CN203942534U - Incorporated light transmitting-receiving subassembly - Google Patents

Incorporated light transmitting-receiving subassembly Download PDF

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Publication number
CN203942534U
CN203942534U CN201420362499.6U CN201420362499U CN203942534U CN 203942534 U CN203942534 U CN 203942534U CN 201420362499 U CN201420362499 U CN 201420362499U CN 203942534 U CN203942534 U CN 203942534U
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light
plane
optical
optical chip
incorporated
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潘国新
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Abstract

The utility model provides a kind of incorporated light transmitting-receiving subassembly, described incorporated light transmitting-receiving subassembly comprises optical chip, light emitting devices, Light Coupled Device, light receiving element and light waveguide-layer, wherein, the surface of described optical chip is provided with isolation channel, described isolation channel extends to opposite side from a side of described optical chip, and described optical chip is separated into spatially to separate receiver region and emitter region, wherein said light emitting devices and described Light Coupled Device are arranged on described emitter region, and described light receiving element is arranged on described optical receiving region, described Light Coupled Device interconnects with described light emitting devices and described light receiving element respectively by described light waveguide-layer.

Description

Incorporated light transmitting-receiving subassembly
Technical field
The utility model relates to Fibre Optical Communication Technology, especially, relates to a kind of incorporated light transmitting-receiving subassembly that is applicable to passive optical network.
Background technology
Along with the continuous growth of user to bandwidth demand, traditional copper cash broadband access system is more and more faced with bandwidth bottleneck; Meanwhile, the Fibre Optical Communication Technology that bandwidth capacity is huge is increasingly mature, application cost declines year by year, therefore, Optical Access Network becomes the strong competitor of broadband access network of future generation gradually, wherein, and EPON (Passive Optical Network, PON) system, because its point-to-multipoint network architecture and system are by advantages such as passive device connections, becomes the solution that optical fiber access field operator favors most.
Generally speaking, passive optical network comprises an optical line terminal (Optical Line Terminal who is positioned at central office, OLT), multiple optical network unit (Optical Network Unit that are positioned at user's side, ONU) and between described optical line terminal and optical network unit for carrying out the Optical Distribution Network (Optical Distribution Network, ODN) of light signal branch/coupling or multiplex/demultiplex.Wherein, optical line terminal and optical network unit are generally referred to as optical access device, and it is mainly the transmitting-receiving of carrying out up-downgoing data by light transmitting-receiving subassembly.
Conventionally, light transmitting-receiving subassembly mainly comprises ballistic device, receiving device and Light Coupled Device, and wherein ballistic device is for utilizing emitted light signal exporting by Light Coupled Device, and Light Coupled Device also external optical signal be coupled to receiving device and receive.
For improving the integrated level of light transmitting-receiving subassembly and the overall dimensions of reduction device, a kind of correlation technique is ballistic device and receiving device are produced on same optical semiconductor chip and form incorporated light transmitting-receiving subassembly, but, adopt at present the integrated optical transmitting-receiving subassembly of said structure, may there is reflection or scattering in optical chip inside and produce reverberation or scattered light in the light signal of ballistic device transmitting, and above-mentioned utilizing emitted light and reverberation likely enter near the receiving device being arranged on ballistic device, thereby receiving device is caused and crosstalked, affect the reception of receiving device for normal light signal.
Utility model content
One of them object of the present utility model is that incorporated light transmitting-receiving subassembly is provided in order to address the above problem.
A kind of incorporated light transmitting-receiving subassembly, comprise optical chip, light emitting devices, Light Coupled Device, light receiving element and light waveguide-layer, wherein, the surface of described optical chip is provided with isolation channel, described isolation channel extends to opposite side from a side of described optical chip, and described optical chip is separated into spatially to separate receiver region and emitter region, wherein said light emitting devices and described Light Coupled Device are arranged on described emitter region, and described light receiving element is arranged on described optical receiving region, described Light Coupled Device interconnects with described light emitting devices and described light receiving element respectively by described light waveguide-layer.
