CN103258673A - Silver-saving binding-type moving contact process technology - Google Patents
Silver-saving binding-type moving contact process technology Download PDFInfo
- Publication number
- CN103258673A CN103258673A CN2013101753437A CN201310175343A CN103258673A CN 103258673 A CN103258673 A CN 103258673A CN 2013101753437 A CN2013101753437 A CN 2013101753437A CN 201310175343 A CN201310175343 A CN 201310175343A CN 103258673 A CN103258673 A CN 103258673A
- Authority
- CN
- China
- Prior art keywords
- silver
- contact
- plated
- contact blade
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a silver-saving binding-type moving contact process technology. Contact blades are bound on the periphery of a non-magnetic stainless steel circle support through non-magnetic stainless steel ring-shaped tension springs, the contact blades are formed by T2 copper plates in a fine-blanking mode, and the surfaces of the contact blades are silver-plated. Silver plating is a conventional process, and is characterized in that plated silver of the contact blades are different in thickness according to different portions of each contact blade, the thickness of the plated silver on the inner side face of each contact blade is 0.1mm, and the thicknesses of other portions of each contact blade are 0.03mm. A silver plating method for the contact blades comprises the steps that firstly, other portions except the inner side face of each contact blade are bonded together through plastic film, each contact blade is dipped into a silver plating solution, the silver plating is carried out on the exposed inner side face of each contact blade, when the thickness of the plated silver reaches 0.07mm, the contact blade is hoisted out, the plastic film adhered to each contact blade is removed after each contact blade is hoisted out, then each contact blade is dipped into the silver plating solution, the silver is evenly coated on the whole contact blade, and the thickness of the plated silver is 0.03mm. The silver-saving binding-type moving contact process technology has the advantage that compared with the prior art, the silver can probably be saved by 65% according to calculation of the silver plating area.
Description
Technical field
The present invention relates to moving contact of a kind of cluster, relate in particular to the process technology of a moving contact of a kind of cluster.
Background technology
Moving contact of cluster is applied to middle circuit breakers such as ZN63, its structure is around magnetism-free stainless steel circle support, go up contact with the binding of magnetism-free stainless steel annular tension spring, contact is by the smart drawing of T2 copper coin, electroplate, existing silver-plated technology is all evenly silver-plated with contact, silver-plated main purpose is the performance for the conduction that improves contact, and the conduction contact part of contact is the inner side edge at contact, improving electric conductivity only need have this position enough silver coating thickness just passable, the silver-plated thickness in other positions is can book a little, and prior art has just been wasted silver like this, has increased the useless processing charges of product simultaneously.
Summary of the invention
The objective of the invention is in order to solve above-mentioned technical deficiency, propose a kind of bundling type moveable contact process technology of saving silver, save silver consuming amount, reduce the processing charges of product.
The present invention is achieved through the following technical solutions: a kind of bundling type moveable contact process technology of saving silver, by magnetism-free stainless steel circle support, magnetism-free stainless steel annular tension spring and contact are formed, around described magnetism-free stainless steel circle support, go up contact with the binding of magnetism-free stainless steel annular tension spring, described contact is with T2 copper coin fine-punching formation, electroplate, silver-plated is conventional technology, it is characterized in that: the silver-plated different silver-plated thickness differences in position of pressing of contact, at the silver-plated thickness 0.1mm of contact medial surface, the silver-plated thickness 0.03mm in other positions of contact, the silver-coating method of contact is: earlier other positions of contact except the medial surface are glued with plastic film, contact is immersed silver plating solution, and the medial surface that contact is exposed begins silver-plated, when reaching 0.07mm, contact is hung out, hang out the back and remove the plastic film that is bonded on the contact, immerse silver plating solution again, make the contact of full wafer evenly coat 0.03mm.
The beneficial effect of type of the present invention is: compared with prior art, probably can save silver 65% by silver-plated area calculating, can reduce considerable silver-plated processing charges simultaneously.
Description of drawings
Fig. 1 is a kind of structural representation of saving the bundling type moveable contact of silver.
Embodiment
Come below in conjunction with accompanying drawing 1 and embodiment that the present invention is described in further detail:
A kind of bundling type moveable contact process technology of saving silver, by magnetism-free stainless steel circle support 1, magnetism-free stainless steel annular tension spring 2 and contact 3 are formed, around described magnetism-free stainless steel circle support 1, go up contact 3 with 2 bindings of magnetism-free stainless steel annular tension spring, described contact 3 is with T2 copper coin fine-punching formation, electroplate, silver-plated is conventional technology, it is characterized in that: the silver-plated different silver-plated thickness differences in position of pressing of contact 3, at contact 3 medial surfaces 3.1 silver-plated thickness 0.1mm, the silver-plated thickness 0.03mm in other positions of contact 3, the silver-coating method of contact 3 is: earlier other positions except the medial surface 3.1 are glued with plastic film, contact 3 is immersed silver plating solution, and medial surface 3.1 beginnings that contact 3 is exposed are silver-plated, when reaching 0.07mm, contact 3 is hung out, hang out the back and remove the plastic film that is bonded on the contact 3, immerse silver plating solution again, make full wafer contact 3 evenly coat 0.03mm.
