CN103258929A - Light-emitting diode (LED) chip and preparation method thereof - Google Patents
Light-emitting diode (LED) chip and preparation method thereof Download PDFInfo
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- CN103258929A CN103258929A CN2013101570900A CN201310157090A CN103258929A CN 103258929 A CN103258929 A CN 103258929A CN 2013101570900 A CN2013101570900 A CN 2013101570900A CN 201310157090 A CN201310157090 A CN 201310157090A CN 103258929 A CN103258929 A CN 103258929A
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Abstract
The invention discloses a light-emitting diode (LED) chip and a preparation method thereof. The LED chip comprises a first type epitaxial layer, a luminous epitaxial layer, a second type epitaxial layer, a first electrode and a second electrode, wherein the luminous epitaxial layer is arranged on one side of the first type epitaxial layer, the second type epitaxial layer is arranged on the one side, away from the first type epitaxial layer, of the luminous epitaxial layer, the second type epitaxial layer comprises a second type coating layer and a second type contacting layer, the surface of one side, away from the luminous epitaxial layer, of the second type epitaxial layer is provided with a groove, the groove at least penetrates through the second type contacting layer, the first electrode is electrically connected with the first type epitaxial layer, and the second electrode is arranged on one side, away from the luminous epitaxial layer, of the second type epitaxial layer and covers the groove. Meanwhile, the preparation method of the LED chip is provided. The LED chip improves effective current injection, reduces light absorption of the second type epitaxial layer, and improves luminous efficiency of the chip.
Description
Technical field
The present invention relates to Light-Emitting Diode (LED) manufacturing field, particularly relate to a kind of led chip and preparation method thereof.
Background technology
Since early 1990s gallium nitride based LED commercialization, the application of LED is enlarged rapidly, and the market of expansion constantly proposes new specification requirement to LED again, impels the structure of LED to develop to more perfect, more ripe direction.Domestic LED enterprise is under the encouragement of government is helped in recent years, obtained further development again by Beijing Olympic Games, Shanghai World's Fair, the Guangzhou Asian Games, Shenzhen Games for university students and " ten thousand in ten cities " etc.
LED need make electrode on the luminescent material surface as a kind of electroluminescent device, injects electric current from electrode and comes driving LED luminous.The area size of electrode has very big influence to the photoelectric properties of LED, and electrode area is more big on the one hand, and it is more easy that electric current injects, and CURRENT DISTRIBUTION can be accomplished more even, and operating voltage also can reduce, and this is conducive to electricity conversion; Electrode is light absorbent on the other hand, and the more big shading surface of its area is also more big, and this just causes the decline of electric light transformation efficiency.In the prior art, the way by making current barrier layer at LED solves this contradiction.Specifically, the position of certain depth making insulating material stops the electric current in this piece zone to pass through under the distance electrode, like this electrode under just can not be luminous, so electrode does not in fact just have or seldom shading, thereby improve the electric light transformation efficiency of LED.
Current barrier layer is in block current flow, and the epitaxial loayer itself below the current barrier layer is not to luminous generation contribution.Opposite, because when the preparation epitaxial loayer, the impurity magnesium (Mg) that can mix a large amount of, thereby in the forbidden band of epitaxial loayer, introduce deep energy level impurities, i.e. so-called gold-tinted zoning, so, epitaxial loayer below the current barrier layer also can absorb light, causes the light extraction efficiency of led chip to reduce.
Therefore, the luminous efficiency that how improves led chip has become the problem that those skilled in the art need solve.
Summary of the invention
The objective of the invention is to, a kind of led chip and preparation method thereof is provided, to solve the low problem of existing led chip luminous efficiency.
For solving the problems of the technologies described above, the invention provides a kind of led chip, comprising:
First kind epitaxial loayer;
Luminous epitaxial loayer is arranged at described first kind epitaxial loayer one side;
The second type epitaxial loayer, be arranged at described luminous epitaxial loayer and deviate from described first kind epitaxial loayer one side, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer, the surface that the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side has groove, and described groove runs through the described second type contact layer at least;
First electrode, described first kind epitaxial loayer electricity links to each other, and thinks that described first kind epitaxial loayer provides voltage;
Second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
Further, in described led chip, described groove runs through the described second type epitaxial loayer.
Further, in described led chip, also has a undoped epitaxial layers between described luminous epitaxial loayer and the described second type epitaxial loayer.
