CN103273758B - Ctp版材电解砂目工艺 - Google Patents

Ctp版材电解砂目工艺 Download PDF

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CN103273758B
CN103273758B CN201310172866.6A CN201310172866A CN103273758B CN 103273758 B CN103273758 B CN 103273758B CN 201310172866 A CN201310172866 A CN 201310172866A CN 103273758 B CN103273758 B CN 103273758B
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CN103273758A (zh
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李煜
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Huangshan Jinruitai Technology Co ltd
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Abstract

本发明公开了一种CTP版材电解砂目工艺,其是对铝板进行多级电解,包括对铝板进行粗电解,在铝板的表面形成宽度为d1、深度为h1的砂目;以及对粗电解后的铝板进行细电解,在铝板的表面形成宽度为d2、深度为h2的砂目,其中d1>d2,h1<h2。通过先在铝板的外表面形成宽度大、深度小的砂目,然后在对粗电解后的铝板进行细电解,继续在铝板的外表面形成宽度小、深度大的砂目,这样经电解处理后的铝板表面积就被大大增大,且砂目深度适中,对后期涂覆的感光涂层的吸附力和承载能力强,制得的CTP版材的分辨率和网点还原等性能被大大提升。

Description

CTP版材电解砂目工艺
技术领域
本发明涉及印刷版材生产领域,具体涉及一种CTP版材电解砂目工艺。
背景技术
CTP版材的生产所采用的工艺大致如下:铝板—除油处理—电解砂目处理—氧化处理—封孔处理—涂布感光液—烘干处理—裁切包装;其中电解砂目处理是对铝板的表面进行电解处理,使得铝板的表面形成砂目以增大铝板表面积,从而提高铝板对感光材料的吸附力和承载量。
而目前所采用的电解砂目的工艺大多为一次电解,如名称为“一种热敏CTP版电解砂目工艺”(公开号CN102310676A)的中国专利文献中记载的技术方案:将铝板基进行三相交流电解,电解液为盐酸、磷酸、醋酸及水的混合溶液,电解时混合溶液的温度为26-32℃,电解时间为1秒-120秒;混合溶液中盐酸、磷酸及醋酸浓度百分比为盐酸1.2%-1.5%∶0.6%∶1.3%,其余为水溶液。采用该技术方案虽然能够获取得到均匀的砂目,但由于其采用一次电解完成,电解后的铝板表面上的砂目还是较大、铝板表面积增大有限,对于感光材料的吸附和承载能力有限。另外,其电解工艺过程无修补除灰电解过程,版基的白度指标难以达到最佳状态。
发明目的
本发明的目的在于提供一种CTP版材电解砂目工艺,其处理后的铝板表面形成多层次的细小均匀砂目结构、铝板表面积大、对感光材料的吸附和承载能力强。
其采取的方案为:一种CTP版材电解砂目工艺,其是对铝板进行多级电解,包括对铝板进行粗电解,在铝板的表面形成宽度为d1、深度为h1的砂目;以及对粗电解后的铝板进行细电解,在铝板的表面形成宽度为d2、深度为h2的砂目,其中d1>d2,h1<h2。
本申请中通过对铝板先后进行粗电解和细电解处理,先在铝板的外表面形成宽度(d1)大、深度(h1)小的砂目,然后在对粗电解后的铝板进行细电解,继续在铝板的外表面形成宽度(d2)小、深度(h2)大的砂目,这样经电解处理后的铝板表面积就被大大增大,且砂目深度适中,对后期涂覆的感光涂层的吸附力和承载能力强,制得的CTP版材的分辨率和网点还原等性能被大大提升。当然铝板在经过电解前需要进行除油处理,如图1所示,这里将电解后在铝板的外表面上形成的新的砂目理想化看做铝板外表面上设置的凹槽或凹孔。图3、5分别为经粗电解和细电解后的铝板的截面示意图,电解后铝板的外表面为不规则的凹凸不平状(锯齿状),本申请中所指的宽度(d1、d2)可理解为该次电解所形成的新的砂目口部的径向平均尺寸;深度(h1、h2)可理解为该次电解所形成的新的砂目深度的平均尺寸,如图3、5所示。当然本领域普通技术人员可根据上述方案来选取相应的电解液和控制电解条件(包括温度、电解电极、时间、电解电流)来相应的实现粗电解和细电解,以获取表面具有多层次的细小均匀砂目的铝板。
但随着进一步的实验和研究发现,在实现上目的同时,按照不同电解液和控制电解条件,制得的CTP版材的性能之间还是存在一些差异。因此,通过长期试验、不断改变电解液成分和电解条件,最终确定采取按如下方案作为最优化方案进行实施,即:
所述的细电解包括一级细电解和二级细电解,其中一级细电解的电极极距为18~30mm、时间5.6~7.7s、电解电流为900~1300A;二级细电解的电极极距为15~25mm、时间5.6~6.8s、电解电流为800~1200A;细电解的温度为25~35℃、细电解所用的电解液含有1.5~2.5%的盐酸和0.05~0.5%的硫酸/磷酸、其余为水。本申请中电解液中各物质的浓度,如无特别说明均指质量浓度。
粗电解所用的电解液为0.5~1%的盐酸溶液,电解的温度为20~25℃、电解的电极极距为20~40mm、时间4.8~5.8s、电解电流为1200~1700A。
通过高极距、低浓度电解液、高电压、大电流、低温度的粗电解、在铝板的表面形成较平缓的砂目轮廓,如图2、3所示,有利于铝版表面的全电解状态的实现。在细电解过程中采用高浓度电解液、较低极距、较高温度和中等电流在粗电解形成的大致轮廓上形成细微结构的砂目,如图4、5所示,加入硫酸和磷酸的目的主要是控制形成的砂目Ra与Rz的比值关系,从而在铝板表面形成多层次的细小均匀砂目,按上述方案制得的铝板外表面砂目的Ra值为0.45~0.55um,Rz值在2.7~3.3um,两者的比值(Rz/Ra)接近6:1,使得制得的CTP版材印刷的精度以及清晰度达到最佳。
由于,细电解的电解过程会产生较多的电解灰质,因此本发明进一步的方案为:电解砂目工艺还包括对粗电解后的铝板表面砂目进行修补和除灰的修复电解。修复电解的温度为25~30℃、电解的电极极距为12~18mm、时间3.8~5.8s、电解电流为1000~1400A;修复电解所用的电解液含有1.0~2.5%的盐酸和0.8~3.0%的冰醋酸、其余为水。采用中温、低极距、大电流的含盐酸加冰醋酸的电解液进行修复电解,一则对粗电解、细电解形成的砂目微观结构的进行修补、进一步调整Ra与Rz的比值关系;二则去除细电解产生的灰质,提高版面的白度指标,使得制得的版面白度在0.24~0.28之间。
附图说明
图1为粗电解前的铝板截面示意图;
图2为粗电解后的铝板截面示意图;
图3为图2的A处放大示意图;
图4为细电解后的铝板截面示意图;
图5为图4的B处放大示意图。
具体实施方式
以下通过具体实施例来对本发明的技术方案做进一步解释和说明,但不应理解为对本发明保护范围的限定。
实施例1、2、3中选用选80mm(宽)×100mm(高)的高密度石墨作为电解电极,通过调整各工作箱电极的排列数量及极距,从而达到对铝板电解砂目的有效控制和调整,各级电极数量分别为:粗电解:15~18根;一级细电解:18~24根;二级细电解:18~21根;修复电解:12~18根。各级极距分别为:粗电解:20~40mm;一级细电解:18~30mm;二级细电解:15~25mm;修复电解:12~18mm。通过控制铝板在电解槽内的运行速度控制各级电解的时间,实施例1、2、3中铝板的运行速度均为15m/min。
实施例1
按照下表中所示的电解条件对铝板进行电解砂目处理;
对按上述条件进行电解砂目的铝板进行检测,测得Ra:0.47um;Rz:2.97um;白度:0.25。
实施例2
按照下表中所示的电解条件对铝板进行电解砂目处理;
对按上述条件进行电解砂目的铝板进行检测,测得Ra:0.53um;Rz:3.14um;白度:0.26。
实施例3
按照下表中所示的电解条件对铝板进行电解砂目处理;
对按上述条件进行电解砂目的铝板进行检测,测得Ra:0.51um;Rz:3.02um;白度:0.26。

