CN103278102B - The laser measurement system of the three-dimensional deformation of a kind of object and measuring method thereof - Google Patents
The laser measurement system of the three-dimensional deformation of a kind of object and measuring method thereof Download PDFInfo
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- CN103278102B CN103278102B CN201310164251.9A CN201310164251A CN103278102B CN 103278102 B CN103278102 B CN 103278102B CN 201310164251 A CN201310164251 A CN 201310164251A CN 103278102 B CN103278102 B CN 103278102B
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Abstract
The invention discloses the laser measurement system of the three-dimensional deformation of a kind of object, comprise data processing module, generating laser, laser reflector and laser pickoff, the input port of described generating laser is connected with described data processing module; The output port of described generating laser is corresponding with the described laser reflector position be arranged on object under test; Described laser pickoff is arranged in the region that covers with the reflects laser of described laser reflector, described laser pickoff comprises transverse axis laser pickoff, longitudinal axis laser pickoff and vertical pivot laser pickoff, and described transverse axis laser instrument, longitudinal axis laser instrument are arranged with vertical pivot laser instrument is vertical between two.Meanwhile, the present invention also provides the laser measurement method of the three-dimensional deformation of a kind of object.The present invention is easy to operate, and the data of acquisition are comprehensive, and precision is high, can be extensive, cheap be applied to bridges and culverts, railway, the teaching of bearing platform, scientific research and online practical application.
Description
Technical field
The present invention relates to the measuring system of the three-dimensional deformation of a kind of physics, in particular, relate to the laser measurement system of the three-dimensional deformation of a kind of object.
Background technology
At present, object changing sensor system is to be directly measured as master, main method is miking, the measurement of Double sided mirror correlation and elastic force measurement etc., the method often testing complex of above-mentioned direct measurement, measuring accuracy is low, can not real-time follow-up deformation values change and be not suitable for large-scale teaching, scientific research and practical application.
Summary of the invention
Technical matters to be solved by this invention is, overcomes the shortcoming of prior art, provide a kind of test simple, precision is high and the laser measurement system of the three-dimensional deformation of object that applicable extensive teaching uses.
Meanwhile, the present invention also provides the laser measurement method of the three-dimensional deformation of a kind of object.
In order to solve above technical matters, the invention provides the laser measurement system of the three-dimensional deformation of a kind of object, comprise data processing module, generating laser, laser reflector and laser pickoff, the input port of described generating laser is connected with described data processing module, for receiving the electric excitation control signal that described data processing module transmits; The output port of described generating laser is corresponding with the described laser reflector position be arranged on object under test;
Described laser pickoff is arranged in the region that covers with the reflects laser of described laser reflector, described laser pickoff comprises the transverse axis laser pickoff receiving reflects laser horizontal component, the longitudinal axis laser pickoff receiving reflects laser longitudinal component and receives the vertical pivot laser pickoff of reflects laser vertical component, described transverse axis laser instrument, longitudinal axis laser instrument are arranged with vertical pivot laser instrument is vertical between two, meanwhile, the plane that described transverse axis laser instrument and described longitudinal axis laser instrument are formed is surface level; Further, described transverse axis laser instrument, longitudinal axis laser instrument are connected with described data processing module respectively with vertical pivot laser instrument, for respectively the laser components of reception being sent to described data processing module.
Being further defined to of technical solution of the present invention, described generating laser comprises laser solid pump Pudong Development Bank light pipe, pumping condenser lens, crystal frequency multiplier, expansion lens, collimation lens and the infrared color filter that central shaft sets gradually on the same line.
Further, described generating laser also comprises the steady circuit and exciting circuit that are connected with described laser solid pump Pudong Development Bank light pipe, and described steady circuit comprises triode Q1 and is parallel to resistance R15, stabilivolt Z1 and the electric capacity C7 between described triode Q1 base stage and emitter; Described exciting circuit comprises triode Q4, triode Q11, resistance R12, resistance R38, resistance R10, resistance R6 and light emitting diode D7, the emitter of described triode Q4 is connected with the base stage of the triode Q1 in described steady circuit, described triode Q4 collector be connected with described resistance R12, described triode Q4 base stage and described resistance R38 and described resistance R10 connect after be connected with the base stage of described triode Q11; The grounded emitter of described triode Q11, ground connection after described light emitting diode D7 and the R6 series connection of described triode Q11.