Further, in described led chip, the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, and described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove.
Further, in described led chip, the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, and described transparency conducting layer is positioned at the surface of described groove and described luminous epitaxial loayer.
Further, in described led chip, also has a current barrier layer between described transparency conducting layer and the described groove.
Further, in described led chip, described first electrode is positioned at described first kind epitaxial loayer to deviate from described luminous epitaxial loayer one side or is positioned at described first kind epitaxial loayer towards described luminous epitaxial loayer one side.
According to another side of the present invention, the present invention also provides a kind of preparation method of led chip, comprising:
First kind epitaxial loayer is provided;
Prepare luminous epitaxial loayer in described first kind epitaxial loayer one side;
Deviate from described first kind epitaxial loayer one side at described luminous epitaxial loayer and prepare the second type epitaxial loayer, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, and the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer;
The described second type epitaxial loayer of selective etch forms groove with the surface that deviates from described luminous epitaxial loayer one side at the described second type epitaxial loayer, and described groove runs through the described second type contact layer at least;
Prepare first electrode and second electrode, described first electrode links to each other with described first kind epitaxial loayer electricity, think that described first kind epitaxial loayer provides voltage, described second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
Further, in the preparation method of described led chip, described groove runs through the described second type epitaxial loayer.
Further, in the preparation method of described led chip, preparation one undoped epitaxial layers between described luminous epitaxial loayer and the described second type epitaxial loayer.
Further, in the preparation method of described led chip, deviate from described luminous epitaxial loayer one side at the described second type epitaxial loayer and prepare a transparency conducting layer, described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove.
Further, in the preparation method of described led chip, deviate from described luminous epitaxial loayer one side at the described second type epitaxial loayer and prepare a transparency conducting layer, described transparency conducting layer is positioned at the surface of described groove and described luminous epitaxial loayer.
Further, in the preparation method of described led chip, preparation one current barrier layer between described transparency conducting layer and described groove.
Further, in the preparation method of described led chip, deviate from described luminous epitaxial loayer one side or described first kind epitaxial loayer prepares described first electrode towards described luminous epitaxial loayer one side at described first kind epitaxial loayer.
Compared with prior art, led chip provided by the invention and preparation method thereof has the following advantages:
1. in led chip of the present invention and preparation method thereof, the surface that the described second type epitaxial loayer of this kind led chip deviates from described luminous epitaxial loayer one side has groove, described groove runs through the described second type contact layer at least, described second electrode covers described groove, compared with prior art, there is not the described second type contact layer in the described second type epitaxial loayer that is arranged so that described second electrode below of described groove, thereby increased the contact resistance of described second electrode and the described second type epitaxial loayer, block current flow directly is injected in the described second type epitaxial loayer of described second electrode below, thus the effective injection that has improved electric current; And the described second type epitaxial loayer that is arranged so that described second electrode below of described groove is partly or entirely eliminated, thereby has reduced the absorption of the light that the second type epitaxial loayer sends described luminous epitaxial loayer, therefore, improves the luminous efficiency of chip.
2. in led chip of the present invention and preparation method thereof, the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, described transparency conducting layer improves electrical efficiency, described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove, make described second electrode directly prepare the surface at described groove, and because the resistance between the surface of described second electrode and described groove is bigger, so current barrier layer needn't be set, save technology.
Description of drawings
Fig. 1 is the led chip preparation method's of one embodiment of the invention flow chart;
Fig. 2 a-Fig. 2 f is the structural representation of the led chip in each processing step of led chip preparation method of one embodiment of the invention;
Fig. 3 is the generalized section of the led chip of further embodiment of this invention.
Embodiment
Below in conjunction with schematic diagram led chip of the present invention and preparation method thereof is described in more detail, the preferred embodiments of the present invention have wherein been represented, should be appreciated that those skilled in the art can revise the present invention described here, and still realize advantageous effects of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
In the following passage, with way of example the present invention is described more specifically with reference to accompanying drawing.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present invention is, the invention provides a kind of led chip and preparation method thereof, the surface that the described second type epitaxial loayer of this led chip deviates from described luminous epitaxial loayer one side has groove, described groove runs through the described second type contact layer at least, described second electrode covers described groove, described second electrode covers described groove, improved effective injection of electric current, and reduced the absorption of the light that the second type epitaxial loayer sends described luminous epitaxial loayer, therefore, improve the luminous efficiency of led chip.
