CN103226422B - Capacitive touch panel and a manufacturing method - Google Patents

Capacitive touch panel and a manufacturing method Download PDF

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Publication number
CN103226422B
CN103226422B CN201310086378.3A CN201310086378A CN103226422B CN 103226422 B CN103226422 B CN 103226422B CN 201310086378 A CN201310086378 A CN 201310086378A CN 103226422 B CN103226422 B CN 103226422B
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layer
lower
touch sensing
sensing circuit
insulating
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CN201310086378.3A
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CN103226422A (en
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秘琮翔
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宸鸿光电科技股份有限公司
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Abstract

本发明提供一种电容式触控面板,其包括一基板、一下触控感应线路层、一下导线层、一透明绝缘胶层、一上导线层、一上绝缘墨水层、一上触控感应线路层以及一盖板。 The present invention provides a capacitive touch panel includes a substrate, a lower touch sensing circuit layer, a lower conductor layer, a transparent insulating layer, an upper wiring layer, an insulating layer of ink, on a touch-sensing circuit and a cover layer. 本发明提供的电容式触控面板可设计以独立的工艺形成所述下触控感应线路层和上触控感应线路层,独立的工艺可使产品的良率提高,进而有利于大尺寸面板制造。 The capacitive touch panel of the present invention may be designed to provide a separate process of forming the lower wiring layer and the touch sensing touch sensing circuit layer, an independent process can improve product yield, thereby facilitating large-size panel manufacturing .

Description

电容式触控面板及制作方法 Capacitive touch panel and a manufacturing method

[0001 ] 本发明是针对母案(申请号:201010174999.3,申请日:2010年5月14日,发明名称:电容式触控面板)所提出的分案申请。 [0001] The present invention is directed to the parent application (application number: 201010174999.3 capacitive touch panel, filing date:: May 14, 2010, title of the invention) of the proposed divisional application.

技术领域 FIELD

[0002]本发明是关于一种电容式触控面板,尤其一种具有高制造良率而适合大尺寸制造的电容式触控面板。 [0002] The present invention relates to a capacitive touch panel, particularly having a capacitive touch panel and high manufacturing yield for manufacturing large size.

背景技术 Background technique

[0003]现有的触控面板有电阻式触控面板和电容式触控面板两种,近年来,又以电容式触控面板较受到市场上的重视。 [0003] The conventional touch panel has a resistive touch panel and a capacitive touch panel two kinds, in recent years, a capacitive touch panel again more attention on the market.

[0004]请参阅图3所示,现有电容式触控面板的结构式包括一玻璃基板61、一下触控感应线路层62、一上触控感应线路层63、一软性电路板64、一透明绝缘胶层65及一玻璃盖板66,其中:所述玻璃基板61具有一上表面和一下表面;所述上、下触控感应线路层63、62是分别形成于所述玻璃基板61的上、下表面上;所述软性电路板64是设于所述玻璃基板61的上表面上,并与部分上触控感应线路层63接触而与之点连接;所述透明绝缘层65是覆盖于所述玻璃盖板61上;所述玻璃盖板66是覆盖于所述透明绝缘胶层65上而所述透明绝缘胶层65粘贴固定。 [0004] Please refer to FIG. 3, the structural formula of the conventional capacitive touch panel includes a glass substrate 61, a lower layer of the touch sensing circuit 62, a line on the touch sensing layer 63, a flexible printed circuit board 64, a an insulating adhesive layer 65 and a transparent cover glass 66, wherein: the glass substrate 61 having an upper surface and a lower surface; the upper, 63, 62 are respectively formed on the glass substrate 61 under the touch sensing circuit layer the upper and lower surface; said flexible circuit board 64 is disposed on the upper surface of the glass substrate 61, and the contact portion of the touch sensing circuit layer 63 and the point of attachment thereto; the insulating layer 65 is transparent overlaid on the glass plate 61; and the glass plate 66 is covered on the transparent insulating adhesive layer 65 and the adhesive 65 is fixed on the transparent insulating adhesive layer.

[0005]然由于目前的技术,仅能分开地在所述玻璃基板61的上、下表面形成所述上触控感应线路层63和下触控感应线路层62,例如先形成所述上触控感应线路层63,如此一来,后续形成所述下触控感应线路层62时,已完成的上触控感应线路层63极容易在形成下触控感应线路层62的过程中遭到刮伤或沾污,进而使制造良率大幅度降低。 [0005] However, due to the current technology, only separately on the glass substrate 61, on the lower surface of the touch sensing circuit layer 63 and the lower touch sensing circuit layer 62, for example, is first formed on the contact induction line control layer 63, thus, forming a subsequent layer of the lower touch sensing circuit 62, the completed touch sensing electrode wiring layer 63 is vulnerable to scratch formation during the touch sensing circuit layer 62 injury or contamination, thereby enabling a significant reduction in manufacturing yield. 也因为良率过低,故此种电容式触控面板的尺寸通常无法做得太大,导致其应用范围受限;此外,因所述下触控感应线路层62外露而未有任何保护,故在搬运时容易因碰撞导致所述下触控感应线路层62受损。 Because of low yield, so that the size of such capacitive touch panel generally can not be made too large, resulting in their application range is limited; In addition, since the lower touch sensing circuit layer 62 is exposed and any No protection, so during transport easily due to the collision causes the touch sensing circuit layer 62 damaged.