Thereby the incorporated light transmitting-receiving subassembly that the utility model provides arranges isolation channel at optical chip and realizes the separate of emitter region and receiver region, and can realize the coupling of utilizing emitted light and reception light by corresponding light path design, due to optical transmitting set and optical receiver spatially separate, the utilizing emitted light that therefore can reduce light emitting devices, because scattered light and reverberation that scattering or reflection form cause and crosstalk light receiving element, ensures the receptivity of light receiving element; And, in the time that described incorporated light transmitting-receiving subassembly is applied in passive optical network, can effectively improve the light transmitting-receiving performance of optical network unit, reduce the error code causing owing to crosstalking, promote user and experience.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing using during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the structural representation of the passive optical network that incorporated light transmitting-receiving subassembly that the utility model provides can be applicable;
Fig. 2 is the planar structure schematic diagram of a kind of embodiment of incorporated light transmitting-receiving subassembly of providing of the utility model;
Fig. 3 is the side structure schematic diagram of the incorporated light transmitting-receiving subassembly that provides of the utility model.
Embodiment
To the technical scheme in the utility model embodiment be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
The incorporated light transmitting-receiving subassembly that the application provides goes for the point-to-multipoint Optical Access Network networks such as EPON (PON) system.Refer to Fig. 1, the structural representation of the PON system that its incorporated light transmitting-receiving subassembly providing for the utility model can be applicable.Described PON system 100 comprises at least one optical line terminal (OLT) equipment 110, multiple optical network unit (ONU) equipment 120 and the Optical Distribution Network 130 between described OLT equipment 110 and described ONU equipment 120.Wherein, be defined as down direction from described OLT equipment 110 to the direction of described ONU equipment 120; And be defined as up direction from described ONU equipment 120 to the direction of described OLT equipment 110.
Described PON system 100 can be to realize the communication network of the Data dissemination between described OLT equipment 110 and described ONU equipment 120 without any need for active device.In specific embodiment, described PON system 110 can be a G.983 step transmission mode EPON (ATM PON of series standard definition of ITU-T, APON) system or broadband passive optical network (Broadband PON, BPON) G.984 gigabit passive optical network (the Gagabit PON of series standard definition of system, ITU-T, GPON), the Ethernet passive optical network system of IEEE802.3ah standard definition (Ethernet PON, EPON) or next-generation passive optical network (such as XGPON or 10G EPON etc.).The full content of the various PON systems of above-mentioned standard definition is combined in present specification by reference.
Described OLT equipment 110 is usually located at central office (Central Office, CO) position, its can unified management described in multiple ONU equipment 120.Described OLT equipment 110 can serve as the medium between described ONU equipment 120 and upper layer network, be transmitted to described ONU equipment 120 using the data that receive from described upper layer network as downlink data and by described Optical Distribution Network 130, and the upstream data receiving from described ONU equipment 120 is forwarded to described upper layer network.
Described ONU equipment 120 can be arranged on user resident position by distributed earth.The network equipment that described ONU equipment 120 communicates for realizing described OLT equipment 110 and subscriber equipment, particularly, it can serve as the medium between described OLT equipment 110 and subscriber equipment, be forwarded to described OLT equipment 110 such as receiving data from subscriber equipment as upstream data and by described Optical Distribution Network 130, and the downlink data receiving from described OLT equipment 110 is transmitted to subscriber equipment.Be to be understood that, described ONU equipment 120 and Optical Network Terminal (Optical Network Terminal, ONT) device structure is close, therefore, in the scheme providing in present specification, between described ONU equipment 120 and ONT equipment, can exchange, for ease of describing, below be referred to as ONU equipment 120.
Described ONU equipment 120 can carry out the transmitting of uplink optical signal and the reception of downlink optical signal by the portion of setting within it or coupled light transmitting-receiving subassembly 121, described smooth transmitting-receiving subassembly 121 can adopt the incorporated light transmitting-receiving subassembly that the utility model provides to realize, and its concrete structure will be described in conjunction with Fig. 2 below.
Described Optical Distribution Network 130 is data distribution systems, and it can comprise optical fiber, optical coupler, optical branching device and/or other optical devices.Described optical fiber, described optical coupler, described optical branching device and/or described other optical devices can be passive device, just can realize the device of the Data dissemination between described OLT equipment 110 and described ONU equipment 120 without power supply support.In the PON system 100 shown in Fig. 1, described Optical Distribution Network 130 concrete configurations become to adopt two-stage beam-splitting structure; Alternately, described Optical Distribution Network 130 also can adopt other any point-to-multipoint network configurations such as single-stage light splitting or multistage light splitting.