In conjunction with above-mentioned core concept, the invention provides a kind of led chip, comprising: first kind epitaxial loayer; Luminous epitaxial loayer is arranged at described first kind epitaxial loayer one side; The second type epitaxial loayer, be arranged at described luminous epitaxial loayer and deviate from described first kind epitaxial loayer one side, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer, the surface that the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side has groove, and described groove runs through the described second type contact layer at least; First electrode, described first kind epitaxial loayer electricity links to each other, and thinks that described first kind epitaxial loayer provides voltage; Second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
Further, in conjunction with above-mentioned led chip, the present invention also provides a kind of manufacture method of led chip, may further comprise the steps:
Step S11 provides first kind epitaxial loayer;
Step S12 prepares luminous epitaxial loayer in described first kind epitaxial loayer one side;
Step S13, deviate from described first kind epitaxial loayer one side at described luminous epitaxial loayer and prepare the second type epitaxial loayer, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, and the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer;
Step S14, the described second type epitaxial loayer of selective etch forms groove with the surface that deviates from described luminous epitaxial loayer one side at the described second type epitaxial loayer, and described groove runs through the described second type contact layer at least;
Step S15, prepare first electrode and second electrode, described first electrode links to each other with described first kind epitaxial loayer electricity, thinks that described first kind epitaxial loayer provides voltage, described second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
Below in conjunction with core concept, describe led chip of the present invention and preparation method thereof in detail.
[first embodiment]
In the present embodiment, deviate from described luminous epitaxial loayer one side at the described second type epitaxial loayer and prepare a transparency conducting layer, described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove.
Specify led chip in the present embodiment and preparation method thereof below in conjunction with Fig. 1 and Fig. 2 a-Fig. 2 f.Wherein, Fig. 1 is the led chip preparation method's of one embodiment of the invention flow chart, and Fig. 2 a-Fig. 2 f is the structural representation of the led chip in each processing step of led chip preparation method of one embodiment of the invention.
At first, carry out step S11, first kind epitaxial loayer 110 is provided.
In producing actually, led chip also comprises substrate 100 as required, and described first kind epitaxial loayer 110 is formed at a side of described substrate 100, shown in Fig. 2 a.But can also between described first kind epitaxial loayer 110 and described substrate 100, form to improve the resilient coating of lattice matching degree, specifically not limit.Wherein, the material of described first kind epitaxial loayer 110 can be the semi-conducting material of N-types such as n type gallium nitride, N-type aluminium nitride doping, specifically do not limit, the material of described substrate 100 can be sapphire, other material, as carborundum, magnesium oxide or zinc oxide also within thought range of the present invention.In addition, the substrate 100 of present embodiment is the graphic sapphire substrate, because the graphic sapphire substrate can reduce the epitaxial film materials dislocation density, improves the crystal mass of epitaxial loayer.
Then, carry out step S12, a side that deviates from described substrate 100 at described first kind epitaxial loayer 110 prepares luminous epitaxial loayer 120, shown in Fig. 2 b.General, described luminous epitaxial loayer 120 is quantum well layer, can be single quantum well layer or multiple quantum well layer, in the present embodiment, described first kind epitaxial loayer 110 is n type gallium nitride, so, gallium nitride/InGaN Multiple Quantum Well that described luminous epitaxial loayer 120 is 3～5 cycles, but the material of described luminous epitaxial loayer 120 is not limited to gallium nitride/InGaN, as long as can form the trap layer and build layer, can realize quantum well radiation, also within thought range of the present invention.
Because in the present embodiment, also has a undoped epitaxial layers 121 between described luminous epitaxial loayer 120 and the described second type epitaxial loayer 130, so between step S12 and step S13, deviate from described first kind epitaxial loayer 110 1 sides at described luminous epitaxial loayer and prepare undoped epitaxial layers 121, in the present embodiment, the material of described undoped epitaxial layers 121 is the non-impurity-doped gallium nitride.
