CN103229434A - Sending and receiving optical component and optical module - Google Patents
Sending and receiving optical component and optical module Download PDFInfo
- Publication number
- CN103229434A CN103229434A CN201280002169XA CN201280002169A CN103229434A CN 103229434 A CN103229434 A CN 103229434A CN 201280002169X A CN201280002169X A CN 201280002169XA CN 201280002169 A CN201280002169 A CN 201280002169A CN 103229434 A CN103229434 A CN 103229434A
- Authority
- CN
- China
- Prior art keywords
- receiving device
- receiving
- optical assembly
- chip
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention discloses a sending and receiving optical component and an optical module. The sending and receiving optical component includes a sending device, a receiving device and a filtering device, wherein the sending device and the filtering device are integrated into the same chip and the receiving device is fixed on the outer surface of the chip; on one aspect, the sending device sends optical signals and transmits the optical signals to the outside through the filtering device; on the other aspect, optical signals which are transmitted from the outside are reflected into the receiving device through the filtering device. The optical module is provided with the sending and receiving optical device. Because the receiving device is arranged externally on the outer surface of the chip and the sending device is integrated into the chip, the possibility that the optical signals may generate cross-talk to the receiving device is reduced greatly and the influence on the receiving performance of other optical signals of the receiving device are further reduced or eliminated. Moreover, the sending and receiving optical component is simple in structure, smaller in the size of the chip and lower in cost.
Description
Technical field
The present invention relates to electronic applications, particularly a kind of transmitting-receiving optical assembly and optical module.
Background technology
Passive optical network PON (passive optical network) technology relies on its network architecture of putting multiple spot and many advantages such as passive, becomes optical fiber and inserts FTTx(Fiber To The X) field is subjected to the solution of operator's favor most.But the large scale deployment of PON technology directly is limited by the cost of active optical assembly.Active optical assembly commonly used is a kind of transmitting-receiving optical assembly, mainly comprise: ballistic device, receiving device, filtering device, ballistic device is launched light signal on the one hand, and wave device spreads out of the external world with this light signal after filtration, receives the extraneous light signal that transmits on the other hand, and the reflection of this light signal is entered receiving device by filtering device, it is separate to receive and dispatch two aspects.
General active optical assembly, constituted ballistic device by laser (DFB:Distributed feedback laser) and monitoring detector (mPD:monitor photodetector), (PD:Photodetector) constituted receiving device by detector, constitute filtering device by wavelength division multiplexer (WDM:Wavelength division multiplexer), dock with external fiber then, ballistic device and receiving device close ripple, partial wave by WDM respectively, different light signals is received and launch.
In the active optical assembly of transceiver, ballistic device is when external world's emission light signal, the transmit direction of ballistic device can be set, but the light signal that sends can be to different directions scattering, reflection etc. at chip internal, near as easy as rolling off a log the entering receiving device, this part light signal can form a kind of noise, receiving device is produced crosstalk, thereby influence the receptivity of receiving device to other light signals.
Summary of the invention
In order to solve the light signal problem that generation is crosstalked to receiving device that the prior art ballistic device sends, the embodiment of the invention provides a kind of transmitting-receiving optical assembly and optical module.Described technical scheme is as follows:
First aspect, a kind of transmitting-receiving optical assembly is provided, described transmitting-receiving optical assembly comprises: ballistic device, receiving device and filtering device, and described ballistic device and described filtering device all are integrated in same chip internal, and described receiving device is fixed in the outer surface of described chip;
Described ballistic device emission light signal, and the described filtering device of process is sent to the external world with this light signal; And the light signal that is imported into by the external world enters described receiving device by described filtering device reflection.
In first kind of first aspect possible implementation, described receiving device is fixed in the outer surface of described chip top by the formal dress or the mode of losing money instead of making money.
In conjunction with first kind of possibility implementation of first aspect, in second kind of possible implementation, the edge of the described chip of described receiving device below is set to beveled edges, and described beveled edges is used for light signal is reflexed to described receiving device.