Particularly, in the embodiment shown in fig. 1, described Optical Distribution Network 130 adopts two-stage beam-splitting structure to realize the Data dissemination between described OLT equipment 110 and described ONU equipment 120.Described Optical Distribution Network 130 comprises first order optical splitter 131 and multiple second level optical splitter 132.Wherein, the common port of described first order optical splitter 131 is connected to described OLT equipment 110 by trunk optical fiber (Trunk Fiber), and its branch end is connected to respectively the common port of described second level optical splitter 132 accordingly by profile fiber (Distributed Fiber), the branch end of each second level optical splitter 132 is further connected to corresponding ONU equipment 120 by branch optical fiber (Branch Fiber).
At down direction, after the downlink optical signal that described OLT equipment 110 sends first carries out first order light splitting through described first order optical splitter 131, carry out second level light splitting by described second level optical splitter 132 again, thereby produce multichannel downlink optical signal and export to respectively described ONU equipment 120, and being received by the light transmitting-receiving subassembly 121 of described ONU equipment 120; At up direction, described ONU equipment 120 the uplink optical signal that sends of light transmitting-receiving subassembly 121 close road by described second level optical splitter 132 and described first order optical splitter 131 successively after, form on the way traveling optical signal and output to described OLT equipment 110.In specific embodiment, alternatively, described first order optical splitter 131 can be deployed in the nearer fibre distribution frame of distance center office (Optical Distribution Frame, ODF), and described second level optical splitter 132 can be deployed in distant-end node (Remote Node, RN).
Refer to Fig. 2 and Fig. 3, the structural representation of its a kind of embodiment of incorporated light transmitting-receiving subassembly providing for the utility model.Described incorporated light transmitting-receiving subassembly 200 goes for the ONU equipment 120 of the PON system 100 described in Fig. 1, and as the light transmitting-receiving subassembly 121 of described ONU equipment 120.Described incorporated light transmitting-receiving subassembly 200 can comprise optical chip 210, Light Coupled Device 220, light emitting devices 230, light receiving element 240, light waveguide-layer 250 and filtering device 270.
Wherein, the chip substrate that described optical chip 210 can form for semi-conducting material manufacturing, such as indium phosphide (InP) substrate.Described optical chip 210 can have polygon plane structure, such as, in the present embodiment, described optical chip 210 can be for two corners of a wherein side of the Semiconductor substrate of rectangle plane are removed and obtain two inclined-planes, the first inclined-plane 211 shown in Fig. 2 and the second inclined-plane 212.Wherein, described the first inclined-plane 211 is between first side 211 and the second side 212 of described optical chip 210, and described the second inclined-plane 212 is between first side 211 and the 3rd side 213 of described optical chip 210, and be also connected by the 4th side 214 between described the second side 212 and described the 3rd side 213.
Particularly, the first side 211 of described optical chip 210, the first inclined-plane 215, the second side 212, the 4th side 214, the 3rd side 213, the second inclined-plane 212 are connected successively, and all perpendicular to the bottom surface 218 of described optical chip 210.Wherein, described the first side 211 is parallel relative with described the 4th side 214, and described the second side 212 is parallel with described the 3rd side 213 relatively, and described the first side 211 is also mutually vertical with described the 3rd side 213 with described the second side 212 with described the 4th side 214.In addition, angle between described the first inclined-plane 215 and described the second side 212 and described the first side 211 can be 135 °, and angle between described the second inclined-plane 216 and described the 3rd side 213 and described the first side 211 also can be 135 °, that is to say, described the first inclined-plane 215 is mutually vertical each other with described the second inclined-plane 216.
And, the surface of described optical chip 210 is also formed with isolation channel 280, described isolation channel 280 can extend to described the 4th side 214 from described the first side 211, and its bearing of trend can parallel with the second side 212 of described optical chip 210 and the 3rd side 213.Described isolation channel 280 can become the surface segmentation of described optical chip 210 two separate regions, i.e. emitter region and receiver region, and the two is respectively used to arrange described light emitting devices 230 and described light receiving element 240; Because described light emitting devices 230 and described light receiving element 240 are arranged on separate region, therefore can effectively reduce mutually crosstalking between the two.
Particularly, in the present embodiment, described light emitting devices 230 is arranged on the position of contiguous described second side 212 of emitter region of described optical chip 210, and described Light Coupled Device 220 is arranged on the position of contiguous described the 4th side 214 of light emitting area of described optical chip 210; Described light receiving element 240 is arranged on the position of contiguous described the 4th side 214 of optical receiving region of described optical chip 210.
