The present invention be directed to the divisional application that female case (application number: 201010174999.3, the applying date: on May 14th, 2010, denomination of invention: capacitance type touch-control panel) is proposed.
Summary of the invention
For improving the shortcoming that existing capacitance type touch-control panel fine ratio of product is the best and range of application is limited, the main object of the present invention is providing a kind of capacitance type touch-control panel, and it has high fine ratio of product and is suitable for large scale manufacture.
The technical way taked by reaching object defined above is to make aforementioned capacitance type touch-control panel include:
One substrate, has a circuit surface;
Touch-control sensing circuit layer once, is located on the circuit surface of described substrate;
Conductor layer once, is provided on the edge of described lower touch-control sensing circuit layer, and electrically connects with described lower touch-control sensing circuit layer;
One transparent insulation glue-line, is provided on described lower touch-control sensing circuit layer and described lower wire layer;
One upper conductor layer, is provided on described transparent insulation glue-line;
Dielectric ink water layer on one, is to arrange to be covered in described upper conductor layer, and described upper dielectric ink water layer has and multiple wears groove, respectively wears and is filled with the conductive layer contacted with described upper conductor layer in groove;
Touch-control sensing circuit layer on one, is to arrange and be covered on described transparent insulation glue-line, and upper dielectric ink water layer described in covering part, and the conductive layer worn in groove with described upper dielectric ink water layer electrically connects;And
One cover plate, has a circuit surface, and described glass cover-plate is to be located on described upper touch-control sensing circuit layer with its circuit surface.
Utilize technique scheme, owing to described lower touch-control sensing circuit layer is to contact with cover plate respectively at described substrate with upper touch-control sensing circuit layer, therefore in technique, can design and make described substrate and cover plate form described lower touch-control sensing circuit layer and upper touch-control sensing circuit layer with separate technique, manufacture owing to utilizing plate process that flat board carries out one side line layer has been ripe technology, therefore process yields is good, and preferably fine ratio of product is then conducive to manufacturing large size panel.
Detailed description of the invention
A preferred embodiment about the present invention; refer to shown in Fig. 1 and Fig. 2, be to include on a glass substrate 11, once touch-control sensing circuit layer 12, once dielectric ink water layer 13, once conductor layer 14, once insulating barrier 15, once conductive adhesive layer 16, flexible circuit board 22, transparent insulation glue-line 30, on insulating barrier 41, in conductive adhesive layer 42, upper conductor layer 43, touch-control sensing circuit layer 45, glass cover-plate 46, up-protective layer 51 and a lower protective layer 52 on dielectric ink water layer 44,.
Above-mentioned glass substrate 11 has a circuit surface 111.
Above-mentioned lower touch-control sensing circuit layer 12 is formed on the circuit surface 111 of described glass substrate 11;In the present embodiment, described lower touch-control sensing circuit layer 12 is made up of the lower touch control line of two-layer equation touch control electrode layer, such as X-axis touch control line.
Above-mentioned lower dielectric ink water layer 13 is to be formed and be covered on the edge of described lower touch-control sensing circuit layer 12, the lower touch-control sensing circuit layer 12 not covered is made to constitute a Touch Zone 131, the most described lower dielectric ink water layer 13 is covered in correspondence lower touch-control sensing circuit layer 12 edge is formed with multiple groove 132 of wearing, and respectively wears and is filled with conductive layer 133 in groove 132;In the present embodiment, described lower dielectric ink water layer 13 is to use dark ink, with technology such as printer bakings, dark ink being made wear groove 132 to shape, therefore it is seen in another side relative to circuit surface 111 on described glass cover-plate 11, described lower dielectric ink water layer 13 has the effect covered;Additionally, described conductive layer 133 is to use or the conductive materials of approximation identical with the color of described lower dielectric ink water layer 13, therefore the existence wearing groove 132 can be sheltered.
Above-mentioned lower wire layer 14 is to be formed and be covered on described lower dielectric ink water layer 13, and the conductive layer 133 worn described in passing through in groove 132 electrically connects with described lower touch-control sensing circuit layer 12.
Above-mentioned lower insulating barrier 15 is to be formed and be covered on described lower wire layer 14, to avoid described lower wire layer 14 to cause oxidation because being exposed in air, the most described lower insulating barrier 15 has a breach 151 and the lower wire layer 14 of exposed portion;In the present embodiment, described lower insulating barrier 15 is to use transparent isolation material.
Above-mentioned lower conductive adhesive layer 16 is formed at covering the lower wire layer 14 exposed on described lower insulating barrier 15 at breach 151;In the present embodiment, described conductive adhesive layer 16 is to use anisotropic conductive film (AnisotropicConductiveFilm is called for short ACF) or anisotropic conductive (AnisotropicConductivePaste is called for short ACP).
In technique, a lower plate technique can be designed and complete foregoing glass substrate 11, lower touch-control sensing circuit layer 12, lower dielectric ink water layer 13, lower wire layer 14, lower insulating barrier 15 and the technique of lower conductive adhesive layer 16.