发明内容 SUMMARY

[0006]为改善现有电容式触控面板制造良率不佳和应用范围受限的缺点,本发明的主要目的在提供一种电容式触控面板,其具有尚制造良率而适合大尺寸制造。 [0006] To improve conventional capacitive touch panel manufacturing yield is poor and limited range of applications drawbacks, the main object of the present invention to provide a capacitive touch panel, which still has a large size and manufacturing yield for manufacturing.

[0007]为达成前述目的所采取的主要技术手段如下: [0007] The main technical means to achieve the above object taken as follows:

[0008] —种电容式触控面板,包括:基板、下触控感应线路层、上触控感应线路层、透明绝缘胶层及盖板,所述下触控感应线路层形成于所述基板的上表面上,所述透明绝缘胶层覆盖于所述下触控感应线路层上,所述上触控感应线路层形成于所述透明绝缘胶层上,所述盖板形成于所述上触控感应线路层上。 [0008] - species capacitive touch panel, comprising: a substrate, a lower layer of the touch sensing circuit, the touch sensing circuit layer, a transparent adhesive layer and the insulating cover, the lower touch sensing circuit layer formed on the substrate the upper surface of the transparent insulating adhesive layer covering on the lower touch sensing circuit layer, on the touch sensing circuit layer formed on said transparent insulating layer, formed on the said cover plate touch sensing circuit layer.

[0009]其中,所述的电容式触控面板在于: [0009] wherein the capacitive touch panel comprising:

[00Ί0]所述基板具有一线路面; [00Ί0] The substrate having a road line;

[0011 ]所述下触控感应线路层设于所述基板的线路面上; [0011] The touch sensing circuit under the wiring layer provided on the surface of the substrate;

[0012] —下导线层,设于所述下触控感应线路层的边缘上,并与所述下触控感应线路层电连接; [0012] - touch sensing circuit electrically connected to the lower layer of the lower wiring layer, provided on the lower edge of the touch sensing circuit layer, and;

[0013]所述透明绝缘胶层设于所述下触控感应线路层及所述下导线层上; [0013] The transparent insulating adhesive layer provided on the lower touch sensing circuit layer and the lower layer of the wire;

[0014] —上导线层设于所述透明绝缘胶层上; [0014] - a wiring layer disposed on said transparent insulating adhesive layer;

[0015] —上绝缘墨水层,设置並覆盖于所述上导线层上,且所述上绝缘墨水层具有多个穿槽,各穿槽中填充有与所述上导线层接触的导电层; [0015] - the insulating ink layer disposed on and covering the upper conductor layer and the insulating layer having a plurality of ink through grooves, each groove filled with a conductive layer through the contact with the upper wiring layer;

[0016]所述上触控感应线路层,是设置并覆盖于所述透明绝缘胶层上,并覆盖部分所述上绝缘墨水层,且与所述上绝缘墨水层穿槽中的导电层电连接;及 [0016] on the touch sensing circuit layer is disposed on and covering the transparent insulating layer, and covering the upper portion of the insulating ink layer, and the conductive layer and the insulating layer through the ink tank connection; and

[0017]所述盖板具有一线路面,且所述盖板是以其线路面设于所述上触控感应线路层上。 The [0017] cover has road line, the line and the plate surface thereof is disposed on the upper layer of the touch sensing circuit.

[0018]其中,所述电容式触控面板进一步包括一下绝缘墨水层,所述绝缘墨水层设于所述下触控感应线路层的边缘上,且所述下绝缘墨水层具有多个穿槽,各穿槽中填充有导电层,其中所述下导线层通过所述穿槽中的导电层与所述下触控感应线路层电连接。 [0018] wherein the capacitive touch panel further comprises a lower insulating ink layer, the insulating ink layer disposed on the lower edge of the touch sensing circuit layer, and said lower insulating layer having a plurality of ink through slots each wear grooves are filled with a conductive layer, wherein the lower wiring layer electrically connected to said lower wiring layer through the conductive touch sensing layer through said groove.

[0019]其中,所述的电容式触控面板进一步包括一上绝缘层及一下绝缘层,其中,所述上绝缘层设于所述透明绝缘胶层与所述上导线层之间,所述下绝缘层设于所述透明绝缘胶层与所述下导线层之间。 [0019] wherein the capacitive touch panel further comprises an upper insulating layer and a lower insulating layer, wherein said insulating layer is disposed between the adhesive layer and the transparent insulating layer on the conductor, the lower insulating layer is provided between the adhesive layer and the transparent insulating layer under the wire.

[0020]其中,所述的电容式触控面板进一步包括一软性电路板,与部分所述下触控感应线路层及部分所述上触控感应线路层接触形成电连接。 [0020] wherein the capacitive touch panel further comprising a flexible circuit board, the contacting portion of the lower wiring layer and a touch sensing portion of the touch sensing circuit layer formed on the electrical connection.