Then, carry out step S13, deviate from described first kind epitaxial loayer one side at described luminous epitaxial loayer and prepare the second type epitaxial loayer 130, the described second type epitaxial loayer 130 comprises the second type coating 131 and the second type contact layer 132, the described second type coating 131 is arranged at the side towards described luminous epitaxial loayer 120, shown in Fig. 2 c.Because in the present embodiment, gallium nitride/InGaN Multiple Quantum Well that described luminous epitaxial loayer 120 is 3～5 cycles, so the material of the described second type coating 131 is P type gallium nitride, the described second type contact layer 132 is P type InGaN, the lattice arrangement rule of P type InGaN, help to improve electrical property, but the material of the described second type coating 131 and the described second type contact layer 132 is not limited to be P type gallium nitride and P type InGaN, other the P type uniconductor material that the hole can be provided for described luminous epitaxial loayer 120 is with within thought range of the present invention.
Because in the present embodiment, the described second type epitaxial loayer 130 deviates from described luminous epitaxial loayer 120 1 sides and also has a transparency conducting layer 140, so between step S13 and step S14, deviate from described luminous epitaxial loayer 120 1 sides at the described second type epitaxial loayer 130 and prepare described transparency conducting layer 140, generally, the material of described transparency conducting layer 140 is ITO (tin indium oxide).
In the present embodiment, described first electrode is arranged at described first kind epitaxial loayer 110 towards described luminous epitaxial loayer 120 1 sides, so between step S13 and step S14, the described second type epitaxial loayer 130 of selective etch, described luminous epitaxial loayer 120, with the described first kind epitaxial loayer 110 of exposed portions serve, shown in Fig. 2 d, at described first electrode of described first kind epitaxial loayer 110 preparations of exposed portions serve.
Subsequently, carry out step S14, the described second type epitaxial loayer 130 of selective etch forms groove 150 with the surface that deviates from described luminous epitaxial loayer 120 1 sides at the described second type epitaxial loayer, and described groove 150 runs through the described second type contact layer 132 at least.The described second type epitaxial loayer 130 that is arranged so that described second electrode below of described groove 150 is partly or entirely eliminated, thereby reduced the absorption of the light that the second type epitaxial loayer 130 pairs of described luminous epitaxial loayers 120 send, therefore, improve the luminous efficiency of led chip.Preferable, described groove 150 runs through the described second type epitaxial loayer 130, can reduce the absorption of the light that 130 pairs of described luminous epitaxial loayers 120 of the second type epitaxial loayer send more so that the described second type epitaxial loayer 130 of described second electrode below is all eliminated.Run through the described second type epitaxial loayer 130 but be not limited to described groove 150, described groove 150 can only run through the described second type contact layer 132, perhaps also is positioned at the described second type coating 131 of part, also within thought range of the present invention.In the present embodiment, owing to before carrying out step S14, prepared described transparency conducting layer 140, so described transparency conducting layer 140 is positioned at the surface of the described luminous epitaxial loayer 130 beyond the described groove 150, shown in Fig. 2 e.Can also carry out step S14 earlier, prepare described transparency conducting layer 140 again, afterwards the described transparency conducting layer 140 in the described groove 150 be removed, can also form described transparency conducting layer 140 on the surface of described groove 150 described luminous epitaxial loayer 130 in addition.
At last, carry out step S15, prepare first electrode 160 and second electrode 170, described first electrode 160 is arranged at described first kind epitaxial loayer 110 and links to each other towards described luminous epitaxial loayer 120 1 sides and with described first kind epitaxial loayer 110, think that described first kind epitaxial loayer 110 provides voltage, described second electrode 170 is arranged at the described second type epitaxial loayer 130 and deviates from described luminous epitaxial loayer 130 1 sides, and covers described groove 150, shown in Fig. 2 f.In the production process of reality, the cross-sectional area of described second electrode 170 is slightly larger than the cross-sectional area of described groove 150, and is general, the cross-sectional area of described second electrode 170 than the cross-sectional area of described groove 150 big 1 micron～20 microns, as 5 microns, 10 microns.Because the setting of described groove 150, making does not have the described second type contact layer 132 in the described second type epitaxial loayer 130 of described second electrode 170 belows, thereby increased the contact resistance of described second electrode 170 and the described second type epitaxial loayer 130, block current flow directly is injected in the described second type epitaxial loayer 130 of described second electrode 170 belows, thereby improved effective injection of electric current, improved the luminous efficiency of led chip.