In conjunction with first aspect, first aspect first kind may implementation or second kind of first aspect may implementation, in the third possible implementation, described transmitting-receiving optical assembly also comprises filter plate, described filter plate is arranged between described receiving device and the described chip, and described filter plate is used for the light signal that enters described receiving device is filtered.
In conjunction with the third possibility implementation of first aspect, optionally, in the 4th kind of possible implementation of first aspect, described filter plate and described receiving device become one.
In conjunction with the third possibility implementation of first aspect, optionally, in the 5th kind of possible implementation of first aspect, described filter plate and described receiving device are separate.
Second aspect provides a kind of optical module, and described optical module is provided with the transmitting-receiving optical assembly.
The third aspect, a kind of transmitting-receiving optical assembly is provided, described transmitting-receiving optical assembly comprises: ballistic device, receiving device and filtering device, described ballistic device comprises reflector and monitoring detector, described reflector and described filtering device all are integrated in same chip internal, and described monitoring detector and described receiving device are fixed in the outer surface of described chip;
Described ballistic device emission light signal, and the described filtering device of process is sent to the external world with this light signal; And the light signal that is imported into by the external world enters described receiving device by described filtering device reflection.
In first kind of the third aspect possible implementation, described receiving device is fixed in the outer surface of described chip top by the formal dress or the mode of losing money instead of making money.
In conjunction with first kind of possibility implementation of the third aspect, in second kind of possible implementation, the edge of the described chip of described receiving device below is set to beveled edges, and described beveled edges is used for light signal is reflexed to described receiving device.
In conjunction with the third aspect, the third aspect first kind may implementation or second kind of the third aspect may implementation, in the third possible implementation, described transmitting-receiving optical assembly also comprises filter plate, described filter plate is arranged between described receiving device and the described chip, and described filter plate is used for the light signal that enters described receiving device is filtered.
In conjunction with the third possibility implementation of the third aspect, in the 4th kind of possible implementation of the third aspect, described filter plate and described receiving device become one.
In conjunction with the third possibility implementation of the third aspect, in the 5th kind of possible implementation of the third aspect, described filter plate and described receiving device are separate.
Fourth aspect provides a kind of optical module, and described optical module is provided with the transmitting-receiving optical assembly.
The beneficial effect that the technical scheme that the embodiment of the invention provides is brought is:
The embodiment of the invention is by being placed on receiving device the outer surface of chip, ballistic device then is integrated in chip internal, the light signal of ballistic device emission is by scattering, channels such as reflection change the direction of light signal, and light signal passes chip internal enters the chip outer surface place with angle accurately receiving device, this process is compared background technology and is wanted the many of difficulty, and the light signal that can enter receiving device also can only be a special angle, and it is extremely faint, reduce greatly thereby make this light signal produce the possibility of crosstalking, and then reduce even remove from the influence of receiving device the receptivity of other light signals to receiving device; In addition, embodiment of the invention structure is more simple, and chip size reduces, and cost of manufacture reduces greatly, and is significant in actual applications.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the front view of the transmitting-receiving optical assembly that provides of the embodiment of the invention one;
Fig. 2 is the vertical view of transmitting-receiving optical assembly among Fig. 1;
Fig. 3 is the vertical view of the transmitting-receiving optical assembly that provides of the embodiment of the invention two;
Fig. 4 is the A-A cutaway view of Fig. 3;
Fig. 5 is the B-B cutaway view of Fig. 3.
Wherein: 1 ballistic device, 11 lasers, 12 monitoring detectors, 2 receiving devices, 3 filtering devices, 4 beveled edges, 5 filter plates, 6 chips.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, embodiment of the present invention is described further in detail below in conjunction with accompanying drawing.
As shown in Figure 1, a kind of transmitting-receiving optical assembly that the embodiment of the invention provides, described transmitting-receiving optical assembly comprises: ballistic device 1, receiving device 2 and filtering device, described ballistic device 1 and described filtering device all are integrated in same chip 6 inside, and described receiving device 2 is fixed in the outer surface of described chip 6;
On the one hand, described ballistic device 1 emission light signal, and the described filtering device of process is sent to the external world with this light signal; On the other hand, receive the light signal that imports into by the external world, and this light signal reflection is entered described receiving device 2 by described filtering device.