[0021]而且,本发明的一种电容式触控面板的制作方法,包括于一基板的上表面上形成一下触控感应线路层,于所述下触控感应线路层形成一透明绝缘胶层,于所述透明绝缘胶层上形成一上触控感应线路层,于所述上触控感应线路层上形成一盖板。 [0021] Furthermore, the method for manufacturing a capacitive touch panel according to the present invention, the touch sensing circuit comprising forming a lower layer on a surface of a substrate, the touch sensing circuit layer formed under the adhesive layer a transparent insulating , on the transparent insulating adhesive layer is formed on a touch sensing circuit layer, formed on said upper cover a touch sensing circuit layer.

[0022]其中,所述的电容式触控面板制作方法,包括: [0022] wherein the capacitive touch panel manufacturing method, comprising:

[0023]步骤1:在提供具有一线路面的基板; [0023] Step 1: providing a substrate having a first line in the road surface;

[0024]步骤2:在所述基板的线路面上形成所述下触控感应线路层; [0024] Step 2: The touch sensing circuit layer is formed on the lower surface of the circuit substrate;

[0025]步骤3:在所述下触控感应线路层边缘上形成一下导线层,所述下导线层与所述下触控感应线路层电连接; [0025] Step 3: forming a lower wiring layer on the lower edge of the touch sensing circuit layer, a lower electrical wiring layer and the lower layer connection touch sensing circuit;

[0026]步骤4:提供具有一线路面的盖板,; [0026] Step 4: providing a plate having a line road surface;

[0027]步骤5:在所述盖板的线路面上形成一上触控感应线路层; [0027] Step 5: forming a wiring layer on a touch sensing surface of the cover plate of the line;

[0028] 步骤6:在所述上触控感应线路层的边缘上形成一上绝缘墨水层,并在所述上绝缘墨水层形成多个穿槽,各穿槽中填充有导电层; [0028] Step 6: is formed on an edge of the touch sensing circuit on an upper layer of the insulating layer of the ink, and through a plurality of grooves are formed on the insulating ink layer, each filled with a conductive layer through the groove;

[0029]步骤7:在所述上绝缘墨水层上形成一上导线层,所述上导线层通过所述穿槽中的导电层与所述上触控感应线路层电连接;以及 [0029] Step 7: an upper wiring layer is formed on the insulating ink layer, the upper layer of the upper conductor circuit layer is electrically connected to the touch sensing by the conductive layer through the groove; and

[0030]步骤8:将步骤3的基板与步骤7的盖板通过透明绝缘胶层相粘合,且所述透明绝缘胶层介于所述基板的线路面与所述盖板的线路面之间。 [0030] Step 8: Step 3 Step cover plate substrate 7 by bonding with a transparent insulating layer, and the insulating adhesive layer interposed between the transparent surface of the line side circuit substrate and the cover plate of between.

[0031]其中,所述的电容式触控面板制作方法,在所述步骤2之后在所述下触控感应线路层的边缘上形成一下绝缘墨水层,且在所述下绝缘墨水层上形成多个穿槽,各穿槽中填充有导电层,其中所述下导线层通过所述穿槽中的导电层与所述下触控感应线路层电连接。 [0031] wherein the capacitive touch panel manufacturing method according to, after the step 2 an insulating ink is formed at an upper edge of said lower layer in the touch sensing circuit layer, and an ink layer formed on the lower insulating through a plurality of grooves, each groove is filled with a conductive wear layer, wherein the lower wiring layer electrically connected to said lower wiring layer through the conductive touch sensing layer through said groove.

[0032]其中,所述的电容式触控面板制作方法,进一步包括:在所述上导线层上形成一上绝缘层且在所述下导线层上形成一下绝缘层,其中透明绝缘胶层位于所述上绝缘层与所述下绝缘层之间。 [0032] wherein the capacitive touch panel manufacturing method, further comprising: a conductor formed on the upper insulating layer and an upper layer is formed at the lower conductor layer on the insulating layer, wherein the transparent insulating adhesive layer is located between the upper insulating layer and the lower insulating layer.

[0033]其中,所述的电容式触控面板制作方法,进一步包括:形成一软性电路板,与部分所述下触控感应线路层及部分所述上触控感应线路层接触形成电连接。 [0033] wherein the capacitive touch panel manufacturing method, further comprising: forming a flexible circuit board electrically connected to the lower portion of the touch sensing circuit layer and the contact portion of the touch sensing circuit layer and .

[0034]利用上述技术方案,由于所述下触控感应线路层和上触控感应线路层是分别于所述基板和盖板接触,因此在工艺上,可设计令所述基板和盖板以分开的工艺形成所述下触控感应线路层和上触控感应线路层,由于利用平板工艺对平板进行单面线路层的制造已是成熟的技术,因此工艺良率佳,而较佳的制造良率则有利于制造大尺寸面板。 [0034] With the above aspect, since the lower wiring layer and an upper touch sensing touch sensing circuit layer is in contact with the base plate and cover plate respectively, so the process can be designed to make the base plate and the cover plate separate process of forming the lower wiring layer and an upper touch sensing touch sensing circuit layer, since the single-sided circuit plate produced by the plate process layer is a mature technology, good process yield, and the preferred manufacturing yield is conducive to the manufacture of large-size panels.

