010-08-30 | 2011-05-04 | 深圳市金宏威实业发展有限公司 | Radiator shell and communication terminal device |
| CN201828874U (en) * | 2010-10-29 | 2011-05-11 | 黄翊伦 | Enclosure structure for mainboard heat dissipation |
-
2013
- 2013-06-04 CN CN2013102195692A patent/CN103279178A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201255863Y (en) * | 2008-09-16 | 2009-06-10 | 华为技术有限公司 | Server heat radiating construction and server |
| CN201821591U (en) * | 2010-08-30 | 2011-05-04 | 深圳市金宏威实业发展有限公司 | Radiator shell and communication terminal device |
| CN201828874U (en) * | 2010-10-29 | 2011-05-11 | 黄翊伦 | Enclosure structure for mainboard heat dissipation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104484023A (en) * | 2014-12-15 | 2015-04-01 | 浪潮电子信息产业股份有限公司 | CPU VR heat radiation device based on multi-path server |
| CN104503557A (en) * | 2015-01-16 | 2015-04-08 | 浪潮(北京)电子信息产业有限公司 | Heat dissipation management method and system based on multipath processor |
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Application publication date: 20130904 |