Further, described laser reflector is prism.
Further, described transverse axis laser pickoff, longitudinal axis laser pickoff and vertical pivot laser pickoff include ccd image sensor U3, the pin 3 of described ccd image sensor U3, pin 4 and pin 5 are connected the CMOS treatment circuit to signal buffered respectively, and the pin 21 of described ccd image sensor U3 connects binary channels operational amplification circuit.
Another technical scheme provided by the invention is: the laser measurement method of the three-dimensional deformation of a kind of object, carries out as follows:
(1) Emission Lasers is to laser reflector under electric excitation state for generating laser, and the laser wave that laser reflector will receive reflects;
(2) the transverse axis laser pickoff of laser pickoff receives and is extracted the laser level component that receives after the laser that reflects and this horizontal component is transferred to data processing module, the longitudinal axis laser pickoff of laser pickoff extracts the laser longitudinal component that receives and this longitudinal component is transferred to data processing module, and the vertical pivot laser pickoff of laser pickoff extracts the laser vertical component that receives and this vertical component is transferred to data processing module;
(3) first data processing module records the transverse axis position of the reflects laser of object under test when pressure is zero, longitudinal axis positions and vertical pivot position, then, when receiving the quadrature component of laser pickoff transmission, longitudinal axis component and vertical pivot component at every turn, all compare with the data of object under test when pressure is zero, thus draw object under test solid figure variable
The invention has the beneficial effects as follows: the laser measurement system of the three-dimensional deformation of a kind of object provided by the invention and method thereof, directly use laser to carry out remote measurement, directly read the three-dimensional component of the stereoscopic features of deformation, without the need to contacting with object under test, easy to operate, the data of acquisition are comprehensive, and precision is high, can be extensive, cheap be applied to bridges and culverts, railway, the teaching of bearing platform, scientific research and online practical application, and can real-time tracing, set up complete Database Systems.
Accompanying drawing explanation
Fig. 1 is the block schematic illustration of the laser measurement system of the three-dimensional deformation of object of the present invention;
Fig. 2 is the structural representation of generating laser of the present invention;
Fig. 3 is the steady circuit of generating laser of the present invention and the circuit diagram of exciting circuit;
Fig. 4 is the structural representation of laser reflector of the present invention;
Fig. 5 is the circuit diagram of laser pickoff of the present invention.
Embodiment
embodiment 1
The laser measurement system of the three-dimensional deformation of a kind of object that the present embodiment provides, its block schematic illustration as shown in Figure 1, comprises data processing module, generating laser, laser reflector and laser pickoff.
The input port of described generating laser is connected with described data processing module, for receiving the electric excitation control signal that described data processing module transmits; The output port of described generating laser is corresponding with the described laser reflector position be arranged on object under test.The structural representation of generating laser as shown in Figure 2, comprise laser solid pump Pudong Development Bank light pipe 1 that central shaft sets gradually on the same line, pumping condenser lens 2, crystal frequency multiplier 3, expansion lens 4, collimation lens 5 and infrared color filter 6, after receiving electric excitation control signal that data processing module transmits, send laser wave.Laser solid pump Pudong Development Bank light pipe 1 adopts luminotron linear array, and light source is sent by multiple light emitting diode, and its parameter is (650nm, 5mw), low-power consumption, dynamical luminous power Output of laser ripple.Pumping condenser lens 2 is a kind of gradient-index lens, because laser solid pump Pudong Development Bank light pipe 1 adopts the linear array form of luminotron, light-emitting area is in strip, the emission angle of two vertical direction has larger difference, if carry out optical focus with ordinary lens, then complex structure and huge, use pumping condenser lens 2, then compact, send light in the front end of lens by laser solid pump Pudong Development Bank light pipe 1 linear array to focus on through pumping condenser lens 2, the hot spot of better ovality can be obtained, then process of frequency multiplication is carried out through crystal frequency multiplier 3, 2 times that make that frequency becomes when sending, wavelength becomes half when sending, by expansion lens 4, laser beam is dispersed, because laser-beam divergence angle is larger, differ greatly at the beam divergence angle being parallel and perpendicular to light-emitting area direction, the shortcoming of eigen astigmatism can be formed, the astigmatism so use collimation lens 5 pairs of laser beam disappear, collimation process.The laser of non-wave band is carried out filtering by infrared filter 6, allows the light of this wave band to pass through.