附图说明 BRIEF DESCRIPTION

[0035]图1是本发明一较佳实施例的分解图。 [0035] FIG. 1 is an exploded view of a preferred embodiment.

[0036]图2是本发明一较佳实施例的剖面图。 [0036] FIG. 2 is a cross-sectional view of the present invention, a preferred embodiment of the embodiment of FIG.

[0037]图3是现有电容式触控面板的剖面图。 [0037] FIG. 3 is a sectional view of a conventional capacitive touch panel.

[0038] 主要附图标记说明:11-玻璃基板;111-线路面;12-下触控感应线路层;13-下绝缘墨水层;131-触控区;132-穿槽;133-导电层;14-下导线层;15-下绝缘层;151-缺口; 16-下导电胶层;20-软性电路板;21-下表面;22-上表面;30-透明绝缘胶层;41-上绝缘层;411-缺口;42_上导电胶层;43-上导线层;44-上绝缘墨水层;441-穿槽;442-导电层;45-上触控感应线路层;46-玻璃盖板;461-线路面;51-上保护层;52-下保护层;61-玻璃基板;62-下触控感应线路层;63-上触控感应线路层;64-软性电路板;65-透明绝缘胶层;66-玻璃盖板。 [0038] Main reference numerals DESCRIPTION: 11- glass substrate; 111- line surface; the 12- touch sensing circuit layer; 13- lower insulating ink layer; 131- touch area; 132- through slot; 133- conductive layer ; 14- lower wire layer; lower insulating layer 15; 151- gap; 16- lower conductive paste layer; flexible circuit board 20; the lower surface 21; the upper surface of 22-; 30- transparent insulating adhesive layer; 41- on the insulating layer; 411- gap; 42_ conductive adhesive layer; the wiring layer 43; 44- on the insulating ink layer; 441- through slot; 442- conductive layer; 45- on the touch sensing circuit layer; 46- glass cover; 461- circuit surface; upper protective layer 51; 52- lower protective layer; 61- glass substrate; at 62- touch sensing circuit layer; 63- on the touch sensing circuit layer; 64- flexible circuit board; 65 a transparent insulating paste layer; 66- glass cover plate.

具体实施方式 Detailed ways

[0039]关于本发明的一较佳实施例,请参阅图1及图2所示,是包括一玻璃基板11、一下触控感应线路层12、一下绝缘墨水层13、一下导线层14、一下绝缘层15、一下导电胶层16、一软性电路板22、一透明绝缘胶层30、一上绝缘层41、一上导电胶层42、一上导线层43、一上绝缘墨水层44、一上触控感应线路层45、一玻璃盖板46、一上保护层51及一下保护层52。 [0039] For a preferred embodiment of the present invention, see FIGS. 1 and 2, comprising a glass substrate 11, a lower layer of the touch sensing circuit 12, a lower insulating ink layer 13, a lower wiring layer 14, a lower the insulating layer 15, a lower conductive adhesive layer 16, a flexible printed circuit board 22, a transparent insulating adhesive layer 30, an upper insulating layer 41, a conductive adhesive layer 42, an upper wiring layer 43, an upper insulating layer 44 of the ink, a 45, a glass cover 46, an upper protective layer, the protective layer 51 and a lower layer 52 of the touch sensing circuit.

[0040]上述玻璃基板11具有一线路面111。 [0040] The glass substrate 11 having a 111 line pavement.

[0041]上述下触控感应线路层12是形成于所述玻璃基板11的线路面111上;在本实施例中,所述下触控感应线路层12是由双层式触控电极层的下触控线路组成,例如X轴触控线路。 [0041] Under the above-described touch sensing circuit layer 12 is formed on the wiring surface 111 of the glass substrate 11; in the present embodiment, the lower touch sensing circuit layer 12 is a double touch electrode layer the touch lines form, for example, the X-axis touch line.

[0042]上述下绝缘墨水层13是形成并覆盖于所述下触控感应线路层12的边缘上,使未受覆盖的下触控感应线路层12构成一触控区131,又所述下绝缘墨水层13在对应所覆盖的下触控感应线路层12边缘处形成有多个穿槽132,各穿槽132中是填充有导电层133;在本实施例中,所述下绝缘墨水层13是采用深色油墨,以印刷机烘烤等技术将深色油墨使穿槽132成形,故自所述玻璃盖板11上相对于线路面111的另侧观之,所述下绝缘墨水层13具有遮蔽的效果;此外,所述导电层133是采用与所述下绝缘墨水层13的颜色相同或近似的导电物质,故可掩蔽穿槽132的存在。 [0042] The lower insulating ink layer 13 is formed on the lower cover and the upper edge 12 of the touch sensing circuit layer, the lower layer were not covered with the touch sensing circuit 12 composed of a touch region 131, and the lower a plurality of grooves 132 through the insulating layer 13 is formed of the ink 12 at the lower edge of the touch sensing circuit layer corresponding to the covered through each groove 132 is filled with the conductive layer 133; in the present embodiment, the lower insulating ink layer 13 is with dark ink to the printer baking techniques dark ink so shaped through slot 132, so the cover glass 11 from the respect, the other side of the lower insulating layer Views of ink line surface 111 for 13 has the effect of shielding; in addition, the conductive layer 133 are similar or the same color with the insulating ink layer 13 of the conductive substance, it can mask the presence of the through slots 132.