Wherein, in the present embodiment, the chip 6 general indium phosphide InP chips 6 that adopt, by laser 11(DFB:Distributed feedback laser) and monitoring detector 12(mPD:monitor photodetector) constituted ballistic device 1, (PD:Photodetector) constituted receiving device 2 by detector, constitute filtering device by wavelength division multiplexer (WDM:Wavelength division multiplexer), then with extraneous fiber alignment, ballistic device 1 and receiving device 2 close ripple by WDM respectively, partial wave, different light signals is received and launches, general laser 11, monitoring detector 12 and wavelength division multiplexer all be on InP chip 6 by epitaxially grown mode, directly on the InP wafer, be made into.
The embodiment of the invention is by being placed on receiving device 2 outer surface of chip 6, ballistic device 1 then is integrated in chip 6 inside, the light signal of ballistic device 1 emission is by scattering, channels such as reflection change the direction of light signal, and light signal passes chip 6 inside and enters the receiving device 2 of chip 6 outer surface with angle accurately, this process is compared background technology and is wanted the many of difficulty, and the light signal that can enter receiving device 2 also can only be a special angle, and it is extremely faint, from but this light signal produces the possibility of crosstalking to receiving device 2 reduces greatly, and then reduce even remove from the influence of receiving device 2 to the receptivity of other light signals; In addition, embodiment of the invention structure is more simple, in the prior art, need to be provided with three-decker on the chip substrate, ground floor is the passive wave guide layer, general main InGaAsP phosphorus InGaAsP material higher by refractive index, that absworption peak is short constitutes, but be not limited thereto, this ducting layer is mainly used in makes wavelength division multiplexer and other passive waveguide structure, the second layer is an active layer, general main InGaAsP phosphorus InGaAsP material lower by refractive index, that absworption peak is long constitutes, but is not limited thereto, and this active layer is mainly used in makes laser and monitoring detector; The 3rd layer then is mainly used in the making receiving device, it is detector, between each layer structure by the InP material interval, the present invention then only needs double-layer structure, promptly only need the ground floor and the second layer, receiving device 2 can directly be fixed on chip 6 outer surface and get final product, thereby remove from three-decker making receiving device 2 is set specially, and then the structure of the embodiment of the invention is simplified, design and the integrated difficulty of device extension have greatly been reduced, reduce the complexity that the device extension is integrated and make, improve the acceptance rate of producing, and receiving device 2 directly is attached to chip 6 outer surfaces, need not to carry out spacial alignment, operations such as focusing and passive coupling are simplified encapsulation of the present invention; Because receiving device 2 external outer surface at chip 6, can shorten the waveguide length of receiving device 2, thereby can shorten the length of entire chip 6, and can make on the same chip 6 and hold more device, cost of manufacture reduces greatly, and is significant in actual applications.
As shown in Figure 1, particularly, as preferably, described receiving device 2 is fixed in the outer surface of described chip 6 tops by the formal dress or the mode of losing money instead of making money.Certainly, those skilled in the art guarantee that receiving device 2 is fixed in chip 6 outer surface no matter receiving device 2 by which kind of mode, needs only as can be known, receiving device 2 also can be fixed in the outer surface of chip 6 other directions, as long as inconsistent with the light signal direction of luminescent device emission.
As shown in Figure 1, further, the edge of the described chip 6 of described receiving device 2 belows is set to beveled edges 4, and described beveled edges 4 is used for light signal is reflexed to described receiving device 2.