Claims (4)

1.一种CTP版材电解砂目工艺,其是对铝板进行多级电解,包括对铝板进行粗电解,在铝板的表面形成宽度为d1、深度为h1的砂目;以及对粗电解后的铝板进行细电解,在铝板的表面形成宽度为d2、深度为h2的砂目,其中d1>d2,h1<h2;所述的细电解包括一级细电解和二级细电解,其中一级细电解的电极极距为18~30mm、时间5.6~7.7s、电解电流为900~1300A;二级细电解的电极极距为15~25mm、时间5.6~6.8s、电解电流为800~1200A;细电解的温度为25~35℃、细电解所用的电解液含有1.5~2.5%的盐酸和0.05~0.5%的硫酸/磷酸、其余为水。
2.如权利要求1所述的CTP版材电解砂目工艺,其特征在于:电解砂目工艺还包括对粗电解后的铝板表面砂目进行修补和除灰的修复电解。
3.如权利要求1所述的CTP版材电解砂目工艺,其特征在于:粗电解所用的电解液为0.5~1%的盐酸溶液,电解的温度为20~25℃、电解的电极极距为20~40mm、时间4.8~5.8s、电解电流为1200~1700A。
4.如权利要求2所述的CTP版材电解砂目工艺,其特征在于:修复电解的温度为25~30℃、电解的电极极距为12~18mm、时间3.8~5.8s、电解电流为1000~1400A;修复电解所用的电解液含有1.0~2.5%的盐酸和0.8~3.0%的冰醋酸、其余为水。
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CN102423954A (zh) * 2011-08-24 2012-04-25 上海希尔彩印制版有限公司 印染辊凹版的平印印版制造方法
CN202623553U (zh) * 2012-05-03 2012-12-26 长沙科利达印刷器材有限公司 一种uvctp自动生产线电解砂目的电极
CN102839412A (zh) * 2012-09-05 2012-12-26 上海强邦印刷器材有限公司 一种新型的ctp版铝版基的电化学磨版电解液

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JP2006021425A (ja) * 2004-07-08 2006-01-26 Fuji Photo Film Co Ltd 平版印刷版用支持体の製造方法
JP5241871B2 (ja) * 2011-03-11 2013-07-17 富士フイルム株式会社 サーマルポジ型平版印刷版原版及び平版印刷版の作製方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102423954A (zh) * 2011-08-24 2012-04-25 上海希尔彩印制版有限公司 印染辊凹版的平印印版制造方法
CN202623553U (zh) * 2012-05-03 2012-12-26 长沙科利达印刷器材有限公司 一种uvctp自动生产线电解砂目的电极
CN102839412A (zh) * 2012-09-05 2012-12-26 上海强邦印刷器材有限公司 一种新型的ctp版铝版基的电化学磨版电解液

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