[0043]上述下导线层14是形成并覆盖于所述下绝缘墨水层13上,而通过所述穿槽132中的导电层133与所述下触控感应线路层12电连接。 [0043] The wiring layer 14 is formed at and covering the insulating layer on the lower ink 13, through the conductive layer 133 through the slot 132 in the lower layer touch sensing electrical line 12 is connected.

[0044]上述下绝缘层15是形成并覆盖于所述下导线层14上,以避免所述下导线层14因暴露于空气中造成氧化,又所述下绝缘层15上具有一缺口151而露出部分的下导线层14;在本实施例中,所述下绝缘层15是采用透明的绝缘材质。 [0044] The lower insulating layer 15 is formed on the lower cover and conductor layer 14, in order to avoid the oxidation of the lower wiring layer 14 caused by exposure to air, and having a notch 151 of the lower insulating layer 15 expose the lower conductor layer portion 14; in the present embodiment, the lower insulating layer 15 is made of transparent insulating material.

[0045]上述下导电胶层16是形成于所述下绝缘层15上缺口 151处而覆盖露出的下导线层14;在本实施例中,所述导电胶层16是采用异方性导电膜(Anisotropic Conductive Film,简称ACF)或异方性导电胶(Anisotropic Conductive Paste,简称ACP)。 [0045] The conductive adhesive layer 16 of the lower wiring layer 14 is formed on the lower notch 15 on the insulating layer 151 to cover the exposed; in the present embodiment, the conductive adhesive layer 16 is the use of an anisotropic conductive film (anisotropic conductive Film, referred to as ACF) or anisotropic conductive paste (anisotropic conductive Paste, referred to as ACP).

[0046]在工艺上,可设计一下板工艺完成前述玻璃基板11、下触控感应线路层12、下绝缘墨水层13、下导线层14、下绝缘层15及下导电胶层16的工艺。 [0046] In the process, a lower plate may be designed to accomplish the foregoing process of the glass substrate 11, the touch sensing circuit layer 12, the insulating ink layer 13, the wiring layer 14, the process of the insulating layer 15 and the conductive adhesive layer 16 at.

[0047]上述软性电路板20具有一下表面21和上表面22,且所述软性电路板20是以其下表面设于所述下导电胶层16上,并延伸至所述玻璃基板11外,又所述软性电路板20是通过所述下导电胶层16及所述下绝缘墨水层13穿槽132中的导电层133而与所述下触控感应线路层12电连接。 [0047] The flexible circuit board 20 has a lower surface 21 and upper surface 22, and the flexible circuit board 20 is provided on its lower surface on the lower conductive adhesive layer 16, and extends to the glass substrate 11 outside, and the flexible circuit board 20 by the conductive adhesive layer 16 under the lower conductive layer 133 and the insulating layer 13 through the ink tank 132 and the touch sensing circuit electrically connected to the lower layer 12.

[0048] 上述透明绝缘胶层30是形成于所述触控区131及下绝缘层15上。 [0048] The transparent insulating plastic layer 30 is formed on the touch region 131 and the lower insulating layer 15.

[0049]上述上绝缘层41是形成于所述透明绝缘胶层30上,又所述上绝缘层41上是具有一411而露出所述软性电路板20。 [0049] The upper insulating layer 41 is formed on the transparent insulating adhesive layer 30, and the upper insulating layer 41 having a 411 to expose the flexible printed circuit board 20.

[0050]上述上导电胶层42是形成于所述上绝缘层41的缺口 411处而与所述软性电路板20的上表面22接触。 [0050] The conductive adhesive layer 42 is formed on the notch 411 and the insulating layer 41 on the flexible circuit board 20 in contact with the surface 22.

[0051]上述上导线层43是形成并覆盖于所述上导电胶层42和上绝缘层41上。 [0051] The upper wiring layer 43 is formed on and covering the conductive paste layer 42 and the upper insulating layer 41.

[0052] 上述上绝缘墨水层44是形成并覆盖于所述上导线层43上,又所述上绝缘墨水层44上是形成有多个穿槽441,各穿槽441中式填充有与所述上导线层43接触的导电层442; [0052] The ink on the insulating layer 44 is formed on and covering the upper conductor layer 43 and the insulating ink layer 44 is formed with a plurality of through slots 441, 441 through respective Chinese filling the groove conductive layer contacts the upper wiring layer 43442;

[0053]在本实施例中,所述导电层442是采用与所述上绝缘墨水层44的颜色相同或近似的导电物质,以掩蔽穿槽441的存在。 [0053] In the present embodiment, the conductive layer 442 is to use the same color on the insulating layer 44 of the ink or similar conductive substance, to mask the presence of the groove 441 through.