Described generating laser also comprises the steady circuit and exciting circuit that are connected with described laser solid pump Pudong Development Bank light pipe, its circuit diagram as shown in Figure 3, described steady circuit comprises triode Q1 and is parallel to resistance R15, stabilivolt Z1 and the electric capacity C7 between described triode Q1 base stage and emitter, and the model of stabilivolt Z1 is LM385-1.2; Described exciting circuit comprises triode Q4, triode Q11, resistance R12, resistance R38, resistance R10, resistance R6 and light emitting diode D7, the emitter of described triode Q4 is connected with the base stage of the triode Q1 in described steady circuit, described triode Q4 collector be connected with described resistance R12, described triode Q4 base stage and described resistance R38 and described resistance R10 connect after be connected with the base stage of described triode Q11; The grounded emitter of described triode Q11, ground connection after described light emitting diode D7 and the R6 series connection of described triode Q11.
Laser reflector is arranged on object under test, by the laser wave reflection received.Laser reflector is prism, and its structural representation as shown in Figure 4, comprises two sensitive surfaces 8 and a reflecting surface 7, reflecting surface 7 is coated with silver-colored gold plating.Light can be totally reflected by prism self, reflecting surface 7 is plated again the coating of the outer gold of interior silver simultaneously, is all reflected by light, make its efficiency higher, be convenient to measure with the laser of micropower.
Described laser pickoff is arranged in the region that covers with the reflects laser of described laser reflector, described laser pickoff comprises the transverse axis laser pickoff receiving reflects laser horizontal component, the longitudinal axis laser pickoff receiving reflects laser longitudinal component and receives the vertical pivot laser pickoff of reflects laser vertical component, described transverse axis laser instrument, longitudinal axis laser instrument are arranged with vertical pivot laser instrument is vertical between two, meanwhile, the plane that described transverse axis laser instrument and described longitudinal axis laser instrument are formed is surface level; And, described transverse axis laser instrument, longitudinal axis laser instrument are connected with described data processing module respectively with vertical pivot laser instrument, the horizontal component of the reflects laser of reception is sent to described data processing module by described transverse axis laser instrument, the longitudinal component of the reflects laser of reception is sent to described data processing module by described longitudinal axis laser instrument, and the vertical component of the reflects laser of reception is sent to described data processing module by described vertical pivot laser instrument.
As shown in Figure 5, described transverse axis laser pickoff, longitudinal axis laser pickoff and vertical pivot laser pickoff include ccd image sensor U3 to the circuit diagram of described laser pickoff, and in the present embodiment, ccd image sensor U3 uses TCD1304.Pin 3, the pin 4 of described ccd image sensor U3 are connected CMOS treatment circuit respectively with pin 5, and CMOS treatment circuit carries out buffered to access signal.The pin 21 of described ccd image sensor U3 connects binary channels operational amplification circuit.Ccd image sensor U3 is core, there are 3600 photovoltaic elements, after photovoltaic element receives laser spot, by circuit sweeps, this unit has corresponding signal and exports, because the spacing between each photovoltaic element is fixing, therefore, the order of the place unit exported according to there being signal, just can obtain the distance of laser spots skew, thus obtain deformation quantity.The chip adopted in CMOS treatment circuit is 74HC14, and the model of the amplifier adopted in binary channels operational amplification circuit is LM324.
Another technical scheme provided by the invention is: the laser measurement method of the three-dimensional deformation of a kind of object, carries out as follows:
(1) Emission Lasers is to laser reflector under electric excitation state for generating laser, and the laser wave that laser reflector will receive reflects;
(2) the transverse axis laser pickoff of laser pickoff receives and is extracted the laser level component that receives after the laser that reflects and this horizontal component is transferred to data processing module, the longitudinal axis laser pickoff of laser pickoff extracts the laser longitudinal component that receives and this longitudinal component is transferred to data processing module, and the vertical pivot laser pickoff of laser pickoff extracts the laser vertical component that receives and this vertical component is transferred to data processing module;
(3) first data processing module records the transverse axis position of the reflects laser of object under test when pressure is zero, longitudinal axis positions and vertical pivot position, then, when receiving the quadrature component of laser pickoff transmission, longitudinal axis component and vertical pivot component at every turn, all compare with the data of object under test when pressure is zero, thus draw object under test solid figure variable.
