CN201117564Y - Plating bimetal sheet - Google Patents
Plating bimetal sheet Download PDFInfo
- Publication number
- CN201117564Y CN201117564Y CNU2007201923936U CN200720192393U CN201117564Y CN 201117564 Y CN201117564 Y CN 201117564Y CN U2007201923936 U CNU2007201923936 U CN U2007201923936U CN 200720192393 U CN200720192393 U CN 200720192393U CN 201117564 Y CN201117564 Y CN 201117564Y
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- CN
- China
- Prior art keywords
- bimetal leaf
- protective layer
- plating
- coated
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a coating bimetallic strip which includes a bimetallic strip body that is coated with a coating protective layer. The bimetallic strip body is coated with the coating protective layer, thereby being provided with the advantages of corrosion resistance and long service life. With the metal with relative high conductivity, the coating protective layer can effectively lower the conductive resistance and lower the energy consumption and is easier to be controlled in the processing during the molding of the metallic strip.
Description
(1) technical field
The utility model relates to a kind of film-plating bimetal leaf.
(2) background technology
Bimetal leaf is formed by stacking by the different alloy of two-layer thermal coefficient of expansion usually, and it is widely used in relay, switch, aspects such as controller.There is following defective in existing bimetal leaf:
1, bimetal leaf service time of a specified duration make moist easily and get rusty, all can not deal with problems fully even if take to add the wet goods way.
2, the metal material of formation bimetal leaf is generally all kinds of ferroalloys or other alloy, and resistance is bigger, and power consumption is bigger during use.
(3) utility model content
For solving the defective that bimetal leaf is perishable, useful life is short, resistance is big in the prior art, the utility model provides a kind of film-plating bimetal leaf.
Described film-plating bimetal leaf comprises the bimetal leaf body, and described bimetal leaf body is coated with the plated film protective layer.
Further, described plated film protective layer is copper or zinc or silver.
Further again, described plated film protective layer is a copper.
The beneficial effects of the utility model are: the bimetal leaf body is coated with the plated film protective layer, thereby bimetal leaf can be corrosion-resistant, long service life; The plated film protective layer adopts the high metal of relative conductivity, then can reduce conductive resistance effectively, reduces energy consumption, easier control temperature when sheet metal uses.
(4) description of drawings
Fig. 1 is the structural representation of bimetal leaf described in the utility model.
(5) embodiment
Below in conjunction with embodiment one step of the utility model is illustrated, but protection range of the present utility model is not limited to this.
With reference to Fig. 1, a kind of film-plating bimetal leaf comprises bimetal leaf body 1, and described bimetal leaf body 1 is coated with plated film protective layer 2.
Above-mentioned film-plating bimetal leaf can carry out the bimetal leaf surface electroplating processes to obtain the plated film protective layer usually.Described plating can be adopted barrel plating, electroplates and carries out in the cylinder electroplating machine.
Claims (3)
1, a kind of film-plating bimetal leaf comprises the bimetal leaf body, it is characterized in that described bimetal leaf body is coated with the plated film protective layer.
2, film-plating bimetal leaf as claimed in claim 2 is characterized in that described plated film protective layer is copper or zinc or silver.
3, film-plating bimetal leaf as claimed in claim 3 is characterized in that described plated film protective layer is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201923936U CN201117564Y (en) | 2007-10-31 | 2007-10-31 | Plating bimetal sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201923936U CN201117564Y (en) | 2007-10-31 | 2007-10-31 | Plating bimetal sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201117564Y true CN201117564Y (en) | 2008-09-17 |
Family
ID=39992145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201923936U Expired - Fee Related CN201117564Y (en) | 2007-10-31 | 2007-10-31 | Plating bimetal sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201117564Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102439679A (en) * | 2009-04-15 | 2012-05-02 | Abb股份公司 | Thermal tripping device and installation switch apparatus having a thermal tripping device |
| CN102441627A (en) * | 2010-10-12 | 2012-05-09 | 通用汽车环球科技运作有限责任公司 | Bimetallic forging forming method |
-
2007
- 2007-10-31 CN CNU2007201923936U patent/CN201117564Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102439679A (en) * | 2009-04-15 | 2012-05-02 | Abb股份公司 | Thermal tripping device and installation switch apparatus having a thermal tripping device |
| CN102439679B (en) * | 2009-04-15 | 2015-02-11 | Abb股份公司 | Thermal tripping device and installation switch apparatus having a thermal tripping device |
| CN102441627A (en) * | 2010-10-12 | 2012-05-09 | 通用汽车环球科技运作有限责任公司 | Bimetallic forging forming method |
| CN102441627B (en) * | 2010-10-12 | 2015-05-13 | 通用汽车环球科技运作有限责任公司 | Bimetallic forging forming method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20101031 |