CN201117564Y - Plating bimetal sheet - Google Patents

Plating bimetal sheet Download PDF

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Publication number
CN201117564Y
CN201117564Y CNU2007201923936U CN200720192393U CN201117564Y CN 201117564 Y CN201117564 Y CN 201117564Y CN U2007201923936 U CNU2007201923936 U CN U2007201923936U CN 200720192393 U CN200720192393 U CN 200720192393U CN 201117564 Y CN201117564 Y CN 201117564Y
Authority
CN
China
Prior art keywords
bimetal leaf
protective layer
plating
coated
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007201923936U
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Chinese (zh)
Inventor
洪常青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CNU2007201923936U priority Critical patent/CN201117564Y/en
Application granted granted Critical
Publication of CN201117564Y publication Critical patent/CN201117564Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a coating bimetallic strip which includes a bimetallic strip body that is coated with a coating protective layer. The bimetallic strip body is coated with the coating protective layer, thereby being provided with the advantages of corrosion resistance and long service life. With the metal with relative high conductivity, the coating protective layer can effectively lower the conductive resistance and lower the energy consumption and is easier to be controlled in the processing during the molding of the metallic strip.

Description

Film-plating bimetal leaf
(1) technical field
The utility model relates to a kind of film-plating bimetal leaf.
(2) background technology
Bimetal leaf is formed by stacking by the different alloy of two-layer thermal coefficient of expansion usually, and it is widely used in relay, switch, aspects such as controller.There is following defective in existing bimetal leaf:
1, bimetal leaf service time of a specified duration make moist easily and get rusty, all can not deal with problems fully even if take to add the wet goods way.
2, the metal material of formation bimetal leaf is generally all kinds of ferroalloys or other alloy, and resistance is bigger, and power consumption is bigger during use.
(3) utility model content
For solving the defective that bimetal leaf is perishable, useful life is short, resistance is big in the prior art, the utility model provides a kind of film-plating bimetal leaf.
Described film-plating bimetal leaf comprises the bimetal leaf body, and described bimetal leaf body is coated with the plated film protective layer.
Further, described plated film protective layer is copper or zinc or silver.
Further again, described plated film protective layer is a copper.
The beneficial effects of the utility model are: the bimetal leaf body is coated with the plated film protective layer, thereby bimetal leaf can be corrosion-resistant, long service life; The plated film protective layer adopts the high metal of relative conductivity, then can reduce conductive resistance effectively, reduces energy consumption, easier control temperature when sheet metal uses.
(4) description of drawings
Fig. 1 is the structural representation of bimetal leaf described in the utility model.
(5) embodiment
Below in conjunction with embodiment one step of the utility model is illustrated, but protection range of the present utility model is not limited to this.
With reference to Fig. 1, a kind of film-plating bimetal leaf comprises bimetal leaf body 1, and described bimetal leaf body 1 is coated with plated film protective layer 2.
Above-mentioned film-plating bimetal leaf can carry out the bimetal leaf surface electroplating processes to obtain the plated film protective layer usually.Described plating can be adopted barrel plating, electroplates and carries out in the cylinder electroplating machine.

Claims (3)

1, a kind of film-plating bimetal leaf comprises the bimetal leaf body, it is characterized in that described bimetal leaf body is coated with the plated film protective layer.
2, film-plating bimetal leaf as claimed in claim 2 is characterized in that described plated film protective layer is copper or zinc or silver.
3, film-plating bimetal leaf as claimed in claim 3 is characterized in that described plated film protective layer is a copper.
CNU2007201923936U 2007-10-31 2007-10-31 Plating bimetal sheet Expired - Fee Related CN201117564Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201923936U CN201117564Y (en) 2007-10-31 2007-10-31 Plating bimetal sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201923936U CN201117564Y (en) 2007-10-31 2007-10-31 Plating bimetal sheet

Publications (1)

Publication Number Publication Date
CN201117564Y true CN201117564Y (en) 2008-09-17

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ID=39992145

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201923936U Expired - Fee Related CN201117564Y (en) 2007-10-31 2007-10-31 Plating bimetal sheet

Country Status (1)

Country Link
CN (1) CN201117564Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102439679A (en) * 2009-04-15 2012-05-02 Abb股份公司 Thermal tripping device and installation switch apparatus having a thermal tripping device
CN102441627A (en) * 2010-10-12 2012-05-09 通用汽车环球科技运作有限责任公司 Bimetallic forging forming method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102439679A (en) * 2009-04-15 2012-05-02 Abb股份公司 Thermal tripping device and installation switch apparatus having a thermal tripping device
CN102439679B (en) * 2009-04-15 2015-02-11 Abb股份公司 Thermal tripping device and installation switch apparatus having a thermal tripping device
CN102441627A (en) * 2010-10-12 2012-05-09 通用汽车环球科技运作有限责任公司 Bimetallic forging forming method
CN102441627B (en) * 2010-10-12 2015-05-13 通用汽车环球科技运作有限责任公司 Bimetallic forging forming method

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080917

Termination date: 20101031