Described light emitting devices 230 can comprise laser 231 and the back light detector 232 that space arranges, wherein said laser 231 can be distributed feedback (Distributed Feedback, DFB) laser, described back light detector 232 can be monitor optical detector (Monitor Photo-detector, mPD), it is arranged on the back side of described laser 231, backlight for detection of described laser 231.Described light receiving element 240 can be photodetector (Photodetector, PD), and described Light Coupled Device 220 can be wavelength division multiplexer (Wavelength Division Multiplexer, WDM), it can dock with external fiber, thereby realize the utilizing emitted light of described light emitting devices 230 is coupled to described external fiber, and couple light to described light receiving element 240 from the light signal of described external fiber as reception.
In the present embodiment, because emitter region and the receiver region of described optical chip 210 are separate, therefore described light emitting devices 230, described light receiving element 240 and described Light Coupled Device 220 can be produced on the same layer on described optical chip 210 surfaces.Particularly, described laser 231, described back light detector 232 and described Light Coupled Device 250 can form by the emitter zone zone epitaxial growth at described optical chip 210, and described light receiving element 240 can form by the light receiving area zone epitaxial growth at described optical chip 210.
Described light waveguide-layer 250 is for being formed on the surperficial passive optical waveguide layer of described optical chip 210, and it can adopt the phosphorus InGaAsP (InGaAsP) that refractive index is higher and absworption peak is shorter to be made.In the present embodiment, described light waveguide-layer 250 can comprise the first fiber waveguide 251, the second fiber waveguide 252 and the 3rd fiber waveguide 253.Wherein, described the first fiber waveguide 251 and described the second fiber waveguide 252 are all formed on the emitter region of described optical chip 210, and the bearing of trend of the two can all parallel with the second side 212 of described optical chip 210; And described the 3rd fiber waveguide 253 can be arranged on the receiver region of described optical chip 210, and its bearing of trend can parallel with the 3rd side 213 of described optical chip 210.
Described the first fiber waveguide 251 is connected between described laser 231 and described Light Coupled Device 220, for the utilizing emitted light of described laser 231 being exported to described Light Coupled Device 220.One end of described the second fiber waveguide 252 is connected to described Light Coupled Device 220, and the other end extends to the first inclined-plane 215 of described optical chip 210 from the emitter zone field surface of described optical chip 210.One end of described the 3rd fiber waveguide 253 is connected to described light receiving element 240, and the other end extends to the second inclined-plane 216 of described optical chip 210 from the receiver region surface of described optical chip 210.And the end that the end that described the 3rd fiber waveguide 253 and described the second inclined-plane 216 join and described the second fiber waveguide 252 and described the first inclined-plane 215 join toward each other, and can also be provided with described filtering device 270 between the two.Particularly, described filtering device 270 can be arranged on the position of contiguous described first sides 211 of isolation channel 280 on described optical chip 210 surfaces, its further filtering enter the Crosstalk in described receiver region.
The first inclined-plane 215 and second inclined-plane 216 of described optical chip 210 can be used as reflecting surface, such as, the surface on described the first inclined-plane 215 and described the second inclined-plane 216 can be provided with highly reflecting films, and the region of described optical chip 210 between described the first inclined-plane 215 and described the second inclined-plane 216 can be provided with optical waveguide material.Particularly, the light signal that described optical coupler 220 receives from outside can be transferred to described the first inclined-plane 215 by described the second fiber waveguide 252, and reflexed to described the second inclined-plane 216 and enter described the 3rd fiber waveguide 253 by described the first inclined-plane 215, described the 3rd fiber waveguide 253 further arrives described light receiving element 240 by described optical signal transmission, thereby realizes light-receiving function.
Thereby the incorporated light transmitting-receiving subassembly that the utility model provides arranges isolation channel at optical chip and realizes the separate of emitter region and receiver region, and can realize the coupling of utilizing emitted light and reception light by corresponding light path design, due to optical transmitting set and optical receiver spatially separate, the utilizing emitted light that therefore can reduce light emitting devices, because scattered light and reverberation that scattering or reflection form cause and crosstalk light receiving element, ensures the receptivity of light receiving element; And, in the time that described incorporated light transmitting-receiving subassembly is applied in passive optical network, can effectively improve the light transmitting-receiving performance of optical network unit, reduce the error code causing owing to crosstalking, promote user and experience.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model description to do; or be directly or indirectly used in other relevant technical field, within being all in like manner included in scope of patent protection of the present utility model.