[0054] 上述上触控感应线路层45是形成于所述透明绝缘胶层30上,并覆盖部分上绝缘墨水层44,且与所述上绝缘墨水层44穿槽441中的导电层442接触,如此一来,所述上触控感应线路层45可通过所述上绝缘墨水层44穿槽441中的导电层442及所述上导电胶层42与所述软性电路板20电连接;在本实施例中,所述上触控感应线路层45是由双层式触控电极层的上触控线路组成,例如Y轴触控线路。 [0054] The upper layer 45 is a touch sensing circuit is formed on the transparent insulating adhesive layer 30, and the insulating portion 44 covers the ink layer, and in contact with the conductive layer through the insulating ink layer 44 and the upper groove 441 442 , Thus, the touch sensing circuit layer 45 on the upper conductive layer may be an insulating ink layer 44 through the grooves 441,442 and the conductive adhesive layer 42 is electrically connected to the flexible circuit board 20 by; in the present embodiment, on the touch sensing circuit layer 45 is composed of a touch on the line touch electrode layer bilayer composition, for example, the Y-axis of the touch line.

[0055]上述玻璃盖板46是具有一线路面461,又所述玻璃盖板46是以其线路面461设于所述上触控感应线路层45和上绝缘墨水层44上,因此从所述玻璃盖板46上相对于线路面461的另侧观之,所述上绝缘墨水层44具有遮蔽线路的效果。 [0055] The glass cover plate 46 having pavement line 461, and the cover glass 46 is disposed with its circuit surface 461 of the upper touch sensing circuit layer 45 and the upper insulating ink layer 44, and therefore from the glass cover plate 46 with respect to the other side surface 461 of the line view, has the effect of shielding the upper wiring layer 44 of insulating ink.

[0056] 在工艺上,可设计以一与所述下板工艺独立的上板工艺完成前述上绝缘层41、上导电胶层42、上导线层43、上绝缘墨水层44、上触控感应线路层45及玻璃盖板46的制造。 [0056] In the process, may be designed to complete the lower plate with a separate process on the insulating layer on the process sheet 41, the conductive adhesive layer 42, the conductor layer 43, the insulating ink layer 44, the touch sensing manufacturing a wiring layer 45 and the glass cover plate 46.

[0057]请参阅图2所示,上述上保护层51是粘贴于所述软性电路板20的上表面22和所述玻璃盖板46的一侧边之间,由此保护弯折所述软性电路板20时,不致与所述玻璃盖板46的侧边直接接触,因此可避免所述软性电路板20因弯折而遭所述玻璃盖板46的侧边切割损坏。 [0057] Please refer to FIG. 2, on the protective layer 51 is between the upper surface of the flexible circuit board attached to a side edge 20 of the glass 22 and the cover 46, thereby protecting the bent the flexible printed circuit board 20, without direct contact with the side of the glass cover plate 46, thereby avoiding the side of the flexible circuit board 20 due to the glass cover plate 46 is bent who were cut damage.

[0058]上述下保护层52是粘贴于所述软性电路板20的下表面21和所述玻璃基板11的一侧边之间,其效果与所述上保护层51相同。 [0058] The lower protective layer 52 is attached between the glass substrate 21 and a side edge 11 of the lower surface of the flexible circuit board 20, the effect is the same as the upper protective layer 51.

[0059]本发明具有下列优点: [0059] The present invention has the following advantages:

[0060] 1.通过上述构造,可在工艺上设计分离的上板工艺和下板工艺,因以目前技术水准,使用平板玻璃工艺进行单面线路层的制作良率佳,故本发明的构造可使制造良率较现有电容式触控面板佳。 Good [0060] 1, can be separated in the design process of the upper plate and the lower plate process technology, due to the current level of technology, technology for flat glass sided wiring layer structure prepared by the above yield, it is constructed according to the present invention allows the production yield than the best conventional capacitive touch panel.

[0061] 2.由于本发明的制造良率较佳,故有利于制作大尺寸面板,使本发明的电容式触控面板的应用领域可较现有电容式触控面板广。 [0061] 2. Since the manufacturing yield of the present invention is preferred, it is conducive to the production of large-size panels, the field of application of the present invention, the capacitive touch panel may be widely than conventional capacitive touch panel.

[0062] 3.本发明的触控面板是在玻璃盖板46和玻璃基板11的线路面461、11分别形成上、下绝缘墨水层44、13,以分别覆盖上、下触控感应线路层45、12的边缘,故可遮蔽设于所述上、下绝缘墨水层44、13之间的上、下导线层43、14、上、下绝缘层41、15及上、下导电胶层42、16;因此,当本发明的触控面板完成后欲与电子产品机壳组装时,机壳的边缘可直接设计于玻璃盖板46和玻璃基板11的边缘,增加本发明触控面板设计上的方便性。 Touch panel [0062] 3. The present invention is 461,11 respectively formed wiring 46 and the cover glass surface of the glass substrate 11, lower insulating ink layer 44,13, respectively on the cover, the touch sensing circuit layer the edges 45,12, it can be disposed on the shield, the lower insulating layer between the ink 44,13, 43,14 lower conductor layer, the upper and lower insulating layer 41, 15 and upper and lower conductive adhesive layer 42 on Accordingly, when the touch panel of the present invention to be completed Electronics housing assembly, the edges of the housing may be designed directly to the edge of the cover glass 46 and the glass substrate 11, the present invention is designed to increase the touch panel;, 16 convenience.