Claims (1)
1. save silver-colored bundling type moveable contact process technology for one kind, by magnetism-free stainless steel circle support, magnetism-free stainless steel annular tension spring and contact are formed, around described magnetism-free stainless steel circle support, go up contact with the binding of magnetism-free stainless steel annular tension spring, described contact is with T2 copper coin fine-punching formation, electroplate, silver-plated is conventional technology, it is characterized in that: the silver-plated different silver-plated thickness differences in position of pressing of contact, at the silver-plated thickness 0.1mm of contact medial surface, the silver-plated thickness 0.03mm in other positions of contact, the silver-coating method of contact is: earlier other positions of contact except the medial surface are glued with plastic film, contact is immersed silver plating solution, and the medial surface that contact is exposed begins silver-plated, when reaching 0.07mm, contact is hung out, hang out the back and remove the plastic film that is bonded on the contact, immerse silver plating solution again, make the contact of full wafer evenly coat 0.03mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101753437A CN103258673A (en) | 2013-04-29 | 2013-04-29 | Silver-saving binding-type moving contact process technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101753437A CN103258673A (en) | 2013-04-29 | 2013-04-29 | Silver-saving binding-type moving contact process technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103258673A true CN103258673A (en) | 2013-08-21 |
Family
ID=48962531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101753437A Pending CN103258673A (en) | 2013-04-29 | 2013-04-29 | Silver-saving binding-type moving contact process technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103258673A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87107696A (en) * | 1987-06-13 | 1988-07-27 | 北京开关厂 | Mask method for local silver-plating |
| CN2935439Y (en) * | 2006-07-20 | 2007-08-15 | 郑建强 | Conductive device of low-resistance voltage sharing high-voltage segregate switch |
| CN201975272U (en) * | 2010-12-17 | 2011-09-14 | 上海华通开关厂有限公司 | Quincuncial contact |
| CN102290275A (en) * | 2011-08-05 | 2011-12-21 | 常熟市强盛冲压件有限公司 | Switch blade for high-voltage breaker and silver plating process for switch blade |
| US20120129374A1 (en) * | 2009-08-12 | 2012-05-24 | Abb Technology Ltd. | Tulip contact and electrical contact system for switching device |
-
2013
- 2013-04-29 CN CN2013101753437A patent/CN103258673A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87107696A (en) * | 1987-06-13 | 1988-07-27 | 北京开关厂 | Mask method for local silver-plating |
| CN2935439Y (en) * | 2006-07-20 | 2007-08-15 | 郑建强 | Conductive device of low-resistance voltage sharing high-voltage segregate switch |
| US20120129374A1 (en) * | 2009-08-12 | 2012-05-24 | Abb Technology Ltd. | Tulip contact and electrical contact system for switching device |
| CN201975272U (en) * | 2010-12-17 | 2011-09-14 | 上海华通开关厂有限公司 | Quincuncial contact |
| CN102290275A (en) * | 2011-08-05 | 2011-12-21 | 常熟市强盛冲压件有限公司 | Switch blade for high-voltage breaker and silver plating process for switch blade |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103924276B (en) | Electroplating system and electroplating method for surface-mounted light emitting diode support | |
| RU2014104692A (en) | COMMUNICATION SYSTEM USING THE PARTIAL POWER SUPPLY OF THE HIGH POWER AND THE METHOD FOR THEIR MANUFACTURE | |
| KR102314570B1 (en) | Electrical Connectors, Mobile Terminals and Methods of Manufacturing Electrical Connectors | |
| CN206774720U (en) | A kind of galvanization coating and terminal for terminal surfaces processing | |
| CN104014468A (en) | Processing technology for implementing light-reflecting face and frosted face on same plastic shell | |
| CN104513980A (en) | Metal layer structure formed on plastic surface and surface treatment technology | |
| CN103258673A (en) | Silver-saving binding-type moving contact process technology | |
| CN203890465U (en) | Electroplating system of surface mounting type light emitting diode (LED) bracket | |
| CN107708333B (en) | Preparation method of copper-reducing circuit board of new energy automobile battery | |
| CN203242511U (en) | Silver-saving bundled moving contact structure | |
| CN201717316U (en) | Combined type storage battery grid made from aluminum, bronze and silver plate | |
| CN204597675U (en) | A kind of quartz watch movement stepping motor iron core plated film insulation system | |
| CN104282427A (en) | Die-cast inductor welding point manufacturing technology | |
| CN203456303U (en) | Waveform-divided metalized film | |
| CN208987058U (en) | A kind of PCM Coil Coating Products and television set | |
| CN203602708U (en) | Coating film clamp for film coating device | |
| CN201117564Y (en) | Plating bimetal sheet | |
| CN102268720B (en) | Substrate electroplating clamp with covered rubber on surface | |
| CN104152879A (en) | A method of manufacturing barrier material-plated copper foil | |
| CN204039538U (en) | The composite electroplated hanger of a kind of flex circuit application | |
| CN204303574U (en) | A kind of closing device for capacitor | |
| CN104010447A (en) | Method for manufacturing conductor circuit | |
| CN204966072U (en) | Flat copper line of accurate nickel plating tin -plating | |
| CN104582375A (en) | Metal outer surface film lamination method and device, and metal housing | |
| CN203683386U (en) | Clamp for film oxidation on glass substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG DONGCHI SWITCH CO., LTD. Free format text: FORMER OWNER: NINGBO TIANCHI ELECTRIC APPLIANCE TECHNOLOGY CO., LTD. Effective date: 20131205 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 315322 NINGBO, ZHEJIANG PROVINCE TO: 315222 NINGBO, ZHEJIANG PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20131205 Address after: 315222 honor village, Sinpo Town, Cixi, Zhejiang Applicant after: ZHEJIANG DONGCHI SWITCH CO., LTD. Address before: 315322 West Industrial Zone, Sinpo Town, Zhejiang, Cixi Applicant before: Ningbo Tianchi Electrical Appliance Science & Technology Co., Ltd. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130821 |