Claims (10)

1. an incorporated light transmitting-receiving subassembly, it is characterized in that, comprise optical chip, light emitting devices, Light Coupled Device, light receiving element and light waveguide-layer, wherein, the surface of described optical chip is provided with isolation channel, described isolation channel extends to opposite side from a side of described optical chip, and described optical chip is separated into spatially to separate receiver region and emitter region, wherein said light emitting devices and described Light Coupled Device are arranged on the emitter region of described optical chip, described light receiving element is arranged on described optical receiving region, described Light Coupled Device interconnects with described light emitting devices and described light receiving element respectively by described light waveguide-layer.
2. incorporated light transmitting-receiving subassembly as claimed in claim 1, is characterized in that, also comprises filtering device, and wherein said filtering device is arranged on described isolation channel.
3. incorporated light transmitting-receiving subassembly as claimed in claim 2, is characterized in that, described light waveguide-layer comprises the first fiber waveguide, and described the first fiber waveguide is connected between described light emitting devices and described Light Coupled Device.
4. incorporated light transmitting-receiving subassembly as claimed in claim 2, is characterized in that, the same side of the contiguous described optical chip of described light receiving element and described Light Coupled Device arranges, and described isolation channel is between described light receiving element and described Light Coupled Device.
5. incorporated light transmitting-receiving subassembly as claimed in claim 4, it is characterized in that, and described optical chip comprises the first inclined-plane and the second inclined-plane, described the first inclined-plane and described the second inclined-plane lay respectively at the both sides of described isolation channel, and the two side being all close to away from described light receiving element and described Light Coupled Device.
6. incorporated light transmitting-receiving subassembly as claimed in claim 5, it is characterized in that, described light waveguide-layer also comprises the second fiber waveguide and the 3rd fiber waveguide, described the second fiber waveguide is all parallel with described isolation channel with described the 3rd fiber waveguide, wherein said second fiber waveguide one end is connected to described Light Coupled Device, and the other end extends to described the first inclined-plane; Described the 3rd fiber waveguide one end is connected to described light receiving element, and the other end extends to described the second inclined-plane.
7. incorporated light transmitting-receiving subassembly as claimed in claim 6, it is characterized in that, toward each other, and described filtering device is arranged between the end that end that described the 3rd fiber waveguide and described the second inclined-plane join and described the second fiber waveguide and described the first inclined-plane join the end that the end that described the 3rd fiber waveguide and described the second inclined-plane join and described the second fiber waveguide and described the first inclined-plane join.
8. incorporated light transmitting-receiving subassembly as claimed in claim 7, is characterized in that, described the first inclined-plane and described the second inclined-plane are reflecting surface.
9. incorporated light transmitting-receiving subassembly as claimed in claim 8, is characterized in that, mutually vertical between described the first inclined-plane and described the second inclined-plane.
10. incorporated light transmitting-receiving subassembly as claimed in claim 9, is characterized in that, described the first inclined-plane all has the angle of 135 ° with its side being connected with described optical chip with described the second inclined-plane.
CN201420362499.6U 2014-07-02 2014-07-02 Incorporated light transmitting-receiving subassembly Expired - Fee Related CN203942534U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114203838A (en) * 2021-12-10 2022-03-18 中国电子科技集团公司第四十四研究所 Super-radiation light-emitting diode chip integrated with lateral detector and preparation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114203838A (en) * 2021-12-10 2022-03-18 中国电子科技集团公司第四十四研究所 Super-radiation light-emitting diode chip integrated with lateral detector and preparation method
CN114203838B (en) * 2021-12-10 2024-03-29 中国电子科技集团公司第四十四研究所 Superradiation light-emitting diode chip integrated with lateral detector and preparation method

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Granted publication date: 20141112

Termination date: 20160702