[0063] 4.由于本发明的上、下触控感应线路层45、12以及上、下导线层43、44是设于所述玻璃基板11和玻璃盖板46之间而不致裸露,因此在搬运本发明的触控面板时,可避免搬运不甚导致上、下触控感应线路层45、12以及上、下导线层43、14损坏问题。 [0063] 4. Due to the present invention, the touch sensing circuit layer 45,12 and upper and lower wiring layer 43, 44 is disposed between the exposed and without the glass substrate 46 and the glass cover 11, so when carrying the touch panel of the present invention, results in less handling can be avoided on the touch sensing circuit layer 45,12 and an upper and lower layer problem of damaging the wires 43,14.

[0064]以上说明对本发明而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离一下所附权利要求所限定的精神和范围的情况下,可做出许多修改、变化、或等效,但都将落入不能发明的保护范围内。 [0064] For the present invention described above is illustrative only, and not restrictive, those of ordinary skill in the art understand, without departing from what is defined in the appended claims and the spirit of scope, many modifications may be made , change, or equivalent, but will not fall within the scope of the invention.

Claims (8)

1.一种电容式触控面板,包括:基板、下触控感应线路层、上触控感应线路层、透明绝缘胶层及盖板,所述下触控感应线路层形成于所述基板的上表面上,所述透明绝缘胶层覆盖于所述下触控感应线路层上,其特征在于,所述上触控感应线路层形成于所述透明绝缘胶层上,所述盖板形成于所述上触控感应线路层上,其中, 所述基板具有一线路面; 所述下触控感应线路层设于所述基板的线路面上; 一下导线层,设于所述下触控感应线路层的边缘上,并与所述下触控感应线路层电连接; 所述透明绝缘胶层设于所述下触控感应线路层及所述下导线层上; 一上导线层设于所述透明绝缘胶层上; 一上绝缘墨水层,设置並覆盖于所述上导线层上,且所述上绝缘墨水层具有多个穿槽,各穿槽中填充有与所述上导线层接触的导电层; 所述上触控感应线路层,是设 A capacitive touch panel, comprising: a substrate, a lower layer of the touch sensing circuit, the touch sensing circuit layer, a subbing layer and a transparent insulating plate, the touch sensing circuit layer formed on the lower substrate, the upper surface of the transparent insulating adhesive layer covering on the lower touch sensing circuit layer, wherein said upper touch sensing circuit layer formed on said transparent insulating layer, formed on the cover plate the upper touch sensing circuit layer, wherein the substrate has a pavement line; touch sensing circuit of the lower wiring layer is provided on the surface of the substrate; look wire layer provided on the lower touch sensing circuit upper edge layer, and is electrically connected to the lower layer of the touch sensing circuit; said transparent insulating adhesive layer provided on the lower touch sensing circuit layer and the lower conductor layer; a wiring layer provided on the upper a transparent insulating adhesive layer; a insulating ink layer disposed on and covering the upper conductor layer, an insulating layer and the ink having a plurality of through grooves, each groove is filled through contact with the upper wire layer a conductive layer; on the touch sensing circuit layer is provided 置并覆盖于所述透明绝缘胶层上,并覆盖部分所述上绝缘墨水层,且与所述上绝缘墨水层穿槽中的导电层电连接;及所述盖板具有一线路面,且所述盖板是以其线路面设于所述上触控感应线路层上。 Placed on and covering the transparent insulating layer, and covering the upper portion of the insulating layer of the ink, and is electrically connected to the conductive layer through the insulating ink layer on said tank; said cap plate having a line and the road, and the said cover is provided on its line on the upper surface of the touch sensing circuit layer.
2.根据权利要求1所述的电容式触控面板,其特征在于,进一步包括一下绝缘墨水层,所述下绝缘墨水层设于所述下触控感应线路层的边缘上,且所述下绝缘墨水层具有多个穿槽,各穿槽中填充有导电层,其中所述下导线层通过所述穿槽中的导电层与所述下触控感应线路层电连接。 The capacitive touch panel as claimed in claim 1, wherein the ink further comprises a lower insulating layer, the lower insulating ink layer disposed on the lower edge of the touch sensing circuit layer, and the lower insulation ink layer having a plurality of through grooves, each filled with the conductive layer through the groove, wherein the lower wiring layer electrically connected to said lower wiring layer through the conductive touch sensing layer through said groove.
3.根据权利要求1所述的电容式触控面板,其特征在于,进一步包括一上绝缘层及一下绝缘层,其中,所述上绝缘层设于所述透明绝缘胶层与所述上导线层之间,所述下绝缘层设于所述透明绝缘胶层与所述下导线层之间。 The capacitive touch panel as claimed in claim 1, wherein the insulating layer further comprises an upper and a lower insulating layer, wherein the upper insulating layer disposed on the adhesive layer and the transparent insulating the wire between the layers, the lower insulating layer is provided between the adhesive layer and the transparent insulating layer under the wire.