When work, light signal enters from the left end of chip 6, and transmission enters the right in the passive wave guide layer, because the existence of the right beveled edges 4, the light signal that arrives the right can reflect, and makes light signal change direction, upwards enters into receiving device 2 detectors.By the angle of beveled edges 4 is set, make light signal accurately be folded to and enter into detector that finish normal reception, in this embodiment, detector can be diode PIN, also can be avalanche photodide APD.Wherein, semiconductor is the crystalline material that the crystal orientation is arranged, and crystal has directivity, and different directions crystalline nature difference along lattice, such as along certain specific crystal orientation, semiconductor device can be easy to dissociate and form a clean smooth plane of disruption, and is same, on some specific crystal orientation, chemical corrosion liquid is also different fully to the corrosion rate of crystal, as the InP material, after through the chemical corrosion liquid wet etching, naturally formed the symmetrical rank of falling from power, the slope of hypotenuse is identical.And in embodiments of the present invention in the passive wave guide layer of chip 6, this hypotenuse is beveled edges 4, its slope directly influences the light signal direction that enters detector, the final receptivity that influences detector, therefore how to make smooth beveled edges 4, just become a key point of technology, because in the passive wave guide layer, sandwich layer is different with tectal material, etching forms irregular surface easily, and the sandwich layer number is many more, and reflecting surface is coarse more, in order to address the above problem, can use different solutions earlier, the layer that etching is different forms contra bevel, utilize the low solution of selectivity again, such as Br
2, the difference between the floating different levels.
As shown in Figure 1, as preferably, described transmitting-receiving optical assembly also comprises filter plate 5, and described filter plate 5 is arranged between described receiving device 2 and the described chip 6, and described filter plate 5 is used for the light signal that enters described receiving device 2 is filtered.In the present embodiment, filter plate 5 is mainly used in and stops the light signal that is entered receiving device 2 by ballistic device 1 emission, also can according to actual needs other unwanted signals be stopped.
Particularly, as preferably, described filter plate and described receiving device become one.
As shown in Figure 1, as preferably, described filter plate 5 is separate with described receiving device 2.
Wherein, filter plate 5 also can be so that from the light signal of ballistic device 1 laser 11, be blocked in outside the receiving device 2, and can not enter receiving device 2 becomes noise; This filter plate 5 can be a discrete device, also can integrate with receiving device 2 by the method for plated film.
In addition, as shown in Figure 2, constitute filtering device 3 by wavelength division multiplexer, the selection of receiving device in the embodiment of the invention (referring to Fig. 1) be used for integrated chip (referring to Fig. 1) platform independence, can be according to different scenes, flexible different PIN and the APD of sensitivity that selects, i.e. diode and avalanche photodide; The embodiment of the invention can also be by selecting the receiving device (referring to Fig. 1) of different parameters, GPON, EPON(a new generation optical fiber access technology) be upgraded to other parts that 10G GPON and 10G EPON are used for integrated chip (referring to Fig. 1) platform, substantially can be motionless, thus reach simple and easy purpose of upgrading.
A kind of optical module, described optical module are provided with embodiment one described transmitting-receiving optical assembly.The structure of the transmitting-receiving optical assembly among the above embodiment one is all identical, does not repeat them here.Transmitting-receiving optical assembly in the embodiment of the invention reduces the light signal possibility that generation is crosstalked to receiving device of ballistic device emission greatly, and then reduces even remove from the influence of receiving device to the receptivity of other light signals; In addition, embodiment of the invention structure is more simple, and chip size reduces, and cost of manufacture reduces greatly, and is significant in actual applications.
Embodiment two
As shown in Figure 3, a kind of vertical view of receiving and dispatching optical assembly of providing of the embodiment of the invention.
As shown in Figure 4, a kind of transmitting-receiving optical assembly that the embodiment of the invention provides, described transmitting-receiving optical assembly comprises: ballistic device 1, receiving device (referring to Fig. 3) and filtering device (referring to Fig. 3), described ballistic device 1 comprises laser 11 and monitoring detector 12, described laser 11 and described filtering device (referring to Fig. 3) all are integrated in same chip 6 inside, and described monitoring detector 12 and described receiving device (referring to Fig. 3) are fixed in the outer surface of described chip 6;
On the one hand, described ballistic device 1 emission light signal, and the described filtering device of process (referring to Fig. 3) is sent to the external world with this light signal; On the other hand, receive the light signal that imports into by the external world, and this light signal reflection is entered described receiving device (referring to Fig. 3) by described filtering device (referring to Fig. 3).