In sum, the invention provides a kind of led chip and preparation method thereof, wherein the structure of led chip is shown in Fig. 2 f, comprise first kind epitaxial loayer 110, luminous epitaxial loayer 120, the second type epitaxial loayer 130, first electrode 160 and second electrode 170, described luminous epitaxial loayer 120 is arranged at described first kind epitaxial loayer 110 1 sides, the described second type epitaxial loayer 130 is arranged at described luminous epitaxial loayer 120 and deviates from described first kind epitaxial loayer 110 1 sides, the described second type epitaxial loayer 130 comprises the second type coating 131 and the second type contact layer 132, the described second type coating 131 is arranged at the side towards described luminous epitaxial loayer 120, the surface that the described second type epitaxial loayer 130 deviates from described luminous epitaxial loayer 120 1 sides has groove 150, described groove to 150 runs through the described second type contact layer 132 less, described first electrode 160 is arranged at described first kind epitaxial loayer 110 and links to each other towards described luminous epitaxial loayer 120 1 sides and with described first kind epitaxial loayer 110, think that described first kind epitaxial loayer 110 provides voltage, described second electrode is arranged at the described second type epitaxial loayer 130 and deviates from described luminous epitaxial loayer 120 1 sides, and covers described groove 150.In addition, described first electrode 160 is not limited to be arranged at described first kind epitaxial loayer 110 and links to each other towards described luminous epitaxial loayer 120 1 sides and with described first kind epitaxial loayer 110, described first electrode 160 can also be arranged at the side that described first kind epitaxial loayer 110 deviates from described luminous epitaxial loayer 120, and link to each other with described first kind epitaxial loayer 110, also can be for described first kind epitaxial loayer 110 provides voltage, also within thought range of the present invention.
[second embodiment]
See also Fig. 3, Fig. 3 is the generalized section of the led chip of further embodiment of this invention.The led chip of the led chip of described another execution mode and a described execution mode is basic identical, its difference is: described transparency conducting layer 140 is positioned at the surface of described groove 150 and described luminous epitaxial loayer 130, can also improve effective injection of electric current, and reduced the absorption of the light that the second type epitaxial loayer 130 pairs of described luminous epitaxial loayers 120 send, also can reach the beneficial effect of the luminous efficiency that improves led chip.
Preferable, preparation one current barrier layer 180 between described transparency conducting layer 140 and described groove 150, described current barrier layer 180 can stop electric current directly to be injected in the described second type epitaxial loayer 130 of described second electrode 170 belows effectively, thereby further improve effective injection of electric current, with the luminous efficiency of further raising led chip.
To sum up, led chip of the present invention and preparation method thereof, the surface that the described second type epitaxial loayer of this led chip deviates from described luminous epitaxial loayer one side has groove, described groove runs through the described second type contact layer at least, and described second electrode covers described groove, and described second electrode covers described groove, improved effective injection of electric current, and reduced the absorption of the light that the second type epitaxial loayer sends described luminous epitaxial loayer, therefore, improved the luminous efficiency of led chip.Compared with prior art, led chip provided by the invention and preparation method thereof has the following advantages:
1. in led chip of the present invention and preparation method thereof, the surface that the described second type epitaxial loayer of this kind led chip deviates from described luminous epitaxial loayer one side has groove, described groove runs through the described second type contact layer at least, described second electrode covers described groove, compared with prior art, there is not the described second type contact layer in the described second type epitaxial loayer that is arranged so that described second electrode below of described groove, thereby increased the contact resistance of described second electrode and the described second type epitaxial loayer, block current flow directly is injected in the described second type epitaxial loayer of described second electrode below, thus the effective injection that has improved electric current; And the described second type epitaxial loayer that is arranged so that described second electrode below of described groove is partly or entirely eliminated, thereby has reduced the absorption of the light that the second type epitaxial loayer sends described luminous epitaxial loayer, therefore, improves the luminous efficiency of chip.
2. in led chip of the present invention and preparation method thereof, the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, described transparency conducting layer improves electrical efficiency, described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove, make described second electrode directly prepare the surface at described groove, and because the resistance between the surface of described second electrode and described groove is bigger, so current barrier layer needn't be set, save technology.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (14)
1. led chip comprises:
First kind epitaxial loayer;
Luminous epitaxial loayer is arranged at a side of described first kind epitaxial loayer;
The second type epitaxial loayer, be arranged at described luminous epitaxial loayer and deviate from described first kind epitaxial loayer one side, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer, the surface that the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side has groove, and described groove runs through the described second type contact layer at least;
First electrode links to each other with described first kind epitaxial loayer electricity, is used for providing voltage to described first kind epitaxial loayer;
Second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
2. led chip as claimed in claim 1 is characterized in that, described groove runs through the described second type epitaxial loayer.