4.根据权利要求1所述的电容式触控面板,其特征在于,进一步包括一软性电路板,与部分所述下触控感应线路层及部分所述上触控感应线路层接触形成电连接。 4. The capacitive touch panel as claimed in claim 1, characterized in that, further comprising a flexible printed circuit board, the touch sensing circuit layer portion of the lower and the upper portion of the touch sensing layer in contact with the electrical circuit connection.
5.—种电容式触控面板的制作方法,包括于一基板的上表面上形成一下触控感应线路层,于所述下触控感应线路层形成一透明绝缘胶层,其特征在于,于所述透明绝缘胶层上形成一上触控感应线路层,于所述上触控感应线路层上形成一盖板,其中,所述电容式触控面板的制作方法包括: 步骤I:提供具有一线路面的基板; 步骤2:在所述基板的线路面上形成所述下触控感应线路层; 步骤3:在所述下触控感应线路层边缘上形成一下导线层,所述下导线层与所述下触控感应线路层电连接; 步骤4:提供具有一线路面的盖板; 步骤5:在所述盖板的线路面上形成一上触控感应线路层; 步骤6:在所述上触控感应线路层的边缘上形成一上绝缘墨水层,并在所述上绝缘墨水层形成多个穿槽,各穿槽中填充有导电层; 步骤7:在所述上绝缘墨水层上形成一上导线层,所述上导 5.- The method of fabricating a capacitive touch panel, comprising forming on the upper surface of the substrate at a touch sensing circuit layer in the touch sensing circuit layer formed under a transparent insulating layer, characterized in the transparent touch sensing circuit is formed on an insulating layer on the adhesive layer, is formed on the upper cover plate on a touch sensing circuit layer, wherein the method of manufacturing the capacitive touch panel comprises: step I: providing a line pavement substrate; step 2: touch sensing circuit wiring layer is formed on the lower surface of the substrate; step 3: forming at the lower edge of the touch sensing circuit layer conductor layer, the lower wiring layer touch sensing circuit electrically connected to said lower layer; step 4: providing a cover plate having a road line; step 5: forming a wiring layer on a touch sensing surface of the cover plate of the line; step 6: the is formed on the upper edge of a touch sensing circuit layer on the insulating layer of the ink, and through a plurality of grooves are formed on the insulating ink layer, each filled with a conductive layer through the groove; step 7: the insulating layer of the ink on the forming an upper wiring layer, said upper guide 层通过所述穿槽中的导电层与所述上触控感应线路层电连接;以及步骤8:将步骤3的基板与步骤7的盖板通过透明绝缘胶层相粘合,且所述透明绝缘胶层介于所述基板的线路面与所述盖板的线路面之间。 Layer through the through groove of the upper conductive layer is electrically connected to touch sensing circuit layer; and Step 8: Step 3 Step cover plate substrate 7 by transparent insulating adhesive layer with an adhesive, and said transparent an insulating adhesive layer interposed between the line circuit side of the cap plate surface of the substrate.
6.根据权利要求5所述的电容式触控面板的制作方法,其特征在于,在所述步骤2之后在所述下触控感应线路层的边缘上形成一下绝缘墨水层,且在所述下绝缘墨水层上形成多个穿槽,各穿槽中填充有导电层,其中所述下导线层通过所述穿槽中的导电层与所述下触控感应线路层电连接。 The capacitive touch panel manufacturing method according to claim 5, wherein, after said step 2 is formed on the lower edge of the touch sensing circuit layer at the insulating ink layer, and the is formed on the lower insulating layer of ink through a plurality of grooves, each groove is filled with a conductive wear layer, wherein the lower wiring layer electrically connected to said lower wiring layer through the conductive touch sensing layer through said groove.
7.根据权利要求5所述的电容式触控面板的制作方法,其特征在于,进一步包括:在所述上导线层上形成一上绝缘层且在所述下导线层上形成一下绝缘层,其中透明绝缘胶层位于所述上绝缘层与所述下绝缘层之间。 7. A method for manufacturing a capacitive touch panel according to claim 5, characterized in that, further comprising: a conductor formed on the upper insulating layer and an upper layer is formed at the lower conductor layer on the insulating layer, wherein the transparent insulating adhesive layer positioned between the upper insulating layer and the lower insulating layer.
8.根据权利要求5所述的电容式触控面板的制作方法,其特征在于,进一步包括:形成一软性电路板,与部分所述下触控感应线路层及部分所述上触控感应线路层接触形成电连接。 The capacitive touch panel manufacturing method according to claim 5, characterized in that, further comprising: forming a flexible circuit board, the touch sensing circuit portion of the lower layer, and the touch sensing portion and a contact electrically connected to the circuit layer is formed.
CN201310086378.3A 2010-05-14 2010-05-14 Capacitive touch panel and a manufacturing method CN103226422B (en)

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