Wherein, in the present embodiment, the chip 6 general InP(indium phosphides that adopt) chip 6, by laser 11(DFB:Distributed feedback laser) and monitoring detector 12(mPD:monitor photodetector) constituted ballistic device 1, laser 11 is reflector, constituted receiving device (referring to Fig. 3) by detector (PD:Photodetector), constitute filtering device (referring to Fig. 3) by wavelength division multiplexer (WDM:Wavelength division multiplexer), ballistic device 1 and receiving device (referring to Fig. 3) close ripple by WDM respectively, partial wave, different light signals is received and launches, present embodiment is on the basis of embodiment one, monitoring detector in the ballistic device 1 12 is adopted and the same mode of receiving device (referring to Fig. 3), be placed on the outer surface of chip 6, so be provided with and can make the length of entire chip 6 shorter, entire chip 6 is more smaller and more exquisite than embodiment one.General laser 11 and wavelength division multiplexer all be on InP chip 6 by epitaxially grown mode, direct on the InP wafer, be made into.
The embodiment of the invention is by being placed on receiving device (referring to Fig. 3) outer surface of chip 6, ballistic device 1 then is integrated in chip 6 inside, the light signal of ballistic device 1 emission is by scattering, channels such as reflection change the direction of light signal, and light signal passes chip 6 inside and enters the receiving device (referring to Fig. 3) of chip 6 outer surface with angle accurately, this process is compared background technology and is wanted the many of difficulty, and the light signal that can enter receiving device (referring to Fig. 3) also can only be a special angle, and it is extremely faint, from but this light signal produces the possibility crosstalk to receiving device (referring to Fig. 3) reduces greatly, and then reduce even remove from the influence of receiving device (referring to Fig. 3) to the receptivity of other light signals; In addition, embodiment of the invention structure is more simple, in the prior art, need to be provided with three-decker on chip 6 substrates, ground floor is the passive wave guide layer, general main InGaAsP phosphorus InGaAsP material lower by refractive index, that absworption peak is short constitutes, but be not limited thereto, this ducting layer is mainly used in makes wavelength division multiplexer and other passive waveguide structure, the second layer is an active layer, general main InGaAsP phosphorus InGaAsP material higher by refractive index, that absworption peak is long constitutes, but is not limited thereto, and this active layer is mainly used in makes laser 11 and monitoring detector 12; The 3rd layer then is mainly used in making receiving device (referring to Fig. 3), it is detector, between each layer structure by the InP material interval, the present invention then only needs double-layer structure, promptly only need the ground floor and the second layer, receiving device (referring to Fig. 3) can directly be fixed on chip 6 outer surface and get final product, thereby remove from three-decker making receiving device (referring to Fig. 3) is set specially, and then the structure of the embodiment of the invention is simplified, design and the integrated difficulty of device extension have greatly been reduced, reduce the complexity that the device extension is integrated and make, improve the acceptance rate of producing, and receiving device (referring to Fig. 3) directly is attached to chip 6 outer surfaces, need not to carry out spacial alignment, operations such as focusing and passive coupling are simplified encapsulation of the present invention; Because the external outer surface of receiving device (referring to Fig. 3) at chip 6, can shorten the waveguide length of receiving device (referring to Fig. 3), thereby can shorten the length of entire chip 6, and can make on the same chip 6 and hold more device, cost of manufacture reduces greatly, and is significant in actual applications.
As shown in Figure 5, particularly, as preferably, described receiving device 2 is fixed in the outer surface of described chip 6 tops by the formal dress or the mode of losing money instead of making money.Certainly, those skilled in the art guarantee that receiving device 2 is fixed in chip 6 outer surface no matter receiving device 2 by which kind of mode, needs only as can be known, receiving device 2 also can be fixed in the outer surface of chip 6 other directions, as long as inconsistent with the light signal direction of luminescent device emission.
As shown in Figure 5, further, the edge of the described chip 6 of described receiving device 2 belows is set to beveled edges 4, and described beveled edges 4 is used for light signal is reflexed to described receiving device 2.In the present embodiment, because monitoring detector 12 (referring to Fig. 4) and receiving device 2 are all external at chip 6 outer surfaces, so the purpose of beveled edges 4 is: the first, the light signal reflection that the external world is imported into enters receiving device 2; The second, the light signal of laser 11 (referring to Fig. 4) is reflexed to monitoring detector 12 (referring to Fig. 4).