3. led chip as claimed in claim 2 is characterized in that, comprises that also a undoped epitaxial layers is arranged between described luminous epitaxial loayer and the described second type epitaxial loayer.
4. the led chip described in claim 1 or 3 is characterized in that, the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, and described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove.
5. as claim 1 or 3 described led chips, it is characterized in that the described second type epitaxial loayer deviates from described luminous epitaxial loayer one side and also has a transparency conducting layer, described transparency conducting layer is positioned at the surface of described groove and described luminous epitaxial loayer.
6. led chip as claimed in claim 5 is characterized in that, also has a current barrier layer between described transparency conducting layer and the described groove.
7. led chip as claimed in claim 1 is characterized in that, described first electrode is positioned at described first kind epitaxial loayer to deviate from described luminous epitaxial loayer one side or be positioned at described first kind epitaxial loayer towards described luminous epitaxial loayer one side.
8. the preparation method of a led chip comprises:
First kind epitaxial loayer is provided;
Prepare luminous epitaxial loayer in described first kind epitaxial loayer one side;
Deviate from described first kind epitaxial loayer one side at described luminous epitaxial loayer and prepare the second type epitaxial loayer, the described second type epitaxial loayer comprises the second type coating and the second type contact layer, the described second type coating is arranged at the side towards described luminous epitaxial loayer, and the described second type contact layer is arranged at a side that deviates from described luminous epitaxial loayer;
The described second type epitaxial loayer of selective etch forms groove with the surface that deviates from described luminous epitaxial loayer one side at the described second type epitaxial loayer, and described groove runs through the described second type contact layer at least;
Prepare first electrode and second electrode, described first electrode links to each other with described first kind epitaxial loayer electricity, think that described first kind epitaxial loayer provides voltage, described second electrode is arranged at the described second type epitaxial loayer and deviates from described luminous epitaxial loayer one side, and covers described groove.
9. the preparation method of led chip as claimed in claim 8 is characterized in that, described groove runs through the described second type epitaxial loayer.
10. the preparation method of led chip as claimed in claim 8 is characterized in that, preparation one undoped epitaxial layers between described luminous epitaxial loayer and the described second type epitaxial loayer.
11. the preparation method as claim 8 or 10 described led chips, it is characterized in that, deviate from described luminous epitaxial loayer one side at the described second type epitaxial loayer and prepare a transparency conducting layer, described transparency conducting layer is positioned at the surface of the described luminous epitaxial loayer beyond the described groove.
12. the preparation method as claim 8 or 10 described led chips, it is characterized in that, deviate from described luminous epitaxial loayer one side at the described second type epitaxial loayer and prepare a transparency conducting layer, described transparency conducting layer is positioned at the surface of described groove and described luminous epitaxial loayer.
13. the preparation method of led chip as claimed in claim 12 is characterized in that, preparation one current barrier layer between described transparency conducting layer and described groove.
14. the preparation method of led chip as claimed in claim 8 is characterized in that, deviates from described luminous epitaxial loayer one side or described first kind epitaxial loayer prepares described first electrode towards described luminous epitaxial loayer one side at described first kind epitaxial loayer.
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| TW409434B (en) * | 1998-06-24 | 2000-10-21 | Epistar Corp | Flip type light emitting diode |
| KR20060062715A (en) * | 2004-12-06 | 2006-06-12 | 삼성전기주식회사 | Gan semiconductor light emitting device having esd protection diode |
| US20100283070A1 (en) * | 2007-02-12 | 2010-11-11 | Samsung Electro-Mechanics Co., Ltd. | Nitride semiconductor light emitting device and method of manufacturing the same |
| CN101877379A (en) * | 2009-02-25 | 2010-11-03 | Lg伊诺特有限公司 | Light emitting device |
| CN102074634A (en) * | 2009-10-22 | 2011-05-25 | Lg伊诺特有限公司 | Light emitting device and light emitting device package |
| CN102097565A (en) * | 2009-11-06 | 2011-06-15 | Lg伊诺特有限公司 | Light emitting device, light emitting device package and lighting system |
| CN102339920A (en) * | 2010-07-20 | 2012-02-01 | 晶元光电股份有限公司 | Light-emitting component |
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