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of application claims.
Claims (6)
1. the laser measurement system of the three-dimensional deformation of object, it is characterized in that, comprise data processing module, generating laser, laser reflector and laser pickoff, the input port of described generating laser is connected with described data processing module, for receiving the electric excitation control signal that described data processing module transmits; The output port of described generating laser is corresponding with the described laser reflector position be arranged on object under test;
Described laser pickoff is arranged in the region that covers with the reflects laser of described laser reflector, described laser pickoff comprises the transverse axis laser pickoff receiving reflects laser horizontal component, the longitudinal axis laser pickoff receiving reflects laser longitudinal component and receives the vertical pivot laser pickoff of reflects laser vertical component, described transverse axis laser instrument, longitudinal axis laser instrument are arranged with vertical pivot laser instrument is vertical between two, meanwhile, the plane that described transverse axis laser instrument and described longitudinal axis laser instrument are formed is surface level; Further, described transverse axis laser instrument, longitudinal axis laser instrument are connected with described data processing module respectively with vertical pivot laser instrument, for respectively the laser components of reception being sent to described data processing module.
2. the laser measurement system of the three-dimensional deformation of a kind of object according to claim 1, it is characterized in that, described generating laser comprises laser solid pump Pudong Development Bank light pipe, pumping condenser lens, crystal frequency multiplier, expansion lens, collimation lens and the infrared color filter that central shaft sets gradually on the same line.
3. the laser measurement system of the three-dimensional deformation of a kind of object according to claim 2, it is characterized in that, described generating laser also comprises the steady circuit and exciting circuit that are connected with described laser solid pump Pudong Development Bank light pipe, and described steady circuit comprises triode Q1 and is parallel to resistance R15, stabilivolt Z1 and the electric capacity C7 between described triode Q1 base stage and emitter; Described exciting circuit comprises triode Q4, triode Q11, resistance R12, resistance R38, resistance R10, resistance R6 and light emitting diode D7, the emitter of described triode Q4 is connected with the base stage of the triode Q1 in described steady circuit, described triode Q4 collector be connected with described resistance R12, described triode Q4 base stage and described resistance R38 and described resistance R10 connect after be connected with the base stage of described triode Q11; The grounded emitter of described triode Q11, ground connection after described light emitting diode D7 and the R6 series connection of described triode Q11.
4. the laser measurement system of the three-dimensional deformation of a kind of object according to claim 1, it is characterized in that, described laser reflector is prism.
5. the laser measurement system of the three-dimensional deformation of a kind of object according to claim 1, it is characterized in that, described transverse axis laser pickoff, longitudinal axis laser pickoff and vertical pivot laser pickoff include ccd image sensor U3, the pin 3 of described ccd image sensor U3, pin 4 and pin 5 are connected the CMOS treatment circuit to signal buffered respectively, and the pin 21 of described ccd image sensor U3 connects binary channels operational amplification circuit.
6. a laser measurement method for the three-dimensional deformation of object, is characterized in that, carry out as follows:
(1) Emission Lasers is to laser reflector under electric excitation state for generating laser, and the laser wave that laser reflector will receive reflects;
(2) the transverse axis laser pickoff of laser pickoff receives and is extracted the laser level component that receives after the laser that reflects and this horizontal component is transferred to data processing module, the longitudinal axis laser pickoff of laser pickoff extracts the laser longitudinal component that receives and this longitudinal component is transferred to data processing module, and the vertical pivot laser pickoff of laser pickoff extracts the laser vertical component that receives and this vertical component is transferred to data processing module;
(3) first data processing module records the transverse axis position of the reflects laser of object under test when pressure is zero, longitudinal axis positions and vertical pivot position, then, when receiving the quadrature component of laser pickoff transmission, longitudinal axis component and vertical pivot component at every turn, all compare with the data of object under test when pressure is zero, thus draw object under test solid figure variable.
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Denomination of invention: Laser measurement system and method for three-dimensional deformation of object Effective date of registration: 20191216 Granted publication date: 20150923 Pledgee: Nanjing Bank Co., Ltd. Chengnan Branch Pledgor: Jiangsu SWR Science & Technology Co., Ltd. Registration number: Y2019320000363 |
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