When work, light signal enters from the left end of chip 6, and transmission enters the right in the passive wave guide layer, because the existence of the right beveled edges 4, the light signal that arrives the right can reflect, and makes light signal change direction, upwards enters into receiving device 2 detectors.By the angle of beveled edges 4 is set, make light signal accurately be folded to and enter into detector, finish normal reception, in this embodiment, detector can be PIN, promptly diode also can be APD, i.e. avalanche photodide.Wherein, semiconductor is the crystalline material that the crystal orientation is arranged, and crystal has directivity, and different directions crystalline nature difference along lattice, such as along certain specific crystal orientation, semiconductor device can be easy to dissociate and form a clean smooth plane of disruption, and is same, on some specific crystal orientation, chemical corrosion liquid is also different fully to the corrosion rate of crystal, as the InP material, after through the chemical corrosion liquid wet etching, naturally formed the symmetrical rank of falling from power, the slope of hypotenuse is identical.And in embodiments of the present invention in the passive wave guide layer of chip 6, this hypotenuse is beveled edges 4 very, its slope directly influences the light signal direction that enters detector, the final receptivity that influences detector, therefore how to make smooth beveled edges 4, just become a key point of technology, because in the passive wave guide layer, sandwich layer is different with tectal material, etching forms irregular surface easily, and the sandwich layer number is many more, and reflecting surface is coarse more, in order to address the above problem, can use different solutions earlier, the layer that etching is different forms contra bevel, utilize the low solution of selectivity again, such as Br
2, the difference between the floating different levels.
As shown in Figure 5, as preferably, described transmitting-receiving optical assembly also comprises filter plate 5, and described filter plate 5 is arranged between described receiving device 2 and the described chip 6, and described filter plate 5 is used for the light signal that enters described receiving device 2 is filtered.In the present embodiment, filter plate 5 is mainly used in and stops the light signal that is entered receiving device 2 by ballistic device (referring to Fig. 4) emission, also can according to actual needs other unwanted signals be stopped.
Particularly, as preferably, described filter plate and described receiving device become one.
As shown in Figure 5, as preferably, described filter plate 5 is separate with described receiving device 2.
Wherein, filter plate 5 also can be so that from the light signal of ballistic device (referring to Fig. 4) laser (referring to Fig. 4), be blocked in outside the receiving device 2, and can not enter receiving device 2 becomes noise; This filter plate 5 can be a discrete device, also can integrate with receiving device 2 by the method for plated film.
In addition, in the embodiment of the invention selection of receiving device 2 be used for integrated chip 6 platform independences, can be according to different scenes, different PIN and the APD of sensitivity that selects, i.e. diode and avalanche photodide flexibly; The embodiment of the invention can also be by selecting the receiving device 2 of different parameters, the GPON(gigabit passive optical network) and the EPON(ethernet passive optical network) be upgraded to other parts that 10G GPON and 10G EPON are used for integrated chip 6 platforms, substantially can be motionless, thus reach simple and easy purpose of upgrading.
A kind of optical module, described optical module are provided with embodiment two described transmitting-receiving optical assemblies.The structure of the transmitting-receiving optical assembly among the above embodiment two is all identical, does not repeat them here.Transmitting-receiving optical assembly in the embodiment of the invention reduces the light signal possibility that generation is crosstalked to receiving device of ballistic device emission greatly, and then reduces even remove from the influence of receiving device to the receptivity of other light signals; In addition, embodiment of the invention structure is more simple, and chip size reduces, and cost of manufacture reduces greatly, and is significant in actual applications.
The invention described above embodiment sequence number is not represented the quality of embodiment just to description.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (14)
1. receive and dispatch optical assembly for one kind, it is characterized in that, described transmitting-receiving optical assembly comprises: ballistic device, receiving device and filtering device, and described ballistic device and described filtering device all are integrated in same chip internal, and described receiving device is fixed in the outer surface of described chip;
Described ballistic device emission light signal, and the described filtering device of process is sent to the external world with this light signal; And the light signal that is imported into by the external world enters described receiving device by described filtering device reflection.