Above-mentioned flexible circuit board 20 has a lower surface 21 and upper surface 22, and described flexible circuit board 20 is to be located on described lower conductive adhesive layer 16 with its lower surface, and extending to outside described glass substrate 11, the most described flexible circuit board 20 is the conductive layer 133 wearing in groove 132 by described lower conductive adhesive layer 16 and described lower dielectric ink water layer 13 and electrically connects with described lower touch-control sensing circuit layer 12.
Above-mentioned transparent insulation glue-line 30 is formed on described Touch Zone 131 and lower insulating barrier 15.
Above-mentioned upper insulating barrier 41 is formed on described transparent insulation glue-line 30, and the most described upper insulating barrier 41 is to have a breach 411 and expose described flexible circuit board 20.
Above-mentioned upper conductive adhesive layer 42 is formed at contacting with the upper surface 22 of described flexible circuit board 20 at the breach 411 of described upper insulating barrier 41.
Above-mentioned upper conductor layer 43 is to be formed and be covered on described upper conductive adhesive layer 42 and upper insulating barrier 41.
Above-mentioned upper dielectric ink water layer 44 is to be formed and be covered in described upper conductor layer 43, the most described upper dielectric ink water layer 44 is be formed with multiple groove 441 of wearing, respectively wears groove 441 Chinese style and be filled with the conductive layer 442 contacted with described upper conductor layer 43;
In the present embodiment, described conductive layer 442 is to use or the conductive materials of approximation identical with the color of described upper dielectric ink water layer 44, to shelter the existence wearing groove 441.
Above-mentioned upper touch-control sensing circuit layer 45 is formed on described transparent insulation glue-line 30, and dielectric ink water layer 44 in covering part, and the conductive layer 442 worn in groove 441 with described upper dielectric ink water layer 44 contacts, consequently, it is possible to described upper touch-control sensing circuit layer 45 can wear the conductive layer 442 in groove 441 by described upper dielectric ink water layer 44 and described upper conductive adhesive layer 42 electrically connects with described flexible circuit board 20;In the present embodiment, described upper touch-control sensing circuit layer 45 is made up of the upper touch control line of two-layer equation touch control electrode layer, such as Y-axis touch control line.
Above-mentioned glass cover-plate 46 is to have a circuit surface 461, the most described glass cover-plate 46 is to be located on described upper touch-control sensing circuit layer 45 and upper dielectric ink water layer 44 with its circuit surface 461, therefore from described glass cover-plate 46, it is seen in another side relative to circuit surface 461, and described upper dielectric ink water layer 44 has the effect covering circuit.
In technique, can design and complete aforementioned upper insulating barrier 41, upper conductive adhesive layer 42, upper conductor layer 43, upper dielectric ink water layer 44, upper touch-control sensing circuit layer 45 and the manufacture of glass cover-plate 46 with the upper plate technique of one Yu described lower plate technique independence.
Refer to shown in Fig. 2; above-mentioned up-protective layer 51 is between upper surface 22 and the side of described glass cover-plate 46 being pasted on described flexible circuit board 20; when thus protection bends described flexible circuit board 20; will not directly contact with the side of described glass cover-plate 46, described flexible circuit board 20 therefore can be avoided damaged by the side cutting of described glass cover-plate 46 because of bending.
Above-mentioned lower protective layer 52 is between lower surface 21 and the side of described glass substrate 11 being pasted on described flexible circuit board 20, and its effect is identical with described up-protective layer 51.
The present invention has the advantage that
1. by above-mentioned structure, upper plate technique and the lower plate technique of separation can be designed in technique, because with current technical level, the making yield that use plate glass technique carries out one side line layer is good, therefore the structure of the present invention can make the more existing capacitance type touch-control panel of fine ratio of product good.
2. preferable due to the fine ratio of product of the present invention, therefore be conducive to making large size panel, make the present invention capacitance type touch-control panel application can more existing capacitance type touch-control panel wide.
3. the contact panel of the present invention is to form upper and lower dielectric ink water layer 44,13 respectively at the circuit surface 461,111 of glass cover-plate 46 and glass substrate 11, to be covered each by the edge of upper and lower touch-control sensing circuit layer 45,12, therefore upper and lower conductor layer 43,14, upper and lower insulating barrier 41,15 and the upper and lower conductive adhesive layer 42,16 being located between described upper and lower dielectric ink water layer 44,13 can be covered;Therefore, when being intended to after the contact panel of the present invention completes assemble with electronic product enclosure, the edge of casing can directly be designed at glass cover-plate 46 and the edge of glass substrate 11, increases the convenience in contact panel of the present invention design.
4. due to the upper and lower touch-control sensing circuit layer 45,12 of the present invention and upper and lower conductor layer 43,14 are provided at will not be exposed between described glass substrate 11 and glass cover-plate 46, therefore, when carrying the contact panel of the present invention, can avoid carrying and the most very cause upper and lower touch-control sensing circuit layer 45,12 and upper and lower conductor layer 43,14 damage problem.
Described above it is merely exemplary for the purpose of the present invention; and nonrestrictive, those of ordinary skill in the art understand, in the case of the spirit and scope limited without departing from claims once; many amendments, change or equivalence can be made, but fall within the protection domain that can not invent.