2. transmitting-receiving optical assembly according to claim 1 is characterized in that, described receiving device is fixed in the outer surface of described chip top by the formal dress or the mode of losing money instead of making money.
3. transmitting-receiving optical assembly according to claim 2 is characterized in that, the edge of the described chip of described receiving device below is set to beveled edges, and described beveled edges is used for light signal is reflexed to described receiving device.
4. according to any described transmitting-receiving optical assembly of claim 1-3, it is characterized in that, described transmitting-receiving optical assembly also comprises filter plate, and described filter plate is arranged between described receiving device and the described chip, and described filter plate is used for the light signal that enters described receiving device is filtered.
5. transmitting-receiving optical assembly according to claim 4 is characterized in that, described filter plate and described receiving device become one.
6. transmitting-receiving optical assembly according to claim 4 is characterized in that, described filter plate and described receiving device are separate.
7. an optical module is characterized in that, described optical module is provided with any described transmitting-receiving optical assembly of claim 1-6.
8. receive and dispatch optical assembly for one kind, it is characterized in that, described transmitting-receiving optical assembly comprises: ballistic device, receiving device and filtering device, described ballistic device comprises reflector and monitoring detector, described ballistic device and described filtering device all are integrated in same chip internal, and described monitoring detector and described receiving device are fixed in the outer surface of described chip;
Described ballistic device emission light signal, and the described filtering device of process is sent to the external world with this light signal; And the light signal that is imported into by the external world enters described receiving device by described filtering device reflection.
9. transmitting-receiving optical assembly according to claim 8 is characterized in that, described receiving device is fixed in the outer surface of described chip top by the formal dress or the mode of losing money instead of making money.
10. transmitting-receiving optical assembly according to claim 9 is characterized in that, the edge of the described chip of described receiving device below is set to beveled edges, and described beveled edges is used for light signal is reflexed to described receiving device.
11. any according to Claim 8-10 described transmitting-receiving optical assembly, it is characterized in that, described transmitting-receiving optical assembly also comprises filter plate, and described filter plate is arranged between described receiving device and the described chip, and described filter plate is used for the light signal that enters described receiving device is filtered.
12. transmitting-receiving optical assembly according to claim 11 is characterized in that, described filter plate and described receiving device become one.
13. transmitting-receiving optical assembly according to claim 11 is characterized in that, described filter plate and described receiving device are separate.
14. an optical module is characterized in that, described optical module is provided with any described transmitting-receiving optical assembly of claim 8-13.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/087915 WO2014101141A1 (en) | 2012-12-28 | 2012-12-28 | Transmitting-receiving optical component and optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103229434A true CN103229434A (en) | 2013-07-31 |
| CN103229434B CN103229434B (en) | 2015-12-09 |
Family
ID=48838338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280002169.XA Active CN103229434B (en) | 2012-12-28 | 2012-12-28 | A kind of transmitting-receiving optical assembly and optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103229434B (en) |
| WO (1) | WO2014101141A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103746748A (en) * | 2013-10-31 | 2014-04-23 | 华为技术有限公司 | Optical network terminal and digital integrated optical assembly |
| CN104092500A (en) * | 2014-07-13 | 2014-10-08 | 潘国新 | Integrated optical transceiver module |
| CN110289555A (en) * | 2019-06-21 | 2019-09-27 | 中国科学院半导体研究所 | Semiconductor laser light resource |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050019038A1 (en) * | 2002-12-06 | 2005-01-27 | Sony Corporation | Optical transceiver |
| US20050083982A1 (en) * | 2003-10-20 | 2005-04-21 | Binoptics Corporation | Surface emitting and receiving photonic device |
| CN1743886A (en) * | 2004-08-31 | 2006-03-08 | 安捷伦科技有限公司 | Compact optical transceiver module |
| US20060118893A1 (en) * | 2004-01-20 | 2006-06-08 | Binoptics Corporation | Monitoring photodetector for integrated photonic devices |
| CN101876732A (en) * | 2010-06-11 | 2010-11-03 | 伍茂仁 | Transmitting terminal module and receiving terminal module with optical waveguide structures |
| CN102141660A (en) * | 2010-09-15 | 2011-08-03 | 华为技术有限公司 | Integrated optical transceiving device |
-
2012
- 2012-12-28 CN CN201280002169.XA patent/CN103229434B/en active Active
- 2012-12-28 WO PCT/CN2012/087915 patent/WO2014101141A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050019038A1 (en) * | 2002-12-06 | 2005-01-27 | Sony Corporation | Optical transceiver |
| US20050083982A1 (en) * | 2003-10-20 | 2005-04-21 | Binoptics Corporation | Surface emitting and receiving photonic device |
| US20060118893A1 (en) * | 2004-01-20 | 2006-06-08 | Binoptics Corporation | Monitoring photodetector for integrated photonic devices |
| CN1743886A (en) * | 2004-08-31 | 2006-03-08 | 安捷伦科技有限公司 | Compact optical transceiver module |
| CN101876732A (en) * | 2010-06-11 | 2010-11-03 | 伍茂仁 | Transmitting terminal module and receiving terminal module with optical waveguide structures |
| CN102141660A (en) * | 2010-09-15 | 2011-08-03 | 华为技术有限公司 | Integrated optical transceiving device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103746748A (en) * | 2013-10-31 | 2014-04-23 | 华为技术有限公司 | Optical network terminal and digital integrated optical assembly |
| CN103746748B (en) * | 2013-10-31 | 2017-02-01 | 华为技术有限公司 | Optical network terminal and digital integrated optical assembly |
| CN104092500A (en) * | 2014-07-13 | 2014-10-08 | 潘国新 | Integrated optical transceiver module |
| CN110289555A (en) * | 2019-06-21 | 2019-09-27 | 中国科学院半导体研究所 | Semiconductor laser light resource |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014101141A1 (en) | 2014-07-03 |
| CN103229434B (en) | 2015-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102346284B (en) | Laser diode package structure using self-standing parallel plate beam splitter | |
| US9110260B2 (en) | Hybrid optical coupling module having an alignment mark formed on an optical transmission means and an array lens and manufacturing method thereof | |
| US10007065B2 (en) | Multiplexed optoelectronic engines | |
| US20140314422A1 (en) | Bidirectional parallel optical transceiver module and a method for bidirectionally communicating optical signals over an optical link | |
| US9709759B2 (en) | NxN parallel optical transceiver | |
| WO2019105113A1 (en) | Optical transceiver | |
| CN102694050B (en) | Optical receiver | |
| CN101517937B (en) | Method and system for integrated DWDM receivers | |
| CN103513351B (en) | Optical module | |
| CN104601244A (en) | 400 Gbps hot-plug high-speed optical transceiver module | |
| US9910218B2 (en) | Optical module and optical network system | |
| DE102014103330A1 (en) | Bidirectional optical data communication module | |
| EP2478401A1 (en) | Optoelectronic device for bidirectionally transporting information through optical fibers and method of manufacturing such a device | |
| WO2019173998A1 (en) | Optical receiving assembly, combined transceiver assembly, combined optical module, olt and pon system | |
| CN103229434A (en) | Sending and receiving optical component and optical module | |
| CN104049323A (en) | Optical module | |
| US20160119074A1 (en) | Optical transceiver having optics with rotated optical path | |
| CN109116469B (en) | Optical module | |
| CN107167886A (en) | A kind of multi-wave length parallel optical transceiving device | |
| Masuko et al. | A low cost PON transceiver using single TO-CAN type micro-BOSA | |
| Lim et al. | Low-cost coaxial-type single TO-can bidirectional optical subassembly | |
| CN203942534U (en) | Incorporated light transmitting-receiving subassembly | |
| JP7199143B2 (en) | Semiconductor light receiving device and its manufacturing method | |
| CN104092500A (en) | Integrated optical transceiver module | |
| CN203942535U (en) | Incorporated light transmitting-receiving subassembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |